CN111710704B - Display panel and display device - Google Patents

Display panel and display device Download PDF

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Publication number
CN111710704B
CN111710704B CN202010606459.1A CN202010606459A CN111710704B CN 111710704 B CN111710704 B CN 111710704B CN 202010606459 A CN202010606459 A CN 202010606459A CN 111710704 B CN111710704 B CN 111710704B
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layer
conductive
display panel
substrate
conductive bump
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CN111710704A (en
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高宇
林君
刘俊哲
刘孟宇
黄智�
夏景成
李田田
孙佳欣
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Yungu Guan Technology Co Ltd
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Yungu Guan Technology Co Ltd
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/10OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/18Carrier blocking layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528Geometry or layout of the interconnection structure
    • H01L23/5286Arrangements of power or ground buses
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30Devices specially adapted for multicolour light emission
    • H10K59/35Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40OLEDs integrated with touch screens

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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The invention discloses a display panel and a display device, the display panel includes: a substrate; a pixel defining layer including a pixel opening penetrating the pixel defining layer; the multilayer functional layer at least partially extends to one side of the pixel definition layer, which is far away from the substrate, and comprises a first current carrier layer, a second current carrier layer and a third current carrier layer, wherein the first current carrier layer is positioned on the surface of the pixel definition layer, which is far away from the substrate, and in the pixel opening; the first conductive protrusion is positioned on at least part of the periphery of the pixel opening and is in contact with the first current carrier layer; the second conductive protrusion is positioned on one side of the first conductive protrusion, which is far away from the substrate, and at least one functional layer is clamped between the second conductive protrusion and the first conductive protrusion; the first conductive bump and the second conductive bump can form a current path. The display panel provided by the invention can improve the light emission of other sub-pixels caused by the movement of carriers to other adjacent sub-pixels, and can improve the display effect.

Description

Display panel and display device
Technical Field
The invention relates to the technical field of display, in particular to a display panel and a display device.
Background
Organic Light Emitting Diode (OLED) display has the advantages of low cost, wide viewing angle, low driving voltage, fast response speed, rich Light Emitting colors, simple preparation process, capability of realizing large-area flexible display and the like, and is considered to be one of the display technologies with the greatest development prospects.
In the process of preparing the OLED display panel, functional layers such as a hole injection layer, a hole transport layer, a hole blocking layer, and an electron blocking layer, which are located on both sides of a light emitting layer, are generally evaporated by using a common mask (common mask), and the functional layers are connected to sub-pixels in a direction parallel to the display panel. When some sub-pixels are lighted, current is transmitted to adjacent sub-pixels in a transverse direction, so that other sub-pixels emit light, and therefore, the adjacent sub-pixels are interfered with each other, and the display effect is influenced.
Disclosure of Invention
The invention provides a display panel and a display device, which can improve the light emission of other sub-pixels caused by the movement of carriers to other adjacent sub-pixels and can improve the display effect.
In one aspect, an embodiment of the present invention provides a display panel, including: a substrate; the pixel definition layer is positioned on one side of the substrate and comprises a pixel opening penetrating through the pixel definition layer along the thickness direction; the multilayer functional layer comprises a first current carrier layer, and the first current carrier layer is positioned on the surface of the pixel defining layer, which is far away from the substrate, and in the pixel opening; the first conductive bump is positioned on one side of the pixel defining layer, which is far away from the substrate, and is in contact with the first current carrier layer; the second conductive bulge is positioned on one side of the first conductive bulge, which is far away from the substrate, and at least one functional layer is clamped between the second conductive bulge and the first conductive bulge; the first conductive bump and the second conductive bump can form a current path.
According to an aspect of an embodiment of the present invention, an orthographic projection of the first conductive bump on the substrate surrounds the pixel opening; and/or an orthographic projection of the second conductive bump on the substrate surrounds the pixel opening.
According to an aspect of the embodiment of the present invention, the material of the first conductive bump, and/or the second conductive bump includes at least one of a transparent conductive material, a metal, and an alloy.
According to one aspect of an embodiment of the invention: the second conductive bump is electrically connected with a conductive layer of the display panel, the conductive layer comprises a touch layer,
the touch layer is positioned on one side, away from the substrate, of the multilayer functional layer, the second conductive protrusions are positioned on the surface, facing the substrate, of the touch layer, the touch layer comprises a conductive sub-layer, and the second conductive protrusions are electrically connected with the conductive sub-layer; at least one functional layer that presss from both sides between electrically conductive arch of second and the electrically conductive arch includes: the first conductive structure is clamped between the second conductive protrusion and the first conductive protrusion, the second conductive structure is positioned on the outer peripheral side of the first conductive structure, and the thickness of the first conductive structure is smaller than that of the second conductive structure;
optionally, at least a portion of the first conductive bump is disposed opposite the first conductive bump.
According to an aspect of an embodiment of the present invention, the display panel further includes: the film packaging layer is positioned between the touch layer and the multilayer functional layer and comprises a through hole, and the second conductive protrusion fills the through hole; the protective layer is positioned on one side, away from the substrate, of the touch layer; alternatively, the display panel further includes: the packaging cover plate is positioned on one side of the touch layer, which is far away from the substrate;
optionally, the display panel further includes a ground circuit, and the ground circuit is connected to the conductive sublayer;
optionally, the display panel includes a display area for accommodating the sub-pixels, the display area includes a central sub-area and an edge sub-area surrounding the central sub-area, and the first conductive bump and the second conductive bump are located in the central sub-area.
According to an aspect of the embodiment of the present invention, the first conductive protrusion is located between the first carrier layer and the pixel defining layer, or the first conductive protrusion is located on a side of the first carrier layer facing away from the pixel defining layer, or the first carrier injection layer includes a through hole penetrating through a thickness thereof, and the first conductive protrusion is located on a surface of the pixel defining layer facing away from the substrate and fills the through hole.
According to an aspect of an embodiment of the invention, the multi-layer functional layer further comprises: a first electrode disposed between the pixel defining layer and the substrate and exposed to the pixel opening; the light-emitting layer is positioned in the pixel opening and positioned on one side of the first carrier layer, which is far away from the first electrode; the second electrode layer is positioned on one side, away from the substrate, of the light emitting layer, and a part of the second electrode layer extends to one side, away from the substrate, of the pixel defining layer; the second conductive bump is electrically connected with the conductive layer of the display panel, the conductive layer comprises a second electrode layer,
the second conductive protrusion is located on a surface of the second electrode layer facing the first electrode.
According to an aspect of an embodiment of the present invention, the first conductive bump includes a first tip portion facing the second conductive bump, the second conductive bump includes a second tip portion facing the first conductive bump, and an orthographic projection of the first tip portion on the substrate at least partially overlaps an orthographic projection of the second tip portion on the substrate.
According to an aspect of the embodiments of the present invention, under a preset electric field, the first tip portion and the second tip portion discharge and are capable of disconnecting at least one functional layer interposed between the first tip portion and the second tip portion;
optionally, the multilayer functional layer further comprises: and the second current carrier layer is positioned on the surface of the second electrode layer facing the substrate side, the second current carrier layer comprises a groove, the groove extends from the surface close to the second electrode layer to the back away from the second electrode layer, and the second conductive protrusion fills the groove.
On the other hand, an embodiment of the present invention further provides a display device, including the display panel of any one of the above embodiments.
According to the display panel and the display device provided by the embodiment of the invention, the display panel comprises a substrate, a pixel defining layer, a plurality of functional layers, a first conductive bump and a second conductive bump, wherein the pixel defining layer comprises a pixel opening penetrating through the thickness of the pixel defining layer, and a sub-pixel is formed in the pixel opening. In order to prevent carriers from moving to other adjacent sub-pixels and causing other sub-pixels to emit light, in the embodiment of the invention, a first conductive bump and a second conductive bump are arranged, and at least one functional layer is sandwiched between the first conductive bump and the second conductive bump, so that when a current path is formed by the first conductive bump and the second conductive bump, carriers moving transversely in at least one functional layer can be led out through the current path between the first conductive bump and the second conductive bump, or the functional layer sandwiched between the first conductive bump and the second conductive bump is disconnected by energy generated when the first conductive bump and the second conductive bump are electrified, so that the carriers moving transversely in at least one functional layer can be effectively prevented from moving transversely to the adjacent sub-pixels and causing other sub-pixels to emit light, thereby improving the display effect of the display panel and avoiding color cast and other situations.
Drawings
Other features, objects and advantages of the invention will become apparent from the following detailed description of non-limiting embodiments thereof, when read in conjunction with the accompanying drawings, in which like reference characters designate the same or similar parts throughout the figures thereof, and which are not to scale.
FIG. 1 is a top view of a display panel of one embodiment of the present invention;
FIG. 2 is an enlarged view of the display panel shown in FIG. 1 at Q;
FIG. 3 is a cross-sectional view of the first display panel shown in FIG. 1 taken along the direction B-B;
fig. 4 is a sectional view of the second display panel shown in fig. 1 taken along the direction B-B;
fig. 5 is a sectional view of the third display panel shown in fig. 1 taken along a direction B-B;
fig. 6 is a sectional view of the fourth display panel shown in fig. 1 taken along the B-B direction.
In the figure:
100-a display panel; AA-display area; AA 1-central subregion; AA 2-border sub-region; NA-non-display area;
11-a substrate; 12-a device layer;
20-pixel definition layer; 21-pixel openings;
31 — a first charge carrier layer; 31 a-a first carrier injection layer; 31 b-a first carrier transport layer; 32-a first conductive structure; 33-a second conductive structure; 34-a first electrode; 35-a light emitting layer; 36-a second electrode layer; 37-a second charge carrier layer; 371-first carrier blocking layer; 372-a second carrier transport layer; 373 — a second carrier injection layer;
41-a first conductive bump; 42-a second conductive bump;
50-sub-pixel; 51-red subpixel; 52-green sub-pixel; 53-blue subpixel;
60-a touch layer; 61-a conductive sublayer;
71-thin film encapsulation layer; 72-a protective layer; 73-encapsulating the cover plate.
Detailed Description
Features and exemplary embodiments of various aspects of the present invention will be described in detail below, and in order to make objects, technical solutions and advantages of the present invention more apparent, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not to be construed as limiting the invention. It will be apparent to one skilled in the art that the present invention may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present invention by illustrating examples of the present invention.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of another identical element in a process, method, article, or apparatus that comprises the element.
It will be understood that when a layer, region or layer is referred to as being "on" or "over" another layer, region or layer in describing the structure of the component, it can be directly on the other layer, region or layer or intervening layers or regions may also be present. Also, if the component is turned over, one layer or region may be "under" or "beneath" another layer or region.
Features of various aspects and exemplary embodiments of the present invention will be described in detail below. Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
In the process of manufacturing the OLED display panel, a common mask (common mask) is usually used for vapor deposition of a functional layer for manufacturing sub-pixels, so that a part of the functional layer is connected to each sub-pixel along a direction parallel to the plane of the display panel, and at this time, the part of the functional film is a common layer. When the display panel includes sub-pixels of multiple colors, for example, the display panel includes a red sub-pixel, a green sub-pixel, and a blue sub-pixel, the turn-on voltages of the red sub-pixel, the green sub-pixel, and the blue sub-pixel are not the same, the turn-on voltage of the blue sub-pixel is greater than the turn-on voltage of the green sub-pixel and greater than the turn-on voltage of the red sub-pixel, and the sub-pixel with the greater turn-on voltage interferes with the sub-pixel with the smaller turn-on voltage.
Specifically, during the display process of the display panel, when the blue sub-pixel is powered on to illuminate the blue sub-pixel, although the voltage mainly acts on the blue sub-pixel, because the conducting performance of the common layer is better, a part of the voltage is applied to the green sub-pixel and/or the red sub-pixel adjacent to the blue sub-pixel through the common layer, because the lighting voltages of the blue sub-pixel and the red sub-pixel are both less than the lighting voltage of the blue sub-pixel, the carriers moving in the common layer may cause the red sub-pixel and/or the green sub-pixel to be illuminated simultaneously, that is, crosstalk occurs to the red sub-pixel and/or the green sub-pixel, which causes the monochromatic light color coordinates in the low gray scale to be deviated, the white color coordinates to be shifted, or the low gray scale white matching to be failed.
In order to solve the above problems, embodiments of the invention provide a display panel 100 and a display device. The display panel 100 and the display device according to the embodiment of the present invention will be described in detail with reference to the accompanying drawings.
Referring to fig. 1 to 4 together, fig. 1 is a top view of a display panel according to an embodiment of the present invention, fig. 2 is an enlarged view of the display panel shown in fig. 1 at a position Q, fig. 3 is a cross-sectional view of a first display panel shown in fig. 1 along a direction B-B, and fig. 4 is a cross-sectional view of a second display panel shown in fig. 1 along the direction B-B.
The embodiment of the invention provides a display panel 100, which has a display area AA and a non-display area NA located at the outer periphery of the display area AA, and the display panel 100 includes a substrate 11, a pixel defining layer 20, a plurality of functional layers, a first conductive bump 41 and a second conductive bump 42. The display panel 100 further includes a plurality of sub-pixels 50 arranged in an array and located in the display area AA. The display panel 100 further includes a device layer 12, and the device layer 12 is located between the pixel defining layer 20 and the substrate 11. The device layer 12 may include pixel circuitry for driving the display of each sub-pixel 50.
The pixel defining layer 20 is located on one side of the substrate 11, and the pixel defining layer 20 includes a pixel opening 21 penetrating the pixel defining layer 20 in a thickness direction. The pixel opening 21 of the pixel defining layer 20 defines a light emitting region of the display panel 100, that is, a position of each sub-pixel 50, and the structure located in the pixel opening 21 is used for realizing display of the display panel 100.
At least some of the layers of the multi-layer functional layer extend on the side of the pixel defining layer 20 facing away from the substrate 11, so that at least some of the layers of the multi-layer functional layer are common layers. In order to form the sub-pixel 50, and to realize the light emitting display of the sub-pixel 50, as shown in fig. 3, the multi-layer functional layer includes at least a first electrode 34, a first carrier layer 31, a light emitting layer 35, a second carrier layer 37, and a second electrode layer 36, which are stacked in a direction away from the substrate 11. Further, the first carrier layer 31 may include a first carrier injection layer 31a and a first carrier transport layer 31b, and the second carrier layer 37 may include a first carrier blocking layer 371, a second carrier transport layer 372, and a second carrier injection layer 373 that are stacked in a direction away from the substrate 11.
In some embodiments, one of the first electrode 34 and the second electrode layer 36 is an anode and the other is a cathode, and the first electrode 34 is an anode and the second electrode layer 36 is a cathode layer. The first carrier injection Layer 31a is a Hole Injection Layer (HIL), the first carrier transport Layer 31b is a Hole Transport Layer (HTL), the first carrier Blocking Layer 371 is a Hole Blocking Layer (HBL), the second carrier transport Layer 372 is an Electron Transport Layer (ETL), and the second carrier injection Layer 373 is an Electron Injection Layer (EIL), wherein the Hole injection Layer, the Hole transport Layer, the Hole Blocking Layer, the Electron transport Layer, and the Electron injection Layer may be common layers. In a light-emitting display, hole carriers move to the light-emitting layer along the hole injection layer and the hole transport layer, electron carriers move to the light-emitting layer 35 along the electron injection layer, the electron transport layer, and the hole blocking layer, and holes and electrons react in the light-emitting layer 35 to cause the light-emitting layer 35 to emit light.
In order to prevent carriers corresponding to one of the sub-pixels 35 from moving laterally into the other sub-pixels 35, the multi-layer functional layer includes a first carrier layer 31, and the first carrier layer 31 is located on a surface of the pixel defining layer 20 facing away from the substrate 11 and in the pixel opening 21. The first conductive protrusion 41 is located on a side of the pixel defining layer 20 facing away from the substrate, and the first conductive protrusion 41 is in contact with the first carrier injection layer 31, and optionally, the first conductive protrusion 41 may be in contact with the first carrier injection layer 31a, so that carriers laterally moving by the first carrier injection layer 31a are transferred into the first conductive protrusion 41. The second conductive bump 42 is located on a side of the first conductive bump 41 away from the substrate 11, at least one functional layer is sandwiched between the second conductive bump 42 and the first conductive bump 41, the second conductive bump 42 is electrically connected to a conductive layer of the display panel 100, and the first conductive bump 41 and the second conductive bump 42 can form a current path. It is to be understood that when the first conductive bump 41 is located on a side of the pixel defining layer 20 facing away from the substrate, the first conductive bump 41 may be located on a sidewall of the pixel opening 21, or the first conductive bump 41 may be located between two adjacent pixel openings 21 and on a side of the pixel defining layer 20 facing away from the substrate.
According to the display panel 100 of the embodiment of the invention, the first conductive bump 41 and the second conductive bump 42 are provided, and at least one functional layer is sandwiched between the first conductive bump 41 and the second conductive bump 42, so that when a current path is formed between the first conductive bump 41 and the second conductive bump 42, carriers moving laterally in at least one functional layer can be led out through the current path between the first conductive bump 41 and the second conductive bump 42, or at least one functional layer sandwiched between the first conductive bump 41 and the second conductive bump 42 is disconnected by energy generated when power is applied between the first conductive bump 41 and the second conductive bump 42, so that the carriers moving laterally in at least one functional layer are effectively prevented from moving laterally to an adjacent subpixel 50 to cause light emission of other subpixels 50, thereby improving the display effect of the display panel 100 and avoiding situations such as color cast of a display screen.
Referring to fig. 2, in some embodiments, an orthographic projection of the first conductive bump 41 on the substrate 11 surrounds the pixel opening 21; and/or the orthographic projection of the second conductive bump 42 on the substrate 11 surrounds the pixel opening 21. Through the arrangement, the first conductive bumps 41 and the second conductive bumps 42 are matched with each other, so that the carriers moving transversely in at least one functional layer can be better prevented from moving transversely to the adjacent sub-pixels 50 to cause the other sub-pixels 50 to emit light.
When the sub-pixel 50 includes a red sub-pixel 51, a green sub-pixel 52 and a blue sub-pixel 53, since the turn-on voltage of the blue sub-pixel 53 is greater than the turn-on voltage of the green sub-pixel 52 and the turn-on voltage of the red sub-pixel 51, in order to prevent the turn-on voltage of the blue sub-pixel 53 from being large and generating crosstalk to the red sub-pixel 51 and the green sub-pixel 52, in some embodiments, a first conductive protrusion 41 may be disposed on the periphery of the pixel opening 21 corresponding to the blue sub-pixel 53, and a second conductive protrusion 42 may be disposed on a side of the first conductive protrusion 41 facing away from the substrate 11, so that the first conductive protrusion 41 and the second conductive protrusion 42 cooperate with each other to better prevent carriers moving laterally in at least one functional layer from moving laterally to the adjacent red sub-pixel 51 and green sub-pixel 52 and causing the other sub-pixels 50 to emit light. Of course, the first conductive bump 41 may be disposed on the periphery of the pixel opening 21 corresponding to the sub-pixel 50 of each emission color, and the second conductive bump 42 may be disposed on the side of the first conductive bump opposite to the substrate 11, as long as the effect of preventing the lateral crosstalk of carriers is achieved.
In a specific implementation, an orthogonal projection of the first conductive bump 41 on the substrate 11 surrounds the pixel opening 21, and an orthogonal projection of the second conductive bump 42 on the substrate 11 surrounds the pixel opening 21, at this time, an orthogonal projection of a blocking structure formed by the first conductive bump 41 and the second conductive bump 42 on the substrate can be on the whole periphery of each sub-pixel 50, and the first conductive bump 41 blocks at least one layer of first carriers in one of the sub-pixels 50 from moving into the adjacent sub-pixel 50 upwards and the second conductive bump 42 blocks at least one layer of second carriers in one of the sub-pixels 50 from moving into the adjacent sub-pixel 50 downwards.
Alternatively, the orthographic projection of the first conductive bump 41 on the substrate 11 surrounds the pixel opening 21, and the orthographic projection of the second conductive bump 42 on the substrate 11 is located on a partial outer peripheral side of the orthographic projection of the pixel opening 21 on the substrate 11. Still alternatively, the orthographic projection of the second conductive protrusion 42 on the substrate 11 surrounds the pixel opening 21, and the orthographic projection of the first conductive protrusion 41 on the substrate 11 is located on a partial outer periphery side of the orthographic projection of the pixel opening 21 on the substrate 11, at this time, the blocking structure formed by the structures of the first conductive protrusion 41 and the second conductive protrusion 42 can block a part or all of the carriers from moving laterally into the adjacent sub-pixel 50, so as to prevent the other sub-pixels 50 from emitting light.
In some embodiments, the material of the first conductive bump 41, and/or the second conductive bump 42 includes at least one of a transparent conductive material, a metal, and an alloy. The electric conductivity of the first conductive protrusion 41 and the second conductive protrusion 42 can be improved by reasonably arranging the materials of the first conductive protrusion 41 and the second conductive protrusion 42, so that a good current path is formed between the first conductive protrusion 41 and the second conductive protrusion 42. In specific implementation, the materials of the first conductive bump 41 and the second conductive bump 42 may be the same, for example, the materials of the first conductive bump 41 and the second conductive bump 42 may be metal or Indium Tin Oxide (ITO), and optionally, the materials of the first conductive bump 41 and the second conductive bump 42 may be one of silver, titanium, and molybdenum. The materials of the first conductive bump 41 and the second conductive bump 42 may be different, as long as a good conductive path can be formed.
In specific implementation, when the first conductive bump 41 and the second conductive bump 42 are made of metal, the first conductive bump 41 and the second conductive bump 42 in corresponding patterns may be formed by evaporation. When the first conductive bump 41 and the second conductive bump 42 are made of ITO, a layer of ITO may be deposited by sputtering, and then a layer of photoresist is prepared on the ITO layer and wet etching is performed to prepare the first conductive bump 41 and the second conductive bump 42.
Referring to fig. 3, in order to lead out the carriers moving laterally in the common layer, in some embodiments, the display panel 100 further includes a touch layer 60, the second conductive protrusion 42 is electrically connected to a conductive layer of the display panel 100, the conductive layer includes the touch layer 60, the touch layer 60 is located on a side of the multi-layer functional layer facing away from the substrate 11, the second conductive protrusion 42 is located on a surface of the touch layer 60 facing the substrate 11, the touch layer 60 includes a conductive sub-layer 61, and the second conductive protrusion 42 is electrically connected to the conductive sub-layer 61. Since the conductive sub-layer 61 is disposed on the touch layer 60, optionally, the conductive sub-layer 61 is an ITO conductive layer, so that carriers moving laterally in the common layer can be transmitted to the conductive sub-layer 61 through the first conductive bump 41 and the second conductive bump 42, and are connected to the ground circuit through the conductive sub-layer 61, thereby effectively guiding out the carriers moving laterally.
Based on this, in order to form a current path between the first conductive bump 41 and the second conductive bump 42 and enable carriers to be transmitted into the conductive sub-layer 61 of the touch layer 60 through the current path, in some embodiments, at least one functional layer sandwiched between the second conductive bump 42 and the first conductive bump 41 includes a first conductive structure 32 and a second conductive structure 33, where the first conductive structure 32 is sandwiched between the second conductive bump 42 and the first conductive bump 41, the second conductive structure 33 is located on an outer peripheral side of the first conductive structure 32, and a thickness of the first conductive structure 32 is smaller than a thickness of the second conductive structure 33. In the process, a certain pressing effect is performed on the first conductive structure 32 to reduce the thickness of the first conductive structure 32, and since the thickness of the first conductive structure 32 is smaller than the thickness of the second conductive structure 33, the impedance of the first conductive structure 32 with a smaller thickness is smaller than the impedance of the second conductive structure 33, most or all carriers move along the first conductive structure 32 with a smaller impedance, which is beneficial for leading out the carriers through the first conductive protrusion 41 and the second conductive protrusion 42, and preventing the lateral crosstalk of the carriers.
In order to effectively realize that the thickness of the first conductive structure 32 is smaller than that of the second conductive structure 33, so that the impedance of the first conductive structure 32 with the smaller thickness is smaller than that of the second conductive structure 33, optionally, at least a part of the first conductive protrusion 41 is arranged opposite to the first conductive protrusion 42, and by reasonably setting the positions of the first conductive protrusion 41 and the second conductive protrusion 42, the laterally moving carriers are conveniently led out.
Alternatively, when the current of the carriers is small, in order to lead out the carriers of the predetermined current, when the second electrode layer 36 is a cathode layer, the second electrode layer 36 is connected to the ground circuit, the second conductive protrusion 42 may be located on the surface of the second electrode layer 36 facing the first electrode 34, and the first conductive protrusion 41 may be located on the surface of the pixel defining layer 20 facing away from the substrate 11, and at this time, the first conductive protrusion 41 and the second conductive protrusion 42 cooperate with each other to lead out the carriers moving laterally.
Further, the second conductive bump 42 is electrically connected to a conductive layer of the display panel 100, and the display panel 100 may further include a conductive layer located between the second electrode layer 36 and the touch layer 60, where the conductive layer may be a metal conductive layer and is electrically connected to a ground circuit, so that the conductive layer leads out laterally moving carriers. Alternatively, the display panel 100 may further include a conductive layer located between the second electrode layer 36 and the first carrier layer 31, and the conductive layer is electrically connected to the ground circuit, or the display panel 100 may further include a conductive layer located between the second electrode layer 36 and at least one second carrier layer.
In some embodiments, the display panel 100 further includes a thin film encapsulation layer 71 and a protection layer 72, the thin film encapsulation layer 71 is located between the touch layer 60 and the multi-layer functional layer, in this case, the thin film encapsulation layer 71 is located between the first conductive bumps 41 and the second conductive bumps 42, the thin film encapsulation layer 71 includes through holes, the second conductive bumps 42 fill the through holes, and the protection layer 72 is located on a side of the touch layer 60 facing away from the substrate 11. Optionally, the second conductive bump 42 fills the through hole and extends to the surface of the second electrode layer 36 facing away from the substrate, such that the first conductive bump 41 and the second conductive bump 42 are electrically conductive through the multi-layer functional layers. By arranging the film packaging layer 71, the display panel 100 is packaged, and the display effect of the display panel 100 is prevented from being influenced by external water vapor and oxygen inside the display panel 100. Since the thin film encapsulation layer 71 is an insulating material in which inorganic layers and organic layers are sequentially stacked, in order to electrically connect the first conductive bump 41 and the second conductive bump 42, a current path can be formed between the first conductive bump 41 and the second conductive bump 42 by providing a through hole on the thin film encapsulation layer 71 and filling the through hole with the second conductive bump 42. Further, in order to improve the weakening of the packaging performance of the display panel 100 caused by the through holes formed in the film packaging layer 71, the protection layer 72 is disposed in the embodiment of the present invention, so as to better isolate external water vapor and oxygen and improve the packaging performance of the display panel 100.
Based on this, in order to prevent external moisture and oxygen from entering the inside of the display panel 100 through the side of the display panel 100, in some embodiments, the display panel 100 includes a display area AA for accommodating the sub-pixels 50, the display area AA includes a central sub-area AA1 and an edge sub-area AA2 surrounding the central sub-area AA1, and the first conductive bump 41 and the second conductive bump 42 are located in the central sub-area AA1. At this time, a portion of the thin film encapsulation layer 71 corresponding to the edge sub-area AA2 may not be provided with a via structure, so as to achieve good encapsulation performance. Meanwhile, since the first conductive bump 41 and the second conductive bump 42 are disposed in the central sub-area AA1, the lateral crosstalk of carriers between the sub-pixels 50 in the central sub-area AA1 can be prevented, and the display effect of the display panel 100 can also be improved.
The display panel 100 may be provided with not only the thin film encapsulation layer 71 to improve the encapsulation performance but also be encapsulated by glass Frit (Frit). Referring to fig. 4 and 5, fig. 4 is a sectional view of the second display panel shown in fig. 1 taken along a direction B-B, and fig. 5 is a sectional view of the third display panel shown in fig. 1 taken along the direction B-B. When the display panel 100 is packaged by Frit, the display panel 100 further includes a package cover 73, and the package cover 73 is located on a side of the touch layer 60 away from the substrate 11, in this case, the display panel 100 uses an in-cell touch technology, so that the first conductive bumps 41 can be electrically connected to the second conductive bumps 42 electrically connected to the touch layer 60.
When the first conductive bumps 41 and the second conductive bumps 42 cooperate to guide out the laterally moving carriers, optionally, the display panel 100 further includes a ground circuit (not shown in the figure), and the ground circuit is connected to the conductive sublayer 61, and with the above arrangement, the guided out carriers can be transmitted to the ground by the first conductive bumps 41, the second conductive bumps 42 and the conductive sublayer 61, so that the influence of the movement of the carriers in the touch layer 60 on the touch performance is prevented.
Since different doping materials are disposed in different functional layers, so that contact resistances between the first conductive bump 41 and the different functional layers are different, when the material of the first conductive bump 41 is metal or ITO, the first carrier injection layer 31a is doped with a doping material that facilitates carrier transmission into a metal layer or ITO layer, and the doping material in the first carrier transmission layer 31b is different from the doping material of the first carrier injection layer 31a, so that a contact resistance between the first conductive bump 41 and the first carrier injection layer 31a is small, a contact resistance between the first conductive bump 41 and the first carrier transmission layer 31b is large, in order to enable laterally moving carriers to be transmitted to and along the first conductive bump 41, in some embodiments, as shown in fig. 4, the first conductive bump 41 is located between the first carrier injection layer 31a and the pixel defining layer 20, or, as shown in fig. 5, the first conductive bump 41 is located on a side of the first carrier injection layer 31a away from the pixel defining layer 20, optionally, the first conductive bump 41 is located on a side of the first conductive bump 31a opposite to the first conductive bump surface of the first conductive bump 31a, and the first conductive bump 41 is located away from the pixel defining layer, and the first conductive bump 31a functions as the first conductive bump 31a, and the first conductive bump is used as a to define the first conductive bump. Alternatively, the first carrier injection layer 31a may include a through hole penetrating through the thickness thereof, and the first conductive protrusion 41 is located on the surface of the pixel defining layer 20 facing away from the substrate 11 and fills the through hole, so that the through hole facilitates positioning of the first conductive protrusion 41 and functions to guide out laterally moving carriers.
Referring to fig. 6, fig. 6 is a cross-sectional view of the fourth display panel shown in fig. 1 along a direction B-B. In some embodiments, when the multi-layer functional layer includes the first electrode 34, the light emitting layer 35 and the second electrode layer 36, the first electrode 34 is located between the pixel defining layer 20 and the substrate 11 and exposed to the pixel opening 21, the light emitting layer 35 is located in the pixel opening 21 and located on a side of the at least one first carrier layer 31 facing away from the first electrode 34, the second electrode layer 36 is located on a side of the light emitting layer 35 facing away from the substrate 11, and a portion of the second electrode layer 36 extends on a side of the pixel defining layer 20 facing away from the substrate 11.
The second conductive bump 42 is electrically connected to a conductive layer of the display panel 100, the conductive layer includes the second electrode layer 36, the second conductive bump 42 is located on a surface of the second electrode layer 36 facing the first electrode 34, and the first conductive bump 41 may be located on a surface of the pixel defining layer 20 facing away from the substrate 11. By disposing the second conductive protrusion 42 on the surface of the second electrode layer 36 facing the first electrode 34, when the second electrode layer 36 is a cathode, the second electrode layer 36 is connected to a ground circuit, thereby effectively guiding out laterally moving carriers. Or the functional layer clamped between the first conductive bump 41 and the second conductive bump 42 can be disconnected by energy generated when the first conductive bump 41 and the second conductive bump 42 are electrified, so that the lateral crosstalk of carriers can be effectively prevented. One of the first electrode 34 and the second electrode 36 is an anode, and the other is a cathode. Here, the first electrode 34 is taken as an anode, and the second electrode layer 36 is taken as a cathode.
Optionally, the second electrode layer 36 is a continuous structure. By providing the continuous second electrode layer 36, the display panel 100 can be manufactured easily, and power can be supplied to the second electrode layer 36 easily when the display panel 100 performs power on display. In a specific implementation, since the second electrode layer 36 has a continuous structure, it can be fabricated using a common mask (common mask), thereby improving the fabrication efficiency of the display panel 100.
When the second conductive bump 42 is located on the surface of the second electrode layer 36 facing the first electrode 34, in some embodiments, the first conductive bump 41 includes a first peak portion facing the second conductive bump 42, the second conductive bump 42 includes a second peak portion facing the first conductive bump 41, an orthographic projection of the first peak portion on the substrate 11 at least partially overlaps with an orthographic projection of the second peak portion on the substrate 11, and an orthographic projection of the first peak portion on the substrate 11 partially or completely overlaps with an orthographic projection of the second peak portion on the substrate 11. When the first electrode 34 and the second electrode layer 36 of one sub-pixel 50 are respectively supplied with power and an electric field exists, a current is formed between the first electrode 34 and the second electrode layer 36, the current is concentrated to a large amount of charges when passing through the first tip portion and the second tip portion, at this time, the first tip portion and the second tip portion can discharge, the energy generated by the discharge can disconnect the surface of the second conductive protrusion 42, which is positioned on the second electrode layer 36 and faces the first electrode 34, so that the common layer between the sub-pixels 50 is disconnected, and the lateral movement of carriers is prevented.
In some embodiments, under a predetermined electric field, the first tip portion and the second tip portion discharge and can disconnect at least one functional layer sandwiched between the first tip portion and the second tip portion, so as to effectively prevent a lateral movement of carriers.
Referring further to fig. 6, in order to facilitate the fabrication of the second conductive bump 42, when the multi-layer functional layer includes the second carrier layer 37, the second carrier layer 37 is located on a surface of the second electrode layer 36 facing the substrate 11, the second carrier layer 37 includes a groove extending from a surface of the second carrier layer 37 close to the second electrode layer 36 to the back away from the second electrode layer 36, and the second conductive bump 42 fills the groove. Optionally, the thickness of the recess is 10-100 angstroms. In the manufacturing process, a groove may be first formed in at least one second carrier layer 37, then a second conductive protrusion 42 is formed in the groove, and then the second electrode layer 36 is formed.
In summary, according to the display panel 100 of the embodiment of the invention, the display panel 100 includes the substrate 11, the pixel defining layer 20, the plurality of functional layers, the first conductive bumps 41 and the second conductive bumps 42, the pixel defining layer 20 includes the pixel openings 21 penetrating through the thickness thereof, and the sub-pixels 50 are formed in the pixel openings 21. In order to prevent carriers from moving to other adjacent sub-pixels 50 and causing other sub-pixels 50 to emit light, in the embodiment of the present invention, a first conductive bump 41 and a second conductive bump 42 are disposed, and at least one functional layer is interposed between the first conductive bump 41 and the second conductive bump 42, so that when a current path is formed between the first conductive bump 41 and the second conductive bump 42, carriers moving laterally in at least one functional layer can be led out through the current path between the first conductive bump 41 and the second conductive bump 42, or energy generated when electricity is conducted between the first conductive bump 41 and the second conductive bump 42 breaks the functional layer interposed between the first conductive bump 41 and the second conductive bump 42, so as to effectively prevent carriers moving laterally in at least one functional layer from moving laterally to adjacent sub-pixels 50 and causing other sub-pixels 50 to move laterally, thereby improving an effective display color shift of the display panel 100, and thereby improving an effective display color shift of the display panel, and the like, and thereby improving an effective display color shift of the display panel.
On the other hand, an embodiment of the present invention further provides a display device, including the display panel 100 of any of the above embodiments. In some embodiments, the display device further includes at least one camera assembly for capturing external light to generate an image of a corresponding object, and the camera assembly is connected to the display panel 100, so that the display panel 100 displays the image generated by the camera assembly. The display device provided by the embodiment of the invention can improve the light emission of other sub-pixels 50 caused by the movement of carriers to other adjacent sub-pixels 50, and can improve the display effect.
In accordance with the present invention, as described above, these embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention and various embodiments with various modifications as are suited to the particular use contemplated. The invention is limited only by the claims and their full scope and equivalents.

Claims (13)

1. A display panel, comprising:
a substrate;
a pixel defining layer on one side of the substrate, the pixel defining layer including a pixel opening penetrating the pixel defining layer in a thickness direction;
a multi-layer functional layer comprising a first charge carrier layer located within the pixel opening and a surface of the pixel defining layer facing away from the substrate;
the first conductive protrusion is positioned on one side, away from the substrate, of the pixel defining layer, and the first conductive protrusion is in contact with the first current carrier layer;
the second conductive protrusion is positioned on one side, away from the substrate, of the first conductive protrusion, and at least one functional layer is clamped between the second conductive protrusion and the first conductive protrusion;
wherein the first conductive bump and the second conductive bump are capable of forming a current path;
at least a part of the first conductive bump is disposed opposite to the second conductive bump in the thickness direction.
2. The display panel according to claim 1, wherein an orthographic projection of the first conductive bump on the substrate surrounds the pixel opening; and/or an orthographic projection of the second conductive bump on the substrate surrounds the pixel opening.
3. The display panel according to claim 1, wherein the material of the first conductive bump and/or the second conductive bump comprises at least one of a transparent conductive material, a metal, and an alloy.
4. The display panel of claim 1, wherein the second conductive bump is electrically connected to a conductive layer of the display panel, the conductive layer comprising a touch layer,
the touch layer is positioned on one side, away from the substrate, of the multilayer functional layer, the second conductive protrusions are positioned on the surface, facing the substrate, of the touch layer, the touch layer comprises a conductive sub-layer, and the second conductive protrusions are electrically connected with the conductive sub-layer;
the at least one functional layer sandwiched between the second conductive bump and the first conductive bump includes:
a first conductive structure and a second conductive structure, wherein the first conductive structure is sandwiched between the second conductive bump and the first conductive bump, the second conductive structure is located on an outer peripheral side of the first conductive structure,
wherein the thickness of the first conductive structure is less than the thickness of the second conductive structure.
5. The display panel according to claim 4, further comprising:
the film packaging layer is positioned between the touch layer and the multilayer functional layer and comprises a through hole, and the second conductive protrusion fills the through hole;
the protective layer is positioned on one side, away from the substrate, of the touch layer;
alternatively, the display panel further includes:
and the packaging cover plate is positioned on one side of the touch layer, which is deviated from the substrate.
6. The display panel of claim 5, further comprising a ground circuit, the ground circuit being connected to the conductive sublayer.
7. The display panel according to claim 5, wherein the display panel comprises a display area for accommodating the sub-pixels, the display area comprises a central sub-area and an edge sub-area surrounding the central sub-area, and the first conductive bump and the second conductive bump are located in the central sub-area.
8. The display panel according to claim 1, wherein the first conductive bump is located between the first current carrier layer and the pixel definition layer, or is located on a side of the first current carrier layer facing away from the pixel definition layer, or comprises a through hole penetrating through a thickness of the first current carrier layer, and the first conductive bump is located on a surface of the pixel definition layer facing away from the substrate and fills the through hole.
9. The display panel of claim 1, wherein the multi-layer functional layers further comprise:
a first electrode between the pixel defining layer and the substrate and exposed to the pixel opening;
the light-emitting layer is positioned in the pixel opening and positioned on one side, away from the first electrode, of the first carrier layer;
the second electrode layer is positioned on one side, away from the substrate, of the light emitting layer, and a part of the second electrode layer extends to one side, away from the substrate, of the pixel defining layer;
the second conductive bump is electrically connected with a conductive layer of the display panel, the conductive layer including a second electrode layer,
the second conductive protrusion is located on a surface of the second electrode layer facing the first electrode.
10. The display panel of claim 9, wherein the first conductive bump comprises a first tip portion facing the second conductive bump, wherein the second conductive bump comprises a second tip portion facing the first conductive bump, and wherein an orthographic projection of the first tip portion on the substrate at least partially overlaps an orthographic projection of the second tip portion on the substrate.
11. The display panel according to claim 10, wherein the first tip portion and the second tip portion are discharged and at least one of the functional layers interposed between the first tip portion and the second tip portion can be disconnected under a predetermined electric field.
12. The display panel of claim 11, wherein the multi-layer functional layers further comprise:
the second current carrier layer is located on the surface, facing the substrate side, of the second electrode layer and comprises a groove, the groove extends from the surface, close to the second electrode layer, to the back of the second electrode layer, and the second conductive protrusion fills the groove.
13. A display device characterized by comprising the display panel according to any one of claims 1 to 12.
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