CN111644941A - Device for removing oxide layer of electronic element welding leg - Google Patents
Device for removing oxide layer of electronic element welding leg Download PDFInfo
- Publication number
- CN111644941A CN111644941A CN201910155401.7A CN201910155401A CN111644941A CN 111644941 A CN111644941 A CN 111644941A CN 201910155401 A CN201910155401 A CN 201910155401A CN 111644941 A CN111644941 A CN 111644941A
- Authority
- CN
- China
- Prior art keywords
- small
- rotary drum
- chuck
- hole
- mounting hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/033—Other grinding machines or devices for grinding a surface for cleaning purposes, e.g. for descaling or for grinding off flaws in the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/18—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
Abstract
The invention relates to the field of electronic component welding of electronic circuits, in particular to a device for removing an oxidation layer of a welding leg of an electronic component. The automatic belt wheel clamping device comprises a base, a main motor, a synchronous belt, a small belt wheel, a large pull rod, a large nut, a large rotary drum, a large chuck, a pressure spring, a sliding seat, a compression screw, an abrasive belt, an auxiliary motor, an eccentric wheel, a small rotary drum, a small chuck, a small pull rod, a small nut, a flat key and a pressing plate. The novel structure, the reasonable and compact structure, the convenient use and the high efficiency of removing the oxidation layer of the welding leg.
Description
Technical Field
The invention relates to the field of electronic component welding of electronic circuits, in particular to a device for removing an oxidation layer of a welding leg of an electronic component.
Background
With the rapid development of the electronic industry, the quality of electronic products is more and more important. The soldering quality of the solder tails of electronic components is directly related to the quality of electronic products. At present, pin-type pin plug-in welding or square pin-free flat surface mounting welding methods are commonly adopted for electronic components, and solder paste is melted by pre-adding the solder paste and heating in a reflow soldering furnace, so that the electronic components are welded or mounted on a flexible circuit board or a printed circuit board. In order to ensure the soldering quality, it is necessary to remove an oxide layer from the solder fillet of the electronic component before soldering.
Disclosure of Invention
To this end, the invention provides an apparatus for removing oxide layer from the solder leg of electronic device.
The technical scheme adopted by the invention is as follows:
the device for removing the oxidation layer of the electronic element welding leg comprises a base, a main motor, a synchronous belt, a small belt wheel, a large pull rod, a large nut, a large rotary drum, a large chuck, a pressure spring, a sliding seat, a compression screw, an abrasive belt, an auxiliary motor, an eccentric wheel, a small rotary drum, a small chuck, a small pull rod, a small nut, a flat key and a pressing plate.
The base is provided with a main motor mounting hole, a large rotary drum mounting hole, an auxiliary motor mounting hole, a small rotary drum mounting hole, a sliding groove and a sliding hole.
The sliding seat is provided with a pressure spring guide post, a movable guide rail, a pressure plate groove and a pressing screw hole.
The big rotary drum is provided with a big rotary drum outer cylinder and a big rotary drum inner taper hole.
The small rotary drum is provided with a small rotary drum outer cylinder and a small rotary drum inner taper hole.
The large chuck is provided with a large chuck screw hole, a large chuck outer conical surface and a large chuck elastic hole.
The small chuck is provided with a small chuck screw hole, a small chuck outer conical surface and a small chuck elastic hole.
The main motor is fixed in the main motor mounting hole. The small belt wheel is installed on a rotor shaft of the main motor.
The large belt wheel is mounted on the large drum through the flat key.
The auxiliary motor is fixed in the auxiliary motor mounting hole. The eccentric wheel is installed on a rotor shaft of the auxiliary motor.
The outer cylinder of the large rotary drum is matched with the mounting hole of the large rotary drum and can rotate. The outer cylinder of the small rotary drum is matched with the mounting hole of the small rotary drum and can rotate.
And (3) loading the large chuck into the inner taper hole of the large rotary drum. The inner taper hole of the large rotary drum is matched with the outer taper surface of the large chuck.
And (3) loading the small chuck into the inner taper hole of the small rotary drum. The inner taper hole of the small rotary drum is matched with the outer taper surface of the small chuck.
The movable guide rail is matched with the sliding groove and can slide. And the pressure spring is arranged on the pressure spring guide post, and the pressure spring guide post is matched with the sliding hole and can slide.
The synchronous belt is arranged on the small belt wheel and the large belt wheel.
The invention has the beneficial effects that:
the device for removing the oxidation layer of the electronic element welding leg has the advantages of novel concept, reasonable and compact structure, convenience in use and high efficiency in removing the oxidation layer of the welding leg.
Drawings
The following is further illustrated in connection with the figures of the present invention:
fig. 1 and 2 are schematic structural diagrams of the present invention.
Fig. 3 is an exploded view of the present invention.
Fig. 4 is a schematic structural view of the base.
Fig. 5 is a schematic structural view of the sliding seat.
Fig. 6 is a schematic structural view of the large drum.
Fig. 7 is a schematic structural view of the small drum.
Fig. 8-9 are schematic views of the structure of the large chuck.
Fig. 10-11 are schematic views of the structure of the small chuck.
In the figure, 1, a base, 2, a main motor, 3, a synchronous belt, 4, a small belt wheel, 5, a large belt wheel, 6, a large pull rod, 7, a large nut, 8, a large rotary drum, 9, a large chuck, 10, an electronic component, 11, a pressure spring, 12, a sliding seat, 13, a compression screw, 14, an abrasive belt, 15, an auxiliary motor, 16, an eccentric wheel, 17, a small rotary drum, 18, a small chuck, 19, a small pull rod, 20, a small nut, 21, a main motor mounting hole, 22, a large rotary drum mounting hole, 23, an auxiliary motor mounting hole, 24, a small rotary drum mounting hole, 25, a sliding groove, 26, a sliding hole, 27, a flat key, 28, a pressure plate, 29, a pressure spring guide column, 30, a movable guide rail, 31, a pressure plate groove, 32, a compression screw hole, 33, a large rotary drum inner cone, 34, a large rotary drum hole, 35, a small rotary drum outer cone, 36, a small rotary drum inner cone hole, 37, a large chuck screw hole, 38, a, 39. the large chuck elastic hole, 40 small chuck screw holes, 41 small chuck outer conical surfaces and 42 small chuck elastic holes.
Detailed Description
The invention will be further described with reference to the accompanying drawings and examples, which are preferred embodiments of the invention.
As shown in fig. 1-3. The device for removing the oxide layer on the electronic component solder leg comprises the base 1, the main motor 2, the synchronous belt 3, the small belt wheel 4, the large belt wheel 5, the large pull rod 6, the large nut 7, the large rotary drum 8, the large chuck 9, the pressure spring 11, the sliding seat 12, the compression screw 13, the abrasive belt 14, the auxiliary motor 15, the eccentric wheel 16, the small rotary drum 17, the small chuck 18, the small pull rod 19, the small nut 20, the flat key 27 and the pressure plate 28.
As shown in fig. 4. The base 1 is provided with the main motor mounting hole 21, the large drum mounting hole 22, the auxiliary motor mounting hole 23, the small drum mounting hole 24, the sliding groove 25, and the sliding hole 26.
Preferably, the base 1 is cast and machined.
As shown in fig. 5. The sliding seat 12 is provided with the pressure spring guide post 29, the movable guide rail 30, the pressure plate groove 31 and the pressing screw hole 32.
Preferably, the sliding seat 12 is cast and machined.
As shown in fig. 6. The large drum 8 is provided with the large drum outer cylinder 33 and the large drum inner tapered hole 34.
As shown in fig. 7. The small drum 17 is provided with the small drum outer cylinder 35 and the small drum inner tapered hole 36.
As shown in fig. 8-9. The large chuck 9 is provided with the large chuck screw hole 37, the large chuck outer conical surface 38 and the large chuck elastic hole 39.
As shown in fig. 10-11. The small chuck 18 is provided with the small chuck screw hole 40, the small chuck outer conical surface 41 and the small chuck elastic hole 42.
When the electronic component leg de-oxidation layer device is used for de-oxidation layer, the electronic component 10 to be processed, such as a resistor, is inserted into the large chuck elastic hole 39, and one leg of the resistor is inserted into the small chuck elastic hole 42; screwing one end of the large pull rod 6 into the large chuck screw hole 37, screwing the other end of the large pull rod 6 into the large nut 7, and screwing the large nut to the outward end surface of the large rotary drum 8; one end of the small pull rod 19 is screwed into the small chuck screw hole 40, and the other end of the small pull rod 19 is screwed into the small nut 20 and screwed to the outward end surface of the small rotary drum 17.
The abrasive belt 14 is wound on one welding leg of the resistor for one circle, then both ends of the abrasive belt 14 are respectively inserted into the pressing plate grooves 31 positioned at the front end and the rear end of the sliding seat 12, and one pressing plate 28 is respectively placed in each pressing plate groove 31 and is screwed by the pressing screw 13.
Firstly, starting the main motor 2, then starting the auxiliary motor 15, rotating the large rotary drum 8, rotating the large chuck 9 and rotating the resistor; the eccentric wheel 16 rotates, and under the combined action of the eccentric wheel 16 and the pressure spring 11, the sliding seat 12 slides back and forth to drive the abrasive belt 14 to pull back and forth, so that the oxide layer of one welding leg of the resistor is removed.
Stopping the main motor 2 and the auxiliary motor 15, loosening the large nut 7 and the small nut 20, taking out the resistor, replacing one end of the resistor for clamping again, starting the main motor 2 firstly, then starting the auxiliary motor 15, and removing an oxide layer of the other welding leg of the resistor. And stopping the main motor 2 and the auxiliary motor 15, loosening the large nut 7 and the small nut 20, and taking out the resistor. And (4) finishing.
Appropriate changes and modifications to the embodiments described above will become apparent to those skilled in the art from the disclosure and teachings of the foregoing description. Therefore, the present invention is not limited to the above-disclosed embodiments, and modifications and variations of the present invention are also intended to fall within the scope of the claims of the present invention. Furthermore, although specific terms are employed herein, they are used in a generic and descriptive sense only and not for purposes of limitation.
Claims (1)
1. An electronic component welding leg oxidation layer removing device comprises a base, a main motor, a synchronous belt, a small belt wheel, a large pull rod, a large nut, a large rotary drum, a large chuck, a pressure spring, a sliding seat, a compression screw, an abrasive belt, an auxiliary motor, an eccentric wheel, a small rotary drum, a small chuck, a small pull rod, a small nut, a flat key and a pressing plate; the method is characterized in that: the base is provided with a main motor mounting hole, a large rotary drum mounting hole, an auxiliary motor mounting hole, a small rotary drum mounting hole, a sliding groove and a sliding hole; the sliding seat is provided with a pressure spring guide post, a movable guide rail, a pressure plate groove and a pressing screw hole; the large rotary drum is provided with a large rotary drum outer cylinder and a large rotary drum inner taper hole; the small rotary drum is provided with a small rotary drum outer cylinder and a small rotary drum inner taper hole; the large chuck is provided with a large chuck screw hole, a large chuck outer conical surface and a large chuck elastic hole; the small chuck is provided with a small chuck screw hole, a small chuck outer conical surface and a small chuck elastic hole; the main motor is fixed in the main motor mounting hole; the small belt wheel is arranged on a rotor shaft of the main motor; the large belt wheel is mounted on the large rotary drum through the flat key; the auxiliary motor is fixed in the auxiliary motor mounting hole; the eccentric wheel is arranged on a rotor shaft of the auxiliary motor; the outer cylinder of the large rotary drum is matched with the mounting hole of the large rotary drum and can rotate; the outer cylinder of the small rotary drum is matched with the mounting hole of the small rotary drum and can rotate; loading the large chuck into the inner taper hole of the large rotary drum; the inner taper hole of the large rotary drum is matched with the outer conical surface of the large chuck; loading the small chuck into the inner taper hole of the small rotary drum; the inner taper hole of the small rotary drum is matched with the outer conical surface of the small chuck; the movable guide rail is matched with the sliding groove and can slide; the pressure spring is arranged on the pressure spring guide post, and the pressure spring guide post is matched with the sliding hole and can slide; the synchronous belt is arranged on the small belt wheel and the large belt wheel.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910155401.7A CN111644941B (en) | 2019-02-18 | 2019-02-18 | Device for removing oxide layer of electronic element welding leg |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910155401.7A CN111644941B (en) | 2019-02-18 | 2019-02-18 | Device for removing oxide layer of electronic element welding leg |
Publications (2)
Publication Number | Publication Date |
---|---|
CN111644941A true CN111644941A (en) | 2020-09-11 |
CN111644941B CN111644941B (en) | 2022-07-08 |
Family
ID=72342456
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910155401.7A Active CN111644941B (en) | 2019-02-18 | 2019-02-18 | Device for removing oxide layer of electronic element welding leg |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN111644941B (en) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1203847A (en) * | 1998-07-08 | 1999-01-06 | 上海机床厂有限公司 | Grinding method and device for cylindrical workpiece of generating line parallel to gyroaxis |
CN102717320A (en) * | 2012-06-08 | 2012-10-10 | 重庆银钢一通凸轮科技有限公司 | Abrasive belt polishing device |
DE102011100972B4 (en) * | 2011-05-10 | 2013-02-28 | Sepotec Maschinenbau Gmbh | Belt grinder with additional radius grinder |
CN104526510A (en) * | 2014-12-18 | 2015-04-22 | 谭新锋 | Front-back reciprocating swing type sanding mechanism |
CN105196140A (en) * | 2015-10-20 | 2015-12-30 | 慈溪市华表机械有限公司 | External cylindrical superfinishing machine |
CN105690095A (en) * | 2016-02-24 | 2016-06-22 | 苏州红隼机电科技有限公司 | Turning, grinding and polishing all-in-one machine device for rubber roller |
CN108673310A (en) * | 2018-06-15 | 2018-10-19 | 陈思海 | A kind of sand belt grinding device for horizontal lathe |
-
2019
- 2019-02-18 CN CN201910155401.7A patent/CN111644941B/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1203847A (en) * | 1998-07-08 | 1999-01-06 | 上海机床厂有限公司 | Grinding method and device for cylindrical workpiece of generating line parallel to gyroaxis |
DE102011100972B4 (en) * | 2011-05-10 | 2013-02-28 | Sepotec Maschinenbau Gmbh | Belt grinder with additional radius grinder |
CN102717320A (en) * | 2012-06-08 | 2012-10-10 | 重庆银钢一通凸轮科技有限公司 | Abrasive belt polishing device |
CN104526510A (en) * | 2014-12-18 | 2015-04-22 | 谭新锋 | Front-back reciprocating swing type sanding mechanism |
CN105196140A (en) * | 2015-10-20 | 2015-12-30 | 慈溪市华表机械有限公司 | External cylindrical superfinishing machine |
CN105690095A (en) * | 2016-02-24 | 2016-06-22 | 苏州红隼机电科技有限公司 | Turning, grinding and polishing all-in-one machine device for rubber roller |
CN108673310A (en) * | 2018-06-15 | 2018-10-19 | 陈思海 | A kind of sand belt grinding device for horizontal lathe |
Also Published As
Publication number | Publication date |
---|---|
CN111644941B (en) | 2022-07-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2021097872A1 (en) | Design and machining platform for mechanical part | |
CN111070007A (en) | Grinding device capable of quickly clamping and rotating workpiece | |
CN111644941B (en) | Device for removing oxide layer of electronic element welding leg | |
CN108907660A (en) | A kind of dedicated press-loading apparatus of automobile speed variator bearing | |
CN215393035U (en) | PCB pressing and overturning double-side welding tool | |
CN109548293A (en) | A kind of automobile pcb board fast fixing structure | |
CN106064316B (en) | A kind of fixture of high pressure copper fingertip and its method for clamping fingertip | |
CN211804294U (en) | Reflow soldering clamp | |
CN210360889U (en) | Handle type louver wheel | |
CN217019210U (en) | Portable hand welding fixture | |
CN220362183U (en) | Welding device for chip mounting processing | |
CN220087575U (en) | Clamp for processing circuit board | |
CN218983717U (en) | High-precision etching resistance equipment clamping structure | |
CN220359444U (en) | Circuit board processing clamp | |
CN219746552U (en) | Gear ring processing closing device | |
CN219598781U (en) | Pump body clamping auxiliary device for machining shielding pump | |
CN219818544U (en) | Welding table for electronic product | |
CN218461117U (en) | Electric element welding equipment for processing circuit board | |
CN218830830U (en) | Connection structure of electronic device base and circuit board | |
CN211625973U (en) | Electronic parts processing is with electronic parts drying device | |
CN218450742U (en) | Circuit board press-in device | |
CN220383271U (en) | Power supply circuit board static eliminating equipment | |
CN218831173U (en) | High cell-phone circuit board SMT paster production line of production efficiency | |
CN215748258U (en) | Electronic component welding point grinding device | |
CN210671042U (en) | Guide rail fastener easy to unload |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20220620 Address after: 518000 25B, 25C, 25d, Fortune Building, No. 88, third Fuhua Road, Gangxia community, Futian street, Futian District, Shenzhen City, Guangdong Province Applicant after: Shenzhen kemaoxiang Electronics Co.,Ltd. Address before: 321300 No. 536 Chenlutang Village, Yongkang Economic Development Zone, Jinhua City, Zhejiang Province Applicant before: YONGKANG RENHE HARDWARE PRODUCTS Co.,Ltd. |
|
GR01 | Patent grant | ||
GR01 | Patent grant |