CN111668638B - Electronic component module and connector housing thereof - Google Patents
Electronic component module and connector housing thereof Download PDFInfo
- Publication number
- CN111668638B CN111668638B CN202010150560.0A CN202010150560A CN111668638B CN 111668638 B CN111668638 B CN 111668638B CN 202010150560 A CN202010150560 A CN 202010150560A CN 111668638 B CN111668638 B CN 111668638B
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- CN
- China
- Prior art keywords
- substrate
- connector
- electronic component
- housing
- main body
- Prior art date
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- 239000000758 substrate Substances 0.000 claims abstract description 239
- 229920005989 resin Polymers 0.000 claims abstract description 106
- 239000011347 resin Substances 0.000 claims abstract description 106
- 238000007789 sealing Methods 0.000 claims abstract description 59
- 238000005192 partition Methods 0.000 claims abstract description 20
- 238000003780 insertion Methods 0.000 claims abstract description 17
- 230000037431 insertion Effects 0.000 claims abstract description 17
- 239000003795 chemical substances by application Substances 0.000 claims description 51
- 238000009751 slip forming Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract 1
- 238000002347 injection Methods 0.000 description 28
- 239000007924 injection Substances 0.000 description 28
- 230000013011 mating Effects 0.000 description 18
- 239000003990 capacitor Substances 0.000 description 12
- 230000006870 function Effects 0.000 description 7
- 230000007547 defect Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 239000000446 fuel Substances 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000005484 gravity Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000009993 protective function Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/502—Bases; Cases composed of different pieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
- H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
Abstract
An electronic component module and a connector housing thereof can prevent a substrate from being damaged when the substrate is inserted into the connector housing in an assembly operation in advance, and can realize a good protection function for the substrate in a use process. The electronic component module includes: a substrate having a substrate body and a card edge connector; and a connector housing accommodating the substrate. The connector housing has: a substrate accommodating section; a connector fitting portion; and a partition wall through which a slit is formed. The connector fitting portion has an opening portion for connection of the counterpart connector, and the substrate housing portion has an opening portion for insertion of the substrate along the connector fitting direction. The gap between the substrate and the slit is closed by a first sealing resin cured from a first resin material injected from an opening of the connector fitting portion, and the substrate main body is sealed by a second sealing resin cured from a second resin material injected from an opening of the substrate housing portion.
Description
Technical Field
The invention relates to an electronic element module and a connector housing thereof.
Background
There is known an electronic component module in which a card edge connector is provided on one side of a substrate main body on which an electronic component is mounted, and a substrate composed of the substrate main body and the card edge connector is arranged in a connector housing.
For example, in the electronic component module described in japanese patent application laid-open No. 2017-117914, as shown in fig. 6 of japanese patent application laid-open No. 2017-117914, an elastic member 21 is disposed in a connector housing 10 having a box shape flattened in the up-down direction, and is divided into a first housing portion 11 opening upward and a second housing portion 13 opening to one side. The substrate main body 3 is disposed in the first housing portion 11, and the electronic component 5 protruding from the lower surface of the substrate main body 3 is positioned in the recess 12 formed in the bottom wall of the first housing portion 11, thereby preventing interference with the bottom wall. In the above state, the card edge connector 8 of the board 2 is inserted into the slit 21a formed in the elastic member 21 and protrudes into the second housing portion 13, thereby forming a connector fitting portion to which the connector on the other side can be connected. The resin agent is injected into the first housing portion 11, and the substrate main body 3 is sealed with the cured sealing resin 28, thereby protecting the substrate main body 3.
When the electronic component module 1 is assembled, first, as shown in fig. 8 of japanese patent application laid-open No. 2017-117914, the substrate 2 is inserted into the first housing portion 11 of the connector housing 10 from obliquely above, and the edge connector 8 at the front end is projected into the second housing portion 13 through the slit 21a of the elastic member 21. Next, when the substrate 2 is rotated in a horizontal posture with the slit 21a as a fulcrum, the substrate body 3 is disposed in the first housing portion 11, and the electronic component 5 protruding from the lower surface of the substrate body 3 is housed in the recess 12.
After that, when the injection nozzle is disposed above the first housing portion 11 and the resin agent is injected to the upper surface of the substrate body 3, the resin agent is guided to the lower side of the substrate body 3 through the gap around the substrate body 3, and the air existing at the lower side is discharged upward through the air suction hole penetrating the substrate body 3. The injected resin agent impregnates the substrate main body 3 and is prevented from leaking to the second housing portion 13 by the elastic member 21, and when the resin agent is cured and seals the substrate main body 3 as the sealing resin 28, the assembly operation of the electronic component module 1 is completed.
However, the electronic component module 1 described in japanese patent application laid-open No. 2017-117914 has two types of defects (referred to as defects 1 and 2) as described below, and therefore there is room for improvement.
The defect 1 relates to protection of the substrate 2 generated during the assembly operation of the electronic component module 1, and there is a possibility that each portion of the substrate 2 is damaged by an excessive force due to the substrate 2 being inserted obliquely into the first housing portion 11.
More specifically, since the card edge connector 8 is not positioned by a stopper or the like but is delegated to the operator's eyes for measurement when it is inserted into the slit 21a of the elastic member 21, there is a possibility that an excessive or insufficient insertion depth may occur. In addition, when the insertion depth is insufficient, the edge connector 8 at the front end contacts the side wall of the first housing portion 11, and conversely, when the insertion depth is insufficient, the edge connector 8 and the substrate body 3 are damaged by an excessive force. When the insertion depth is excessive or insufficient, the electronic component 5 to be accommodated in the recess 12 of the first accommodating portion 11 may be damaged by contact with the bottom wall.
The defect 2 relates to protection of the substrate 2 generated during use of the assembled electronic component module 1, and the upper surface of the substrate main body 3 is sealed only with the sealing resin 28, so that the protection is insufficient.
More specifically, the lower surface of the substrate body 3 is protected by the bottom wall of the connector housing 10, and the upper surface of the substrate body 3 is protected by the cured sealing resin 28. Although cured, the sealing resin 28 is weaker than the connector housing 10 manufactured by injection molding or the like, and thus the upper surface of the substrate main body 3 is insufficiently protected as compared with the lower surface. Therefore, when an external force acts on the electronic component module 1, the internal substrate body 3 and the electronic component 5 may be broken together with the sealing resin 28. Further, although a countermeasure of covering the surface of the sealing resin 28 with a metal plate or the like is conceivable, other problems such as an increase in cost may occur due to the addition of components.
Disclosure of Invention
The present invention has been made to solve the above-described problems, and an object of the present invention is to provide an electronic component module and a connector housing thereof, which can prevent breakage of a substrate during insertion into the connector housing in advance during assembly work, and which can realize a good protection function for the substrate during use.
In order to achieve the above object, an electronic component module of the present invention includes: a substrate having a substrate main body on which an electronic component is mounted and a card edge connector provided at one side edge of the substrate main body; and a connector housing accommodating the substrate, the connector housing having: a substrate accommodating portion accommodating a substrate main body; a connector fitting portion formed adjacent to the substrate accommodating portion and accommodating the card edge connector; and a partition wall that penetrates a slit through which the card edge connector is inserted, and that divides the board housing portion and the connector fitting portion, the connector fitting portion being formed with an opening portion at an end portion on an opposite side from the board housing portion, the board housing portion being formed with an opening portion at an end portion on an opposite side from the connector fitting portion, the opening portion being configured to allow insertion of the board in a fitting direction of the opposite side connector, a gap between the board and the slit being closed with a first sealing resin that is formed by curing a first resin injected through the opening portion of the connector fitting portion, the board body being closed with a second sealing resin that is formed by curing a second resin injected through the opening portion of the board housing portion.
As another aspect of the electronic component module, the escape portion that prevents interference with the electronic component may be formed continuously to the opening portion in the substrate accommodating portion.
As another aspect of the electronic component module, the size of the substrate main body may be larger than the size of the card edge connector in the width direction of the substrate orthogonal to the fitting direction of the counterpart connector.
As another embodiment of the electronic component module, a seal groove may be formed on the connector fitting portion side of the partition wall so as to surround the periphery of the slit, and the first sealing resin may be formed in the seal groove.
As another aspect of the electronic component module, the substrate main body and the electronic component may be disposed in the substrate housing portion so as to be surrounded by the substrate housing portion over the entire circumference.
The connector housing of the electronic component module of the present invention is provided with a substrate having a substrate main body on which an electronic component is mounted and a card edge connector provided at one side edge of the substrate main body, and includes: a substrate accommodating portion accommodating a substrate main body; a connector fitting portion formed adjacent to the substrate accommodating portion and accommodating the card edge connector; and a partition wall that penetrates a slit through which the card edge connector is inserted, and that divides the board housing portion and the connector fitting portion, the connector fitting portion being formed with an opening portion at an end portion on an opposite side from the board housing portion, the opening portion being filled with a first resin agent and being connectable to the counterpart connector, the first resin agent being cured to form a first sealing resin, thereby closing a gap between the board and the slit, the board housing portion being formed with an opening portion at an end portion on an opposite side from the connector fitting portion, the opening portion being filled with a second resin agent, the second resin agent being cured to form a second sealing resin sealing the board body.
In another embodiment of the connector housing of the electronic component module, the escape portion that prevents interference with the electronic component may be formed continuously in the substrate housing portion to the opening portion.
In another embodiment of the connector housing of the electronic component module, the size of the board housing portion may be larger than the size of the connector fitting portion in the width direction of the board orthogonal to the fitting direction of the counterpart connector.
In another embodiment of the connector housing of the electronic component module, a seal groove may be formed on the connector fitting portion side of the partition wall so as to surround the periphery of the slit, and the first sealing resin may be formed in the seal groove.
In another embodiment of the connector housing of the electronic component module, the substrate housing portion may be formed in a shape surrounding the entire circumference of the substrate main body and the electronic component disposed therein.
According to the electronic component module and the connector housing thereof of the present invention, the substrate can be prevented from being broken when the substrate is inserted into the connector housing in the assembly operation in advance, and a good protection function for the substrate during use can be realized.
Drawings
Fig. 1 is a perspective view showing an electronic component module and a counterpart connector according to an embodiment.
Fig. 2 is an exploded perspective view showing the electronic component module and the counterpart connector before the connector housing and the substrate are combined.
Fig. 3 is a view in the a direction of fig. 1.
Fig. 4 is a B-direction view of fig. 1.
Fig. 5 is a V-V line cross-sectional view of fig. 1 showing the electronic component module when the counterpart connector is disconnected.
Fig. 6 is a cross-sectional view corresponding to fig. 5 showing the electronic component module when the counterpart connector is connected.
Fig. 7 is a cross-sectional view taken along line VII-VII of fig. 6.
Fig. 8 is a detail view of section C of fig. 6.
Fig. 9 is a perspective view showing the connector housing when the first resin agent is injected.
Fig. 10 is a perspective view showing the connector housing when the second resin agent is injected.
Fig. 11 is a view corresponding to fig. 4 showing another example in which the upper surface of the substrate housing portion is raised as a whole to serve as a relief portion.
(symbol description)
1. Electronic component module
2. Substrate board
3. Substrate main body
4. Card edge connector
5. Electronic component
6. Connector housing
7. Connector fitting part
7a opening part
8. Substrate accommodating portion
8a opening part
9. Counterpart connector
10. Partition wall
11. Slit(s)
12. Sealing groove
13. First sealing resin
14. Avoidance part
16. Second sealing resin
Detailed Description
An embodiment of an electronic component module and a connector housing of the electronic component module embodying the present invention will be described below.
Fig. 1 is a perspective view showing an electronic component module and a mating connector according to the present embodiment, and fig. 2 is an exploded perspective view showing the electronic component module and the mating connector before a connector housing is coupled to a substrate.
The electronic component module 1 includes a substrate 2 and a connector housing 6 made of synthetic resin. The substrate 2 of the electronic component module 1 is composed of a substrate body 3 and a card edge connector 4 provided at one side edge of the substrate body 3. A plurality of electronic components 5 are mounted on the substrate body 3. The plurality of electronic components 5 are connected to each other via a conductor pattern, not shown, and the circuit formed on the substrate body 3 is electrically connected to the card edge connector 4.
The electronic component module 1 is configured by inserting the substrate 2 into the connector housing 6. Further, as will be described later in detail, when the mating connector 9 is connected to the connector fitting portion 7 provided on one side of the connector housing 6, the electronic component module 1 is connected to the electrical device to be connected via the internal card edge connector 4 and the mating connector 9.
The electronic component module 1 of the present embodiment functions as an ECU (engine control unit) for controlling an engine of a motorcycle. The vehicle is equipped with a fuel injection valve, an ignition device, various sensors, and the like of the engine, and the above-described electric devices are connected to the electronic component module 1 via the mating connector 9, and the electronic component module 1 controls the fuel injection and ignition timing of the engine.
In the following description, the upper surface of the substrate body 3 is referred to as an upper surface, the lower surface is referred to as a lower surface, and the directions orthogonal to the upper and lower surfaces of the substrate body 3 are referred to as the up-down directions in accordance with the posture shown in fig. 1. The direction in which the electronic component module 1 is connected to the mating connector 9 is referred to as a connector fitting direction, and the direction orthogonal to the up-down direction and the connector fitting direction is referred to as a board width direction.
Fig. 3 is a view in the direction a of fig. 1, fig. 4 is a view in the direction B of fig. 1, fig. 5 is a cross-sectional view along line V-V of fig. 1 showing the electronic component module 1 when the counterpart connector 9 is disconnected, fig. 6 is a cross-sectional view corresponding to fig. 5 showing the electronic component module 1 when the counterpart connector 9 is connected, and fig. 7 is a cross-sectional view along line VII-VII of fig. 6.
As shown in fig. 2, 4 and 7, the substrate body 3 has a substantially square plate shape, and the electronic components 5 are mounted on the upper and lower surfaces, respectively. The mounted electronic component 5 has various upper and lower dimensions, but for example, as shown in fig. 4, an electronic component 5 having a larger upper and lower dimension H2 as in the electrolytic capacitor 5a is mounted on the upper surface of the substrate main body 3.
As shown in fig. 5 and 7, a plurality of contacts 4a are formed by conductor patterns on one side edge of the substrate 2, thereby forming the card edge connector 4. In detail, the contacts 4a are arranged along one side edge on the upper and lower surfaces of the substrate 2, and the contacts 4a are electrically connected to circuits on the substrate 2.
As shown in fig. 3 to 5, the connector housing 6 in which the substrate 2 is disposed has a cylindrical shape flattened in the up-down direction as a whole. The connector housing 6 is divided into a connector fitting portion 7 and a board housing portion 8 adjacent to each other in the connector fitting direction. A partition wall 10 is formed in the connector housing 6, and the connector fitting portion 7 and the board housing portion 8 are partitioned by the partition wall 10 and communicate with each other via a slit 11 extending in the board width direction, and the slit 11 is formed penetrating the partition wall 10 in the connector fitting direction.
An opening 7a is formed at an end of the connector fitting portion 7 opposite to the board housing portion 8, and the mating connector 9 is fitted into the opening 7a. An opening 8a is formed in an end of the board housing portion 8 opposite to the connector fitting portion 7, and the board 2 is inserted from the opening 8 a. A pair of guide grooves 8b extending in the connector fitting direction are formed on both sides in the board width direction in the board housing portion 8 to guide insertion of the board 2.
The board main body 3 of the board 2 is disposed in the board housing portion 8 of the connector housing 6, and the card edge connector 4 of the board 2 is inserted through the slit 11 of the partition wall 10 and disposed in the connector fitting portion 7 through the slit 11. The slit 11 has a shape corresponding to the cross-sectional shape of the substrate 2, and a minute gap is formed between the inner peripheral surface of the slit 11 and the outer peripheral surface of the substrate 2 so that the substrate 2 can be inserted. A seal groove 12 is formed on the connector fitting portion 7 side of the partition wall 10 so as to surround the periphery of the slit 11, and a first sealing resin 13 is formed by injecting a first resin agent into the seal groove 12 and curing the same. The first sealing resin 13 closes the gap formed between the substrate 2 and the slit 11, and the substrate housing portion 8 and the connector fitting portion 7 are completely separated.
As shown in fig. 4 and 5, since the vertical dimension H2 of the electrolytic capacitor 5a of one of the electronic components 5 mounted on the upper surface of the substrate main body 3 is larger than the interval H1 between the upper surface of the substrate main body 3 and the upper surface 8c of the substrate housing portion 8, the upper portion of the electrolytic capacitor 5a interferes with the upper surface 8c of the substrate housing portion 8 in this state. However, the relief portion 14 is provided to protrude from the upper surface 8c of the substrate housing portion 8, and the relief portion 14 is separated from the upper surface of the substrate main body 3 by a gap H3 larger than the vertical dimension H2 of the electrolytic capacitor 5a. More specifically, the relief portion 14 is formed at a position corresponding to the electrolytic capacitor 5a on the upper surface 8c of the substrate housing portion 8 in the substrate width direction, covers the electrolytic capacitor 5a from above, and continues in the connector fitting direction from the position of the electrolytic capacitor 5a to the opening portion 8a of the substrate housing portion 8 in the same cross-sectional shape. Therefore, interference between the upper portion of the electrolytic capacitor 5a and the escape portion 14 is prevented, and the electrolytic capacitor 5a is housed in the substrate housing portion 8 without any problem.
As shown in fig. 7, the dimension W1 of the substrate body 3 is different from the dimension W2 of the card edge connector 4 in the substrate width direction. Specifically, the dimension W1 of the substrate body 3 is larger than the dimension W2 of the card edge connector 4, with the step portion 15 formed between the substrate body 3 and the card edge connector 4 as a boundary.
As shown in fig. 4 and 5, the second resin agent is injected into and spread inside the substrate housing portion 8, and the substrate main body 3 and each electronic component 5 are sealed with the second sealing resin 16 formed by curing the second resin agent, thereby being free from the influence of water, heat, light, vibration, or the like from the outside.
In this way, the first sealing resin 13 seals the gap between the substrate 2 and the slit 11, and the second sealing resin 16 seals the substrate body 3 and each electronic component 5, and any resin may be used as the first sealing resin 13 and the second sealing resin 16 if the above-described objects can be achieved, and for example, a thermosetting resin, an ultraviolet curable resin, or the like may be arbitrarily used.
Fig. 8 is a detailed view of the portion C in fig. 6, and a connection state of the mating connector 9 to the connector fitting portion 7 of the connector housing 6 will be described below with reference to fig. 5, 6, and 8.
As described above, the connector fitting portion 7 of the connector housing 6 has a cylindrical shape that is flat in the up-down direction and is open on one side in the connector fitting direction. A fitting portion 7b is formed on the partition wall 10 side in the connector fitting portion 7, and a sealing portion 7c is formed on the opening portion 7a side. The sealing portion 7c has a shape that is enlarged in the up-down direction compared with the fitting portion 7b, and the fitting portion 7b and the sealing portion 7c are continuous via the tapered guide portion 7 d.
Corresponding to the connector fitting portion 7, the mating connector 9 is composed of a contact holding portion 9a fitted into the connector fitting portion 7 and an outer tube 9b surrounding the contact holding portion 9a, and the contact holding portion 9a and the outer tube 9b are integrally formed of a synthetic resin material. In a state where the mating connector 9 is connected to the connector fitting portion 7, the outer tube 9b of the mating connector 9 is fitted to the connector fitting portion 7 and is prevented from coming off by the stopper 7e shown in fig. 1 and 2, and the contact holding portion 9a of the mating connector 9 is guided by the tapered guide portion 7d of the connector fitting portion 7 to be fitted into the fitting portion 7 b. The seal 17 provided on the outer periphery of the contact holding portion 9a is held elastically in contact with the inner periphery of the seal portion 7c of the connector fitting portion 7, thereby preventing intrusion of rainwater or the like.
In the contact holding portion 9a of the mating connector 9, a plurality of contacts 9c of two upper and lower rows are arranged in the board width direction so as to correspond to the respective contacts 4a of the card edge connector 4 of the board 2. The holder 18 holds each contact 9c at a predetermined position. The wiring 19 connected to each contact 9c extends from the mating connector 9 to the outside, and is connected to an electric device such as a fuel injection valve, an ignition device, or a sensor mounted on the motorcycle.
As a result of sandwiching the card edge connector 4 from above and below by the two rows of contacts 9c of the mating connector 9, the contacts 4a of the card edge connector 4 come into contact with the contacts 9c of the mating connector 9 and conduct.
Next, a sequence of the assembly operation of the electronic component module 1 configured as described above will be described.
First, the connector housing 6 is manufactured by injection molding or the like using synthetic resin as a material, and the substrate 2 including the electronic component 5, the card edge connector 4 is manufactured. Next, as shown by an arrow in fig. 2, the board 2 is inserted into the board housing 8 of the connector housing 6 through the opening 8a with the card edge connector 4 side as a tip. The insertion direction is along the connector fitting direction, and when the substrate 2 is inserted, the electrolytic capacitor 5a on the substrate 2 moves in the escape portion 14 formed on the upper surface 8c of the substrate housing portion 8. Then, as shown in fig. 7, when the card edge connector 4 protrudes into the connector fitting portion 7 through the slit 11 of the partition wall 10 and the step portion 15 abuts against the partition wall 10, the insertion of the substrate 2 is completed.
Thus, the board 2 is inserted into the board housing portion 8 of the connector housing 6 along the connector fitting direction. Accordingly, the problem 1 of japanese patent application laid-open No. 2017-117914, which is caused by the oblique insertion of the substrate, that is, the breakage of the substrate due to the contact with other members such as the connector housing, can be prevented in advance.
In detail, during the insertion of the substrate 2, the substrate 2 is guided to the guide groove 8b in the substrate housing portion 8, so that the substrate main body 3 and the electronic component 5 are moved in the substrate housing portion 8 without being in contact with the inner wall of the substrate housing portion 8 and without receiving excessive force, and are disposed at respective predetermined positions. At this time, the electrolytic capacitor 5a moves in the escape portion 14 without contacting the inner wall of the escape portion 14 and receiving excessive force, and is disposed at a predetermined position. The card edge connector 4 moves in the board housing portion 8 and then protrudes into the connector fitting portion 7 through the slit 11, but does not contact the inner wall of the board housing portion 8 or the inner wall of the connector fitting portion 7 at this time, and only slightly slides when passing through the slit 11. Therefore, breakage due to contact of the members can be prevented in advance.
On the other hand, as described above, the insertion of the substrate 2 into the connector housing 6 from the substrate accommodating portion 8 side also relaxes the restrictions regarding the height of the electronic component 5 mounted on the substrate main body 3. Here, it is assumed that the board 2 is inserted from the connector fitting portion 7 side along the connector fitting direction. The specification of the connector fitting portion 7 including the card edge connector 4 is automatically determined in correspondence with the specification of the mating connector 9, and the shape of the connector fitting portion 7 into which the mating connector 9 is fitted cannot be freely changed.
Therefore, when the board 2 is supposed to be inserted from the connector fitting portion 7 side, the outline shape of the entire board 2 including the electronic component 5 and the like as viewed along the connector fitting direction is limited by the cross-sectional shape of the connector fitting portion 7. When the contour shape of the board 2 exceeds the cross-sectional shape of the connector fitting portion 7, the board cannot be inserted due to interference with each other, and therefore, the height of the electronic component 5 mounted on the board main body 3 is limited.
In contrast, the cross-sectional shape of the substrate housing portion 8 of the connector housing 6 can be set irrespective of the specification of the counterpart connector 9. Therefore, when the electronic component 5 having a large height such as the electrolytic capacitor 5a is mounted, the recess 14 is formed in the substrate housing portion 8, so that the cross-sectional shape of the substrate housing portion 8 may be made to correspond to the outline shape of the substrate 2. This allows the substrate 2 to be inserted into the substrate housing portion 8 without interfering with the peripheral wall of the substrate housing portion 8. Accordingly, the restrictions on the height of the electronic component 5 mounted on the substrate 2 can be relaxed, and the function of the electronic component module 1 can be improved.
In addition, the advantage of inserting the substrate 2 from the substrate housing portion 8 side is exhibited not only in the height of the electronic component 5 but also in the dimension W1 in the substrate width direction of the substrate main body 3 shown in fig. 7. That is, when the substrate 2 is inserted from the connector fitting portion 7 side, the dimension W1 of the substrate main body 3 is also limited by the cross-sectional shape of the connector fitting portion 7, more specifically, by the dimension W3 in the substrate width direction of the connector fitting portion 7 shown in fig. 7. However, when the substrate 2 is inserted from the substrate accommodating portion 8 side, the substrate main body 3 having a desired dimension W1 can be inserted because the sectional shape of the substrate accommodating portion 8 can be set so that the substrate main body 3 can be inserted. In this case, the dimension of the board housing portion 8 in the board width direction is equal to the dimension W1 of the board main body 3, and is necessarily larger than the dimension W3 of the connector fitting portion 7.
As a result, in the present embodiment, the dimension W1 of the substrate main body 3 may be larger than the dimension W2 of the card edge connector 4 corresponding to the specification of the counterpart connector 9. If the size W1 increases, the effective area available for mounting the electronic component 5 on the substrate main body 3 also increases, and thus this factor contributes greatly to the improvement of the function of the electronic component module.
Returning to the description of the assembly operation, the above-described insertion operation of the board 2 can be performed in an arbitrary posture of the connector housing 6, but in the following injection operation of the first resin agent, the connector housing 6 is held in a posture in which the opening 7a of the connector fitting portion 7 is directed upward as shown in fig. 9. When the inside of the connector fitting portion 7 is viewed from above, the edge connector 4 fitted into the slit 11 of the partition wall 10 as shown in fig. 3 can be confirmed, and the periphery of the edge connector 4 is surrounded by the seal groove 12.
Next, the injection nozzle 31 is inserted into the connector fitting portion 7 through the opening portion 7a, and the first resin agent is injected into the seal groove 12. The first resin agent is cured in the seal groove 12 and forms a first sealing resin 13 surrounding the periphery of the card edge connector 4. Further, the gap between the substrate 2 and the slit 11 is closed by the first sealing resin 13, and the substrate housing portion 8 and the connector fitting portion 7 are completely separated.
Next, as shown in fig. 10, the connector housing 6 is turned over, and the opening 8a of the substrate housing 8 is set to an upward position. As shown in fig. 4, the substrate body 3 inserted into the substrate housing portion 8 can be confirmed. Next, the injection nozzle 32 is inserted into the substrate housing portion 8 through the opening portion 8a, and the second resin agent is injected into the substrate housing portion 8. The second resin agent is cured in the substrate housing portion 8, and the substrate main body 3 and each electronic component 5 are sealed with the second sealing resin 16 thus formed.
The first resin agent and the second resin agent are set to different viscosities and injection amounts as described below due to the purpose.
That is, the first resin agent is intended to close the gap between the substrate 2 and the slit 11. Therefore, when the filler is injected into the seal groove 12, a high viscosity is required so as not to leak to the substrate accommodating portion 8 side through the gap, but the filler is only required to be very small as long as the filler can be cured in the seal groove 12 to close the gap. As one example, when the injection amount of the second resin agent is 40cc, the injection amount of the first resin agent is only about 0.15cc.
When the first resin agent is injected, it is necessary to prevent the first resin agent from adhering to the contacts 4a of the card edge connector 4, the sealing portion 7c exposed in the connector fitting portion 7, and the like. This is because the adhesion to the contact 4a is a cause of poor contact, and the adhesion to the seal portion 7c is a cause of reduced water repellency. However, since the injection amount of the first resin agent is very small and gravity acts in the connector fitting direction in the posture of the connector housing 6 shown in fig. 9 at the time of the injection operation of the first resin agent, it is considered that the seal groove 12 of the injection site is located at a position lower than the contact 4a and the seal portion 7c. Therefore, the first resin agent is injected in a state where the tip of the injection nozzle 31 is held at the nearest height of the seal groove 12, and adhesion to the contacts 4a and the seal portion 7c can be easily avoided.
In addition, although the viscosity of the first resin agent is a factor of decreasing the injection speed, the injection amount is very small. Therefore, the injection operation can be completed simply and in a short time without delay, and the operation can be performed efficiently.
In japanese patent application laid-open No. 2017-117914, the first receiving portion and the second receiving portion of the connector housing are divided by an elastic member. In order to achieve the above-described structure, a mold for molding the elastic member is required, and a molding operation of the elastic member using the mold is also required. In addition, in the assembly work of the electronic component module, a work of disposing the elastic member in the connector housing is required. All of the above increases the manufacturing cost of the electronic component module.
In contrast, in the present embodiment, only a small amount of the first resin agent is injected into the seal groove 12. As described above, since the injection operation can be completed simply and in a short time and a small amount of the first resin agent is inexpensive, the manufacturing cost can be reduced as compared with japanese patent application laid-open No. 2017-117914.
On the other hand, the second resin agent is intended to seal the substrate main body 3 and each electronic component 5 in the substrate housing portion 8, and the gap between the substrate 2 and the slit 11 is already closed by the first sealing resin 13, so that the injection operation can be performed without fear of leakage to the connector fitting portion 7 side. Therefore, as described above for the injection amount, it is required to completely fill the substrate storage section 8, but there is no problem even if the second resin agent is made to have a lower viscosity than the first resin agent.
The injection operation of the second resin agent corresponds to the operation of injecting the resin agent into the first housing portion of the connector housing in japanese patent application laid-open No. 2017-117914, but there is a significant difference in the operation efficiency.
That is, in japanese patent application laid-open No. 2017-117914, as shown in fig. 3, most of the area of the first housing portion that is opened upward is closed by the substrate main body, so that the resin agent cannot be directly injected to the lower side of the substrate main body. Therefore, the resin agent injected into the upper surface of the substrate main body can only be injected at an extremely low rate by indirectly flowing downward through the gap formed around the substrate main body. Although the above problem can be slightly improved by enlarging the opening area of the air-extracting hole, on the other hand, there arises another problem that the effective area of the substrate main body that can be used for mounting the electronic component is reduced.
In contrast, in the present embodiment, the connector housing 6 maintains the posture shown in fig. 10 during the injection operation of the second resin agent, and gravity acts along the connector fitting direction. As a result, in the above-described posture, the connector fitting direction corresponds substantially to the up-down direction, and the substrate housing portion 8 is opened upward, so that the injected second resin agent is stored sequentially from a lower position in the substrate housing portion 8 without delay. In addition, when the second resin agent is injected into the substrate housing portion 8, there is no need to consider preventing adhesion to the contact 4a and the sealing portion 7c. In addition, since the opening 8a of the substrate housing portion 8 is larger than the opening 7a in order to insert the substrate 2, the second resin agent can be injected from a suitable position. Further, since the substrate housing portion 8 in which the substrate body 3 is disposed is divided into two regions arranged in the vertical direction as shown in fig. 10 with the substrate body 3 interposed therebetween and each region is opened upward, the injection nozzle 32 can be disposed in each opening portion and injection can be performed simultaneously. In this way, suitable conditions for increasing the injection speed of the second resin agent are achieved.
In addition, although in japanese patent application laid-open No. 2017-117914 a minute gap may be formed between the slit of the elastic member and the substrate, in the present embodiment, the substrate housing portion 8 and the connector fitting portion 7 are completely separated by the cured first sealing resin 13. In particular, the seal groove 12 formed in the partition wall 10 serves to expand the bonding area for bonding the substrate 2 to the slit 11 via the first sealing resin 13, and further to completely separate the substrate housing portion 8 and the connector fitting portion 7. As a result, since the injected second resin agent can be reliably prevented from leaking to the connector fitting portion 7 side, a second resin agent having a lower viscosity can be used, and the above factors also contribute greatly to the improvement of the injection speed.
Therefore, in the present embodiment, the operation of injecting the second resin agent into the substrate housing portion 8 can be completed in a short time at a high injection speed, and the manufacturing cost can be reduced by improving the operation efficiency.
On the other hand, as is clear from fig. 4, 6, and 7, in the electronic component module 1 completed by the above-described assembly operation, the substrate main body 3 and each electronic component 5 are surrounded by the substrate housing portion 8 and the second sealing resin 16 over the entire periphery including the up-down direction and the substrate width direction by being disposed in the substrate housing portion 8 of the connector housing 6, thereby being protected from the outside. The edge connector 4 is also disposed in the connector fitting portion 7 of the connector housing 6, and is surrounded by the connector fitting portion 7 over the entire circumference including the vertical direction and the board width direction, thereby being protected from the outside.
In addition, although the edge of the substrate main body 3 is buried in the second sealing resin 16 exposed into the opening 8a of the substrate housing portion 8, even if the second sealing resin 16 is damaged, only the edge of the substrate main body 3 is affected by an influence from the outside. The conductor pattern on the important substrate 2, the electronic component 5, is not damaged by any damage because it is kept in a state of being sealed by the second sealing resin 16.
As a result, all important parts of the substrate 2 are protected by the connector housing 6 manufactured by injection molding, and the problem 2 of japanese patent laid-open No. 2017-117914, namely, the upper surface of the substrate body 3 is protected by the fragile sealing resin, is eliminated. Therefore, a good protection function for the substrate 2 can be achieved during use of the electronic component module 1, and reliability as a commodity can be improved by improving durability.
Regarding the protection of the substrate 2, there is also a problem caused by peeling of the sealing resin in japanese patent laid-open No. 2017-117914.
That is, as shown in fig. 7 of japanese patent application laid-open No. 2017-117914, the resin agent injected into the first receiving portion of the connector housing is blocked by the elastic member, and in the region of the upper surface side of the substrate main body, the cured sealing resin is bonded to the side surface of the elastic member and also bonded to the upper surface of the connector housing. The joint surface (hereinafter referred to as an interface) is continuous in a straight line along the boundary between the second housing portion and the sealing resin shown in fig. 2 of japanese patent application laid-open No. 2017-117914, and the upper surface of the substrate main body is sealed and protected immediately below.
If the interface is kept in a desired joint state, rainwater or the like falling onto the electronic component module is blocked by the interface, and therefore the substrate main body is not affected at all. However, the interface may be peeled off by an external force at the time of connection of the counterpart connector or vibration during use, for example, and in this case, the outside may communicate with the upper surface of the substrate main body. As a result, rainwater or the like enters through the peeled portion of the interface, and therefore, there is a problem in terms of the protective function of the substrate main body such as water repellency.
The electronic component module 1 of the present embodiment also has the interface described above. Specifically, as shown in fig. 4, when the substrate housing portion 8 is viewed from the opening portion 8a side, an annular continuous interface is formed between the inner periphery of the substrate housing portion 8 and the outer periphery of the second sealing resin 16. However, even if peeling occurs at the interface and rainwater or the like intrudes, the substrate main body 3 and each electronic component 5 remain sealed by the second sealing resin 16. Therefore, the above-mentioned factors contribute greatly to the improvement of the durability of the electronic component module 1 without being affected by rainwater or the like.
The description of the embodiments has been completed above, but the embodiment of the present invention is not limited to the above-described embodiments. For example, in the above-described embodiment, the electronic component module 1 functioning as the ECU for controlling the engine of the motorcycle and the connector housing 6 of the electronic component module 1 are embodied, but the present invention is not limited thereto and may be modified for various applications.
In the above embodiment, the relief portion 14 is partially formed on the upper surface 8c of the substrate housing portion 8 as shown in fig. 4, but the upper surface 8c of the substrate housing portion 8 may be raised as a whole to be away from the substrate main body 3 as shown in fig. 11, and in this case, the entire upper surface 8c functions as the relief portion 14. Of course, the escape portion 14 is continuously formed to the opening 8a of the substrate housing portion 8, thereby preventing interference with the electronic component 5 having a large height when the substrate 2 is inserted. For example, even in the case of manufacturing a plurality of types of substrates 2 having different arrangements of the large electronic components 5, the connector housing 6 can be shared in the case of fig. 11. In contrast, in the case of fig. 4, there is another advantage that the injection amount of the second resin agent can be reduced.
Claims (10)
1. An electronic component module, characterized in that,
comprising the following steps: a substrate having a substrate main body on which an electronic component is mounted and a card edge connector provided at one side edge of the substrate main body; and a connector housing accommodating the substrate,
the connector housing has:
a substrate accommodating portion accommodating the substrate main body;
a connector fitting portion formed adjacent to the board housing portion and housing the card edge connector; and
a partition wall which is penetrated and formed with a slit for the insertion of the card edge connector and divides the substrate accommodating part and the connector fitting part,
the connector fitting portion has an opening portion formed at an end portion opposite to the substrate housing portion for connection of the counterpart connector,
the substrate housing portion has an opening portion formed at an end portion opposite to the connector fitting portion, the opening portion being for insertion of the substrate,
closing a gap between the substrate and the slit with a first sealing resin formed by curing a first resin injected through an opening of the connector fitting portion,
the substrate body is sealed with a second sealing resin formed by curing a second resin injected through an opening of the substrate housing portion.
2. The electronic component module of claim 1, wherein,
the avoiding portion for preventing interference with the electronic component is continuously formed to the opening of the substrate accommodating portion on the substrate accommodating portion.
3. The electronic component module of claim 1, wherein,
the dimension of the substrate main body is larger than the dimension of the card edge connector in the width direction of the substrate orthogonal to the fitting direction of the counterpart connector.
4. The electronic component module of claim 1, wherein,
a sealing groove is formed on the connector fitting portion side of the partition wall so as to surround the periphery of the slit,
the first sealing resin is formed in the sealing groove.
5. The electronic component module of claim 1, wherein,
the substrate main body and the electronic component are disposed in the substrate housing portion so as to be surrounded by the substrate housing portion over the entire circumference.
6. A connector housing of an electronic component module,
a board having a board main body on which an electronic component is mounted and a card edge connector provided at one side edge of the board main body, wherein the connector housing of the electronic component module includes:
a substrate accommodating portion accommodating the substrate main body;
a connector fitting portion formed adjacent to the board housing portion and housing the card edge connector; and
a partition wall which is penetrated and formed with a slit for the insertion of the card edge connector and divides the substrate accommodating part and the connector fitting part,
the connector fitting portion has an opening portion formed at an end portion opposite to the substrate housing portion, the opening portion being injected with a first resin agent which is cured to form a first sealing resin for sealing a gap between the substrate and the slit and being capable of being connected to a counterpart connector,
the substrate housing portion has an opening formed at an end portion opposite to the connector fitting portion, the opening being inserted with the substrate and being injected with a second resin agent which is cured to form a second sealing resin for sealing the substrate main body.
7. The connector housing of an electronic component module according to claim 6, wherein,
the avoiding portion for preventing interference with the electronic component is continuously formed to the opening of the substrate accommodating portion on the substrate accommodating portion.
8. The connector housing of an electronic component module according to claim 6, wherein,
the board housing portion has a larger dimension than the connector fitting portion in a width direction of the board orthogonal to the fitting direction of the counterpart connector.
9. The connector housing of an electronic component module according to claim 6, wherein,
a sealing groove is formed on the connector fitting portion side of the partition wall so as to surround the periphery of the slit,
the first sealing resin is formed in the sealing groove.
10. The connector housing of an electronic component module according to claim 6, wherein,
the substrate housing portion is formed in a shape that surrounds the entire circumference of the substrate main body and the electronic component disposed inside.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019-042746 | 2019-03-08 | ||
| JP2019042746A JP7287796B2 (en) | 2019-03-08 | 2019-03-08 | Electronic component module and its connector case |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111668638A CN111668638A (en) | 2020-09-15 |
| CN111668638B true CN111668638B (en) | 2024-04-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010150560.0A Active CN111668638B (en) | 2019-03-08 | 2020-03-06 | Electronic component module and connector housing thereof |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7287796B2 (en) |
| CN (1) | CN111668638B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103858286A (en) * | 2011-10-05 | 2014-06-11 | 株式会社自动网络技术研究所 | Electronic circuit unit capable of external connection |
| CN105594067A (en) * | 2013-10-02 | 2016-05-18 | 日立汽车系统株式会社 | Electronic control device |
| CN106663889A (en) * | 2014-08-08 | 2017-05-10 | 株式会社自动网络技术研究所 | Card edge connector and method for manufacturing same |
| JP2017130591A (en) * | 2016-01-22 | 2017-07-27 | 日立オートモティブシステムズ株式会社 | On-vehicle electronic module, card edge connector, and connector |
| CN108780960A (en) * | 2016-03-11 | 2018-11-09 | 株式会社自动网络技术研究所 | Bayonet connector |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5427572Y2 (en) * | 1973-02-03 | 1979-09-07 | ||
| IL113065A (en) * | 1994-04-11 | 2000-06-01 | Raychem Corp | Sealed electronic packaging and a method for environmental protection of active electronics |
| JP6523158B2 (en) | 2015-12-24 | 2019-05-29 | 新電元工業株式会社 | Electronic component module |
| JP6745228B2 (en) | 2017-01-30 | 2020-08-26 | 株式会社ケーヒン | Electronic control unit |
-
2019
- 2019-03-08 JP JP2019042746A patent/JP7287796B2/en active Active
-
2020
- 2020-03-06 CN CN202010150560.0A patent/CN111668638B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103858286A (en) * | 2011-10-05 | 2014-06-11 | 株式会社自动网络技术研究所 | Electronic circuit unit capable of external connection |
| CN105594067A (en) * | 2013-10-02 | 2016-05-18 | 日立汽车系统株式会社 | Electronic control device |
| CN106663889A (en) * | 2014-08-08 | 2017-05-10 | 株式会社自动网络技术研究所 | Card edge connector and method for manufacturing same |
| JP2017130591A (en) * | 2016-01-22 | 2017-07-27 | 日立オートモティブシステムズ株式会社 | On-vehicle electronic module, card edge connector, and connector |
| CN108780960A (en) * | 2016-03-11 | 2018-11-09 | 株式会社自动网络技术研究所 | Bayonet connector |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7287796B2 (en) | 2023-06-06 |
| CN111668638A (en) | 2020-09-15 |
| JP2020145373A (en) | 2020-09-10 |
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