CN111655414B - 借助培育的激光金属沉积 - Google Patents

借助培育的激光金属沉积 Download PDF

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CN111655414B
CN111655414B CN201980010653.9A CN201980010653A CN111655414B CN 111655414 B CN111655414 B CN 111655414B CN 201980010653 A CN201980010653 A CN 201980010653A CN 111655414 B CN111655414 B CN 111655414B
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base material
incubation
laser
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substrate
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CN111655414A (zh
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贝恩德·布尔鲍姆
艾哈迈德·卡梅尔
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Abstract

用于从基础材料来增材制造或修复部件的系统和方法。该系统可包括用于引导培育材料的培育源以及在激光处理沉积于基础材料上的熔池中的添加材料期间用于引导激光能量的激光金属沉积(LMD)系统。LMD系统包括激光能量源，激光能量源被配置为将激光能量引导向基础材料和培育材料以在其上形成熔池，并且在固化后处理沉积的添加材料和培育材料以在基础材料上形成层。

Description

借助培育的激光金属沉积
技术领域
本发明涉及材料技术的领域，并且更具体地讲，涉及使用借助培育的激光金属沉积的增材制造和修复方法。
背景技术
超级合金的焊接由于优化这些合金以实现的高强度(以及对应的低延展性)而带来了各种技术挑战。应用热源(诸如激光器和电弧)来构建增材制造(AM)零件或修复损坏的超级合金部件。遗憾的是，这些合金在激光金属沉积(LMD)过程和后续热处理期间非常容易发生热开裂。在室温下焊接期间的热开裂通常发生在熔池中的固液界面处，这在结构上损害了AM或修复的部件的完整性。
发明内容
在本发明的一个方面中，一种用于从基础材料来增材制造或修复超级合金部件的系统包括：培育(inoculation，孕育、培养)源，被可操作地配置为在激光处理期间将培育材料引导到基础材料上；激光金属沉积(LMD)系统，其包括：激光能量源，被可操作地配置为将激光能量引导向基础材料和培育材料以用于在其上形成熔池并用于激光处理沉积到熔池中的添加材料，从而在基础材料上形成添加材料和培育材料的层。
在本发明的另一个方面中，一种增材制造或修复方法，包括：制备用于激光金属沉积处理的基础材料基板；将培育材料沉积到基础材料基板上；以及通过以下方式来开始对基础材料基板的激光金属沉积处理：熔化基础材料基板和培育处理的至少一些部分，以及将添加材料沉积到熔化的部分中以在基础材料基板上形成添加材料和培育处理的堆积层。
参考以下附图、描述和权利要求，将更好地理解本发明的这些和其他特征、方面和优点。
附图说明
借助于附图更详细地示出了本发明。附图示出了优选配置并且不限制本发明的范围。
图1是示出根据本发明的示例性实施方式的、用于经由激光金属沉积(LMD)来增材制造和/或修复超级合金部件的系统的示意图。
图2是示出根据本发明的示例性实施方式的、用于经由激光金属沉积(LMD)来增材制造和/或修复超级合金涡轮部件的系统的一部分的示意图。
图3是根据本发明的示例性实施方式的增材制造或修复过程的框图。
具体实施方式
在优选的实施方式的以下详细描述中，参考形成其一部分的附图，并且在附图中以说明而非限制的方式示出了其中可实践本发明的特定实施方式。应当理解，在不脱离本发明的精神和范围的情况下，可以利用其他实施方式，并且可以进行改变。
广泛而言，本发明的实施方式提供了用于从基础材料来增材制造或修复部件的系统和方法。系统可以包括用于引导培育材料的培育源，以及用于在激光处理沉积于基础材料上的熔池中的添加材料期间引导激光能量的激光金属沉积(LMD)系统。LMD系统包括激光能量源，该激光能量源被配置为将激光能量引导向基础材料和培育材料以在其上形成熔池，并且在固化后处理沉积的添加材料和培育材料以在基础材料上形成层。
期望一种抑制在焊接期间发生热开裂的系统或方法。以下描述的实施方式允许在焊接过程中抑制热开裂。
图1和图2示出了用于经由激光金属沉积(LMD)200从基础材料/基板100来增材制造部件和/或修复超级合金部件的系统。图1示出了通用部件，并且图2示出了叶片的具体示例。在图1和图2中均示出了系统，该系统可包括培育系统230和LMD系统200，以用于经由激光能量源210向下面的基板施加激光能量202，并且用于将添加/堆积的材料沉积到由激光能量202产生的、下面/基础基板100和培育材料220的熔池232中(或沉积到堆积材料的固化层上)以形成堆积材料的层，从而用于制造或修复期望的超级合金部件，诸如叶片、叶片平台侧面、叶片尖端、叶轮或其他部件。激光能量源210可被可操作地配置为在激光束中引导或发射朝向基础材料100和培育材料220的激光能量202，以用于熔化部分的基础材料100和培育材料220(或先前固化的堆积层)以形成熔池232。
除此之外或另选地，LMD系统200还可包括激光沉积工具，该激光沉积工具被可操作地连接至激光能量源210并且邻近或可操作地耦接到激光能量源210以用于将添加材料222沉积到由激光能量202形成的熔池232中，熔池232被形成在基础材料100和培育材料220上。
除此之外或另选地，激光能量源210可被可操作地配置为用作激光沉积工具以用于将添加材料222沉积到熔池232中。除了经由沉积工具沉积之外或代替经由沉积工具沉积，添加材料222可以经由激光能量源210，经由连接到与激光能量源210共享的壳体的至少一条进料管线224来沉积。LMD系统200还可包括或可被操作地连接至一个或多个粉末进料系统250。粉末进料系统250可以被配置为将添加材料222进料(输送)到激光能量源210或激光沉积工具中的一个或多个以用于将添加材料222沉积到熔池232中以形成堆积材料层从而形成期望的部件。
添加材料222可以包括基础合金粉末材料，其可以包括形成基础材料100的相同或类似的材料。添加材料粉末可以经由粉末进料系统250通过LMD系统200进料，并在LMD过程200期间沉积到熔池232中。添加材料可以是基础合金、钎焊合金、或基础合金和钎焊合金的混合物。
为了改进系统150，系统150还包括培育系统230，该培育系统包括培育进料226。培育进料226可被可操作地配置为在激光处理之前或期间将培育材料220引导到基础材料100上。培育进料226可以是喷枪喷嘴、涂敷设备等。沉积在基础材料100上的培育材料220沿着部件的表面形成初始培育层228。培育材料220可以是例如但不限于TiC、TaC和TiN。在某些实施方案中，可以使用溶剂来将颗粒均匀地沉积在表面上。可使用的溶剂的示例是丙酮。培育材料220在LMD系统200之前被沉积在基础材料100上。因此，熔池232包括培育材料220。
参考图3，提供了增材制造或修复方法的实施方式。方法1000包括制备用于激光金属沉积处理的基础材料基板100的步骤(1010)。在修复部件的情况下，步骤可包括从工业机器移除的部件。部件的任何损坏部分的开挖以及部件的任何预热或固溶处理也可以是在LMD处理之前采取的步骤。
方法包括将培育材料220沉积到基础材料基板100上以形成培育层228(1020)。培育材料220可以呈粉末形式。然后LMD处理可以开始。将基础材料基板100和培育材料220的至少一部分熔化为熔池232。然后将添加材料222沉积到熔化部分中，以在基础材料基板100上形成添加材料222和培育材料220的堆积层。在该步骤期间，熔池232可以由保护气体(诸如氩气、氦气等)保护。可以使用保护气体将添加材料222输送到熔池232。当沉积添加材料222时，激光能量202使材料熔化并随后固化，从而形成用于形成期望的部件的超级合金材料层(1030)。
在处于LMD处理200时，激光能量202的激光束可以在粉末喷嘴内振动，使得在熔池232中搅动该光束。粉末喷嘴或类似的激光能量源210，即提供激光能量202或激光能量202与粉末添加材料222的仪器。将具有超级合金粉末的添加材料与培育材料一起施加作为堆积层。在焊接该层之后，可以在焊接层上添加具有培育材料220的新层并且重复LMD过程200直到期望状况为止(1040)。
一旦具有培育材料220和添加材料222的熔池232已经固化，则可以附加地实施后处理。后处理，诸如高温钎焊和/或用后热或溶液处理增材制造(AM)或修复的部件(1050)。
高gamma prime(γ')合金在LMD过程200和后续热处理过程期间非常容易热开裂。gamma prime(γ')是镍基超级合金的主要强化相。在发生焊接的区域中的非常细的晶粒结构可以显著减小焊接和热处理期间的热开裂现象。非常细的晶粒结构是晶粒尺寸小于200μm的晶粒结构。在重熔过程开始之前，可以通过在基础材料100的表面上沉积培育材料层来获得非常细的晶粒尺寸。
另外，在附加的实施方式中，在LMD方法200期间的激光束的振动以及培育材料220的使用可引起固化过程期间实现超细晶粒尺寸结构。
用于gamma prime合金的焊接技术(例如合金247和Rene 80)尚未可用。在通过LMD过程200添加添加材料222之前，提供培育材料层并振动激光束允许产生抗热开裂的细晶粒尺寸结构。
应当理解，本文公开的示例性LMD系统200的各方面可以由使用任何适当的编程语言或编程技术的任何适当处理器系统来实现。系统可以采用任何适当电路的形式，诸如可涉及硬件实施方式、软件实施方式、或同时包括硬件元件和软件元件两者的实施方式。在一个实施方式中，可以通过软件和硬件(例如，处理器、传感器等)来实现该系统，该软件和硬件可以包括但不限于固件、驻留软件、微代码等。
此外，处理器系统的各个部分可以采取可从处理器可用或处理器可读介质访问的计算机程序产品的形式，该计算机程序产品提供由处理器或任何指令执行系统使用或与其结合使用的程序代码。处理器可读介质的示例可以包括非暂时性有形处理器可读介质，诸如半导体或固态存储器、磁带、可移动计算机磁盘、随机存取存储器(RAM)、只读存储器(ROM)、硬磁盘和光盘。光盘的当前示例包括光盘-只读存储器(CD-ROM)、光盘-读/写(CD-R/W)和DVD。
虽然已经详细描述了具体的实施方式，但是本领域普通技术人员将理解，可以根据本公开的整体教导来开发那些细节的各种修改和替代。因此，所公开的特定装置仅意在为说明性而非限制本发明的范围，本发明的范围由所附权利要求及其任何和所有等同物的全部范围给出。

Claims (12)

1.一种用于从基础材料来增材制造或修复超级合金部件的系统，包括：
培育进料(226)，被可操作地配置为在激光处理之前或期间将培育材料(220)引导到基础材料上；以及
激光金属沉积系统(200)，包括：
激光能量源(210)，被可操作地配置为将激光能量(202)引导向所述基础材料和所述培育材料(220)以用于在其上形成熔池(232)，并且用于激光处理沉积到所述熔池(232)中的添加材料(222)，从而在所述基础材料上形成添加材料(222)和培育材料(220)的层；
其中所述添加材料(222)包括镍基超级合金，并且
其中所述激光能量源(210)振动所述激光能量(202)，从而在所述激光金属沉积系统(200)期间在所述熔池(232)中搅动光束。
2.根据权利要求1所述的系统，其中所述培育进料(226)通过经由喷枪喷嘴喷涂来将所述培育材料(220)引导到所述基础材料上。
3.根据权利要求1所述的系统，其中所述培育进料(226)通过涂敷来将所述培育材料(220)引导到所述基础材料上。
4.根据权利要求1所述的系统，还包括用于将所述培育材料(220)均匀地引导在所述基础材料上的溶剂。
5.根据权利要求1所述的系统，其中所述激光金属沉积系统(200)还包括：
沉积工具，被可操作地连接到粉末进料系统(250)并且被配置为输送所述添加材料(222)以用于一旦沉积就进行激光处理。
6.一种增材制造或修复方法，包括：
制备用于激光金属沉积处理的基础材料基板(100)；
将培育材料(220)沉积到所述基础材料基板(100)上；以及
通过以下方式来开始对所述基础材料基板(100)的激光金属沉积处理：熔化所述基础材料基板(100)和所述培育材料(220)的至少一些部分，以及将添加材料(222)沉积到熔化的部分中，以在所述基础材料基板(100)上形成所述添加材料(222)和所述培育材料(220)的堆积层；
其中所述添加材料(222)包括镍基超级合金，并且
其中将所述基础材料基板(100)和所述培育材料(220)的至少一些部分熔化成熔池(232)的激光能量源(210)振动激光能量(202)，从而在所述激光金属沉积处理期间在所述熔池(232)中搅动光束。
7.根据权利要求6所述的方法，其中使培育材料沉积到所述基础材料基板(100)上的步骤包括将所述培育材料(220)喷涂到所述基础材料基板(100)上。
8.根据权利要求6所述的方法，其中使培育材料沉积到所述基础材料基板(100)上的步骤包括将所述培育材料(220)涂敷到所述基础材料基板(100)上。
9.根据权利要求6所述的方法，其中所述添加材料的化学成分与所述基础材料基板(100)的化学成分相同。
10.根据权利要求6所述的方法，其中所述基础材料基板(100)是超级合金基础材料。
11.根据权利要求6所述的方法，还包括：重复沉积所述培育材料(220)、熔化和沉积步骤，直到实现期望的部件为止。
12.根据权利要求11所述的方法，还包括：
钎焊所述基础材料基板(100)；以及
在将所述期望的部件投入使用之前，经由磨削、铣削和焊后处理中的一种或多种来精加工所述基础材料基板(100)。
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