CN111669684A - Surround type earphone speaker assembly and method of manufacturing the same - Google Patents
Surround type earphone speaker assembly and method of manufacturing the same Download PDFInfo
- Publication number
- CN111669684A CN111669684A CN202010564463.6A CN202010564463A CN111669684A CN 111669684 A CN111669684 A CN 111669684A CN 202010564463 A CN202010564463 A CN 202010564463A CN 111669684 A CN111669684 A CN 111669684A
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- subassembly
- loudspeaker
- main
- shell
- side wall
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R5/00—Stereophonic arrangements
- H04R5/02—Spatial or constructional arrangements of loudspeakers
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R5/00—Stereophonic arrangements
- H04R5/033—Headphones for stereophonic communication
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Manufacturing & Machinery (AREA)
- Headphones And Earphones (AREA)
Abstract
The invention relates to the technical field of earphone speakers, in particular to a surrounding type earphone speaker assembly and a manufacturing method thereof. This surround type earphone adopts the structure of each vice speaker subassembly that main speaker position cooperation circumference set up, can realize the control to surround sound through actual sound production better, in addition, what each vice speaker subassembly adopted is parallelly connected and structural design who does not influence each other, and each vice speaker subassembly can be installed or dismantles as required selection, and the installation is dismantled operating procedure simply.
Description
Technical Field
The invention relates to the technical field of earphone speakers, in particular to an improved structure capable of effectively realizing the adjustment of surround sound effect of an earphone according to requirements, and particularly relates to a surround type earphone speaker assembly and a manufacturing method thereof.
Background
Headphones, as the name implies, are worn on the head, not inserted into the ear canal, and are distinguished from the type of in-ear earplugs; it consists of two parts, a signal transmitter and an earphone with a signal receiving and amplifying device, usually of the moving coil type. The emitter is connected with the signal source, and a front stage or an earphone amplifier can be connected in front of the emitter to improve the tone quality and adjust the tone color.
At present, the requirements of experience customers on tone quality and sound effect are higher and higher, and therefore, how to further design and improve the earphone from the structure to enable the earphone to have better experience is the mainstream technical development direction of the earphone design industry at present.
To sum up, along with the continuous improvement of the modern society to the comfort level requirement, current earphone has been unable to satisfy the requirement of high-end customer group effectively, and how to design a section can be effectual satisfies the whole new earphone that the different audio of customer experienced according to customer's demand is the technical problem that needs to solve at present urgently.
Disclosure of Invention
In order to solve one of the technical problems, the invention adopts the technical scheme that: surround type earphone speaker subassembly, including the earphone casing of wear-type install circuit board subassembly, main loudspeaker in earphone casing's the cavity the outside integrated into one piece of earphone casing has one to surround the auxiliary casing surround and be equipped with the vice speaker subassembly of a plurality of detachable along its circumference in the auxiliary casing surround and be provided with in the auxiliary casing and current control on the circuit board subassembly the parallelly connected socket assembly who sets up of each circuit of main loudspeaker the last difference electric connection of socket assembly has a plurality of to switch on the jack spare switch on pluggable installation respectively in the jack spare auxiliary speaker subassembly, each auxiliary speaker subassembly with main speaker cooperation is realized encircleing the sound production.
Preferably, the surrounding auxiliary shell and the earphone shell form a main shell, and the main shell is manufactured by adopting an integral forming process.
Preferably, the sectional profile of side direction of total casing is T style of calligraphy and inner chamber cavity setting, total casing is the arc sphere towards the middle part of user's ear one side be equipped with a plurality of hole along its circumference even interval on the ladder surface of arc sphere rear side be equipped with on the inside wall of hole with external screw thread matched with internal thread on the vice speaker subassembly.
Preferably, a rear cover is installed on the rear side of the main shell in a matched mode, the circuit board assembly is fixedly installed in the center of the rear cover, the main loudspeaker is installed on the inner side wall of the arc-shaped spherical surface of the main shell, and the main loudspeaker is connected with the circuit board assembly through a wire.
Preferably, the socket assembly is fixedly installed on the inner side wall of the rear cover on the periphery of the circuit board assembly and comprises two insulating rings which are coaxial and arranged at intervals along the inside and the outside, an annular anode copper sheet is fixedly bonded on each insulating ring respectively, a plurality of anode copper tubes are fixedly arranged on the side wall between the two annular anode copper sheets and facing one side of the main shell at intervals along the circumference of the side wall, the bottom of each anode copper tube is connected with the two anode copper sheets through a conductive pin sheet, an annular cathode copper sheet is fixedly arranged on the inner side wall of the rear cover between the two anode copper sheets, the thickness of the cathode copper sheet is lower than that of each insulating ring, insulating rubber is arranged between the cathode copper sheet and the two anode copper sheets, and a plurality of cathode copper needles are fixedly arranged on the side wall of the cathode copper sheet facing one side of the main shell at intervals along the circumference of the cathode copper sheet, each negative copper needle extends to the center line of the inner cavity of the positive copper pipe at the corresponding position, and the negative copper needles are matched with the positive copper pipes and are used for inserting corresponding auxiliary loudspeaker assemblies to achieve electric conduction.
Preferably, the auxiliary speaker assembly includes a speaker main body, each electrode of the speaker main body is connected with a conductive pin member through an earphone wire respectively, the conductive pin member includes a conductive insertion tube, an insulator is fixedly filled in an inner cavity of the conductive insertion tube, a conductive needle tube is fixedly inserted in the center of the insulator, the inner end of the conductive needle tube extends out of the insulator, one end of the conductive insertion tube and one end of the conductive needle tube are both connected with each electrode of the speaker main body through a wire, the other end of the conductive insertion tube is tightly inserted on the inner side wall of the positive copper tube, and the other end of the conductive needle tube is tightly sleeved on the outer side wall of the negative copper tube.
A method of manufacturing a surround type earphone speaker assembly, comprising the steps of:
processing and manufacturing the parts to be used, such as the main shell, the rear cover, the socket assembly and the auxiliary loudspeaker assembly;
purchasing a circuit board assembly and main loudspeaker parts with the existing corresponding sizes;
assembling and assembling the parts to form an assembly product;
packaging the product;
checking;
and (5) leaving the factory.
Preferably, the machining and manufacturing of the overall shell specifically comprises the following steps:
designing a total shell mold;
selecting a mold blank;
roughly and finely machining the inner and outer surfaces of the mold blank;
adopting a spherical punch to punch the blank to form an arc-shaped spherical surface in the middle of the front side of the total shell die;
punching a stepped surface on the inner hole main shell to form an inner hole;
turning internal threads on the inner side wall of each inner hole;
forming a mold;
closing the mold to manufacture the main shell;
and opening the die to obtain a final part product.
Preferably, the method further comprises the following steps after the step of turning the internal thread:
performing light shot blasting and heat treatment on the die.
The invention has the beneficial effects that: this surround type earphone adopts the structure of each vice speaker subassembly that the main speaker cooperation circumference of central point department set up, can realize the control to surround sound through actual sound production better, in addition, what each vice speaker subassembly adopted is parallelly connected and does not influence structural design each other, and each vice speaker subassembly can be installed or dismantles as required selection, and the installation is dismantled operating procedure simply.
Drawings
In order to more clearly illustrate the detailed description of the invention or the technical solutions in the prior art, the drawings that are needed in the detailed description of the invention or the prior art will be briefly described below. Throughout the drawings, like elements or components are generally identified by like reference numerals. In the drawings, elements or components are not necessarily drawn to scale.
Fig. 1 is a schematic perspective view of the present invention.
Fig. 2 is a schematic front view of the present invention.
FIG. 3 is a schematic side view of the present invention.
Fig. 4 is a schematic cross-sectional view of the inner central plane of the present invention.
In the figure, 1, an earphone housing; 2. A circuit board assembly; 3. a main speaker; 4. Surrounding the auxiliary shell; 5. A sub-speaker assembly; 6. a speaker main body; 7. an insulator; 8. a main housing; 9. an arc spherical surface; 10. a step surface; 11. a conductive needle tube; 12. an internal thread; 13. an external thread; 14. a rear cover; 15. an insulating ring; 16. a positive electrode copper sheet; 17. a positive copper tube; 18. a conductive pin sheet; 19. a negative copper sheet; 20. a conductive cannula; 21. and a negative copper needle.
Detailed Description
Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
The following examples are only for illustrating the technical solutions of the present invention more clearly, and therefore are only examples, and the protection scope of the present invention is not limited thereby.
As shown in fig. 1-4, surround type earphone speaker subassembly, including headphone housing 1 install circuit board subassembly 2, main speaker 3 in headphone housing 1's the cavity the outside integrated into one piece of headphone housing 1 has one to surround auxiliary housing 4 surround and be equipped with a plurality of detachable auxiliary speaker subassembly 5 along its circumference in auxiliary housing 4 surround be provided with in the auxiliary housing 4 with current control on the circuit board subassembly 2 the socket subassembly that each circuit of main speaker 3 set up in parallel the last electric connection of socket subassembly has a plurality of to switch on the jack piece pluggable install respectively in the jack piece auxiliary speaker subassembly 5, each auxiliary speaker subassembly 5 with main speaker 3 cooperation is realized surrounding the sound production.
This earphone emergence structure has adopted main loudspeaker 3 to cooperate a plurality of auxiliary loudspeaker subassembly 5, and the sound production is sufficient and has guaranteed the reasonable layout setting of major-minor sound, can realize coordinating the audio frequency better and set up different encirclement reverberation etc. after installing each auxiliary loudspeaker subassembly 5, has realized improving from the hardware.
The installation and the dismantlement of each pair of speaker subassembly 5 and the fixed firm stability after the installation that adopt the cooperation of socket subassembly and the plug jack piece that switches on can be quick, whole stable in structure.
Preferably, the surrounding auxiliary shell 4 and the earphone shell 1 form a main shell 8, and the main shell 8 is manufactured by adopting an integral molding process.
The mould forming mode integrated into one piece that total casing 8 adopted, overall structure intensity is higher, and the quality that its mould was made is good, and intensity is stronger, can guarantee the life of mould.
Preferably, total casing 8's the sectional profile of side direction is T style of calligraphy and inner chamber cavity setting, total casing 8 is arc sphere 9 towards the middle part of user's ear one side be equipped with a plurality of hole along its circumference even interval on the ladder surface 10 of arc sphere 9 rear side be equipped with on the inside wall of hole with external screw thread 13 matched with internal thread 12 on the vice speaker subassembly 5.
Whole total casing 8 adopts integrated into one piece's structure, and overall structure is more stable when using, adopts internal thread 12 structure and vice speaker subassembly 5 to realize detachable and link firmly.
Preferably, a rear cover 14 is fittingly installed at the rear side of the main casing 8, the circuit board assembly 2 is fixedly installed at the center of the rear cover 14, the main speaker 3 is installed on the inner side wall of the arc-shaped spherical surface 9 of the main casing 8, and the main speaker 3 is connected with the circuit board assembly 2 through a wire.
The circuit board assembly 2 is directly mounted by purchasing the current products on the market, and the circuit part does not have the improvement of the innovative design.
Preferably, the socket assembly is fixedly installed on the inner side wall of the rear cover 14 at the periphery of the circuit board assembly 2, and comprises two insulating rings 15 which are coaxial and arranged at intervals along the inside and the outside, an annular anode copper sheet 16 is fixedly bonded on each insulating ring 15, a plurality of anode copper tubes 17 are fixedly arranged on the side wall between the two annular anode copper sheets 16 and facing one side of the main shell 8 at intervals along the circumference of the side wall, the bottom of each anode copper tube 17 is connected with the two anode copper sheets 16 through a conductive pin sheet 18, an annular cathode copper sheet 19 is fixedly arranged on the inner side wall of the rear cover 14 between the two anode copper sheets 16, the thickness of the cathode copper sheet 19 is smaller than that of the insulating ring 15, insulating rubber is arranged between the cathode copper sheet 19 and the two anode copper sheets 16, a plurality of cathode copper needles 21 are fixedly arranged on the side wall of the cathode copper sheet 19 facing one side of the main shell 8 at intervals along the circumference of the side wall, each negative copper needle 21 extends to the center line of the inner cavity of the positive copper tube 17 at the corresponding position, and the negative copper needles 21 and the positive copper tube 17 are matched for inserting the corresponding auxiliary loudspeaker assemblies 5 to realize electric conduction.
The socket assembly is communicated with the circuit board assembly 2 in a conductive mode, the arrangement of the positive and negative ends is achieved through the positive copper sheets 16 and the negative copper sheets 19, finally when the auxiliary loudspeaker assemblies 5 are fixed in a screwing mode, the conductive insertion tubes 20 can be achieved in the screwing process due to the conductive insertion pin pieces on the auxiliary loudspeaker assemblies 5, the conductive needle tubes 11 are respectively matched with the positive copper tubes 17 and the negative copper needles 21 at corresponding positions to achieve electrification of the positive and negative electrodes, the auxiliary loudspeaker assemblies 5 are connected, the loudspeaker main body 6 of each auxiliary loudspeaker assembly 5 can work in a sounding mode when the loudspeaker main body works, sound control is achieved through the main loudspeaker 3, various surrounding and reverberation hardware regulation and control are achieved, and the sound effect is guaranteed through the existing software audio regulation and control technology.
Preferably, the auxiliary speaker assembly 5 includes a speaker body 6, each electrode of the speaker body 6 is connected with a conductive pin member through an earphone wire, the conductive pin member includes a conductive insertion tube 20, an insulator 7 is fixedly filled in an inner cavity of the conductive insertion tube 20, a conductive needle tube 11 is fixedly inserted in the center of the insulator 7, an inner end of the conductive needle tube 11 extends out of the insulator 7, one end of the conductive insertion tube 20 and one end of the conductive needle tube 11 are both connected with each electrode of the speaker body 6 through wires, the other end of the conductive insertion tube 20 is tightly inserted on the inner side wall 17 of the positive copper tube, and the other end of the conductive needle tube 11 is tightly sleeved on the outer side wall of the negative copper tube 21.
The auxiliary loudspeaker assembly 5 is fixed with an inner hole in the main shell through threads after being installed, and meanwhile, the conductive pin piece and the conductive part on the socket assembly at the corresponding position can be communicated according to the screwing depth in the screwing process, so that whether the auxiliary loudspeaker assembly 5 is in a working state or not is realized.
A method of manufacturing a surround type earphone speaker assembly, comprising the steps of:
processing and manufacturing the main shell 8, the rear cover 14, the socket assembly and the auxiliary loudspeaker assembly 5 to form the spare parts;
purchasing the circuit board assembly 2 and the main loudspeaker 3 with the existing corresponding sizes;
assembling and assembling the parts to form an assembly product;
packaging the product;
checking;
and (5) leaving the factory.
Preferably, the machining and manufacturing of the total shell 8 specifically comprises the following steps:
designing a total shell 8 mold;
selecting a mold blank;
roughly and finely machining the inner and outer surfaces of the mold blank;
a spherical punch is adopted to punch the blank to form an arc spherical surface 9 in the middle of the front side of the die of the total shell 8;
punching a stepped surface 10 on the inner hole general shell 8 to form an inner hole;
turning internal threads 12 on the inner side wall of each inner hole;
forming a mold;
closing the molds to manufacture the main shell 8;
and opening the die to obtain a final part product.
Preferably, the following steps are also included after the step of turning the internal thread 12:
performing light shot blasting and heat treatment on the die.
The overall structure of total casing 8 adopts mould integrated into one piece, the quality of mould and the design of structure are especially important in the in-process mould of mass production, not only influence the quality of product and also influence the life-span of mould self, the mould that adopts in this application is split type metal mold, realize the production to total casing 8 through the compound die, at the in-process of processing because the mould adopts internal surface finish machining to handle, the quality of the product of assurance mould processing that can be quick, simultaneously because the shot-blasting that the mould adopted, process such as thermal treatment can effectual improvement mould life-span of using.
This surround type earphone adopts the structure of each pair of speaker subassembly 5 that the 3 cooperation circumferences of main speaker that adopt central point department set up, can realize the control to surround sound through actual sound production better, in addition, what each pair of speaker subassembly 5 adopted is parallelly connected and do not influence structural design each other, each pair of speaker subassembly 5 can be installed or dismantled as required, the installation is dismantled operating procedure simply, it can realize the outage directly to make it break away from the main casing body through closing each pair of speaker subassembly 5 soon, each pair of speaker subassembly 5 after the outage does not influence the normal use of whole product simultaneously, can select the quantity of the vice speaker subassembly 5 of installation and the spaced distance between each pair of speaker subassembly 5 according to actual audio needs, therefore, the universality is strong.
The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; the modifications or the substitutions do not cause the essence of the corresponding technical solutions to depart from the scope of the technical solutions of the embodiments of the present invention, and the technical solutions are all covered in the scope of the claims and the specification of the present invention; it will be apparent to those skilled in the art that any alternative modifications or variations to the embodiments of the present invention may be made within the scope of the present invention.
The present invention is not described in detail, but is known to those skilled in the art.
Claims (9)
1. Surround type earphone speaker subassembly, including the earphone casing of wear-type install circuit board subassembly, main speaker, its characterized in that in earphone casing's the cavity: earphone casing's outside integrated into one piece has one to encircle the auxiliary housing be equipped with a plurality of detachable auxiliary loudspeaker subassembly along its circumference in encircleing the auxiliary housing be provided with current in encircleing the circuit board subassembly is gone up control the socket subassembly that each circuit of main loudspeaker set up in parallel the last electric connection of socket subassembly has a plurality of to switch on the jack subassembly switch on the installation that can plug respectively in the jack subassembly auxiliary loudspeaker subassembly, each auxiliary loudspeaker subassembly with the sound production is encircleed in the main loudspeaker cooperation realization.
2. A surround type headphone speaker assembly according to claim 1, wherein: the surrounding auxiliary shell and the earphone shell form a main shell, and the main shell is manufactured by adopting an integral forming process.
3. A surround type headphone speaker assembly according to claim 2, wherein: the sectional profile of side direction of total casing is T style of calligraphy and inner chamber cavity setting, total casing is the arc sphere towards the middle part of user's ear one side be equipped with a plurality of hole along its circumference even interval on the ladder face of arc sphere rear side be equipped with on the inside wall of hole with external screw thread matched with internal thread on the vice speaker subassembly.
4. A surround type headphone speaker assembly according to claim 3, wherein: the rear cover is installed on the rear side of the main shell in a matched mode, the circuit board assembly is fixedly installed in the center of the rear cover, the main loudspeaker is installed on the inner side wall of the arc-shaped spherical surface of the main shell, and the main loudspeaker is connected with the circuit board assembly through a wire.
5. A surround type headphone speaker assembly according to claim 4, wherein: the socket assembly is fixedly arranged on the inner side wall of the rear cover on the periphery of the circuit board assembly and comprises two insulating rings which are coaxial and arranged at intervals along the inside and the outside, an annular anode copper sheet is fixedly bonded on each insulating ring respectively, a plurality of anode copper pipes are fixedly arranged on the side wall between the two annular anode copper sheets and towards one side of the main shell at intervals along the circumference of the side wall, the bottom of each anode copper pipe is connected with the two anode copper sheets through a conductive pin sheet, an annular cathode copper sheet is fixedly arranged on the inner side wall of the rear cover between the two anode copper sheets, the thickness of the cathode copper sheet is lower than that of the insulating rings, insulating rubber is arranged between the cathode copper sheet and the two anode copper sheets, and a plurality of cathode copper needles are fixedly arranged on the side wall of the cathode copper sheet and towards one side of the main shell at intervals along the circumference of the cathode copper sheet, each negative copper needle extends to the center line of the inner cavity of the positive copper pipe at the corresponding position, and the negative copper needles are matched with the positive copper pipes and are used for inserting corresponding auxiliary loudspeaker assemblies to achieve electric conduction.
6. A surround type headphone speaker assembly according to claim 5, wherein: the auxiliary loudspeaker assembly comprises a loudspeaker main body, each electrode of the loudspeaker main body is connected with a conductive pin piece through an earphone wire respectively, the conductive pin piece comprises a conductive insertion tube, an insulator is fixedly filled in an inner cavity of the conductive insertion tube, a conductive needle tube is fixedly inserted in the center of the insulator, the inner end of the conductive needle tube extends out of the insulator, one ends of the conductive insertion tube and the conductive needle tube are connected with each electrode of the loudspeaker main body through a wire, the other end of the conductive insertion tube is tightly abutted and inserted on the inner side wall of the anode copper tube, and the other end of the conductive needle tube is tightly abutted and sleeved on the outer side wall of the cathode copper tube.
7. A method of manufacturing a surround type headphone speaker assembly, characterized by: the method comprises the following steps:
processing and manufacturing the parts to be used, such as the main shell, the rear cover, the socket assembly and the auxiliary loudspeaker assembly;
purchasing a circuit board assembly and main loudspeaker parts with the existing corresponding sizes;
assembling and assembling the parts to form an assembly product;
packaging the product;
checking;
and (5) leaving the factory.
8. A method of manufacturing a surround type headphone speaker assembly, characterized by: the machining and manufacturing of the total shell specifically comprise the following steps:
designing a total shell mold;
selecting a mold blank;
roughly and finely machining the inner and outer surfaces of the mold blank;
adopting a spherical punch to punch the blank to form an arc-shaped spherical surface in the middle of the front side of the total shell die;
punching a stepped surface on the inner hole main shell to form an inner hole;
turning internal threads on the inner side wall of each inner hole;
forming a mold;
closing the mold to manufacture the main shell;
and opening the die to obtain a final part product.
9. A method of manufacturing a surround type headphone speaker assembly, characterized by: the method also comprises the following steps after the step of turning the internal thread:
performing light shot blasting and heat treatment on the die.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010564463.6A CN111669684B (en) | 2020-06-19 | 2020-06-19 | Surround type earphone speaker assembly and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010564463.6A CN111669684B (en) | 2020-06-19 | 2020-06-19 | Surround type earphone speaker assembly and method of manufacturing the same |
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| Publication Number | Publication Date |
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| CN111669684A true CN111669684A (en) | 2020-09-15 |
| CN111669684B CN111669684B (en) | 2021-10-15 |
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| Application Number | Title | Priority Date | Filing Date |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114160463A (en) * | 2021-12-15 | 2022-03-11 | 湖北省云沃智能科技有限公司 | Bluetooth headset based on ultra-precision automation and production process |
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|---|---|---|---|---|
| CN1422101A (en) * | 2001-11-27 | 2003-06-04 | 黄瑞书 | Improved earphone |
| CN101080107A (en) * | 2006-05-26 | 2007-11-28 | 捷音特科技股份有限公司 | Multi-track earphone |
| US20080247588A1 (en) * | 2007-04-04 | 2008-10-09 | Cotron Corporation | Multiple channel earphone and structure thereof |
| CN103067827A (en) * | 2011-10-21 | 2013-04-24 | 潘建全 | Multi-channel hanging loudspeaker device provided with movable switching structure and assembly method thereof |
| CN106256137A (en) * | 2014-12-09 | 2016-12-21 | 松下知识产权经营株式会社 | Headband receiver |
| CN206517580U (en) * | 2017-01-23 | 2017-09-22 | 东莞市歌尚电子有限公司 | Has the headphone of 3D audios |
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| CN208891032U (en) * | 2018-10-22 | 2019-05-21 | 潍坊职业学院 | A kind of anti-earphone and electronic equipment of bowing of Hall control |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114160463A (en) * | 2021-12-15 | 2022-03-11 | 湖北省云沃智能科技有限公司 | Bluetooth headset based on ultra-precision automation and production process |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111669684B (en) | 2021-10-15 |
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