CN111694248A - Chip mounting structure and powder box thereof - Google Patents
Chip mounting structure and powder box thereof Download PDFInfo
- Publication number
- CN111694248A CN111694248A CN202010638624.1A CN202010638624A CN111694248A CN 111694248 A CN111694248 A CN 111694248A CN 202010638624 A CN202010638624 A CN 202010638624A CN 111694248 A CN111694248 A CN 111694248A
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- China
- Prior art keywords
- chip
- chip mounting
- groove
- clamping
- mounting groove
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G15/00—Apparatus for electrographic processes using a charge pattern
- G03G15/06—Apparatus for electrographic processes using a charge pattern for developing
- G03G15/08—Apparatus for electrographic processes using a charge pattern for developing using a solid developer, e.g. powder developer
- G03G15/0822—Arrangements for preparing, mixing, supplying or dispensing developer
- G03G15/0863—Arrangements for preparing, mixing, supplying or dispensing developer provided with identifying means or means for storing process- or use parameters, e.g. an electronic memory
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G15/00—Apparatus for electrographic processes using a charge pattern
- G03G15/06—Apparatus for electrographic processes using a charge pattern for developing
- G03G15/08—Apparatus for electrographic processes using a charge pattern for developing using a solid developer, e.g. powder developer
- G03G15/0896—Arrangements or disposition of the complete developer unit or parts thereof not provided for by groups G03G15/08 - G03G15/0894
Abstract
The invention discloses a chip mounting structure and a powder box thereof, wherein the chip mounting structure comprises a chip mounting seat and a clamping groove matched with the chip mounting seat; the chip mounting seat is integrally rectangular, a chip mounting groove for mounting a chip is formed in the top of the chip mounting seat, the top of the chip mounting groove is provided with an opening, the front side and the rear side of the chip mounting groove are respectively provided with a front plate and a rear plate, the front plate and the rear plate are different in height, and the front plate is higher than the rear plate; wherein, the rear end of the chip mounting groove is provided with a chip contact exposure port for exposing the chip contact; according to the invention, the chip is fixed at the rear end of the powder box through the chip mounting structure, so that the mounting efficiency is improved on the premise of ensuring the stable connection of the chip; because two daughter card grooves correspond a chip mounting structure's position for the chip can be by a plurality of fixed positions on the powder box, and applicable information reading point in different positions on multiple model printers, the commonality is high.
Description
Technical Field
The invention relates to a printer consumable, in particular to a chip mounting structure and a powder box thereof.
Background
At present, powder boxes are important parts in laser printers, and current printer consumables (compatible consumables) can be generally classified into three types: color bands, ink jet and laser.
The printer door is generally fixedly provided with an information reading point for contacting with a chip on the toner cartridge, the toner cartridge is generally provided with a fixed structure for installing the chip, the chip installation positions of the toner cartridges of different models are different, the fixed chip structure enables the application range of the toner cartridge to be narrow, the toner cartridge of the same model cannot be suitable for printers of various models, and the universality is poor.
Disclosure of Invention
The invention aims to provide a chip mounting structure and a powder box thereof, which aim to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme:
a chip mounting structure comprises a chip mounting base and a clamping groove matched with the chip mounting base; the chip mounting seat is integrally rectangular, a chip mounting groove for mounting a chip is formed in the top of the chip mounting seat, the top of the chip mounting groove is provided with an opening, the front side and the rear side of the chip mounting groove are respectively provided with a front plate and a rear plate, the front plate and the rear plate are different in height, and the front plate is higher than the rear plate; wherein the rear end of the chip mounting groove is provided with a chip contact exposure port for exposing the chip contact, namely the rear side of the rear plate is provided with a chip contact exposure port which is rectangular and is communicated with the inside of the chip mounting groove, the top of the chip contact exposure port is flush with the height of the rear plate, the corner of the chip contact exposure port is arranged in a circular arc transition shape,
the bottom of the chip mounting groove is provided with a positioning projection which is used for conveniently positioning the front side and the back side of the chip when the chip is inserted in the chip mounting groove and can also play a role of a card main chip, so a notch corresponding to the positioning projection is required to be formed on the chip;
the front end of the chip mounting seat is provided with an electronic element accommodating groove for accommodating an electronic element on a chip, the electronic element accommodating groove comprises an upper rectangular groove and a lower rectangular groove which are connected with each other, wherein the bottom of the electronic element accommodating groove is flush with the bottom of the chip contact exposure port, namely the bottom of the lower rectangular groove is flush with the bottom of the chip contact exposure port;
the left side and the right side of the front end of the chip mounting seat are both provided with an inserting block, the tail end of the inserting block is provided with a clamping hook,
the clamping groove is matched with the clamping hook and is formed in the rear end of the powder bin, the clamping groove comprises a plurality of sub clamping grooves which are arranged in parallel and limiting plates used for limiting up and down, and the limiting plates are located at the upper end and the lower end of each sub clamping groove and used for limiting up and down movement of the chip mounting seat; the front ends of the sub-clamping grooves are respectively provided with a clamping hook accommodating cavity, the clamping hook accommodating cavities are communicated with the sub-clamping grooves, and the rear ends of the clamping hook accommodating cavities are perpendicular to the side walls of the sub-clamping grooves to prevent the clamping hooks from being separated.
Further, the positioning protrusion is not located at the center of the bottom of the chip mounting groove.
Further, the positioning protrusion may be positioned at a left side of the bottom of the chip mounting groove.
Further, the positioning protrusion is located at the right side of the bottom of the chip mounting groove.
Further, the grafting piece is the arc, and curved grafting piece can be the too concentrated problem of effectual reduction stress, if be straight grafting piece, when inserting and deviating from the sub-draw-in groove, most stress all can concentrate on the root of grafting piece, the junction of grafting piece and chip mount pad is inserted to most, and curved grafting piece can be effectual with stress more for even distribution on whole grafting piece.
Furthermore, the front end of the electronic component accommodating groove is not provided with an opening, and the front end of the electronic component accommodating groove is also provided with a baffle plate, so that although the thickness of the chip mounting seat can be increased and the heat dissipation of the electronic component on the chip can be influenced, the baffle plate can be used for protecting the electronic component on the chip.
The utility model provides a powder box, includes foretell chip mounting structure, and is concrete, the draw-in groove has been seted up to the rear end of powder box, and the rear end of draw-in groove is pegged graft there is the chip mounting seat, and the axial direction parallel of draw-in groove and developer roll.
Compared with the prior art, the invention has the beneficial effects that:
according to the invention, the chip is fixed at the rear end of the powder box through the chip mounting structure, so that the mounting efficiency is improved on the premise of ensuring the stable connection of the chip;
because two daughter card grooves correspond a chip mounting structure's position for the chip can be by a plurality of fixed positions on the powder box, and the draw-in groove is axially parallel with the developer roll, thereby ensures that the chip can read the point with the information on the printer door closure corresponding, and applicable information reading point in different positions on multiple model printers, the commonality is high.
Drawings
Fig. 1 is a top view of a chip mounting structure according to an embodiment.
Fig. 2 is a schematic structural diagram of a chip mounting structure according to an embodiment.
FIG. 3 is a top view of a chip mounting base in a chip mounting structure according to an embodiment.
Fig. 4 is a front view of a chip mounting base in a chip mounting structure according to an embodiment.
FIG. 5 is a rear view of a chip mounting base in a chip mounting structure according to an embodiment.
Fig. 6 is a top view of a chip mounting base in a chip mounting structure according to a second embodiment.
Fig. 7 is a top view of a chip mounting base in a chip mounting structure according to a third embodiment.
Fig. 8 is a top view of the compact of the third embodiment.
Detailed Description
The technical solution of the present patent will be described in further detail with reference to the following embodiments.
In a first embodiment, please refer to fig. 1-5, a chip mounting structure includes a chip mounting base 100 and a card slot 200 adapted thereto;
the chip mounting seat 100 is rectangular as a whole, a chip mounting groove 101 for mounting a chip is formed in the top of the chip mounting seat 100, the top of the chip mounting groove 101 is opened, the front side and the rear side of the chip mounting groove 101 are respectively provided with a front plate 1011 and a rear plate 1012, the heights of the front plate 1011 and the rear plate 1012 are different, and the height of the front plate 101 is greater than that of the rear plate 1012; wherein the rear end of the chip mounting groove 101 is provided with a chip contact exposing port 102 for exposing a chip contact, namely the rear side of the rear plate 1012 is provided with a chip contact exposing port 102, the chip contact exposing port 102 is rectangular, the chip contact exposing port 102 is communicated with the inside of the chip mounting groove 101, the top of the chip contact exposing port 102 is flush with the height of the rear plate 1012, the corner of the chip contact exposing port 102 is arranged in a circular arc transition shape,
the bottom of the chip mounting groove 101 is provided with a positioning protrusion 103, the positioning protrusion 103 is used for conveniently positioning the front side and the back side of the chip when the chip is inserted into the chip mounting groove 101, and can also play a role of a card main chip, so that a notch corresponding to the positioning protrusion 103 is also required to be formed on the chip;
since the positioning protrusion 103 plays a role of positioning the chip, the positioning protrusion 103 cannot be positioned at the center of the bottom of the chip mounting groove 101 without fail,
the positioning protrusion 103 may be located at the left side of the bottom of the chip mounting groove 101, or the positioning protrusion 103 may be located at the right side of the bottom of the chip mounting groove 101;
an electronic component accommodating groove 104 for accommodating an electronic component on the chip is formed in the front end of the chip mounting base 100, and the electronic component accommodating groove 104 comprises an upper rectangular groove 1041 and a lower rectangular groove 1042 which are connected with each other, wherein the bottom of the electronic component accommodating groove 104 is flush with the bottom of the chip contact exposure port 102, that is, the bottom of the lower rectangular groove 1042 is flush with the bottom of the chip contact exposure port 102;
the left side and the right side of the front end of the chip mounting base 100 are both provided with an insertion block 105, the tail end of the insertion block 105 is provided with a clamping hook 1051,
the card slot 200 is matched with the card hook 1051, the card slot 200 is arranged at the rear end of the powder bin, the card slot 200 comprises a plurality of sub card slots 201 arranged in parallel and limiting plates 203 used for limiting up and down, the limiting plates 203 are positioned at the upper and lower ends of the sub card slots 201 and used for limiting up and down movement of the chip mounting base 100, the front ends of the sub card slots 201 are respectively provided with a card hook accommodating cavity 202, the card hook accommodating cavities 202 are communicated with the sub card slots 201, and the rear ends of the card hook accommodating cavities 202 are vertically arranged with the side walls of the sub card slots 201 to prevent the card hook 1051 from falling off;
in the second embodiment, a chip mounting structure includes a chip mounting base 100 and a card slot 200 adapted to the chip mounting base;
the chip mounting seat 100 is rectangular as a whole, a chip mounting groove 101 for mounting a chip is formed in the top of the chip mounting seat 100, the top of the chip mounting groove 101 is opened, the front side and the rear side of the chip mounting groove 101 are respectively provided with a front plate 1011 and a rear plate 1012, the heights of the front plate 1011 and the rear plate 1012 are different, and the height of the front plate 101 is greater than that of the rear plate 1012; wherein the rear end of the chip mounting groove 101 is provided with a chip contact exposing port 102 for exposing a chip contact, namely the rear side of the rear plate 1012 is provided with a chip contact exposing port 102, the chip contact exposing port 102 is rectangular, the chip contact exposing port 102 is communicated with the inside of the chip mounting groove 101, the top of the chip contact exposing port 102 is flush with the height of the rear plate 1012, the corner of the chip contact exposing port 102 is arranged in a circular arc transition shape,
the bottom of the chip mounting groove 101 is provided with a positioning protrusion 103, the positioning protrusion 103 is used for conveniently positioning the front side and the back side of the chip when the chip is inserted into the chip mounting groove 101, and can also play a role of a card main chip, so that a notch corresponding to the positioning protrusion 103 is also required to be formed on the chip;
since the positioning protrusion 103 plays a role of positioning the chip, the positioning protrusion 103 cannot be positioned at the center of the bottom of the chip mounting groove 101 without fail,
the positioning protrusion 103 may be located at the left side of the bottom of the chip mounting groove 101, or the positioning protrusion 103 may be located at the right side of the bottom of the chip mounting groove 101;
an electronic component accommodating groove 104 for accommodating an electronic component on the chip is formed in the front end of the chip mounting base 100, and the electronic component accommodating groove 104 comprises an upper rectangular groove 1041 and a lower rectangular groove 1042 which are connected with each other, wherein the bottom of the electronic component accommodating groove 104 is flush with the bottom of the chip contact exposure port 102, that is, the bottom of the lower rectangular groove 1042 is flush with the bottom of the chip contact exposure port 102;
the left side and the right side of the front end of the chip mounting base 100 are both provided with an insertion block 105, the tail end of the insertion block 105 is provided with a clamping hook 1051,
the clamping groove 200 is matched with the clamping hook 1051, the clamping groove 200 is formed in the rear end of the powder bin, the clamping groove 200 comprises a plurality of sub-clamping grooves 201 which are arranged in parallel and limiting plates 203 for limiting the upper and lower positions, and the limiting plates 203 are positioned at the upper and lower ends of the sub-clamping grooves 201 and used for limiting the up and down movement of the chip mounting base 100; the front ends of the sub-card slots 201 are respectively provided with a clamping hook accommodating cavity 202, the clamping hook accommodating cavities 202 are communicated with the sub-card slots 201, and the rear ends of the clamping hook accommodating cavities 202 are vertically arranged with the side walls of the sub-card slots 201 so as to prevent the clamping hooks 1051 from falling off;
referring to fig. 6, the difference between the first embodiment and the second embodiment is that the insertion block 105 is arc-shaped, the arc-shaped insertion block 105 can effectively reduce the problem of too concentrated stress, if the insertion block 105 is straight, most of the stress is concentrated at the root of the insertion block 105, i.e., the connection point between the insertion block 105 and the chip mounting base 100, when the insertion block 105 is inserted into and removed from the sub-slot 201, and the arc-shaped insertion block 105 can effectively distribute the stress more uniformly on the whole insertion block 105.
In a third embodiment, a chip mounting structure includes a chip mounting base 100 and a card slot 200 adapted thereto;
the chip mounting seat 100 is rectangular as a whole, a chip mounting groove 101 for mounting a chip is formed in the top of the chip mounting seat 100, the top of the chip mounting groove 101 is opened, the front side and the rear side of the chip mounting groove 101 are respectively provided with a front plate 1011 and a rear plate 1012, the heights of the front plate 1011 and the rear plate 1012 are different, and the height of the front plate 101 is greater than that of the rear plate 1012; wherein the rear end of the chip mounting groove 101 is provided with a chip contact exposing port 102 for exposing a chip contact, namely the rear side of the rear plate 1012 is provided with a chip contact exposing port 102, the chip contact exposing port 102 is rectangular, the chip contact exposing port 102 is communicated with the inside of the chip mounting groove 101, the top of the chip contact exposing port 102 is flush with the height of the rear plate 1012, the corner of the chip contact exposing port 102 is arranged in a circular arc transition shape,
the bottom of the chip mounting groove 101 is provided with a positioning protrusion 103, the positioning protrusion 103 is used for conveniently positioning the front side and the back side of the chip when the chip is inserted into the chip mounting groove 101, and can also play a role of a card main chip, so that a notch corresponding to the positioning protrusion 103 is also required to be formed on the chip;
since the positioning protrusion 103 plays a role of positioning the chip, the positioning protrusion 103 cannot be positioned at the center of the bottom of the chip mounting groove 101 without fail,
the positioning protrusion 103 may be located at the left side of the bottom of the chip mounting groove 101, or the positioning protrusion 103 may be located at the right side of the bottom of the chip mounting groove 101;
an electronic component accommodating groove 104 for accommodating an electronic component on the chip is formed in the front end of the chip mounting base 100, and the electronic component accommodating groove 104 comprises an upper rectangular groove 1041 and a lower rectangular groove 1042 which are connected with each other, wherein the bottom of the electronic component accommodating groove 104 is flush with the bottom of the chip contact exposure port 102, that is, the bottom of the lower rectangular groove 1042 is flush with the bottom of the chip contact exposure port 102;
the left side and the right side of the front end of the chip mounting base 100 are both provided with an insertion block 105, the tail end of the insertion block 105 is provided with a clamping hook 1051,
the card slot 200 is matched with the card hook 1051, the card slot 200 is arranged at the rear end of the powder bin, the card slot 200 comprises a plurality of sub card slots 201 arranged in parallel and limiting plates 203 used for limiting up and down, the limiting plates 203 are positioned at the upper and lower ends of the sub card slots 201 and used for limiting up and down movement of the chip mounting base 100, the front ends of the sub card slots 201 are respectively provided with a card hook accommodating cavity 202, the card hook accommodating cavities 202 are communicated with the sub card slots 201, and the rear ends of the card hook accommodating cavities 202 are vertically arranged with the side walls of the sub card slots 201 to prevent the card hook 1051 from falling off;
referring to fig. 7, the difference between the first embodiment and the second embodiment is that the front end of the electronic component accommodating groove 104 is not open, and a baffle 107 is further disposed at the front end of the electronic component accommodating groove 104, so that although the thickness of the chip mounting base 100 is increased and the heat dissipation of the electronic components on the chip is affected, the baffle 107 can be used to protect the electronic components on the chip.
In a fourth embodiment, please refer to fig. 8, which includes the chip mounting structure, specifically, a card slot 200 is formed at the rear end of the powder box 300, and a chip mounting base 100 is inserted into the rear end of the card slot 200;
the chip mounting seat 100 is rectangular as a whole, a chip mounting groove 101 for mounting a chip is formed in the top of the chip mounting seat 100, the top of the chip mounting groove 101 is opened, the front side and the rear side of the chip mounting groove 101 are respectively provided with a front plate 1011 and a rear plate 1012, the heights of the front plate 1011 and the rear plate 1012 are different, and the height of the front plate 101 is greater than that of the rear plate 1012; wherein the rear end of the chip mounting groove 101 is provided with a chip contact exposing port 102 for exposing a chip contact, namely the rear side of the rear plate 1012 is provided with a chip contact exposing port 102, the chip contact exposing port 102 is rectangular, the chip contact exposing port 102 is communicated with the inside of the chip mounting groove 101, the top of the chip contact exposing port 102 is flush with the height of the rear plate 1012, the corner of the chip contact exposing port 102 is arranged in a circular arc transition shape,
the bottom of the chip mounting groove 101 is provided with a positioning protrusion 103, the positioning protrusion 103 is used for conveniently positioning the front side and the back side of the chip when the chip is inserted into the chip mounting groove 101, and can also play a role of a card main chip, so that a notch corresponding to the positioning protrusion 103 is also required to be formed on the chip;
since the positioning protrusion 103 plays a role of positioning the chip, the positioning protrusion 103 cannot be positioned at the center of the bottom of the chip mounting groove 101 without fail,
the positioning protrusion 103 may be located at the left side of the bottom of the chip mounting groove 101, or the positioning protrusion 103 may be located at the right side of the bottom of the chip mounting groove 101;
an electronic component accommodating groove 104 for accommodating an electronic component on the chip is formed in the front end of the chip mounting base 100, and the electronic component accommodating groove 104 comprises an upper rectangular groove 1041 and a lower rectangular groove 1042 which are connected with each other, wherein the bottom of the electronic component accommodating groove 104 is flush with the bottom of the chip contact exposure port 102, that is, the bottom of the lower rectangular groove 1042 is flush with the bottom of the chip contact exposure port 102;
the left side and the right side of the front end of the chip mounting base 100 are both provided with an insertion block 105, the tail end of the insertion block 105 is provided with a clamping hook 1051,
draw-in groove 200 and trip 1051 adaptation, and draw-in groove 200 sets up the rear end in the powder storehouse, draw-in groove 200 includes a plurality of sub-draw-in grooves 201 that set up side by side and be used for spacing limiting plate 203 from top to bottom, and limiting plate 203 is located sub-draw-in groove 201 upper and lower both ends are used for restricting reciprocating of chip mount pad 100, and the front end of a plurality of sub-draw-in grooves 201 all is equipped with trip holding chamber 202, trip holding chamber 202 and sub-draw-in groove 201 intercommunication, and the rear end of trip holding chamber 202 is perpendicular setting with the lateral wall of sub-draw-in groove 201 to prevent that trip 1051 from deviating from.
It should be noted that as used in the foregoing description, the terms "front," "back," "left," "right," "upper" and "lower" refer to directions in the drawings, and the terms "inner" and "outer" refer to directions toward and away from, respectively, the geometric center of a particular component.
Also, it is to be understood that well-known methods, procedures, components and circuits have not been described in detail so as not to obscure the present invention.
Although the preferred embodiments of the present patent have been described in detail, the present patent is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present patent within the knowledge of those skilled in the art.
Claims (7)
1. A chip mounting structure comprises a chip mounting base and a clamping groove matched with the chip mounting base; the chip mounting seat is characterized in that the whole chip mounting seat is rectangular, a chip mounting groove for mounting a chip is formed in the top of the chip mounting seat, the top of the chip mounting groove is provided with an opening, the front side and the rear side of the chip mounting groove are respectively provided with a front plate and a rear plate, the front plate and the rear plate are different in height, and the front plate is higher than the rear plate; wherein the rear end of the chip mounting groove is provided with a chip contact exposure port for exposing the chip contact, namely the rear side of the rear plate is provided with a chip contact exposure port which is rectangular and is communicated with the inside of the chip mounting groove, the top of the chip contact exposure port is flush with the height of the rear plate, the corner of the chip contact exposure port is arranged in a circular arc transition shape,
the bottom of the chip mounting groove is provided with a positioning projection which is used for conveniently positioning the front side and the back side of the chip when the chip is inserted in the chip mounting groove and can also play a role of a card main chip, so a notch corresponding to the positioning projection is required to be formed on the chip;
the front end of the chip mounting seat is provided with an electronic element accommodating groove for accommodating an electronic element on a chip, the electronic element accommodating groove comprises an upper rectangular groove and a lower rectangular groove which are connected with each other, wherein the bottom of the electronic element accommodating groove is flush with the bottom of the chip contact exposure port, namely the bottom of the lower rectangular groove is flush with the bottom of the chip contact exposure port;
the left side and the right side of the front end of the chip mounting seat are both provided with an inserting block, and the tail end of the inserting block is provided with a clamping hook;
the clamping groove is matched with the clamping hook and is formed in the rear end of the powder bin, the clamping groove comprises a plurality of sub clamping grooves which are arranged in parallel and limiting plates used for limiting up and down, and the limiting plates are located at the upper end and the lower end of each sub clamping groove and used for limiting up and down movement of the chip mounting seat; the front ends of the sub-clamping grooves are respectively provided with a clamping hook accommodating cavity, the clamping hook accommodating cavities are communicated with the sub-clamping grooves, and the rear ends of the clamping hook accommodating cavities are perpendicular to the side walls of the sub-clamping grooves to prevent the clamping hooks from being separated.
2. The chip mounting structure according to claim 1, wherein the positioning protrusion is not located at a central position of the bottom of the chip mounting groove.
3. The chip mounting structure according to claim 2, wherein the positioning protrusion is positioned at a left side of a bottom of the chip mounting groove.
4. The chip mounting structure according to claim 2, wherein the positioning projection is located at a right side of a bottom of the chip mounting groove.
5. The chip mounting structure according to claim 1, wherein the socket block is arc-shaped, the arc-shaped socket block can effectively reduce the problem of excessive stress concentration, and if the socket block is straight, most of the stress is concentrated at the root of the socket block when the socket block is inserted into and removed from the sub-slot, i.e. at the connection between the socket block and the chip mounting seat, and the arc-shaped socket block can effectively and uniformly distribute the stress on the whole socket block.
6. The chip mounting structure according to claim 1, wherein the front end of the electronic component accommodating groove is not open, and a baffle is disposed at the front end of the electronic component accommodating groove, so that the baffle can protect the electronic component on the chip, although the thickness of the chip mounting seat is increased and the heat dissipation of the electronic component on the chip is affected.
7. The powder box is characterized by comprising the chip mounting structure as claimed in any one of claims 1 to 6, and specifically, a clamping groove is formed in the rear end of the powder box, and a chip mounting seat is inserted into the rear end of the clamping groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010638624.1A CN111694248A (en) | 2020-07-06 | 2020-07-06 | Chip mounting structure and powder box thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010638624.1A CN111694248A (en) | 2020-07-06 | 2020-07-06 | Chip mounting structure and powder box thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111694248A true CN111694248A (en) | 2020-09-22 |
Family
ID=72485317
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010638624.1A Pending CN111694248A (en) | 2020-07-06 | 2020-07-06 | Chip mounting structure and powder box thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111694248A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205301814U (en) * | 2015-12-23 | 2016-06-08 | 珠海市鑫诚科技有限公司 | Universal cartridge |
| CN207164470U (en) * | 2017-01-10 | 2018-03-30 | 纳思达股份有限公司 | A kind of Delevoping cartridge, chip fixed part and image processing system |
| CN208255639U (en) * | 2018-04-18 | 2018-12-18 | 中山市三润打印耗材有限公司 | Waste powder hopper and handle box with chip mounting base |
| CN209149080U (en) * | 2019-01-21 | 2019-07-23 | 中山市三润打印耗材有限公司 | Chip-mounting frame, waste powder hopper and handle box |
-
2020
- 2020-07-06 CN CN202010638624.1A patent/CN111694248A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205301814U (en) * | 2015-12-23 | 2016-06-08 | 珠海市鑫诚科技有限公司 | Universal cartridge |
| CN207164470U (en) * | 2017-01-10 | 2018-03-30 | 纳思达股份有限公司 | A kind of Delevoping cartridge, chip fixed part and image processing system |
| CN208255639U (en) * | 2018-04-18 | 2018-12-18 | 中山市三润打印耗材有限公司 | Waste powder hopper and handle box with chip mounting base |
| CN209149080U (en) * | 2019-01-21 | 2019-07-23 | 中山市三润打印耗材有限公司 | Chip-mounting frame, waste powder hopper and handle box |
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