CN111702349A

CN111702349A - Laser cutting device and cutting method

Info

Publication number: CN111702349A
Application number: CN202010577347.8A
Authority: CN
Inventors: 叶浩; 陆昱成
Original assignee: Suzhou Keyun Laser Technology Co Ltd
Current assignee: Suzhou Keyun Laser Technology Co Ltd
Priority date: 2020-06-22
Filing date: 2020-06-22
Publication date: 2020-09-25

Abstract

The invention discloses a laser cutting device and a cutting method, comprising the following steps: the device comprises a control unit, a laser, a light splitting unit, at least two polarized light power adjusting units and at least two galvanometers; the polarized light power adjusting units correspond to the vibrating mirrors one by one, and the vibrating mirrors are positioned on the light outgoing paths of the polarized light power adjusting units; the control unit is electrically connected with the laser and used for controlling the laser to be turned on or turned off; the control unit is respectively electrically connected with each polarized light power adjusting unit and is used for controlling the polarized light power adjusting units to adjust the power of the output light beams when the laser is in an on state; the light splitting unit is positioned on the light emitting side of the laser and is used for splitting the light beam emitted by the laser into sub-beams when the laser is in an open state; the polarized light power adjusting unit is used for converting the power of the sub-beams into target power and then emitting the target power to the corresponding vibrating mirrors or the other polarized light power adjusting unit, and the multi-station synchronous cutting of the workpiece is realized by splitting the laser and then automatically adjusting the splitting power.

Description

Laser cutting device and cutting method

Technical Field

The invention relates to the field of laser cutting, in particular to a laser cutting device and a cutting method.

Background

Laser cutting is a method in which a workpiece is heated by a laser beam having a high energy density, the temperature is rapidly increased to reach the boiling point of the material in a very short time, the material starts to vaporize to form vapor, and these form a cut in the material while the vapor is ejected. When general laser cutting equipment needs to carry out double-station cutting operation, two independent laser cutting sources are needed to carry out cutting, and the cutting efficiency is low.

The laser source is split to achieve multi-station synchronous machining of the cutting workpiece in the prior art, fine automatic adjustment of power after splitting cannot be achieved due to the fact that the laser source is split, manual adjustment is needed or adjustment is achieved through light emitting inside the laser, synchronization between stations is delayed, and machining effect consistency is poor.

Disclosure of Invention

The embodiment of the invention provides a laser cutting device and a cutting method, which realize multi-station synchronous processing and cutting of workpieces by splitting laser and automatically adjusting splitting power.

In a first aspect, an embodiment of the present invention provides a laser cutting apparatus, including: the device comprises a control unit, a laser, a light splitting unit, at least two polarized light power adjusting units and at least two galvanometers; the polarized light power adjusting units correspond to the galvanometers one by one, and the galvanometers are positioned on the light outgoing paths of the polarized light power adjusting units;

the control unit is electrically connected with the laser and used for controlling the laser to be turned on or turned off;

the control unit is respectively electrically connected with each polarized light power adjusting unit and is used for controlling the polarized light power adjusting units to adjust the power of output light beams when the laser is in an on state;

the control unit is respectively electrically connected with the galvanometer corresponding to each polarized light power adjusting unit and is used for simultaneously controlling each galvanometer to be in a working state when the laser is in an on state;

the light splitting unit is positioned on the light emitting side of the laser and is used for splitting the light beam emitted by the laser into sub-light beams when the laser is in an open state; the polarized light power adjusting unit is used for converting the power of the sub-beams into target power and then emitting the target power to the one-to-one corresponding galvanometer or to the other polarized light power adjusting unit.

Optionally, the light splitting unit includes a first one-half wave plate, a first rotating motor, and a first polarization beam splitter; the first rotating motor is used for driving the first one-half wave plate to rotate around the optical axis direction of the first one-half wave plate, light beams emitted by the laser are emitted to the first polarizing beam splitter through the first one-half wave plate, and the first polarizing beam splitter divides the light beams into S polarized light and P polarized light.

Optionally, the polarized light power adjusting unit includes a second half-wave plate, a second rotating electrical machine, and a second polarization beam splitter;

the polarized light power adjusting unit receives the S polarized light or the P polarized light emitted by the light splitting unit; the second rotating motor is used for driving the second half-wave plate to rotate around the optical axis direction of the second half-wave plate, and the S polarized light or the P polarized light emitted by the light splitting unit is divided into the S polarized light and the P polarized light after passing through the second half-wave plate and the second polarization beam splitter; the P polarized light emitted by the second polarized beam splitter enters the vibrating mirrors which are in one-to-one correspondence with the polarized light power adjusting units.

Optionally, the S-polarized light emitted by the second polarization beam splitter enters another polarized light power adjusting unit.

Optionally, at least part of the polarized light power adjusting unit further includes a light collecting pool;

and the S polarized light emitted by the second polarizing beam splitter enters the light collection pool.

Optionally, the polarization beam splitter further comprises a reflector, the reflector is located on the light path between the light splitting unit and the polarized light power adjusting unit, and/or the reflector is located on the light path between the polarized light power adjusting unit and the vibrating mirror.

Optionally, the control unit includes a master control unit and at least one slave control unit; the master control unit and the at least one slave control unit are electrically connected with the polarized light power adjusting units in a one-to-one correspondence manner; the main control unit is also electrically connected with the laser and used for controlling the laser to be turned on or turned off;

the main control unit is further configured to send a power adjustment instruction to the polarized light power adjustment unit electrically connected to the main control unit, so as to instruct the polarized light power adjustment unit electrically connected to the main control unit to convert the power of the sub-beam into a target power and then emit the target power to the one-to-one corresponding galvanometer or another polarized light power adjustment unit; the slave control unit is used for sending a power adjusting instruction to the polarized light power adjusting unit electrically connected with the slave control unit so as to instruct the polarized light power adjusting unit electrically connected with the slave control unit to convert the power of the sub-beams into target power and then emit the target power to the galvanometers in one-to-one correspondence or another polarized light power adjusting unit.

Optionally, the optical system further comprises at least two field lenses, wherein the field lenses correspond to the vibrating lenses one to one, and the field lenses are located on the light emitting sides of the vibrating lenses corresponding to the field lenses one to one.

In a second aspect, an embodiment of the present invention further provides a cutting method, which is performed by the laser cutting apparatus according to any one of the embodiments, and the cutting method includes:

the control unit controls the laser to be started;

the light splitting unit is used for splitting the light beam emitted by the laser into sub-light beams;

the control unit controls each polarized light power adjusting unit to convert the power of the sub-beams into target power and then emits the target power to the corresponding galvanometers;

and each galvanometer cuts the workpiece on the carrying platform through the sub-beams with the target power.

Optionally, the polarized light power adjusting unit includes a second half-wave plate, a second rotating electrical machine, and a second polarizing beam splitter, where the control unit controls each polarized light power adjusting unit to convert the power of the sub-beam into a target power and then to emit the target power to the one-to-one corresponding galvanometer, and includes:

the polarized light power adjusting unit receives the sub-beams emitted by the light splitting unit;

the second rotating motor drives the second half wave plate to rotate around the optical axis direction of the second half wave plate;

the sub-beams emitted by the light splitting unit are divided into S polarized light and P polarized light after passing through the second half-wave plate and the second polarization beam splitter;

the P polarized light emitted by the second polarized beam splitter enters the vibrating mirrors in one-to-one correspondence with the polarized light power adjusting units.

The laser cutting device and the cutting method provided by the embodiment of the invention have the advantages that the light-emitting side of the laser is provided with the light splitting unit, the light beam emitted by the laser is divided into the sub-beams by the light splitting unit, the control unit is electrically connected with each polarized light power adjusting unit, and after the sub-beams emitted by the light splitting unit reach the polarized light power adjusting unit, the power of the sub-beams emitted by the light splitting unit is adjusted by controlling the polarized light power adjusting unit, the power of the sub-beams emitted by the light splitting unit is converted into target power, and then the target power is emitted to the one-to-one corresponding galvanometers to cut the object. The laser beam is split by the beam splitting unit, the power of different sub-beams is automatically adjusted by different polarized light power adjusting units, the power of the sub-beams is converted into target power by the different polarized light power adjusting units and then is emitted to the vibration mirrors in one-to-one correspondence, and the control unit is connected with the different vibration mirrors to realize synchronous control of the vibration mirrors, so that the multi-station synchronous processing and cutting of workpieces is realized.

Drawings

Fig. 1 is a schematic structural diagram of a laser cutting apparatus according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of another laser cutting apparatus according to an embodiment of the present invention;

FIG. 3 is a schematic flow chart of a cutting method according to an embodiment of the present invention;

fig. 4 is a schematic flow chart of another cutting method according to an embodiment of the present invention.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.

Fig. 1 is a schematic structural diagram of a laser cutting apparatus according to an embodiment of the present invention, and as shown in fig. 1, the laser cutting apparatus includes: the laser comprises a control unit 100, a laser 200, a light splitting unit 300, at least two polarized light power adjusting units 400 and at least two vibrating mirrors 500, wherein the polarized light power adjusting units 400 correspond to the vibrating mirrors 500 one by one, the vibrating mirrors 500 are located on light outgoing paths of the polarized light power adjusting units 400, the control unit 100 is electrically connected with the laser 200 and used for controlling the laser 200 to be turned on or turned off, and the control unit 100 is electrically connected with the polarized light power adjusting units 400 respectively (fig. 1 exemplarily shows that the control unit is electrically connected with the polarized light

power adjusting units

401 and 402 respectively) and used for controlling the polarized light power adjusting units 400 to adjust the power of output light beams when the laser 200 is in an on state. The control unit 100 is electrically connected to the galvanometer 500 corresponding to each polarized light power adjustment unit 400, and is configured to control each galvanometer 500 to be in a working state when the laser 200 is in an on state. The light splitting unit 300 is located on the light emitting side of the laser 200, and is configured to split the light beam emitted from the laser 200 into sub-light beams when the laser 200 is in an on state, and the polarized light power adjusting unit 400 is configured to convert the power of the sub-light beams into target power and then emit the target power to the one-to-one corresponding galvanometer 500 or emit the target power to another polarized light power adjusting unit 400.

The laser 200 is electrically connected to the control unit 100, and when the control unit 100 outputs a control signal to control the laser 200 to be in an on state, the laser beam emitted from the laser 200 passes through the light splitting unit 300, and is split into sub-beams, and different sub-beams are converted into target powers by the polarized light power adjusting unit 400 and then emitted to the galvanometers 500 or another polarized light power adjusting unit 400 corresponding to the polarized light power adjusting unit 400 one to one. The power of the laser emitted by the laser 200 is adjusted by the polarized light power adjusting unit 400, and then the device is cut by the galvanometer 500. As shown in fig. 1, the light emitted from the laser beam emitted from the laser 200 is divided into two sub-beams X1 and X2 after passing through the light splitting unit 300, the first sub-beam X1 reaches the polarized light power adjusting unit 401, the second sub-beam X2 reaches the polarized light power adjusting unit 402, the first sub-beam X1 and the second sub-beam X2 reach different polarized light power adjusting units 400 respectively, and then the beams converted into the target power by the polarized light power adjusting unit 400 are emitted to the galvanometer 500 corresponding to the polarized light power adjusting unit 400, and the object is cut by the galvanometer 500.

Since there is still a certain angle of laser staying at the polarized light power adjusting unit 400 after the polarized light power adjusting unit 400 converts the power of the sub-beam into the target power and emits the target power to the one-to-one corresponding galvanometer 500, the laser that is not emitted to the galvanometer 500 by the polarized light power adjusting unit 400 can be emitted to another polarized light power adjusting unit 400, thereby realizing effective utilization of the light emitted by the laser 200. As shown in fig. 1, after the first sub-beam X1 reaches the polarized light power adjustment unit 401, the beam converted into the target power by the polarized light power adjustment unit 401 is emitted to the galvanometer 500 corresponding to the polarized light power adjustment unit 401, and the polarized light power adjustment unit 401 emits the remaining part of the laser light to another polarized light power adjustment unit 400 to realize effective utilization of the laser light.

According to the laser cutting device provided by the embodiment of the invention, the light-emitting side of the laser is provided with the light splitting unit, the light splitting unit is used for splitting the light beam emitted by the laser into the sub-light beams, the control unit is electrically connected with each polarized light power adjusting unit, and after the sub-light beams emitted by the light splitting unit reach the polarized light power adjusting unit, the power of the sub-light beams emitted by the light splitting unit is adjusted by controlling the polarized light power adjusting unit, the power of the sub-light beams emitted by the light splitting unit is converted into the target power, and the target power is emitted to the one-to-one corresponding galvanometers to cut the object. The laser beam is split by the beam splitting unit, the power of different sub-beams is automatically adjusted by different polarized light power adjusting units, the power of the sub-beams is converted into target power by the different polarized light power adjusting units and then is emitted to the vibration mirrors in one-to-one correspondence, and the control unit is connected with the different vibration mirrors to realize synchronous control of the vibration mirrors, so that the multi-station synchronous processing and cutting of workpieces is realized.

Optionally, with reference to fig. 1, the light splitting unit 300 includes a first one-half wave plate 31, a first rotating motor 32 and a first polarizing beam splitter 33, the first rotating motor 32 is configured to drive the first one-half wave plate 31 to rotate around the optical axis of the first one-half wave plate 31, a light beam emitted from the laser 200 is emitted to the first polarizing beam splitter 33 through the first one-half wave plate 31, and the first polarizing beam splitter 33 splits the light beam into S-polarized light and P-polarized light.

As shown in fig. 1, when the control unit 100 controls the laser 200 to be in the on state, the light emitted from the laser 200 reaches the light splitting unit 300, and the first rotating motor 32 of the light splitting unit 300 controls the first one-half wave plate 31 to rotate around the optical axis of the wave plate. By controlling the rotation frequency of the first rotating motor 32, the laser beam can reach the first polarization beam splitter 33 with different power beams after passing through the first half-wave plate, and the first polarization beam splitter 33 can further split the beam into S-polarized light and P-polarized light.

It should be noted that, after the light emitted from the laser 100 passes through the first polarization beam splitter 33 of the beam splitting unit 300, the first polarization beam splitter 33 reflects a part of the light emitted from the laser 100 to form S-polarized light, and a part of the light passes through the first polarization beam splitter 33 to form P-polarized light, in fig. 1, the first sub-beam X1 is P-polarized light, and the second sub-beam X2 is X-polarized light. Further, the first polarization beam splitter 33 reflects a part of the light emitted from the laser 100 to form P-polarized light, a part of the light passes through the first polarization beam splitter 33 to form S-polarized light, and the P-polarized light or the S-polarized light formed by passing through the first polarization beam splitter 33 is reflected or transmitted, which is determined by the structure of the first polarization beam splitter 33.

Furthermore, the first rotating electrical machine 32 of the light splitting unit 300 may be electrically connected to the control unit 100, and the control unit 100 controls the rotation frequency of the first rotating electrical machine 32 of the light splitting unit 300 to further enable the laser light with different frequencies to transmit through the first half-wave plate 31, or directly drive the rotation frequency of the first rotating electrical machine 32 through the driving motor.

Optionally, with reference to fig. 1, the polarized light power adjusting unit 400 includes a second half-wave plate 41, a second rotating electrical machine 42 and a second polarization beam splitter 43, the polarized light power adjusting unit 400 receives the S polarized light or the P polarized light emitted from the beam splitting unit 300, the second rotating electrical machine 42 is configured to drive the second half-wave plate 41 to rotate around the optical axis direction of the second half-wave plate 41, the S polarized light or the P polarized light emitted from the beam splitting unit 300 is divided into the S polarized light and the P polarized light after passing through the second half-wave plate 41 and the second polarization beam splitter 43, and the P polarized light emitted from the second polarization beam splitter 43 enters the polarization mirrors 500 corresponding to the polarized light power adjusting unit 400 one to one.

As shown in fig. 1, when the S-polarized light or the P-polarized light emitted from the light splitting unit 300 reaches the polarized light power adjusting unit 400, the second rotating electrical machine 42 of the polarized light power adjusting unit 400 controls the rotating frequency of the second rotating electrical machine 42 by receiving the control signal output by the control unit 100, so as to adjust the power of the S-polarized light or the P-polarized light emitted from the light splitting unit 100, and emit the adjusted light beam out of the galvanometer. For example, the power of the light emitted from the laser 100 is 100W, the first one-half wave plate of the beam splitting unit converts the light emitted from the laser 100 into 30W light to the first polarization beam splitter 33 under the action of the first rotating motor, and the first polarization beam splitter 33 converts the 30W light into 15W S-polarized light and 15W P-polarized light respectively and emits the S-polarized light and the P-polarized light to the polarized light power adjustment unit 400. When the P polarized light emitted from the light splitting unit 300 passes through the polarized light power adjusting unit 401, the second half wave plate 41 of the polarized light power adjusting unit 401 converts the P polarized light into a laser beam with target power required for cutting a workpiece and emits the laser beam to the second polarized beam splitter 43 under the driving action of the second rotating motor 42, after the laser beam with the target power passes through the second polarized beam splitter 43, the laser beam with the target power is split into S polarized light and P polarized light by the second polarized beam splitter 43, and the P polarized light emitted from the second polarized beam splitter 43 enters the galvanometer 500 corresponding to the polarized light power adjusting unit 401, so that the cutting of the device is completed.

Alternatively, with continued reference to fig. 1, the S-polarized light emitted from the second pbs 43 enters another polarized light power adjusting unit 400.

Referring to fig. 1, after the second polarization beam splitter 43 of the polarized light power adjustment unit 401 divides the laser beam of the target power into S-polarized light and P-polarized light, the second polarization beam splitter 43 of the polarized light power adjustment unit 401 directs the emitted P-polarized light to the polarizer 500 corresponding to the polarized light power adjustment unit 401, and there is a phenomenon that the S-polarized light is not utilized, and by directing the S-polarized light emitted from the second polarization beam splitter 43 to another polarized light power adjustment unit 400, and the polarized light power adjustment unit 400 is connected to the control unit 100, the control unit 100 adjusts the rotation frequency of the rotating motor of the polarized light power adjustment unit 400, so that the laser is effectively utilized, and a plurality of workstations operate simultaneously.

Optionally, with continued reference to fig. 1, at least part of the polarized light power adjusting unit 400 further includes a light collecting pool 44, and the S-polarized light emitted from the second polarization beam splitter 43 is incident to the light collecting pool 44.

Referring to fig. 1, by providing the light collection pool 44 in the polarized light power adjustment unit 402, after the second polarizing beam splitter 43 divides the laser beam of the target power into S-polarized light and P-polarized light, the second polarizing beam splitter 43 of the polarized light power adjustment unit 402 transmits the emitted P-polarized light to the vibrating mirror 500 corresponding to the polarized light power adjustment unit 402, and the light collection pool 44 can absorb the S-polarized light that is not used by the second polarizing beam splitter 43, thereby avoiding the influence of part of the emitted laser light on other worktable cutting tasks.

It should be noted that fig. 1 exemplarily shows that the S-polarized light not used in the polarized light power adjusting unit 401 is emitted to another polarized light power adjusting unit 400, the S-polarized light not used in the polarized light power adjusting unit 402 is emitted to the light collecting pool 44, or the S-polarized light of the polarized light

power adjusting units

401 and 402 may be absorbed by the light collecting pool 44, and the embodiment of the present invention does not limit the specific emission manner of the S-polarized light emitted by the polarized light power adjusting unit 400.

It should be noted that, in the above embodiment, the P-polarized light emitted by the second polarization beam splitter enters the polarization mirrors corresponding to the polarized light power adjusting units one to one, the S-polarized light emitted by the second polarization beam splitter enters another polarized light power adjusting unit or a light collecting pool, or the S-polarized light emitted by the second polarization beam splitter enters the polarization mirrors corresponding to the polarized light power adjusting units one to one, and the P-polarized light emitted by the second polarization beam splitter enters another polarized light power adjusting unit or a light collecting pool.

Optionally, with reference to fig. 1, the laser cutting device further includes a reflecting mirror 600, where the reflecting mirror 600 is located on the light path between the light splitting unit 300 and the polarized light power adjusting unit 400, and/or the reflecting mirror 600 is located on the light path between the polarized light power adjusting unit 400 and the vibrating mirror 500.

As shown in fig. 1, by providing the reflecting mirror 600 on the optical path between the light splitting unit 300 and the polarized light power adjusting unit 400 and on the optical path between the polarized light power adjusting unit 400 and the galvanometer 500, it is ensured by the reflecting mirror that the light emitted from the light splitting unit 300 is emitted to the polarized light power adjusting unit 400 to the maximum extent, and the light emitted from the polarized light power adjusting unit 400 is emitted to the galvanometer 500 to the maximum extent, so that the utilization rate of the laser beam is improved.

Optionally, on the basis of the foregoing embodiment, fig. 2 is a schematic structural diagram of another laser cutting apparatus according to an embodiment of the present invention, and as shown in fig. 2, the control unit 100 includes a master control unit 101 and at least one slave control unit 102, the master control unit 101 and the at least one slave control unit 102 are electrically connected to the respective polarized light power adjusting units 400 in a one-to-one correspondence, and the master control unit 101 is further electrically connected to the laser 200 for controlling the laser 200 to be turned on or turned off.

The main control unit 101 is further configured to send a power adjustment instruction to the polarized light power adjustment unit 400 electrically connected thereto, so as to instruct the polarized light power adjustment unit 400 electrically connected thereto to convert the power of the sub-beam into a target power and then emit the target power to the one-to-one corresponding galvanometer 500 or another polarized light power adjustment unit 400. The slave control unit 102 is configured to send a power adjustment instruction to the polarized light power adjustment unit 400 electrically connected thereto, so as to instruct the polarized light power adjustment unit 400 electrically connected thereto to convert the power of the sub-beam into a target power and then to emit the target power to one-to-one corresponding galvanometer or another polarized light power adjustment unit.

As shown in fig. 2, the main control unit 101 controls the on and off of the laser 200 by being electrically connected to the control laser 200, the main control unit is further electrically connected to a polarized light power adjusting unit 400, and controls the polarized light power adjusting unit 400 electrically connected to the main control unit by sending a power adjusting instruction, the polarized light power adjusting unit 400 converts the power of the sub-beam emitted from the laser 200 into a target power, the sub-control unit is electrically connected to another polarized light power adjusting unit 400, the polarized light power adjusting unit 400 electrically connected to the sub-control unit is controlled by sending a power adjusting instruction, and the polarized light power adjusting unit 400 converts the power of the sub-beam emitted from the laser 200 into the target power. As shown in fig. 2, the master control unit 101 is electrically connected to the polarized light power adjustment unit 402, the slave control unit 102 is electrically connected to the polarized light power adjustment unit 401, and the master control unit 101 and the slave control unit 102 respectively send power adjustment instructions to the polarized light

power adjustment units

402 and 401, so as to implement power conversion of the sub-beams emitted by the laser 200.

It should be noted that the main control unit 101 and the slave control unit 102 may be set to have the same power value for converting the power of the sub-beam to the target power for the polarized light power adjusting unit, or may be set to have different values, and the embodiment of the present invention is not limited in particular.

Further, fig. 2 exemplarily shows that the control unit 100 includes a master control unit 101 and a slave control unit 102, and when the laser cutting apparatus includes 3 polarized light power adjustment units 400, the control unit 100 may be configured to include one

master control unit

101 and 2 slave control units 102, and the specific number of the slave control units 102 is not limited in the embodiment of the present invention.

Optionally, with reference to fig. 2, the optical system further includes at least two field lenses, the field lenses correspond to the galvanometers one by one, and the field lenses are located on the light emitting sides of the galvanometers corresponding to the field lenses one by one.

The scene is arranged on the light emitting side of the galvanometer, so that the light emitted by the laser 200 is focused, and the device is well cut.

On the basis of the foregoing embodiment, fig. 3 is a schematic flow chart of a cutting method provided in an embodiment of the present invention, and as shown in fig. 3, the cutting method includes:

and S110, the control unit controls the laser to be started.

And S120, the light beam emitted by the laser is divided into sub-beams by the light splitting unit.

S130, the control unit controls each polarized light power adjusting unit to convert the power of the sub-beams into target power and then emits the target power to the corresponding galvanometers.

And S140, cutting the workpiece on the carrying platform by each galvanometer through the sub-beams with the target power.

According to the cutting method provided by the embodiment of the invention, the laser is controlled to be started through the control unit, then the light beam emitted by the laser is divided into the sub-beams by the light splitting unit, after the sub-beams emitted by the light splitting unit reach the polarized light power adjusting unit, the power of the sub-beams is converted into the target power by the control unit through controlling each polarized light power adjusting unit and then emitted to the corresponding vibrating mirrors, and then the workpieces on the carrier are cut by each vibrating mirror through the sub-beams with the target power. The laser beam is split by the beam splitting unit, the power of different sub-beams is automatically adjusted by different polarized light power adjusting units, the power of the sub-beams is converted into target power by the different polarized light power adjusting units and then is emitted to the vibration mirrors in one-to-one correspondence, and the control unit is connected with the different vibration mirrors to realize synchronous control of the vibration mirrors, so that the multi-station synchronous processing and cutting of workpieces is realized.

Optionally, on the basis of the foregoing embodiment, fig. 4 is a schematic flowchart of a further cutting method provided in an embodiment of the present invention, where the polarized light power adjusting unit includes a second half-wave plate, a second rotating motor, and a second polarizing beam splitter, where the control unit controls each polarized light power adjusting unit to convert the power of the sub-beam into a target power, and then outputs the target power to the one-to-one corresponding galvanometer, and includes:

s210, the polarized light power adjusting unit receives the sub-beams emitted by the light splitting unit.

S220, the second rotating motor drives the second half wave plate to rotate around the optical axis direction of the second half wave plate, and the power of the sub-beams emitted by the light splitting unit is converted into target power.

And S230, the sub-beams emitted by the light splitting unit are split into S polarized light and P polarized light after passing through the second half-wave plate and the second polarization beam splitter.

S240, the P polarized light emitted by the second polarized beam splitter enters the vibrating mirrors which correspond to the polarized light power adjusting units one by one.

It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A laser cutting apparatus, comprising: the device comprises a control unit, a laser, a light splitting unit, at least two polarized light power adjusting units and at least two galvanometers; the polarized light power adjusting units correspond to the galvanometers one by one, and the galvanometers are positioned on the light outgoing paths of the polarized light power adjusting units;

2. The laser cutting apparatus according to claim 1, wherein the beam splitting unit includes a first one-half wave plate, a first rotating motor, and a first polarizing beam splitter; the first rotating motor is used for driving the first one-half wave plate to rotate around the optical axis direction of the first one-half wave plate, light beams emitted by the laser are emitted to the first polarizing beam splitter through the first one-half wave plate, and the first polarizing beam splitter divides the light beams into S polarized light and P polarized light.

3. The laser cutting apparatus according to claim 2, wherein the polarized light power adjusting unit includes a second half wave plate, a second rotating motor, and a second polarization beam splitter;

4. The laser cutting device according to claim 3, wherein the S polarized light emitted from the second pbs is incident to another polarized light power adjustment unit.

5. The laser cutting device according to claim 3, wherein at least a part of the polarized light power adjusting unit further comprises a light collecting pool;

6. The laser cutting device according to claim 1, further comprising a reflecting mirror located on the optical path between the beam splitting unit and the polarized light power adjusting unit, and/or located on the optical path between the polarized light power adjusting unit and the vibrating mirror.

7. The laser cutting device according to claim 1, wherein the control unit comprises a master control unit and at least one slave control unit; the master control unit and the at least one slave control unit are electrically connected with the polarized light power adjusting units in a one-to-one correspondence manner; the main control unit is also electrically connected with the laser and used for controlling the laser to be turned on or turned off;

8. The laser cutting device according to claim 1, further comprising at least two field lenses, wherein the field lenses are in one-to-one correspondence with the galvanometers, and the field lenses are located on light-emitting sides of the galvanometers in one-to-one correspondence therewith.

9. A cutting method performed by the laser cutting apparatus of any one of claims 1 to 8, the cutting method comprising:

the control unit controls the laser to be started;

10. The cutting method according to claim 9, wherein the polarized light power adjusting unit comprises a second half-wave plate, a second rotating motor and a second polarizing beam splitter, wherein the control unit controls each polarized light power adjusting unit to convert the power of the sub-beam into a target power and then emit the target power to the one-to-one corresponding galvanometer, and the method comprises: