CN111687757B - Rubber substrate ceramic resin abrasive disc and preparation method thereof - Google Patents
Rubber substrate ceramic resin abrasive disc and preparation method thereof Download PDFInfo
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- CN111687757B CN111687757B CN202010574856.5A CN202010574856A CN111687757B CN 111687757 B CN111687757 B CN 111687757B CN 202010574856 A CN202010574856 A CN 202010574856A CN 111687757 B CN111687757 B CN 111687757B
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- rubber
- ceramic resin
- baking
- abrasive disc
- sheet
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0054—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by impressing abrasive powder in a matrix
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D99/00—Subject matter not provided for in other groups of this subclass
- B24D99/005—Segments of abrasive wheels
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The invention provides a rubber substrate ceramic resin grinding sheet, which comprises a rubber substrate and a ceramic resin grinding sheet base body which are integrally formed. The preparation method of the rubber substrate ceramic resin abrasive disc comprises the following steps: s1, performing surface treatment on the rubber sheet with the size consistent with that of the bottom of the standard mold, and then flatly paving the rubber sheet at the bottom of the mold; s2, pouring the stirred slurry for preparing the ceramic resin abrasive disc substrate into a mold with a rubber sheet spread on the bottom; s3, putting the die in the step S2 into an oven for curing and baking, and then demolding to obtain the rubber-based ceramic resin grinding piece. The ceramic resin abrasive disc and the rubber are integrally formed in the casting process, so that the working procedures of cutting and grinding the surface of the abrasive disc and pressing the abrasive disc and the rubber are omitted, the production efficiency of products is greatly improved, a large amount of raw materials are saved, the cost of the products is reduced, the quality of the products is improved, and the ceramic resin abrasive disc and the rubber have good market prospects.
Description
Technical Field
The invention relates to the technical field of mold preparation, in particular to a rubber-based ceramic resin abrasive disc and a preparation method thereof.
Background
The ceramic brush wheel for PCB grinding in the market is generally formed by bonding a ceramic resin grinding sheet, a rubber layer, EVA sponge and an electric wood tube, wherein the grinding core structure is the ceramic resin grinding sheet. The ceramic resin grinding piece is needed to be bonded into a cylindrical ceramic brush wheel, the ceramic resin grinding piece is firstly processed to a required size through steps of cutting and the like, then the ceramic resin grinding piece is brushed with resin and then is pasted on the cylindrical rubber layer. However, the above treatment method has several problems: (1) in the conventional ceramic resin abrasive disc, the surface is cut and ground to a standard size 204 × 14 × 64, so that a large amount of materials and manpower are wasted; (2) after the standard ceramic resin abrasive disc is processed, surface treatment and glue brushing treatment are carried out, and then the ceramic resin abrasive disc and the rubber skin which are brushed with glue are synchronously placed under a hot press for pressing, so that a large amount of labor and time are wasted; (3) since the ceramic resin grinding plate is butt-jointed and pressed in a single piece, material waste is caused by butt joint factors during cutting.
Disclosure of Invention
To solve the above-mentioned drawbacks and disadvantages of the prior art, the present invention provides a rubber-based ceramic resin grinding chip and a method for manufacturing the same.
The technical scheme adopted by the invention is as follows:
a rubber-based ceramic resin grinding chip includes a rubber-based and a ceramic resin grinding chip base body which are integrally formed.
Further, the rubber substrate is a rubber sheet, and the material is high-tear-resistance and high-oil-resistance rubber, including but not limited to nitrile rubber, natural rubber, high-strength non-woven fabric substrate, high-strength polyester film substrate, and the like.
Preferably, the rubber is nitrile butadiene rubber.
The invention also comprises a preparation method of the rubber-based ceramic resin abrasive disc, which comprises the following steps:
s1, performing surface treatment on the rubber sheet with the size consistent with that of the bottom of the mold, and then flatly paving the rubber sheet at the bottom of the mold;
s2, pouring the stirred slurry for preparing the ceramic resin abrasive disc substrate into a mold with a rubber sheet spread on the bottom;
s3, putting the die in the step S2 into an oven for curing and baking, and then demolding to obtain the rubber-based ceramic resin grinding piece.
Further, in step S1, a high temperature resistant film is disposed between the rubber sheet and the bottom of the mold. This is provided to make demolding easier.
Specifically, the film is high-temperature-resistant textured paper. The high-temperature-resistant textured paper is one of high-temperature-resistant adhesive tapes, takes the imported crepe paper as a base material, and has the characteristics of high temperature resistance, good chemical solvent resistance, high adhesive force, softness, fitness, no residual adhesive after tearing, and the like. The pressure-sensitive adhesive tape has the advantages of strong stripping property, strong adhesive force, protection and fixation, solvent resistance and no adhesive residue, and is generally called as the pressure-sensitive adhesive tape for the masking paper in the industry. And (3) flatly paving the rubber sheet pasted with the high-temperature-resistant masking paper into the mold.
After the high-temperature-resistant masking paper is used and baked, the high-temperature-resistant masking paper is cooled and demoulded, the high-temperature-resistant masking paper on the back surface of the rubber substrate ceramic resin abrasive sheet film is directly torn off, and the rubber sheet on the back surface does not pollute viscose, so that the rubber substrate ceramic resin abrasive sheet is obtained.
Further, the baking temperature of the step S3 is 65-95 ℃, and the baking is carried out for 8-15 hours at intervals of 10 ℃.
Specifically, the baking conditions in step S3 are, in order: baking at 65 deg.C for 10 hr, baking at 75 deg.C for 8 hr, baking at 85 deg.C for 15 hr, baking at 95 deg.C for 15 hr, and baking at 105 deg.C for 6 hr.
The invention also comprises the application of the rubber-based ceramic resin grinding sheet in PCB grinding. The rubber-based ceramic resin abrasive disc can be used for preparing a ceramic brush wheel and used for grinding a PCB.
Compared with the prior art, the invention has the advantages that:
according to the invention, the ceramic resin abrasive disc and the rubber sheet are integrally formed in the casting process, so that the working procedures of cutting and grinding the surface of the abrasive disc and pressing the abrasive disc and the rubber are omitted, the production efficiency of a product is greatly improved, a large amount of raw materials are saved, the cost of the product is reduced, the quality of the product is improved, and the ceramic resin abrasive disc and the rubber sheet have good market prospects. Meanwhile, the obtained cured resin abrasive disc can be directly cut into a particle belt-shaped abrasive material with a specific size; the step that the resin abrasive disc is processed to the standard size is omitted, and the process that the rubber sheet is pressed by the resin abrasive disc with the standard size is omitted, so that a large amount of materials and labor cost are saved.
For a better understanding and practice, the invention is described in detail below with reference to the accompanying drawings.
Drawings
FIG. 1 is a schematic view of the structure of a rubber-based ceramic resin grinding chip according to the present invention.
FIG. 2 is a schematic view of a manufacturing process of the rubber-based ceramic resin grinding chip of the present invention.
FIG. 3 is a diagram showing the positional relationship between a rubber sheet and a mold in the production method described in example 2.
FIG. 4 is a view showing the effect of direct cutting of the rubber-based ceramic resin grinding chip obtained by the present invention.
In the figure: 10. a rubber substrate; 11. a rubber sheet; 20. a ceramic resin abrasive disc substrate; 21. sizing agent; 30. a mold; 40. a high temperature resistant film.
Detailed Description
All materials, reagents and equipment selected for use in the present invention are well known in the art, but do not limit the practice of the invention, and other reagents and equipment well known in the art may be suitable for use in the practice of the following embodiments of the invention.
Example 1
A rubber-based ceramic resin grinding chip, as shown in figure 1, comprises a rubber-based 10 and a ceramic resin grinding chip base body 20 which are integrally formed, wherein the rubber in the rubber-based 10 is butadiene-acrylonitrile rubber.
The method for manufacturing the rubber-based ceramic resin grinding chip according to the embodiment, as shown in fig. 2, includes the following steps:
s1, performing surface treatment on the rubber sheet 11 with the size consistent with that of the bottom of the mold 30, and then flatly paving the rubber sheet at the bottom of the mold 30;
s2, pouring the stirred slurry 21 for preparing the ceramic resin grinding sheet substrate 20 into a mould 30 with a rubber sheet 11 laid on the bottom;
s3, putting the die in the step S2 into an oven for curing and baking, wherein the baking conditions are as follows in sequence: baking at 65 ℃ for 10 hours, baking at 75 ℃ for 8 hours, baking at 85 ℃ for 15 hours, baking at 95 ℃ for 15 hours, and baking at 105 ℃ for 6 hours; and cooling and directly demoulding after baking is finished to obtain the rubber substrate ceramic resin abrasive disc.
The cured resin grinding sheet obtained in the embodiment can be directly cut into 12.5 × 13mm particle belt-shaped grinding materials for PCB grinding, as shown in FIG. 4, the step of processing the resin grinding sheet to a standard size is omitted, and the step of pressing the rubber skin on the resin grinding sheet with the standard size is also omitted, so that a great deal of material and labor cost are saved.
Example 2
A rubber-based ceramic resin grinding chip has the same structure as that of the embodiment 1, and the preparation method is similar to that of the embodiment 1, and comprises the following specific steps:
s1, performing surface treatment on the rubber sheet 11 with the size consistent with that of the bottom of the mold 30, and then flatly paving the rubber sheet at the bottom of the mold 30; a high temperature resistant film 40 is spaced between the rubber sheet 11 and the bottom of the mold 30 as shown in fig. 3.
The high temperature resistant film 40 in this embodiment is a high temperature resistant textured paper, which uses an imported crepe paper as a substrate, and has the characteristics of high temperature resistance, good chemical solvent resistance, high adhesion, softness, conformability, no residual glue left after tearing, and the like. The pressure-sensitive adhesive tape has the advantages of strong stripping property, strong adhesive force, protection and fixation, solvent resistance and no adhesive residue, and is generally called as the pressure-sensitive adhesive tape for the masking paper in the industry.
In this embodiment, high temperature resistant beautiful line paper pastes and obeys in the rubber piece back, then tiles inside the mould with high temperature resistant beautiful line paper face.
S2, pouring the stirred slurry 21 for preparing the ceramic resin grinding sheet substrate 20 into a mould 30 with a rubber sheet 11 laid on the bottom;
s3, putting the die in the step S2 into an oven for curing and baking, wherein the baking conditions are as follows in sequence: baking at 65 ℃ for 8 hours, baking at 75 ℃ for 9 hours, baking at 85 ℃ for 13 hours, baking at 95 ℃ for 15 hours, and baking at 105 ℃ for 6 hours; and cooling and demoulding after baking is finished, directly tearing off the high-temperature-resistant masking paper on the back of the rubber substrate ceramic resin abrasive sheet film, and enabling the rubber substrate ceramic resin abrasive sheet not to pollute viscose, thus obtaining the rubber substrate ceramic resin abrasive sheet.
The cured resin grinding sheet obtained in the embodiment can be directly cut into 12.5 × 13mm particle belt-shaped grinding materials for PCB grinding, as shown in FIG. 4, the step of processing the resin grinding sheet to a standard size is omitted, and the step of pressing the rubber skin on the resin grinding sheet with the standard size is also omitted, so that a great deal of material and labor cost are saved.
In the embodiment, with ceramic resin abrasive disc and sheet rubber at pouring in-process integrated into one piece, saved the process of abrasive disc surface cutting grinding process and abrasive disc and rubber pressfitting, promoted the production efficiency of product greatly, practiced thrift a large amount of raw materials, reduced the cost of product, promoted the quality of product simultaneously, had fine market prospect.
The present invention is not limited to the above-described embodiments, and various modifications and variations of the present invention are intended to be included within the scope of the claims and the equivalent technology of the present invention if they do not depart from the spirit and scope of the present invention.
Claims (8)
1. A rubber-based ceramic resin grinding chip is characterized by comprising a rubber-based and a ceramic resin grinding chip base body which are integrally formed; the preparation method of the rubber substrate ceramic resin abrasive disc comprises the following steps:
s1, performing surface treatment on the rubber sheet with the size consistent with that of the bottom of the mold, and then flatly paving the rubber sheet at the bottom of the mold;
s2, pouring the stirred slurry for preparing the ceramic resin abrasive disc substrate into a mold with a rubber sheet spread on the bottom;
s3, putting the die in the step S2 into an oven for curing and baking, and then demolding to obtain the rubber-based ceramic resin grinding piece.
2. The rubber-based ceramic resin grinding chip of claim 1, wherein the rubber substrate is a rubber sheet of a material that is a high tear and high oil resistant rubber.
3. The rubber-based ceramic resin abrasive flake of claim 1 wherein the rubber is nitrile butadiene rubber.
4. The rubber-based ceramic resin grinding chip according to claim 1, wherein a high temperature resistant film is interposed between the rubber chip and the bottom of the mold in step S1.
5. The rubber-based ceramic resin grinding chip of claim 4, wherein the high temperature resistant film is a high temperature resistant textured paper.
6. The rubber-based ceramic resin grinding chip according to claim 1, wherein the baking temperature of step S3 is 65 to 95 ℃ and baked at intervals of 10 ℃ for 8 to 15 hours.
7. The rubber-based ceramic resin grinding chip according to claim 6, wherein the baking conditions of step S3 are, in order: baking at 65 deg.C for 10 hr, baking at 75 deg.C for 8 hr, baking at 85 deg.C for 15 hr, and baking at 95 deg.C for 15 hr.
8. Use of a rubber-based ceramic resin abrasive flake according to any one of claims 1 to 7 in PCB grinding.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010574856.5A CN111687757B (en) | 2020-06-22 | 2020-06-22 | Rubber substrate ceramic resin abrasive disc and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010574856.5A CN111687757B (en) | 2020-06-22 | 2020-06-22 | Rubber substrate ceramic resin abrasive disc and preparation method thereof |
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| Publication Number | Publication Date |
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| CN111687757A CN111687757A (en) | 2020-09-22 |
| CN111687757B true CN111687757B (en) | 2021-08-03 |
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| CN202010574856.5A Active CN111687757B (en) | 2020-06-22 | 2020-06-22 | Rubber substrate ceramic resin abrasive disc and preparation method thereof |
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| CN115366015B (en) * | 2022-09-20 | 2023-08-15 | 广东捷骏电子科技有限公司 | Preparation method of ceramic brush wheel |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20090120553A (en) * | 2008-05-20 | 2009-11-25 | (주)피에스텍 | Absorbing pad composition for polishing, absorbing pad for polishing and method of manufacturing thereof |
| CN107263342A (en) * | 2017-06-07 | 2017-10-20 | 广州立启森科技有限公司 | Printed wiring board grinding brush wheel resin abrasive disc and its manufacture method |
| CN207548487U (en) * | 2017-12-14 | 2018-06-29 | 广州捷骏电子科技有限公司 | A kind of novel brush roll |
| CN110877303A (en) * | 2019-12-04 | 2020-03-13 | 东莞市鼎泰鑫电子有限公司 | Organic ceramic grinding brush and preparation method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105778861A (en) * | 2014-12-24 | 2016-07-20 | 深圳富泰宏精密工业有限公司 | Elastic abrasive particle and manufacturing method thereof |
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- 2020-06-22 CN CN202010574856.5A patent/CN111687757B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20090120553A (en) * | 2008-05-20 | 2009-11-25 | (주)피에스텍 | Absorbing pad composition for polishing, absorbing pad for polishing and method of manufacturing thereof |
| CN107263342A (en) * | 2017-06-07 | 2017-10-20 | 广州立启森科技有限公司 | Printed wiring board grinding brush wheel resin abrasive disc and its manufacture method |
| CN207548487U (en) * | 2017-12-14 | 2018-06-29 | 广州捷骏电子科技有限公司 | A kind of novel brush roll |
| CN110877303A (en) * | 2019-12-04 | 2020-03-13 | 东莞市鼎泰鑫电子有限公司 | Organic ceramic grinding brush and preparation method thereof |
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