CN111635730A - Insulating adhesive, preparation method of insulating adhesive and IBC solar cell - Google Patents
Insulating adhesive, preparation method of insulating adhesive and IBC solar cell Download PDFInfo
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- CN111635730A CN111635730A CN201910156507.9A CN201910156507A CN111635730A CN 111635730 A CN111635730 A CN 111635730A CN 201910156507 A CN201910156507 A CN 201910156507A CN 111635730 A CN111635730 A CN 111635730A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
- C08G18/4202—Two or more polyesters of different physical or chemical nature
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/58—Epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/67—Unsaturated compounds having active hydrogen
- C08G18/671—Unsaturated compounds having only one group containing active hydrogen
- C08G18/672—Esters of acrylic or alkyl acrylic acid having only one group containing active hydrogen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
- C08G18/75—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic
- C08G18/751—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring
- C08G18/752—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group
- C08G18/753—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group containing one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group having a primary carbon atom next to the isocyanate or isothiocyanate group
- C08G18/755—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group containing one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group having a primary carbon atom next to the isocyanate or isothiocyanate group and at least one isocyanate or isothiocyanate group linked to a secondary carbon atom of the cycloaliphatic ring, e.g. isophorone diisocyanate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/204—Applications use in electrical or conductive gadgets use in solar cells
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
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- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The application discloses an insulating glue, a preparation method of the insulating glue and an IBC solar cell, wherein the insulating glue comprises the following components in parts by weight: 20-30 parts of urethane acrylate oligomer, 0.5-5 parts of acrylate oligomer, 1-10 parts of phenolic epoxy resin, 20-40 parts of silanized silica gel, 0.1-3 parts of first thermal initiator, 0.1-1 part of second thermal initiator and 5-30 parts of acrylic monomer, wherein the first thermal initiator is organic peroxide, and the second thermal initiator is a thermal-initiated cation curing agent. The phenolic epoxy resin contains more than 2 epoxy groups in a molecular structure, is compounded with polyurethane acrylate to form a semi-interpenetrating network structure with higher crosslinking density, forms an interlocking network structure by means of mutual penetration, interweaving, entanglement and the like among different polymer molecular chains, and has better heat resistance.
Description
Technical Field
The invention relates to the technical field of solar cells, in particular to an insulating glue, a preparation method of the insulating glue and an IBC solar cell.
Background
The insulating glue is used as a common insulating material to be coated on the outer layer of the conductor, is very convenient to use and can provide a better insulating effect, so that the insulating glue is a frequently-used insulating material in the preparation process of the conductor. The use effect of the insulating adhesive when the insulating adhesive is coated on the surface layer of the conductor is greatly influenced by the adhesion and the insulating property of the insulating adhesive.
In recent years, ibc (indirect back contact) back contact solar cells have been receiving attention from the industry due to their high efficiency that is difficult to achieve with conventional solar cells, and have become a hot spot for research in the next generation of solar cell technology. The positive and negative fine grid lines of the IBC solar cell are arranged on the back of the cell in an interdigital manner, the main grid lines and the auxiliary fine grid lines are printed vertically, the connection part of the positive main grid section and the negative fine grid lines is isolated by printing insulating glue, and the connection part of the negative main grid section and the positive fine grid lines is isolated by printing insulating glue. However, the insulating glue used on the IBC battery is basically used for packaging a semiconductor integrated circuit at present, and has the problem of low maximum use temperature.
Disclosure of Invention
In view of the above-mentioned defects or shortcomings in the prior art, it is desirable to provide an insulating paste, a method for preparing the insulating paste, and an IBC solar cell.
In order to overcome the defects of the prior art, the technical scheme provided by the invention is as follows:
in a first aspect, the invention provides an insulating glue, which is characterized by comprising the following components:
wherein the first thermal initiator is an organic peroxide and the second thermal initiator is a thermally initiated cationic curing agent.
Further, the synthetic monomers of the polyurethane acrylate oligomer comprise isophorone diisocyanate, hydroxyl-terminated modified hyperbranched polyester, hydroxyethyl acrylate and polyester diol.
Further, the acrylate oligomer comprises at least one of tertiary amine acrylate, tetrafunctional acrylate, hexafunctional acrylate, modified epoxy acrylic resin, polyester acrylate and alkenyl ether acrylate resin.
Further, the first thermal initiator comprises at least one of cumene hydroperoxide, tert-butyl peroxyneodecanoate, tert-butyl peroxybenzoate, tert-butyl peroxyisooctanoate, tert-amyl peroxy (2-ethyl hexanoate), dibenzoyl peroxide and bis (4-tert-butylcyclohexyl) peroxydicarbonate.
Further, the second thermal initiator is amine-blocked hexafluoroantimonate or amine-blocked lewis acid salt.
Further, the acrylic monomer includes at least one of neopentyl glycol acrylate, trimethylolpropane triacrylate, pentaerythritol triacrylate, polyethylene glycol 200 diacrylate, polyethylene glycol 400 diacrylate, polyethylene glycol dimethacrylate, methoxy tripropylene glycol monoacrylate, methoxy propoxy neopentyl glycol monoacrylate, methoxy ethoxy trimethylolpropane diacrylate, tris (2-acryloyloxyethyl) isocyanurate.
Further, the insulating glue also comprises 0-1 part of a coupling agent, wherein the coupling agent comprises one of gamma-aminopropyltriethoxysilane, gamma-glycidoxypropyltrimethoxysilane, aniline methyl triethoxysilane, methyl (gamma-epoxypropoxy) diethoxysilane, methyl (gamma-ethylenediamino) diethoxysilane, methyl (gamma-aminopropyl) diethoxysilane and N-beta- (aminoethyl) -gamma-aminopropyltrimethylsilane.
Further, the insulating glue comprises the following components in parts by weight:
in a second aspect, the invention provides a preparation method of an insulating glue, which is characterized by comprising the following steps:
weighing 20-30 parts of urethane acrylate oligomer, 0.5-5 parts of acrylate oligomer, 1-10 parts of novolac epoxy resin, 20-40 parts of silanized silica gel, 0.1-3 parts of first thermal initiator, 0.1-1 part of second thermal initiator and 5-30 parts of acrylic monomer;
uniformly mixing the weighed polyurethane acrylate oligomer, novolac epoxy resin, silanized silica gel and acrylic monomer, adding a first thermal initiator and a second thermal initiator, uniformly stirring, grinding for 2-3 times by three rollers, stirring for 20-40 minutes, and vacuum degassing for 3-20 minutes to obtain the insulating adhesive for the solar cell.
In a third aspect, the present invention further provides an IBC solar cell, which is characterized by including the above-mentioned insulating paste.
Compared with the prior art, the invention has the beneficial effects that:
the phenolic epoxy resin in the insulating glue has high rigidity, is compounded with the polyurethane acrylate to form a semi-interpenetrating network structure, forms an interlocking network structure by means of mutual penetration, interweaving, entanglement and the like among different polymer molecular chains, and improves the heat resistance of the system; the novolac epoxy resin has a molecular structure containing more than 2 epoxy groups, and has high crosslinking density after curing, and the heat resistance of the product is relatively improved. The addition of the silanized silica gel nano particles can reinforce and fill in a micro-area with weaker system resin, increase the interface acting force, reduce the free volume, increase the crosslinking density, increase the glass transition temperature and improve the heat resistance of the system.
Detailed Description
The present application will be described in further detail with reference to examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and not restrictive of the invention.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail with reference to examples.
As mentioned in the background, the insulating paste used in IBC cells is mostly used for semiconductor integrated circuit packaging, and has a problem of low maximum use temperature.
The insulating glue can be used for being printed at the joint of the positive main grid section and the negative fine grid line and at the joint of the negative main grid section and the positive fine grid line on an IBC solar cell to realize isolation. The insulating glue comprises the following components in parts by weight: 20-30 parts of urethane acrylate oligomer, 0.5-5 parts of acrylate oligomer, 1-10 parts of phenolic epoxy resin, 20-40 parts of silanized silica gel, 0.1-3 parts of first thermal initiator, 0.1-1 part of second thermal initiator and 5-30 parts of acrylic monomer; wherein the first thermal initiator is an organic peroxide and the second thermal initiator is a thermally initiated cationic curing agent.
Preferably, the synthetic monomers of the urethane acrylate oligomer comprise isophorone diisocyanate, hydroxyl-terminated modified hyperbranched polyester, hydroxyethyl acrylate and polyester diol.
The novel hyperbranched polyurethane acrylate has high activity, and the ethoxylated hyperbranched polyurethane acrylate has high activity and no oxygen inhibition effect due to the fact that the alpha position of an ether chain has an H atom.
Preferably, the acrylate oligomer comprises at least one of tertiary amine acrylate, tetra-functional acrylate, hexa-functional acrylate, modified epoxy acrylic resin, polyester acrylate, and alkenyl ether acrylate resin.
Preferably, the first thermal initiator comprises at least one of cumene hydroperoxide, tert-butyl peroxyneodecanoate, tert-butyl peroxybenzoate, tert-butyl peroxyisooctanoate, tert-amyl (2-ethylhexanoate) peroxide, dibenzoyl peroxide, bis (4-tert-butylcyclohexyl) peroxydicarbonate.
Preferably, the second thermal initiator is an amine-blocked hexafluoroantimonate or an amine-blocked lewis acid salt.
Preferably, the acrylic monomer comprises at least one of neopentyl glycol acrylate, trimethylolpropane triacrylate, pentaerythritol triacrylate, polyethylene glycol 200 diacrylate, polyethylene glycol 400 diacrylate, polyethylene glycol dimethacrylate, methoxy tripropylene glycol monoacrylate, methoxy propoxy neopentyl glycol monoacrylate, methoxy ethoxy trimethylolpropane diacrylate, tris (2-acryloxyethyl) isocyanurate.
Preferably, the insulating glue further comprises 0-1 part of a coupling agent, wherein the coupling agent comprises one of gamma-aminopropyltriethoxysilane, gamma-glycidoxypropyltrimethoxysilane, aniline methyl triethoxysilane, methyl (gamma-epoxypropoxy adhesive) diethoxysilane, methyl (gamma-ethylenediamino) diethoxysilane, methyl (gamma-aminopropyl) diethoxysilane and N-beta- (aminoethyl) -gamma-aminopropyltrimethylsilane.
Preferably, the insulating glue further comprises a thickening agent, wherein the thickening agent is used in the adhesive system to increase the viscosity of the system, so that the adhesive has the appropriate viscosity for dispensing or printing construction. The thickening agent comprises at least one of fumed silica, cellulose acetate butyrate, ethyl cellulose, hydroxyethyl cellulose, polyvinyl butyral and aldehyde ketone resin.
Preferably, the insulating glue further comprises an auxiliary accelerator, and the auxiliary accelerator is o-benzoylsulfonimide. The o-benzoylsulfimide and tert-butyl hydroperoxide form a compound redox initiator to promote the curing of an unsaturated resin system.
Preferably, the insulating glue further comprises an auxiliary agent, and the auxiliary agent is selected to improve the manufacturability of screen printing and the quality of film forming. The auxiliary agent comprises dye, defoaming agent and plasticizer. The dye comprises carbon black, indigo, titanium dioxide, chrome green or anthraquinone red; the defoaming agent can be lauryl phenylacetate, polydimethylsiloxane or polyether modified silicon defoaming agent, and particularly the polyether modified silicon defoaming agent with better system compatibility in the system. The plasticizer may be selected from phthalic plasticizers, including dibutyl phthalate, dioctyl phthalate, or dicyclohexyl phthalate.
The dye gives the glue a color which is convenient for correcting whether the contact area of the film layer and the electrode is aligned during screen printing and after curing to form the film layer, for example: if the screen is not aligned, whether the slurry is printed in a specified area or not, checking the offset after printing and drying, and observing the thickness and the flatness of the cured film layer. Without the colorant, the slurry may be colorless or light in color, leaving the operator blinded to the printing effect and unable to inspect.
The novolac epoxy resin includes at least one of phenol novolac epoxy resin, o-cresol novolac epoxy resin, and bisphenol a novolac epoxy resin.
The silanized silica gel is an organic silica gel treated with an organosilane. The basic structural unit of the silanized silica gel is composed of silicon-oxygen links, the side chain is connected with other various organic groups through silicon atoms, the structure contains both organic groups and inorganic structures, and the special composition and molecular structure integrates the characteristics of organic matters and the functions of inorganic matters. The bond energy of the C-C bond is 332kJ/mol, the bond energy of the Si-O bond is 460kJ/mol in the organic silica gel, and the chemical bond of the molecule is not broken and decomposed at high temperature or by radiation irradiation, so that the organic silica gel has high thermal stability and excellent high and low temperature resistance, and can be used in a wide temperature range. The average particle size of the silanized silica gel is 1-20 μm, and organic silica gel with the average particle size of nano grade can be selected, preferably 10-500 nm, and more preferably 20-100 nm.
Preferably, the insulating glue comprises the following components in parts by weight: 20-30 parts of urethane acrylate oligomer, 0.5-5 parts of acrylate oligomer, 1-10 parts of phenolic epoxy resin, 20-40 parts of silanized silica gel, 0.1-3 parts of first thermal initiator, 0.1-1 part of second thermal initiator, 5-30 parts of acrylic monomer, 1-10 parts of thickening agent, 0-1 part of coupling agent, 1-5 parts of promoter and 0.5-3 parts of auxiliary agent.
The invention also provides a preparation method of the insulating glue, which comprises the following steps:
weighing 20-30 parts of urethane acrylate oligomer, 0.5-5 parts of acrylate oligomer, 1-10 parts of novolac epoxy resin, 20-40 parts of silanized silica gel, 0.1-3 parts of first thermal initiator, 0.1-1 part of second thermal initiator and 5-30 parts of acrylic monomer;
uniformly mixing the weighed polyurethane acrylate oligomer, novolac epoxy resin, silanized silica gel and acrylic monomer, adding a first thermal initiator and a second thermal initiator, uniformly stirring, grinding for 2-3 times by three rollers, stirring for 20-40 minutes, and vacuum degassing for 3-20 minutes to obtain the insulating adhesive for the solar cell.
The preferred scheme is as follows: weighing 20-30 parts of urethane acrylate oligomer, 0.5-5 parts of acrylate oligomer, 1-10 parts of novolac epoxy resin, 20-40 parts of silanized silica gel, 0.1-3 parts of first thermal initiator, 0.1-1 part of second thermal initiator, 5-30 parts of acrylic monomer, 1-10 parts of thickener, 0-1 part of coupling agent, 1-5 parts of promoter and 0.5-3 parts of auxiliary agent;
firstly, uniformly mixing a polyurethane acrylate oligomer, an acrylate oligomer, novolac epoxy resin, silanized silica gel and an acrylic monomer, then adding a coupling agent, a thickening agent, an auxiliary accelerator and an auxiliary agent, continuously mixing for about 30 minutes until all components are uniformly dispersed, finally adding a first thermal initiator and a second thermal initiator, uniformly stirring, grinding for 2-3 times by three rollers, stirring for 30 minutes, and degassing in vacuum for 3-20 minutes to prepare the insulating adhesive.
Finally, the invention also provides an IBC solar cell which is characterized by comprising the insulating glue.
The foregoing is further illustrated by the following specific examples.
Example 1
The preparation process of the insulating glue comprises the following steps:
weighing: weighing 5 parts of isophorone diisocyanate, 4 parts of hydroxyl-terminated modified hyperbranched polyester, 7 parts of hydroxyethyl acrylate, 12 parts of polyester diol, 0.5 part of alkenyl ether acrylate resin, 4 parts of o-cresol novolac epoxy resin, 40 parts of silanized silica gel, 0.1 part of cumene hydroperoxide, 0.1 part of amine-blocked hexafluoroantimonate, 1 part of o-benzoylsulfimide, 1 part of polyvinyl butyral, 5 parts of isobornyl acrylate, 0.1 part of indigo, 0.9 part of polyether modified silicon defoamer, 2 parts of dicyclohexyl phthalate and 0.5 part of gamma-aminopropyltriethoxysilane;
solid-liquid mixing: firstly, uniformly mixing isophorone diisocyanate, hydroxyl-terminated modified hyperbranched polyester, hydroxyethyl acrylate, polyester dihydric alcohol, alkenyl ether acrylate resin, o-cresol novolac epoxy resin, silanized silica gel and isobornyl acrylate, then adding gamma-aminopropyltriethoxysilane, polyvinyl butyral, o-benzoylsulfimide, indigo, a polyether modified silicon defoaming agent and dicyclohexyl phthalate, continuously mixing for about 30 minutes until all components are uniformly dispersed, finally adding cumene hydroperoxide and amine-sealed hexafluoroantimonate, uniformly stirring, grinding for 2-3 times by three rollers, stirring for 30 minutes, and vacuum degassing for 3-20 minutes to obtain the insulating adhesive.
Example 2
The preparation process of the insulating glue comprises the following steps:
weighing: weighing 15 parts of isophorone diisocyanate, 6 parts of hydroxyl-terminated modified hyperbranched polyester, 4 parts of hydroxyethyl acrylate, 5 parts of polyester diol, 2 parts of polyester acrylate, 2 parts of bisphenol A type novolac epoxy resin, 31.7 parts of silanized silica gel, 0.5 part of cumene hydroperoxide, 1 part of tert-butyl peroxyneodecanoate, 0.2 part of amine-blocked hexafluoroantimonate, 2 parts of o-benzoylsulfimide, 5 parts of polyvinyl butyral, 15 parts of isobornyl acrylate, 8.8 parts of polyethylene glycol 200 diacrylate, 0.1 part of indigo, 0.2 part of polyether modified silicon defoamer, 0.1 part of dibutyl phthalate and 0.5 part of methyl (gamma-aminopropyl) diethoxysilane;
solid-liquid mixing: uniformly mixing isophorone diisocyanate, hydroxyl-terminated modified hyperbranched polyester, hydroxyethyl acrylate, polyester dihydric alcohol, polyester acrylate, bisphenol A type novolac epoxy resin, silanized silica gel, isobornyl acrylate and polyethylene glycol 200 diacrylate, adding methyl (gamma-aminopropyl) diethoxysilane, polyvinyl butyral, o-benzoylsulfimide, indigo, a polyether modified silicon defoamer and dibutyl phthalate, continuously mixing for about 30 minutes until all components are uniformly dispersed, finally adding cumene hydroperoxide, tert-butyl peroxyneodecanoate and amine-blocked hexafluoroantimonate, uniformly stirring, grinding for 2-3 times by three rollers, stirring for 30 minutes, and vacuum degassing for 3-20 minutes to obtain the insulating adhesive.
Example 3
The preparation process of the insulating glue comprises the following steps:
weighing: weighing 2 parts of isophorone diisocyanate, 15 parts of hydroxyl-terminated modified hyperbranched polyester, 5 parts of hydroxyethyl acrylate, 5 parts of polyester diol, 2 parts of alkenyl ether acrylate resin, 2 parts of bisphenol A type novolac epoxy resin, 30 parts of silanized silica gel, 1.5 parts of tert-butyl peroxyneodecanoate, 0.6 part of amine-blocked hexafluoroantimonate, 0.4 part of amine-blocked Lewis acid salt, 2 parts of o-benzoylsulfimide, 10 parts of polyvinyl butyral, 15 parts of isobornyl acrylate, 15 parts of polyethylene glycol 200 diacrylate, 0.1 part of indigo, 0.2 part of polyether modified silicon defoamer, 1.5 parts of dioctyl phthalate and 1 part of methyl (gamma-ethylene diamino) diethoxysilane;
solid-liquid mixing: firstly, uniformly mixing isophorone diisocyanate, hydroxyl-terminated modified hyperbranched polyester, hydroxyethyl acrylate, polyester dihydric alcohol, alkenyl ether acrylate resin, bisphenol A type novolac epoxy resin, silanized silica gel, isobornyl acrylate and polyethylene glycol 200 diacrylate, adding methyl (gamma-ethylene diamino) diethoxy silane, polyvinyl butyral, o-benzoylsulfimide, indigo, polyether modified silicon defoaming agent, dioctyl phthalate and dicyclohexyl phthalate, continuously mixing for about 30 min until all the components are uniformly dispersed, finally adding tert-butyl peroxyneodecanoate, amine-blocked hexafluoroantimonate and amine-blocked Lewis acid salt, stirring uniformly, grinding for 2-3 times by three rollers, stirring for 30 minutes, and vacuum degassing for 3-20 minutes to obtain the insulating adhesive.
Example 4
The preparation process of the insulating glue comprises the following steps:
weighing: weighing 20 parts by weight of isophorone diisocyanate, 2 parts by weight of hydroxyl-terminated modified hyperbranched polyester, 1 part by weight of hydroxyethyl acrylate, 2 parts by weight of polyester diol, 2 parts by weight of alkenyl ether acrylate resin, 3 parts by weight of polyester acrylate, 5 parts by weight of o-cresol novolac epoxy resin, 5 parts by weight of bisphenol A novolac epoxy resin, 20 parts by weight of silanized silica gel, 1 part by weight of cumene hydroperoxide, 2 parts by weight of tert-butyl peroxyneodecanoate, 0.3 part by weight of amine-blocked hexafluoroantimonate, 5 parts by weight of benzoylsulfonimide, 5.9 parts by weight of polyvinyl butyral, 5 parts by weight of isobornyl acrylate, 5 parts by weight of polyethylene glycol 200 diacrylate, 15 parts by weight of trimethylolpropane triacrylate, 0.1 part by weight of indigo blue, 0.2 part by weight of polyether modified silicon defoamer, 2 parts by weight of dibutyl phthalate and 0.5 parts by weight of gamma-aminopropyltriethoxysilane;
solid-liquid mixing: firstly, uniformly mixing isophorone diisocyanate, hydroxyl-terminated modified hyperbranched polyester, hydroxyethyl acrylate, polyester dihydric alcohol, alkenyl ether acrylate resin, polyester acrylate, o-cresol novolac epoxy resin, bisphenol A novolac epoxy resin, silanized silica gel, isobornyl acrylate, polyethylene glycol 200 diacrylate and trimethylolpropane triacrylate, adding gamma-aminopropyl triethoxysilane, polyvinyl butyral, o-benzoylsulfimide, indigo, polyether modified silicon defoamer and dibutyl phthalate, continuously mixing for about 30 minutes until all components are uniformly dispersed, finally adding cumene hydroperoxide, tert-butyl peroxyneodecanoate and amine-blocked Lewis acid salt, uniformly stirring, grinding for 2-3 times by three rollers, stirring for 30 minutes, vacuum degassing for 3-20 minutes, the insulating adhesive is prepared.
Example 5
The preparation process of the insulating glue comprises the following steps:
weighing: weighing 10 parts by weight of isophorone diisocyanate, 7 parts by weight of hydroxyl-terminated modified hyperbranched polyester, 9 parts by weight of hydroxyethyl acrylate, 1 part by weight of polyester diol, 2 parts by weight of polyester acrylate, 1 part by weight of o-cresol novolac epoxy resin, 32 parts by weight of silanized silica gel, 1.6 parts by weight of cumene hydroperoxide, 0.2 part by weight of amine-blocked Lewis acid salt, 2 parts by weight of o-benzoylsulfimide, 6.9 parts by weight of polyvinyl butyral, 10 parts by weight of isobornyl acrylate, 5 parts by weight of polyethylene glycol 200 diacrylate, 0.1 part by weight of indigo, 0.2 part by weight of polyether modified silicon defoamer, 1 part by weight of dicyclohexyl phthalate and 0.5 part by weight of methyl (gamma-aminopropyl) diethoxysilane;
solid-liquid mixing: firstly, uniformly mixing isophorone diisocyanate, hydroxyl-terminated modified hyperbranched polyester, hydroxyethyl acrylate, polyester dihydric alcohol, alkenyl ether acrylate resin, o-cresol novolac epoxy resin, silanized silica gel, isobornyl acrylate and polyethylene glycol 200 diacrylate, then adding methyl (gamma-aminopropyl) diethoxysilane, polyvinyl butyral, o-benzoyl sulfimide, indigo, polyether modified silicon defoamer and dicyclohexyl phthalate, continuously mixing for about 30 minutes until all components are uniformly dispersed, finally adding cumene hydroperoxide and amine closed Lewis acid salt, uniformly stirring, grinding for 2-3 times by three rollers, stirring for 30 minutes, and vacuum degassing for 3-20 minutes to obtain the insulating adhesive.
Example 6
The preparation process of the insulating glue comprises the following steps:
weighing: weighing 5 parts by weight of isophorone diisocyanate, 3 parts by weight of terminal hydroxyl modified hyperbranched polyester, 10 parts by weight of hydroxyethyl acrylate, 2 parts by weight of polyester diol, 2 parts by weight of polyester acrylate, 3 parts by weight of bisphenol A type novolac epoxy resin, 29 parts by weight of silanized silica gel, 1.2 parts by weight of cumene hydroperoxide, 0.4 part by weight of amine-blocked hexafluoroantimonate, 2 parts by weight of o-benzoylsulfimide, 7.1 parts by weight of polyvinyl butyral, 10 parts by weight of polyethylene glycol 200 diacrylate, 18 parts by weight of trimethylolpropane triacrylate, 0.1 part by weight of indigo, 0.2 part by weight of polyether modified silicon defoamer and 1.5 parts by weight of dicyclohexyl phthalate;
solid-liquid mixing: firstly, uniformly mixing isophorone diisocyanate, hydroxyl-terminated modified hyperbranched polyester, hydroxyethyl acrylate, polyester dihydric alcohol, polyester acrylate, bisphenol A novolac epoxy resin, silanized silica gel, polyethylene glycol 200 diacrylate and trimethylolpropane triacrylate, then adding dicyclohexyl phthalate, o-benzoylsulfimide, indigo, polyether modified silicon defoamer and dicyclohexyl phthalate, continuously mixing for about 30 minutes until all components are uniformly dispersed, finally adding cumene hydroperoxide and amine to seal hexafluoroantimonate, uniformly stirring, grinding for 2-3 times by three rollers, stirring for 30 minutes, and vacuum degassing for 3-20 minutes to obtain the insulating adhesive.
The weight parts of the components of the insulating glue in examples 1-6 are shown in Table 1.
Table 1 parts by weight of each component of an insulating paste in examples 1 to 6
And curing the insulating glue obtained in the embodiment 1-6 at 110-150 ℃ for 10-15 minutes to obtain a cured product. Testing the volume resistivity of the cured adhesive film by using an ultrahigh-resistance micro-current meter, and feeding the volume resistance rho v by using a direct-current amplification method in a feeding methodIn the line test, ρ v ═ Rv (a/h), ρ v is the volume resistivity in Ω · m, Rv is the measured volume resistance of the sample in Ω, a is the effective area of the measuring electrode in m2(ii) a The measurement range is 106-1017 omega, and the error is less than or equal to 10%. To ensure the measurement accuracy, a disc-shaped three-electrode system is generally adopted.
And measuring the insulation strength of the cured insulation adhesive film by using a voltage breakdown tester according to the ASTM D149-2009 dielectric breakdown voltage test method standard.
The values of volume resistivity, breakdown voltage and maximum service temperature of the insulating paste are shown in table 3.
Table 3 values of volume resistivity, breakdown voltage and maximum service temperature of the insulating paste.
Comparative example 1 is an insulating adhesive used in the semiconductor integrated circuit industry, which is required to be capable of bearing storage examination at 150-175 ℃ for more than 1000 hours for a long time and bearing high temperature during hot pressing of a lead wire at 350 ℃ for a short time, and compared with a solar cell module product, the insulating adhesive meets the examination of a complex outdoor use environment of high temperature, severe cold, humidity and the like for 25 years, the use environment of a semiconductor integrated circuit chip is much milder, and the requirement on the temperature resistance of the insulating adhesive is not high, the main components of the insulating adhesive of comparative example 1 are novolac epoxy resin, silicon dioxide, a diaminodiphenyl sulfone curing agent and a glycidyl ether active diluent, the novolac epoxy resin has certain temperature resistance, the product cured by the diaminodiphenyl sulfone curing agent has certain heat resistance, and can meet the requirements on volume resistivity and breakdown voltage, but no special heat-resistant component is used in the formula, the novolac epoxy resin in the insulating adhesive of embodiments 1-6 of the invention has high rigidity, forms a semi-interpenetrating network structure by compounding with urethane acrylate, forms an interlocking network structure by means of mutual penetration, interweaving, entanglement and the like among different polymer molecular chains, and improves the heat resistance of the system; the novolac epoxy resin has a molecular structure containing more than 2 epoxy groups, and has high crosslinking density after curing, and the heat resistance of the product is relatively improved. The addition of the silanized silica gel nano particles can reinforce and fill in a micro-area with weaker system resin, increase the interface acting force, reduce the free volume, increase the crosslinking density and increase the glass transition temperature, so that the heat resistance of the system is better.
The above description is only a preferred embodiment of the application and is illustrative of the principles of the technology employed. It will be appreciated by a person skilled in the art that the scope of the invention as referred to in the present application is not limited to the embodiments with a specific combination of the above-mentioned features, but also covers other embodiments with any combination of the above-mentioned features or their equivalents without departing from the inventive concept. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.
Claims (10)
1. The insulating glue is characterized by comprising the following components in parts by weight:
wherein the first thermal initiator is an organic peroxide and the second thermal initiator is a thermally initiated cationic curing agent.
2. The insulation paste according to claim 1,
the synthetic monomer of the polyurethane acrylate oligomer comprises isophorone diisocyanate, hydroxyl-terminated modified hyperbranched polyester, hydroxyethyl acrylate and polyester diol.
3. The insulation paste according to claim 1,
the acrylate oligomer comprises at least one of tertiary amine acrylate, tetrafunctional acrylate, hexafunctional acrylate, modified epoxy acrylic resin, polyester acrylate and alkenyl ether acrylate resin.
4. The insulation paste according to claim 1,
the first thermal initiator comprises at least one of cumene hydroperoxide, tert-butyl peroxyneodecanoate, tert-butyl peroxybenzoate, tert-butyl peroxyisooctanoate, tert-amyl peroxy (2-ethyl hexanoate), dibenzoyl peroxide and bis (4-tert-butylcyclohexyl) peroxydicarbonate.
5. The insulation paste according to claim 1,
the second thermal initiator is amine-blocked hexafluoroantimonate or amine-blocked Lewis acid salt.
6. The insulation paste according to claim 1,
the acrylic monomer comprises at least one of neopentyl glycol acrylate, trimethylolpropane triacrylate, pentaerythritol triacrylate, polyethylene glycol 200 diacrylate, polyethylene glycol 400 diacrylate, polyethylene glycol dimethacrylate, methoxy tripropylene glycol monoacrylate, methoxy propoxy neopentyl glycol monoacrylate, methoxy ethoxy trimethylolpropane diacrylate and tris (2-acryloxyethyl) isocyanurate.
7. An insulation paste according to any one of claims 1 to 6,
the adhesive further comprises 0-1 part of a coupling agent, wherein the coupling agent comprises one of gamma-aminopropyltriethoxysilane, gamma-glycidoxypropyltrimethoxysilane, aniline methyl triethoxysilane, methyl (gamma-epoxypropoxy) diethoxysilane, methyl (gamma-ethylenediamino) diethoxysilane, methyl (gamma-aminopropyl) diethoxysilane and N-beta- (aminoethyl) -gamma-aminopropyltrimethylsilane.
8. The insulating glue according to claim 1, characterized by comprising the following components in parts by weight:
9. the preparation method of the insulating glue is characterized by comprising the following steps:
weighing 20-30 parts of urethane acrylate oligomer, 0.5-5 parts of acrylate oligomer, 1-10 parts of novolac epoxy resin, 20-40 parts of silanized silica gel, 0.1-3 parts of first thermal initiator, 0.1-1 part of second thermal initiator and 5-30 parts of acrylic monomer;
uniformly mixing the weighed polyurethane acrylate oligomer, novolac epoxy resin, silanized silica gel and acrylic monomer, adding a first thermal initiator and a second thermal initiator, uniformly stirring, grinding for 2-3 times by three rollers, stirring for 20-40 minutes, and vacuum degassing for 3-20 minutes to obtain the insulating adhesive for the solar cell.
10. An IBC solar cell, comprising the insulating paste of any one of claims 1 to 8.
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