CN111709114B - Design method and system of profile radiator - Google Patents
Design method and system of profile radiator Download PDFInfo
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- CN111709114B CN111709114B CN202010379062.3A CN202010379062A CN111709114B CN 111709114 B CN111709114 B CN 111709114B CN 202010379062 A CN202010379062 A CN 202010379062A CN 111709114 B CN111709114 B CN 111709114B
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- 238000013461 design Methods 0.000 title claims abstract description 55
- 238000000034 method Methods 0.000 title claims abstract description 30
- 238000004364 calculation method Methods 0.000 claims abstract description 36
- 238000012546 transfer Methods 0.000 claims abstract description 30
- 238000004088 simulation Methods 0.000 claims abstract description 28
- 230000008859 change Effects 0.000 claims abstract description 10
- 230000017525 heat dissipation Effects 0.000 claims description 29
- 238000006243 chemical reaction Methods 0.000 claims description 18
- 241000235648 Pichia Species 0.000 claims description 2
- 230000009471 action Effects 0.000 claims description 2
- 235000021110 pickles Nutrition 0.000 claims description 2
- 230000008569 process Effects 0.000 abstract description 8
- 230000006870 function Effects 0.000 description 29
- 238000004590 computer program Methods 0.000 description 10
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- G—PHYSICS
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- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
- G06F2119/08—Thermal analysis or thermal optimisation
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The invention relates to a design method and a design system of a profile radiator. The method comprises the following steps: dispersing the profile radiator into a plurality of radiating units in the depth direction and the X direction; establishing a simulation model corresponding to each radiating unit and a heat transfer model corresponding to the profile radiator; inputting the thermal boundary of each radiating unit, carrying out numerical simulation calculation on the temperature field and the surrounding flow field of each radiating unit under different design parameters according to the principle of heat transfer theory, generating a temperature field of a radiating body, and outputting a temperature calculation result; and generating an optimal parameter value corresponding to the design parameter according to the temperature calculation result. The invention considers the temperature change in the depth direction and the width direction of the profile radiator, and has high calculation accuracy; after the profile radiator is discretized into a plurality of radiating units, a centralized heat source or a distributed heat source can be precisely applied according to actual working conditions, so that the heat boundary input adaptability is wide, meanwhile, the physical process is clear, the calculation is quick, and the implementation of engineers of enterprises/factories is easy.
Description
[ field of technology ]
The invention relates to the field of radiators, in particular to a design method and a design system of a profile radiator.
[ background Art ]
The basic structure of the semiconductor device is a PN junction, the performance of the PN junction is closely related to the temperature, and in order to ensure the normal operation of the device, the highest junction temperature and the heat dissipation power corresponding to the highest junction temperature, namely the maximum heat dissipation power allowed by the device, must be specified. The maximum junction temperature and maximum heat dissipation power cannot be exceeded during normal operation of the device, otherwise the characteristics and parameters of the device will change and even permanently fail due to melting of the electrodes or semiconductor layers. But power electronics also consume a portion of the electrical energy through electrical-to-thermal conversion while delivering and processing electrical energy. In order to maintain proper operation of the device, the heat converted from the consumed electrical energy must be transferred out of the device in time and effectively dissipated to the environment.
With the advent of the 5G communications era, the semiconductor device has been reduced in size, the heating power density has been increased, and the above-mentioned heat dissipation problem has become a problem to be solved. Meanwhile, the radiator of the semiconductor component can only be installed in a limited space, and the radiator has a plurality of variables such as substrate thickness, fin spacing, fin height and the like, so that the radiator needs to search a plurality of design variables to find out the internal relation of the design variables in the product design process, thereby optimizing the structure of the profile radiator and reducing the thermal resistance of the radiator. The existing design method comprises an experimental test method and a three-dimensional checking calculation method, and experimental tests are generally carried out after a sample is designed and designed as a necessary link of a project. However, in the initial stage of product design, the design value is firstly calculated reasonably, or whether the design value is reasonable or not is firstly calculated, such as the required heat transfer area, the required cross-sectional area, the required fluid flow and the like, and the experiment and the sample modification are repeated repeatedly, so that the project progress can be influenced only by virtue of the experiment test, and the cost is increased. The three-dimensional checking calculation method is increasingly widely applied in the aspect of numerical calculation. Firstly, the model needs to be processed, including model simplification, gridding division and boundary condition definition, then submitted to a solver for solving, and finally, the calculation result is processed and extracted and displayed. This approach is easier to implement for simple or medium-scale models, but for complex models, not only requires a lot of time and skill to perform high quality meshing, but also it is difficult to optimize multiple design variables because of the difficulty in coupling between different physical quantities. Meanwhile, the type of the heat source and the action position of the radiator are not considered in the execution process of the method, so that the deviation between the calculated value and the experimental value is large.
[ invention ]
The invention provides a design method and a design system of a section radiator, which solve the technical problems.
The technical scheme for solving the technical problems is as follows: a design method of a profile radiator comprises the following steps:
step 1, dispersing a profile radiator into a plurality of radiating units in the depth direction and the X direction;
step 2, establishing a simulation model corresponding to each radiating unit and a heat transfer model corresponding to the section radiator, wherein the heat transfer model comprises a heat flow input module, a temperature output module and simulation models respectively corresponding to all radiating units;
step 3, inputting the thermal boundary of each radiating unit through the heat flow input module, performing numerical simulation calculation on the temperature field and the surrounding flow field of each radiating unit of the heat transfer model under different design parameters according to a heat transfer theory, generating a temperature field of a heat sink, and outputting a temperature calculation result through the temperature output module;
and 4, generating an optimal parameter value corresponding to the design parameter according to the temperature calculation result.
In a preferred embodiment, the dispersing the profile radiator into a plurality of radiating units in the depth direction and the X direction is specifically as follows: the profile radiator is discretized into 3-6 first radiating units according to the temperature change or the Pickle number of the profile radiator in the depth direction, and then each first radiating unit is discretized into 3-6 second radiating units again in the X direction according to the type of the heat source and/or the acting position of the heat source.
In a preferred embodiment, the simulation model corresponding to each second heat dissipation unit comprises a fin wall heat exchange element and a mass heat capacity element which are connected, wherein the mass heat capacity elements of two adjacent second heat dissipation units in the depth direction are connected through a first heat conduction element, and the mass heat capacity elements of two adjacent second heat dissipation units in the X direction are connected through a second heat conduction element; meanwhile, the fin wall heat exchange elements of each second radiating unit in the depth direction are sequentially connected, the fin wall heat exchange element of the foremost second radiating unit close to the inlet is connected with the wet air element through a mass flow to mass flow conversion element, the fin wall heat exchange element of the foremost second radiating unit close to the outlet is connected with the mass flow to mass flow conversion element, and a temperature sensor for detecting outlet wet air is arranged close to the mass flow to mass flow conversion element.
In a preferred embodiment, the heat flow input module comprises a piecewise function element, a first function element and a demultiplexer connected in sequence, the demultiplexer comprises a plurality of output ends, and each output end is connected with a mass heat capacity element of the second heat dissipation unit through a corresponding heat flow element respectively.
In a preferred embodiment, the temperature output module includes a multiplexer and a second function element, the output ends of the second heat dissipation units corresponding to the heat flow elements are respectively connected to the input ends of the multiplexer, and the output ends of the multiplexer are connected to the second function element and output the maximum value and the minimum value of the sampled temperature through the second function element.
In a preferred embodiment, the design parameters include base thickness, fin spacing, and/or fin height.
A second aspect of the embodiments of the present invention provides a design system of a profile radiator, including a discrete module, a model building module, a numerical calculation module, and a result generation module,
the discrete module is used for dispersing the profile radiator into a plurality of radiating units in the depth direction and the X direction;
the model building module is used for building a simulation model corresponding to each radiating unit and a heat transfer model corresponding to the section radiator, and the heat transfer model comprises a heat flow input module, a temperature output module and simulation models respectively corresponding to all radiating units;
the numerical calculation module is used for inputting the thermal boundary of each radiating unit through the heat flow input module, then carrying out numerical simulation calculation on the temperature field and the surrounding flow field of each radiating unit of the heat transfer model under different design parameters according to the principle of heat transfer, generating the temperature field of the heat sink, and outputting a temperature calculation result through the temperature output module;
and the result generation module is used for generating an optimal parameter value corresponding to the design parameter according to the temperature calculation result.
In a preferred embodiment, the discrete module is configured to discrete the profile radiator into 3-6 first heat dissipating units according to a temperature change or a pichia number of the profile radiator in a depth direction, and then discrete each first heat dissipating unit into 3-6 second heat dissipating units again in an X direction according to a heat source type and/or a heat source acting position.
In a preferred embodiment, the simulation model corresponding to each second heat dissipation unit comprises a fin wall heat exchange element and a mass heat capacity element which are connected, wherein the mass heat capacity elements of two adjacent second heat dissipation units in the depth direction are connected through a first heat conduction element, and the mass heat capacity elements of two adjacent second heat dissipation units in the X direction are connected through a second heat conduction element; meanwhile, the fin wall heat exchange elements of each second radiating unit in the depth direction are sequentially connected, the fin wall heat exchange element of the foremost second radiating unit close to the inlet is connected with the wet air element through a mass flow to mass flow conversion element, the fin wall heat exchange element of the foremost second radiating unit close to the outlet is connected with the mass flow to mass flow conversion element, and a temperature sensor for detecting outlet wet air is arranged close to the mass flow to mass flow conversion element.
In a preferred embodiment, the heat flow input module comprises a piecewise function element, a first function element and a demultiplexer connected in sequence, the demultiplexer comprises a plurality of output ends, and each output end is connected with a mass heat capacity element of the second heat dissipation unit through a corresponding heat flow element respectively.
In a preferred embodiment, the temperature output module includes a multiplexer and a second function element, the output ends of the second heat dissipation units corresponding to the heat flow elements are respectively connected to the input ends of the multiplexer, and the output ends of the multiplexer are connected to the second function element and output the maximum value and the minimum value of the sampled temperature through the second function element.
The invention provides a design method and a system of a section radiator, which have the following beneficial effects:
(1) The calculation accuracy is high, and not only the temperature change in the depth direction of the profile radiator, namely the Z direction, but also the temperature change in the width direction of the profile radiator, namely the X direction are considered;
(2) The profile radiator is scattered into a plurality of radiating units, and a centralized heat source or a distributed heat source and the like can be precisely applied according to actual working conditions, so that the heat boundary input adaptability is wide;
(3) The physical process of the model is clear, the calculation is quick, and the implementation of engineers of enterprises/factories is easy.
In order to make the above objects, features and advantages of the present invention more comprehensible, preferred embodiments accompanied with figures are described in detail below.
[ description of the drawings ]
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a flow chart of a design method of a profile radiator provided in embodiment 1;
fig. 2 is a front view of a medium heat sink of embodiment 1;
FIG. 3 is a top view of a discrete heat dissipating unit of a medium heat sink according to embodiment 1;
FIG. 4 is a diagram of a heat transfer model corresponding to the discrete rear profile heat sink of example 1;
FIG. 5 is a schematic diagram showing the connection of the heat flow input module in embodiment 1;
FIG. 6 is a schematic diagram showing connection of the temperature output module in embodiment 1;
fig. 7 is a schematic structural diagram of a design system of a profile radiator provided in embodiment 2.
[ detailed description ] of the invention
In order to make the objects, technical solutions and advantageous technical effects of the present invention more apparent, the present invention will be further described in detail with reference to the accompanying drawings and detailed description. It should be understood that the detailed description is intended to illustrate the invention, and not to limit the invention.
Fig. 1 is a flow chart of a design method of a profile radiator provided in embodiment 1, as shown in fig. 1, including the following steps:
and step 1, dispersing the profile radiator into a plurality of radiating units in the depth direction and the X direction. Taking an extruded profile heat sink as an example, as shown in the front view of the profile heat sink of fig. 2, the profile heat sink can be structurally divided into fins and a substrate, and design parameters that can be explored include: base thickness (base height), fin thickness (fintherickness), fin pitch (FinPitch), fin height (FinHeight), and the like. In this embodiment, the profile radiator is first dispersed into 3-6 first radiating units, such as 5 first radiating units, according to the temperature change or the number of the first radiating units in the depth direction, and then each first radiating unit is dispersed into 3-6 second radiating units, such as 5 second radiating units, according to the type of the heat source and/or the acting position of the heat source, so that the total of 25 second radiating units are dispersed as shown in fig. 3.
And then executing step 2, and establishing a simulation model corresponding to each second radiating unit and a heat transfer model corresponding to the section radiator, wherein the heat transfer model comprises a heat flow input module, a temperature output module and simulation models corresponding to all radiating units respectively, and the simulation models can be implemented by adopting AMESIM software, and the heat transfer models are mainly built by adopting Thermal, two-Phase flow and Signal Control libraries. Fig. 4 is a heat transfer model diagram of a discrete back profile radiator, as shown in fig. 4, a simulation model corresponding to each second radiating unit includes a fin wall heat exchange element 5 and a mass heat capacity element 3 which are connected, and the mass heat capacity elements 3 of two adjacent second radiating units in the depth direction are connected through a first heat conduction element 4, and the mass heat capacity elements 3 of two adjacent second radiating units in the X direction are connected through a second heat conduction element 8; meanwhile, the fin wall heat exchange elements 5 of each second heat radiating unit in the depth direction are sequentially connected, the fin wall heat exchange element 5 of the foremost second heat radiating unit close to the inlet is connected with the wet air element 1 through the mass flow to mass flow conversion element 2, the fin wall heat exchange element 5 of the foremost second heat radiating unit close to the outlet is connected with the mass flow to mass flow conversion element 6, and a temperature sensor 7 for detecting outlet wet air is arranged close to the mass flow to mass flow conversion element 6.
In terms of the input thermal boundary of the preferred embodiment, a constant heat flow element 9 may be used, i.e. one heat flow element 9 is assigned to the mass heat capacity element 3 of each second heat sink unit, as shown in fig. 4. And for varying heat flows, or when there is a temperature sampling requirement, a piecewise function may be used for input. In particular, the preferred heat flow input module comprises a piecewise function element 10, a first function element 11 and a demultiplexer 12 connected in sequence, the demultiplexer 12 comprising a plurality of outputs, and each output being connected to a mass heat capacity element 3 of the second heat sink unit via a corresponding heat flow element 9, respectively, as shown in fig. 5.
In another preferred embodiment, the temperature output module includes a multiplexer 13 and a second function element 14, the output ends of the second heat dissipation units corresponding to the heat flow elements 9 are respectively connected to the input ends of the multiplexer 13, the output ends of the multiplexer 13 are connected to the second function element 14, and the maximum value function Max (), the minimum value function Mi n () and the maximum value and the minimum value of the sampled temperature are output through the second function element 14, as shown in fig. 6.
And then executing step 3, inputting the thermal boundary of each radiating unit through a heat flow input module, carrying out numerical simulation calculation on the temperature field and the surrounding flow field of each radiating unit of the heat transfer model under different design parameters according to the principle of heat transfer, generating a temperature field of the heat radiation body, and outputting a temperature calculation result through a temperature output module. The specific numerical simulation calculation process is described in the prior literature or patent, and can be implemented by various software, and is not described in detail here.
And finally, generating optimal parameter values of design parameters such as substrate thickness, fin spacing, fin height and the like according to the temperature calculation result.
It should be understood that the sequence number of each step in the foregoing embodiment does not mean that the execution sequence of each process should be determined by the function and the internal logic, and should not limit the implementation process of the embodiment of the present invention.
The embodiment of the invention also provides a computer readable storage medium which stores a computer program, and when the computer program is executed by a processor, the design method of the profile radiator is realized.
Fig. 7 is a schematic structural diagram of the design system of the profile radiator provided in embodiment 2, as shown in fig. 7, including a discrete module 100, a model building module 200, a numerical calculation module 300 and a result generation module 400,
the discrete module 100 is used for dispersing the profile radiator into a plurality of radiating units in the depth direction and the X direction;
the model building module 200 is used for building a simulation model corresponding to each heat dissipation unit and a heat transfer model corresponding to the profile radiator, wherein the heat transfer model comprises a heat flow input module, a temperature output module and simulation models corresponding to all heat dissipation units respectively;
the numerical calculation module 300 is used for inputting the thermal boundary of each heat dissipation unit through the heat flow input module, then carrying out numerical simulation calculation on the temperature field and the surrounding flow field of each heat dissipation unit of the heat transfer model under different design parameters according to the principle of heat transfer theory, generating a temperature field of the heat dissipation body, and outputting a temperature calculation result through the temperature output module;
the result generation module 400 is configured to generate an optimal parameter value corresponding to the design parameter according to the temperature calculation result.
In a preferred embodiment, the discrete module 100 is specifically configured to discrete the profile radiator into 3-6 first heat dissipating units according to the temperature change or the number of the first heat dissipating units in the depth direction, and then discrete each first heat dissipating unit into 3-6 second heat dissipating units again in the X direction according to the type of the heat source and/or the acting position of the heat source.
In a preferred embodiment, the simulation model corresponding to each second heat dissipation unit comprises a fin wall heat exchange element 5 and a mass heat capacity element 3 which are connected, wherein the mass heat capacity elements of two adjacent second heat dissipation units in the depth direction are connected through a first heat conduction element 4, and the mass heat capacity elements of two adjacent second heat dissipation units in the X direction are connected through a second heat conduction element 8; meanwhile, the fin wall heat exchange elements 5 of each second heat dissipation unit are sequentially connected in the depth direction, the fin wall heat exchange element 5 of the foremost second heat dissipation unit close to the inlet is connected with the wet air element 1 through the mass flow to mass flow conversion element 2, the fin wall heat exchange element 5 of the foremost second heat dissipation unit close to the outlet is connected with the mass flow to mass flow conversion element 6, and the temperature sensor 7 for detecting outlet wet air is arranged close to the mass flow to 7.
In a preferred embodiment, the heat flow input module comprises a piecewise function element 10, a first function element 11 and a demultiplexer 12 connected in sequence, the demultiplexer 12 comprising a plurality of outputs, and each output being connected to the mass heat capacity element 3 of the second heat dissipating unit via a corresponding heat flow element 9, respectively;
the temperature output module comprises a multiplexer 13 and a second function element 14, wherein the output ends of the second heat dissipation units corresponding to the heat flow elements 9 are respectively connected with the input ends of the multiplexer 13, the output ends of the multiplexer 13 are connected with the second function element 14, and the maximum value and the minimum value of the sampled temperature are output through the second function element 14.
The embodiment of the invention also provides a design terminal of the profile radiator, which comprises a computer readable storage medium and a processor, wherein the processor realizes the steps of the design method of the profile radiator when executing a computer program on the computer readable storage medium. The design terminal of the profile radiator of this embodiment includes: a processor, a readable storage medium, and a computer program stored in the readable storage medium and executable on the processor. The steps of the various method embodiments described above, such as steps 1 through 4 shown in fig. 1, are implemented when the processor executes a computer program. Alternatively, the processor, when executing the computer program, implements the functions of the modules in the above-described system embodiments, such as the functions of the modules 100 to 400 shown in fig. 7.
For example, a computer program may be split into one or more modules, one or more modules stored in a readable storage medium and executed by a processor to perform the present invention. One or more of the modules may be a series of computer program instruction segments capable of performing a specific function for describing the execution of a computer program in a design terminal of a profile heat sink.
The design terminal of the profile heat sink may include, but is not limited to, a processor, a readable storage medium. The processor may be a central processing unit (Central Processing Unit, CPU), other general purpose processors, digital signal processors (Digital Signal Processor, DSP), application specific integrated circuits (Application Specific Integrated Circuit, ASIC), off-the-shelf programmable gate arrays (Field-Programmable Gate Array, FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, or the like. A general purpose processor may be a microprocessor or the processor may be any conventional processor or the like.
The readable storage medium may be an internal storage unit of the design terminal of the profile heat sink, such as a hard disk or a memory of the design terminal of the profile heat sink. The readable storage medium may also be an external storage device of a design terminal of the profile radiator, such as a plug-in hard disk, smart Media Card (SMC), secure Digital (SD) Card, flash memory Card (Flash Card) or the like provided on the design terminal of the profile radiator. Further, the readable storage medium may also include both an internal storage unit and an external storage device of the design terminal of the profile heat sink. The readable storage medium is used for storing computer programs and other programs and data required by the design terminal of the profile radiator. The readable storage medium may also be used to temporarily store data that has been output or is to be output.
It will be apparent to those skilled in the art that, for convenience and brevity of description, only the above-described division of the functional units and modules is illustrated, and in practical application, the above-described functional distribution may be performed by different functional units and modules according to needs, i.e. the internal structure of the apparatus is divided into different functional units or modules to perform all or part of the above-described functions. The functional units and modules in the embodiment may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit, where the integrated units may be implemented in a form of hardware or a form of a software functional unit. In addition, specific names of the functional units and modules are only for convenience of distinguishing from each other, and are not used for limiting the protection scope of the present application. The specific working process of the units and modules in the above system may refer to the corresponding process in the foregoing method embodiment, which is not described herein again.
In the foregoing embodiments, the descriptions of the embodiments are emphasized, and in part, not described or illustrated in any particular embodiment, reference is made to the related descriptions of other embodiments.
Those of ordinary skill in the art will appreciate that the elements and method steps of the examples described in connection with the embodiments disclosed herein can be implemented as electronic hardware, or as a combination of computer software and electronic hardware. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present invention.
In the embodiments provided in the present invention, it should be understood that the disclosed apparatus/terminal device and method may be implemented in other manners. For example, the apparatus/terminal device embodiments described above are merely illustrative, e.g., the division of modules or units is merely a logical function division, and there may be additional divisions when actually implemented, e.g., multiple units or components may be combined or integrated into another system, or some features may be omitted or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection via interfaces, devices or units, which may be in electrical, mechanical or other forms.
The units described as separate units may or may not be physically separate, and units shown as units may or may not be physical units, may be located in one place, or may be distributed over a plurality of network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
In addition, each functional unit in the embodiments of the present invention may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit. The integrated units may be implemented in hardware or in software functional units.
The present invention is not limited to the details and embodiments described herein, and thus additional advantages and modifications may readily be made by those skilled in the art, without departing from the spirit and scope of the general concepts defined in the claims and the equivalents thereof, and the invention is not limited to the specific details, representative apparatus and illustrative examples shown and described herein.
Claims (6)
1. The design method of the profile radiator is characterized by comprising the following steps of:
step 1, dispersing a profile radiator into a plurality of radiating units in the depth direction and the X direction: dispersing the profile radiator into 3-6 first radiating units according to the temperature change or the Pickle number of the profile radiator in the depth direction, and dispersing each first radiating unit into 3-6 second radiating units again in the X direction according to the type of the heat source and/or the acting position of the heat source;
step 2, establishing a simulation model corresponding to each radiating unit and a heat transfer model corresponding to the section radiator, wherein the heat transfer model comprises a heat flow input module, a temperature output module and simulation models respectively corresponding to all radiating units;
step 3, inputting the thermal boundary of each radiating unit through the heat flow input module, performing numerical simulation calculation on the temperature field and the surrounding flow field of each radiating unit of the heat transfer model under different design parameters according to a heat transfer theory, generating a temperature field of a heat sink, and outputting a temperature calculation result through the temperature output module;
step 4, generating an optimal parameter value corresponding to the design parameter according to the temperature calculation result;
the simulation model corresponding to each second heat radiating unit comprises a fin wall heat exchanging element and a mass heat capacity element which are connected, wherein the mass heat capacity elements of two adjacent second heat radiating units in the depth direction are connected through a first heat conducting element, and the mass heat capacity elements of two adjacent second heat radiating units in the X direction are connected through a second heat conducting element; meanwhile, the fin wall heat exchange elements of each second radiating unit in the depth direction are sequentially connected, the fin wall heat exchange element of the foremost second radiating unit close to the inlet is connected with the wet air element through a mass flow to mass flow conversion element, the fin wall heat exchange element of the foremost second radiating unit close to the outlet is connected with the mass flow to mass flow conversion element, and a temperature sensor for detecting outlet wet air is arranged close to the mass flow to mass flow conversion element.
2. The method according to claim 1, wherein the heat flow input module comprises a piecewise function element, a first function element and a demultiplexer connected in sequence, the demultiplexer comprises a plurality of output ends, and each output end is connected with a mass heat capacity element of the second heat dissipating unit through a corresponding heat flow element.
3. The method according to claim 2, wherein the temperature output module comprises a multiplexer and a second function element, the output ends of the second heat dissipation units corresponding to the heat flow elements are respectively connected with the input ends of the multiplexer, the output ends of the multiplexer are connected with the second function element, and the maximum value and the minimum value of the sampled temperature are output through the second function element.
4. A method of designing a profile heat sink according to claim 3, wherein the design parameters include base thickness, fin spacing and/or fin height.
5. A design system of a profile radiator is characterized by comprising a discrete module, a model building module, a numerical calculation module and a result generation module,
the discrete module is used for dispersing the profile radiator into 3-6 first radiating units according to the temperature change or the Pichia number of the profile radiator in the depth direction, and dispersing each first radiating unit into 3-6 second radiating units again in the X direction according to the type of the heat source and/or the action position of the heat source;
the model building module is used for building a simulation model corresponding to each radiating unit and a heat transfer model corresponding to the section radiator, and the heat transfer model comprises a heat flow input module, a temperature output module and simulation models respectively corresponding to all radiating units;
the numerical calculation module is used for inputting the thermal boundary of each radiating unit through the heat flow input module, then carrying out numerical simulation calculation on the temperature field and the surrounding flow field of each radiating unit of the heat transfer model under different design parameters according to the principle of heat transfer, generating the temperature field of the heat sink, and outputting a temperature calculation result through the temperature output module;
the result generation module is used for generating an optimal parameter value corresponding to the design parameter according to the temperature calculation result;
the simulation model corresponding to each second heat radiating unit comprises a fin wall heat exchanging element and a mass heat capacity element which are connected, wherein the mass heat capacity elements of two adjacent second heat radiating units in the depth direction are connected through a first heat conducting element, and the mass heat capacity elements of two adjacent second heat radiating units in the X direction are connected through a second heat conducting element; meanwhile, the fin wall heat exchange elements of each second radiating unit in the depth direction are sequentially connected, the fin wall heat exchange element of the foremost second radiating unit close to the inlet is connected with the wet air element through a mass flow to mass flow conversion element, the fin wall heat exchange element of the foremost second radiating unit close to the outlet is connected with the mass flow to mass flow conversion element, and a temperature sensor for detecting outlet wet air is arranged close to the mass flow to mass flow conversion element.
6. The profile radiator design system of claim 5, wherein the heat flow input module includes a piecewise function element, a first function element, and a demultiplexer connected in sequence, the demultiplexer including a plurality of outputs, each output being connected to a mass heat capacity element of the second heat dissipating unit via a corresponding heat flow element, respectively;
the temperature output module comprises a multiplexer and a second function element, the output ends of the second heat dissipation units corresponding to the heat flow elements are respectively connected with the input ends of the multiplexer, the output ends of the multiplexer are connected with the second function element, and the maximum value and the minimum value of the sampled temperature are output through the second function element.
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