CN111704875A - Hot-melt protective adhesive and preparation method and application thereof - Google Patents
Hot-melt protective adhesive and preparation method and application thereof Download PDFInfo
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- CN111704875A CN111704875A CN202010635903.2A CN202010635903A CN111704875A CN 111704875 A CN111704875 A CN 111704875A CN 202010635903 A CN202010635903 A CN 202010635903A CN 111704875 A CN111704875 A CN 111704875A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/08—Copolymers of ethene
- C09J123/0807—Copolymers of ethene with unsaturated hydrocarbons only containing more than three carbon atoms
- C09J123/0815—Copolymers of ethene with aliphatic 1-olefins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J153/02—Vinyl aromatic monomers and conjugated dienes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2207/00—Properties characterising the ingredient of the composition
- C08L2207/04—Thermoplastic elastomer
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Abstract
The invention relates to the technical field of adhesives, in particular to a hot-melt protective adhesive and a preparation method and application thereof. The hot-melt protective adhesive at least comprises the following components in parts by weight: 70-120 parts of thermoplastic elastomer, 10-30 parts of tackifying resin, 5-20 parts of polyolefin copolymer and 0.1-3 parts of antioxidant. The invention provides a hot-melt protective adhesive which is prepared from a thermoplastic elastomer, tackifying resin, a polyolefin copolymer and an antioxidant, is solid at normal temperature, has no odor, and is convenient to store and transport; after being heated and melted, the mixed solution is sprayed on the surface of a circuit board, and is physically cooled and solidified, solidification equipment is not needed, the solidification rate is high, generally 30s, the construction process is simple, and the efficiency is high; the cured paint film has the characteristics of excellent water resistance and condensation resistance, the coating thickness is only 1/3 of the normal encapsulation thickness, and the coating can be disassembled by heating and is easy to repair.
Description
Technical Field
The invention relates to the technical field of adhesives, in particular to a hot-melt protective adhesive and a preparation method and application thereof.
Background
The circuit board in the electronic and electrical equipment is easily corroded by external environment (moisture, mould, salt mist, high dust, vibration, corrosive gas and the like) in the using process, so that the problems of electric leakage, short circuit, aging, welding spot falling/breaking, electrochemical corrosion, ion migration and the like of the circuit board occur, the quality of the circuit board is influenced, the service life of the circuit board is shortened, serious potential safety hazards exist, and the life safety of people is threatened. In order to improve the performance stability and quality reliability of products, enterprises pay more and more attention to the anticorrosion protection of circuit boards of electronic and electrical equipment in production and manufacturing, and can be divided into thin-layer coating, thick-layer coating and encapsulation according to different anticorrosion grades.
Generally, the dressing material only has the functions of moisture prevention and corrosion prevention, but cannot meet the waterproof requirement. Aiming at equipment which works in a high-humidity environment for a long time, such as: the washing machine, the dish washing machine, the gas stove, the sweeping robot, the mower and the like, as well as the charging pile, the windmill and other equipment arranged outdoors, the use temperature is-40 ℃ to +60 ℃, and the humidity can reach 5-95%. It is subjected to various severe environments like high and low temperatures, rain and snow, wind and sand, dust, acid rain, mosquitoes, corrosive gases, vibrations, and the like. Generally, the dressing material only has the functions of moisture prevention and corrosion prevention, but cannot meet the waterproof requirement. Therefore, the wiring board is often potted. However, the potting process is cumbersome and inefficient. Taking the two-component pouring sealant as an example, the method at least comprises 5 procedures of mixing, stirring, defoaming, pouring sealant, curing and the like, wherein the curing time is at least 24 hours, so that the production efficiency is seriously reduced; meanwhile, the thickness of the potting colloid is generally required to be more than 2mm, so that the circuit board looks very thick and heavy. Therefore, the problems of low waterproof grade, complex encapsulation process and low efficiency are always the problems to be solved in the field of PCBA protection of electronic products.
Aiming at the technical problems, the invention provides the hot-melt protective adhesive which is applied to the field of electronic product protective collars, has excellent waterproof performance, simple construction process and easy repair.
Disclosure of Invention
In order to solve the technical problems, the first aspect of the invention provides a hot-melt protective adhesive, which comprises the following raw materials in parts by weight: 70-120 parts of thermoplastic elastomer, 10-30 parts of tackifying resin, 5-20 parts of polyolefin copolymer and 0.1-3 parts of antioxidant.
In a preferred embodiment of the present invention, the thermoplastic elastomer is a styrene-based thermoplastic elastomer and/or a polyolefin-based thermoplastic elastomer.
In a preferred embodiment of the present invention, the styrenic thermoplastic elastomer is at least one selected from the group consisting of a styrene-butadiene-styrene block copolymer, a styrene-isoprene-styrene block copolymer, a styrene-ethylene-butylene-styrene block copolymer, and a styrene-ethylene-propylene-styrene block copolymer.
As a preferred technical scheme of the invention, the content of the styrene in the styrene-isoprene-styrene block copolymer is 5-30 wt%.
As a preferred embodiment of the present invention, the polyolefin thermoplastic elastomer has a melt flow rate of 0.5 to 30g/10 min.
In a preferred embodiment of the present invention, the weight ratio of the styrenic thermoplastic elastomer to the polyolefin thermoplastic elastomer is 1: (0.6-1.5).
In a preferred embodiment of the present invention, the polyolefin copolymer is polypropylene.
As a preferred technical scheme of the invention, the melting temperature of the polypropylene is 100-160 ℃.
The second aspect of the invention provides a preparation method of the hot-melt protective adhesive, which comprises the following steps: adding the thermoplastic elastomer, the tackifying resin, the modified resin and the antioxidant into a reaction kettle, introducing inert gas, and stirring for 2-5 hours at the temperature of 150-190 ℃; then defoaming for 1-5h under the condition that the vacuum degree is 0.01-0.09MPa, thus obtaining the composite material.
The third aspect of the invention provides application of the hot-melt protective adhesive, which is applied to the field of protection of electronic products PCBA.
Advantageous effects
The invention provides a hot-melt protective adhesive which is prepared from a thermoplastic elastomer, tackifying resin, a polyolefin copolymer and an antioxidant, is solid at normal temperature, has no odor, and is convenient to store and transport; after being heated and melted, the mixed solution is sprayed on the surface of a circuit board, and is physically cooled and solidified, solidification equipment is not needed, the solidification speed is high, generally 30s, the construction process is simple, and the efficiency is high; the cured paint film has the characteristics of excellent water resistance and condensation resistance, the thickness of the paint film is only 1/3 of the normal encapsulation thickness, and the paint film is easy to remove and repair after heating.
Detailed Description
The disclosure may be understood more readily by reference to the following detailed description of preferred embodiments of the invention and the examples included therein. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. In case of conflict, the present specification, including definitions, will control.
The term "prepared from …" as used herein is synonymous with "comprising". The terms "comprises," "comprising," "includes," "including," "has," "having," "contains," "containing," or any other variation thereof, as used herein, are intended to cover a non-exclusive inclusion. For example, a composition, process, method, article, or apparatus that comprises a list of elements is not necessarily limited to only those elements but may include other elements not expressly listed or inherent to such composition, process, method, article, or apparatus.
The conjunction "consisting of …" excludes any unspecified elements, steps or components. If used in a claim, the phrase is intended to claim as closed, meaning that it does not contain materials other than those described, except for the conventional impurities associated therewith. When the phrase "consisting of …" appears in a clause of the subject matter of the claims rather than immediately after the subject matter, it defines only the elements described in the clause; other elements are not excluded from the claims as a whole.
When an amount, concentration, or other value or parameter is expressed as a range, preferred range, or as a range of upper preferable values and lower preferable values, this is to be understood as specifically disclosing all ranges formed from any pair of any upper range limit or preferred value and any lower range limit or preferred value, regardless of whether ranges are separately disclosed. For example, when a range of "1 to 5" is disclosed, the described range should be interpreted to include the ranges "1 to 4", "1 to 3", "1 to 2 and 4 to 5", "1 to 3 and 5", and the like. When a range of values is described herein, unless otherwise stated, the range is intended to include the endpoints thereof and all integers and fractions within the range.
The singular forms "a", "an" and "the" include plural referents unless the context clearly dictates otherwise. "optional" or "any" means that the subsequently described event or events may or may not occur, and that the description includes instances where the event occurs and instances where it does not.
Approximating language, as used herein throughout the specification and claims, is intended to modify a quantity, such that the invention is not limited to the specific quantity, but includes portions that are literally received for modification without substantial change in the basic function to which the invention is related. Accordingly, the use of "about" to modify a numerical value means that the invention is not limited to the precise value. In some instances, the approximating language may correspond to the precision of an instrument for measuring the value. In the present description and claims, range limitations may be combined and/or interchanged, including all sub-ranges contained therein if not otherwise stated.
In addition, the indefinite articles "a" and "an" preceding an element or component of the invention are not intended to limit the number requirement (i.e., the number of occurrences) of the element or component. Thus, "a" or "an" should be read to include one or at least one, and the singular form of an element or component also includes the plural unless the stated number clearly indicates that the singular form is intended.
In order to solve the technical problems, the first aspect of the invention provides a hot-melt protective adhesive, which comprises the following raw materials in parts by weight: 70-120 parts of thermoplastic elastomer, 10-30 parts of tackifying resin, 5-20 parts of polyolefin copolymer and 0.1-3 parts of antioxidant.
In a preferred embodiment, the preparation raw materials of the protective glue at least comprise the following components in parts by weight: 100 parts of thermoplastic elastomer, 20 parts of tackifying resin, 10 parts of polyolefin copolymer and 2 parts of antioxidant.
Thermoplastic elastomer
Thermoplastic elastomers, abbreviated as TPE or TPR, are abbreviations for Thermoplastic rubbers. The elastomer has the elasticity of rubber at normal temperature and can be plastically molded at high temperature. The thermoplastic elastomer has the structural characteristics that different resin segments and rubber segments are formed by chemical bonds, the resin segments form physical cross-linking points by virtue of inter-chain acting force, and the rubber segments are high-elasticity segments and contribute to elasticity. The physical cross-linking of the plastic segment changes reversibly with temperature, indicating the plastic processing characteristics of the thermoplastic elastomer. Therefore, thermoplastic elastomers have the physical and mechanical properties of vulcanized rubber and the processing properties of thermoplastics, are a novel polymer material between rubber and resin, and are often called third-generation rubber.
In the present invention, the thermoplastic elastomer is a styrene-based thermoplastic elastomer and/or a polyolefin-based thermoplastic elastomer.
Styrene thermoplastic elastomer
Styrenic thermoplastic elastomers (styrenic TPES), the main category of thermoplastic elastomers, styrenic thermoplastic elastomers (or styrenic block copolymers) are the most widely used ones because they can be mixed with a wide variety of materials such as fillers, extenders, modifiers, and other resins.
In the present invention, the styrenic thermoplastic elastomer is at least one selected from the group consisting of a styrene-butadiene-styrene block copolymer, a styrene-isoprene-styrene block copolymer, a styrene-ethylene-butylene-styrene block copolymer, and a styrene-ethylene-propylene-styrene block copolymer.
In a preferred embodiment, the styrenic thermoplastic elastomer is a styrene-isoprene-styrene block copolymer.
In a more preferred embodiment, the styrene content of the styrene-isoprene-styrene block copolymer is 5 to 30 wt%.
In a most preferred embodiment, the styrene content of the styrene-isoprene-styrene block copolymer is 10 to 20 wt%.
In a preferred embodiment, the styrene-isoprene-styrene block copolymer has a melt flow rate of 5 to 20g/10 min.
In a preferred embodiment, the styrene-isoprene-styrene block copolymer has a melt flow rate of 13 to 18g/10 min.
Melt flow rate (abbreviated as MFR, melt mass flow rate), also referred to as Melt Index (MI), is the gram of melt flowing through a standard capillary over a period of time (typically 10min) in g/10min at a certain temperature and pressure in a standardized melt index apparatus. The melt flow rate is an important reference basis for selecting plastic processing materials and brands, so that the selected raw materials can better meet the requirements of the processing technology, and the reliability and the quality of the formed product are improved. The melt flow rate of the invention is 230 ℃/2.16 kg.
In the present invention, the source of the styrene-isoprene-styrene block copolymer is not particularly limited, and Italy Eini, model SOL TE9133, SOL TE 9131 and the like can be mentioned.
Polyolefin thermoplastic elastomer
The polyolefin thermoplastic elastomer is a high-performance polyolefin product, has rubber elasticity at normal temperature, and has the characteristics of small density, large bending, high low-temperature impact resistance, easy processing, reusability and the like.
In the present invention, the melt flow rate of the polyolefin thermoplastic elastomer is 0.5 to 30g/10 min.
In a preferred embodiment, the polyolefin thermoplastic elastomer has a melt flow rate of 10 to 20g/10 min.
In a more preferred embodiment, the polyolefin thermoplastic elastomer has a melt flow rate of 15 to 20g/10 min.
In a preferred embodiment, the polyolefin thermoplastic elastomer has a melting temperature of 50 to 100 ℃.
In a more preferred embodiment, the polyolefin thermoplastic elastomer has a melting temperature of 60 to 80 ℃.
The temperature at which melting occurs is called the melting point or melting temperature. The melting point temperature range of small molecule crystals is narrow (generally less than 1 ℃), while the melting temperature of polymers tends to be a wide range (generally 10-20 ℃) due to incomplete crystallization. A substance which is solid at normal temperature melts into a liquid state after reaching a certain temperature, which is called a molten state. Is also liquid and is only unstable at room temperature. The molten state is a term used in chemistry, and the corresponding physical means is a solid-liquid coexisting state in the melting process. Only the crystals may be in a solid-liquid coexisting state at the melting point.
In the present invention, the source of the polyolefin elastomer is not particularly limited, and DuPont Dow, model 8411 may be mentioned.
In the invention, the weight ratio of the styrene thermoplastic elastomer to the polyolefin thermoplastic elastomer is 1: (0.6-1.5).
In a preferred embodiment, the weight ratio of the styrenic thermoplastic elastomer to the polyolefin-based thermoplastic elastomer is 1: 1.2.
tackifying resins
Tackifying resins are small molecule compounds that increase the tack, especially surface tack, of rubber materials. Typically, these small molecule species have a relative molecular mass of between about a few hundred and ten thousand, and have relatively high glass transition temperatures. According to their source and synthetic route, they can be mainly divided into two categories of natural products and their derivatives and synthetic resins. Tackifying resins are mainly used for modifying polymers, and are widely used in adhesives, coatings, inks, and as rubber compounds, asphalt modifiers, and polyolefin modifiers.
In the present invention, the tackifier resin is at least one selected from the group consisting of petroleum resin, rosin resin, and terpene resin.
In a preferred embodiment, the tackifying resin is a terpene resin.
In a more preferred embodiment, the terpene resin has a number average molecular weight of 600 to 2600.
In the present invention, the terpene resin is not particularly limited in its origin, and there may be mentioned Shandong Deno New Material science and technology Co., Ltd., brand Nos. T100 and T110, etc.
Polyolefin copolymers
Polymers of olefins are collectively called thermoplastic resins obtained by polymerizing or copolymerizing an α -olefin such as ethylene, propylene, 1-butene, 1-pentene, 1-hexene, 1-octene, 4-methyl-1-pentene or the like and some cyclic olefins alone. The polymer material has the advantages of abundant raw materials, low price, easy processing and forming and excellent comprehensive performance, so the polymer material has the largest output and very wide application. Among them, polyethylene and polypropylene are most important. The main species are polyethylene and also copolymers based on ethylene, such as ethylene-vinyl acetate copolymers, ethylene-acrylic acid or acrylate copolymers, and also polypropylene and also propylene copolymers, poly-1-butene, poly-4-methyl-1-pentene, cycloolefin polymers.
In the present invention, the polyolefin copolymer is polypropylene.
In a preferred embodiment, the polypropylene is a co-polypropylene.
In a preferred embodiment, the polypropylene has a melting temperature of 100 to 160 ℃.
In a more preferred embodiment, the polypropylene has a melting temperature of 130 to 150 ℃.
In a preferred embodiment, the polypropylene has a melt flow rate of from 0.1 to 5g/10 min.
In a more preferred embodiment, the polypropylene has a melt flow rate of from 0.2 to 0.3g/10 min.
In the present invention, the source of the polypropylene is not particularly limited, and korean oil product, model RP2400, can be mentioned.
In the present invention, the weight ratio of the thermoplastic elastomer to the polyolefin copolymer is (8-15): 1.
in a more preferred embodiment, the weight ratio of thermoplastic elastomer to polyolefin copolymer is 10: 1.
the inventor finds that the prepared protective adhesive has high curing speed when being coated on the surfaces of electronic components such as circuit boards and the like through compounding of the thermoplastic elastomer, the tackifying resin and the polyolefin copolymer, has excellent waterproofness after curing, and is easy to repair. The inventor thinks that the possible reasons are that the protective glue system of the invention does not contain any polar atom and water-absorbing group, has extremely poor affinity to water, and molecular chains of the system are intertwined into a net structure, thereby further hindering the approach and permeation of water molecules and improving the water resistance and condensation resistance of the protective glue; meanwhile, the components are mostly in a chain structure and cooperate with reasonable compounding of melt flow rate and melting temperature, so that the protective adhesive has excellent heat dissipation performance, can be directly cooled and solidified physically, and has high solidification speed and simple process; in addition, the compatibility of all raw materials among the protective adhesive systems is excellent, and the protective adhesive is melted at 160-190 ℃, so that the protective adhesive is easy to remove and repair.
Antioxidant agent
Antioxidants (Antioxidants) are substances that prevent the adverse effects of oxygen.
In the present invention, the antioxidant is not particularly limited, and at least one of phosphite antioxidants, hindered phenol antioxidants, hindered amine antioxidants, and sulfur-containing ester antioxidants can be mentioned.
In a preferred embodiment, the antioxidant is a hindered phenolic antioxidant.
In a more preferred embodiment, the hindered phenolic antioxidant is antioxidant 1010, CAS: 6683-19-8.
The second aspect of the invention provides a preparation method of the hot-melt protective adhesive, which comprises the following steps: adding the thermoplastic elastomer, the tackifying resin, the modified resin and the antioxidant into a reaction kettle, introducing inert gas, and stirring for 2-5 hours at the temperature of 150-190 ℃; then defoaming for 1-5h under the condition that the vacuum degree is 0.01-0.09MPa, thus obtaining the composite material.
In a preferred embodiment, the preparation method of the hot-melt protective adhesive comprises the following steps: adding the thermoplastic elastomer, the tackifying resin, the modified resin and the antioxidant into a reaction kettle, introducing inert gas, and stirring for 3 hours at 170 ℃; and then defoaming for 2 hours under the condition that the vacuum degree is not higher than 0.05MPa to obtain the composite material.
The third aspect of the invention provides application of the hot-melt protective adhesive, which is applied to the field of protection of electronic products PCBA.
The present invention will be specifically described below by way of examples. It should be noted that the following examples are only for illustrating the present invention and should not be construed as limiting the scope of the present invention, and that the insubstantial modifications and adaptations of the present invention by those skilled in the art based on the above disclosure are still within the scope of the present invention.
In addition, the starting materials used are all commercially available, unless otherwise specified.
Examples
Example 1
The embodiment 1 provides a hot-melt protective adhesive, which comprises the following raw materials in parts by weight: 100 parts of thermoplastic elastomer, 20 parts of tackifying resin, 10 parts of polyolefin copolymer and 2 parts of antioxidant.
The thermoplastic elastomer is a combination of a styrene thermoplastic elastomer and a polyolefin thermoplastic elastomer, and the weight ratio of the styrene thermoplastic elastomer to the polyolefin thermoplastic elastomer is 1: 1.2; the styrene-isoprene-styrene block copolymer is selected from Italy Eini, model SOL TE 9133; the polyolefin elastomer is selected from DuPont Dow, model 8411; the tackifying resin is terpene resin and is selected from Shandong Deno new material science and technology company, brand number T100; the polyolefin copolymer is polypropylene and is selected from Korean oil, model RP 2400; the antioxidant is an antioxidant 1010, CAS: 6683-19-8.
The preparation method of the hot-melt protective adhesive comprises the following steps: adding the thermoplastic elastomer, the tackifying resin, the modified resin and the antioxidant into a reaction kettle, introducing inert gas, and stirring for 3 hours at 170 ℃; and then defoaming for 2 hours under the condition that the vacuum degree is not higher than 0.05MPa to obtain the composite material.
Example 2
Embodiment 2 provides a hot-melt protective adhesive, which comprises the following raw materials in parts by weight: 70 parts of thermoplastic elastomer, 10 parts of tackifying resin, 5 parts of polyolefin copolymer and 0.1 part of antioxidant.
The thermoplastic elastomer is a combination of a styrene thermoplastic elastomer and a polyolefin thermoplastic elastomer, and the weight ratio of the styrene thermoplastic elastomer to the polyolefin thermoplastic elastomer is 1: 0.6; the styrene-isoprene-styrene block copolymer is selected from Italy Eini, model SOL TE 9133; the polyolefin elastomer is selected from DuPont Dow, model 8411; the tackifying resin is terpene resin and is selected from Shandong Deno new material science and technology company, brand number T100; the polyolefin copolymer is polypropylene and is selected from Korean oil, model RP 2400; the antioxidant is an antioxidant 1010, CAS: 6683-19-8.
The preparation method of the hot-melt protective adhesive comprises the following steps: adding the thermoplastic elastomer, the tackifying resin, the modified resin and the antioxidant into a reaction kettle, introducing inert gas, and stirring for 3 hours at 170 ℃; and then defoaming for 2 hours under the condition that the vacuum degree is not higher than 0.05MPa to obtain the composite material.
Example 3
Embodiment 3 provides a hot-melt protective adhesive, which comprises the following raw materials in parts by weight: 120 parts of thermoplastic elastomer, 30 parts of tackifying resin, 20 parts of polyolefin copolymer and 3 parts of antioxidant.
The thermoplastic elastomer is a combination of a styrene thermoplastic elastomer and a polyolefin thermoplastic elastomer, and the weight ratio of the styrene thermoplastic elastomer to the polyolefin thermoplastic elastomer is 1: 1.5. the styrene-isoprene-styrene block copolymer is selected from Italy Eini, model SOL TE 9133; the polyolefin elastomer is selected from DuPont Dow, model 8411; the tackifying resin is terpene resin and is selected from Shandong Deno new material science and technology company, brand number T100; the polyolefin copolymer is polypropylene and is selected from Korean oil, model RP 2400; the antioxidant is an antioxidant 1010, CAS: 6683-19-8.
The preparation method of the hot-melt protective adhesive comprises the following steps: adding the thermoplastic elastomer, the tackifying resin, the modified resin and the antioxidant into a reaction kettle, introducing inert gas, and stirring for 3 hours at 170 ℃; and then defoaming for 2 hours under the condition that the vacuum degree is not higher than 0.05MPa to obtain the composite material.
Example 4
Example 4 differs from example 1 in that the styrene-isoprene-styrene block copolymer was obtained from a kraton polymer, type D-1162BS, and has a styrene content of 43-45 wt%.
Example 5
Example 5 differs from example 1 in that the polyolefin thermoplastic elastomer has a melt flow rate of 60g/min and is selected from the group consisting of liandbasel, model 7358 XEP.
Example 6
Example 6 differs from example 1 in that the weight ratio of the styrenic thermoplastic elastomer to the polyolefin-based thermoplastic elastomer is 1: 3.
example 7
Example 7 differs from example 1 in that the polyolefin copolymer is polyethylene, has a melting temperature of 111 ℃, and is selected from dupont dowii, model 5005.
Performance testing
The test results are shown in Table 1.
TABLE 1 results of the Performance test of examples
The foregoing examples are merely illustrative and serve to explain some of the features of the method of the present invention. The appended claims are intended to claim as broad a scope as is contemplated, and the examples presented herein are merely illustrative of selected implementations in accordance with all possible combinations of examples. Accordingly, it is applicants' intention that the appended claims are not to be limited by the choice of examples illustrating features of the invention. Also, where numerical ranges are used in the claims, subranges therein are included, and variations in these ranges are also to be construed as possible being covered by the appended claims.
Claims (10)
1. The hot-melt protective adhesive is characterized by at least comprising the following raw materials in parts by weight: 70-120 parts of thermoplastic elastomer, 10-30 parts of tackifying resin, 5-20 parts of polyolefin copolymer and 0.1-3 parts of antioxidant.
2. The hot-melt protective adhesive according to claim 1, wherein the thermoplastic elastomer is a styrene thermoplastic elastomer and/or a polyolefin thermoplastic elastomer.
3. A hot-melt type protective adhesive according to claim 2, wherein the styrenic thermoplastic elastomer is at least one selected from the group consisting of a styrene-butadiene-styrene block copolymer, a styrene-isoprene-styrene block copolymer, a styrene-ethylene-butylene-styrene block copolymer, and a styrene-ethylene-propylene-styrene block copolymer.
4. A hot-melt type protective adhesive according to claim 3, wherein the styrene content in the styrene-isoprene-styrene block copolymer is 5 to 30 wt%.
5. The hot-melt type protective adhesive according to claim 2, wherein the polyolefin thermoplastic elastomer has a melt flow rate of 0.5 to 30g/10 min.
6. The hot melt protective adhesive according to claim 2, wherein the weight ratio of the styrene thermoplastic elastomer to the polyolefin thermoplastic elastomer is 1: (0.6-1.5).
7. A hot-melt type protective adhesive according to claim 1, wherein the polyolefin copolymer is polypropylene.
8. A hot-melt type protective adhesive according to claim 7, wherein the melting temperature of the polypropylene is 100-160 ℃.
9. A method for preparing a hot-melt type protective adhesive according to any one of claims 1 to 8, comprising the following steps: adding the thermoplastic elastomer, the tackifying resin, the modified resin and the antioxidant into a reaction kettle, introducing inert gas, and stirring for 2-5 hours at the temperature of 150-190 ℃; then defoaming for 1-5h under the condition that the vacuum degree is 0.01-0.09MPa, thus obtaining the composite material.
10. The application of the hot-melt protective adhesive according to any one of claims 1 to 8, which is applied to the field of protection of PCBAs of electronic products.
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