CN111625067A - SSD-based adaptive temperature control method and device - Google Patents
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Abstract
The invention discloses a self-adaptive temperature control method and a device based on an SSD, relating to the technical field of flash memory chips.A detection period of the method is dynamically adjusted according to whether temperature control is triggered or not and the temperature change trend after triggering; after triggering temperature control, dynamically adjusting according to the current temperature value and the change trend of the current temperature, and realizing the maximum performance of the disc under the temperature condition which can be borne by the disc; meanwhile, the technical scheme of the invention has the functions of storage and memory. After the disc exits from the temperature control for the first time, the parameters of the disc when the performance is stable can be stored, and when the temperature control is triggered again, the stored parameters can be directly used as an adjusting basis to reduce the time for the temperature control system to enter the stable state.
Description
Technical Field
The invention relates to the technical field of flash memory chips, in particular to an SSD-based adaptive temperature control method and device.
Background
With the popularization of flash memory chips, more and more memory devices use flash memory chips as a storage medium. Due to the physical characteristics of the flash memory chip, when the flash memory chip works at a temperature exceeding a certain temperature, the holding force of the flash memory chip to charges gradually weakens along with the rise of the temperature, so that read-write data are unstable, and when the flash memory chip works at a temperature exceeding a certain temperature, the temperature is reduced by reducing the read-write power consumption, so that the error probability is reduced.
The temperature control is triggered when the temperature defaults to 70 ℃, and 80 ℃ is taken as a limit temperature as an example. The current temperature control scheme is to measure the disc temperature once a minute, and take every 5 degrees as an adjustment grade:
1) when the temperature is 70 ℃ and 75 ℃, the performance is reduced to about 2/3.
2) When the temperature is 75 ℃ and 80 ℃, the performance is reduced to about 1/3.
3) When the temperature exceeds 80 ℃, the performance is reduced to about 1/5.
4) If the temperature of the disc is found to be lower than 70 degrees during the detection, the disc is operated at full speed.
The drawbacks of the prior art solutions include:
1. the detection time is fixed and cannot be dynamically adjusted
The detection time of the current temperature control system is fixed and cannot be dynamically adjusted. This can cause the disk to rise too quickly in the detection interval, thereby directly reaching the disk's limit temperature, which can affect performance and read-write data accuracy.
2: the temperature control adjustment mode is simple and rough
The detection mode and the regulation mode of current control by temperature change are simpler and cruder, the biggest drawback of design like this: 1) the performance of the disc cannot be maximized under temperature control triggering. Since the performance values of the disk are bound according to the currently detected temperature value at this time. 2) And a three-stage stepped temperature control mode is adopted, so that the performance jitter is serious, and an optimal and stable performance environment cannot be achieved.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a SSD-based adaptive temperature control method and device, which can be dynamically adjusted according to the current temperature value and the change trend of the current temperature, so as to exert the performance of a disk to the maximum extent.
In order to achieve the above purposes, the technical scheme adopted by the invention is as follows: an SSD-based adaptive temperature control method comprises the following steps:
s1, when the temperature of the disc rises to be higher than the trigger temperature, starting temperature control, carrying out halving treatment on die concurrence, setting a temperature control detection period, and entering S2;
s2, if the temperature rises, returning to S1; if the temperature is reduced or unchanged, entering S3;
s3: increasing die concurrency number until the temperature is stable and unchanged, when the temperature is maintained at a temperature lower than the maximum bearing temperature value for more than two detection times, increasing die concurrency number, observing the temperature change trend, if the temperature is reduced or unchanged, repeating S3, and if the temperature is increased, entering S4;
s4: if the current temperature is lower than the maximum bearing temperature value of the current die concurrency number, keeping the current die concurrency number until the temperature rises to exceed 1 degree, reducing the die concurrency number, observing the temperature change trend, and returning to S3 if the temperature is reduced or unchanged; if the temperature rises, return is made to S4.
On the basis of the technical scheme, the temperature control detection period is 10 seconds.
Based on the above technical solution, if the temperature rises and the current temperature value is equal to or exceeds the maximum allowable temperature value in S3 or S4, the die concurrency number is reduced and the temperature control detection period set in S1 is shortened, until the temperature value is lower than or equal to the maximum allowable temperature value, the temperature control detection period set in S1 is recovered, and then the process returns to S3.
Based on the technical scheme, if the temperature of the disk exceeds the limit temperature born by the flash in S3 or S4, the fine adjustment is quitted, and the operation returns to S1.
On the basis of the above technical scheme, when the temperature of the disc is reduced to be lower than the trigger temperature, the temperature control is closed, the initial die concurrency number and the fixed detection period are recovered, the die concurrency number when the performance of the disc is stable before the temperature control is quitted is recorded when the temperature control is closed, and the die concurrency number is directly called to enter S2 when the temperature control is re-entered next time.
The invention also provides an adaptive temperature control device based on the SSD, which comprises:
a temperature control module for: when the temperature of the disc rises to be higher than the trigger temperature, starting temperature control, carrying out halving treatment on the die concurrency number, setting a temperature control detection period, and if the temperature rises, continuing to carry out halving treatment on the die concurrency number and shortening the temperature control detection period; if the temperature is reduced or unchanged, fine adjustment is carried out on the die concurrence number and the temperature according to the current temperature value and the change trend of the current temperature;
a temperature controlled exit module for: and when the temperature of the disk is reduced to be lower than the trigger temperature, quitting the temperature control, recovering the initial die concurrency number and the original fixed detection period, and recording the die concurrency number when the performance of the disk is stable before quitting the temperature control for calling when the temperature control module starts the temperature control again.
On the basis of the technical scheme, the temperature control module is specifically used for:
s1, when the temperature of the disc rises to be higher than the trigger temperature, starting temperature control, carrying out halving treatment on die concurrence, setting a temperature control detection period, and entering S2;
s2, if the temperature rises, returning to S1; if the temperature is reduced or unchanged, entering S3;
s3: increasing die concurrency number until the temperature is stable and unchanged, when the temperature is maintained at a temperature lower than the maximum bearing temperature value for more than two detection times, increasing die concurrency number, observing the temperature change trend, if the temperature is reduced or unchanged, repeating S3, and if the temperature is increased, entering S4;
s4: if the current temperature is lower than the maximum bearing temperature value of the current die concurrency number, keeping the current die concurrency number until the temperature rises to exceed 1 degree, reducing the die concurrency number, observing the temperature change trend, and returning to S3 if the temperature is reduced or unchanged; if the temperature rises, return is made to S4.
On the basis of the above technical solution, if the temperature rises in S3 or S4 and the current temperature value is equal to or exceeds the maximum allowable temperature value, the temperature control module decreases the die concurrency number and shortens the temperature control detection period set in S1, and returns to S3 after recovering the temperature control detection period set in S1 until the temperature value is lower than or equal to the maximum allowable temperature value.
Based on the above technical solution, if the temperature of the disk exceeds the limit temperature of the flash in S3 or S4, the temperature control module exits from the fine adjustment and returns to S1.
On the basis of the technical scheme, the temperature control module is further used for: when the temperature control is started again, the die concurrency number recorded by the temperature control exit module when the exit temperature control front disc performance is stable is directly called to enter S2.
The technical scheme provided by the invention has the beneficial effects that:
the detection period of the invention is dynamically adjusted according to whether the temperature control is triggered or not and the temperature change trend after triggering; after triggering temperature control, dynamically adjusting according to the current temperature value and the change trend of the current temperature, and realizing the maximum performance of the disc under the temperature condition which can be borne by the disc;
meanwhile, the technical scheme of the invention has the functions of storage and memory. After the disc exits from the temperature control for the first time, the parameters of the disc when the performance is stable can be stored, and when the temperature control is triggered again, the stored parameters can be directly used as an adjusting basis to reduce the time for the temperature control system to enter the stable state.
Furthermore, the invention can exit immediately after each detection and execution, and the execution performance of the read-write operation can not be influenced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.
FIG. 1 is a schematic flow chart of an adaptive temperature control method according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of the raw temperature control adjustments of a comparative test in an embodiment of the present invention;
fig. 3 is a schematic diagram of adaptive temperature control adjustment according to an embodiment of the present invention.
Detailed Description
Description of terms:
in the application, flash refers to NAND flash specifically, and a disk refers to a Solid State Disk (SSD) specifically.
The NAND flash chip is internally provided with a plurality of concurrent units, and one NAND flash chip is composed of one or more targets, and each Target comprises one or more die. Each die is an independent memory cell. The firmware system can concurrently operate the maximum die number at a time, and the more the concurrent number is, the better the performance is and the higher the power consumption is.
Embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.
Referring to fig. 1, an embodiment of the present invention provides an SSD-based adaptive temperature control method, including the following steps:
s1, when the temperature of the disc rises to be higher than the trigger temperature, starting temperature control, carrying out halving treatment on die concurrence, setting a temperature control detection period, preferably, the temperature control detection period is 10 seconds, and entering S2;
s2, if the temperature rises, returning to S1; if the temperature is reduced or unchanged, entering S3;
s3: increasing die concurrency number until the temperature is stable and unchanged, when the temperature is maintained at a temperature lower than the maximum bearing temperature value for more than two detection times, increasing die concurrency number, observing the temperature change trend, if the temperature is reduced or unchanged, repeating S3, and if the temperature is increased, entering S4;
s4: if the current temperature is lower than the maximum bearing temperature value of the current die concurrency number, keeping the current die concurrency number until the temperature rises to exceed 1 degree, reducing the die concurrency number, observing the temperature change trend, and returning to S3 if the temperature is reduced or unchanged; if the temperature rises, return is made to S4.
The detection period of the embodiment of the invention is dynamically adjusted according to whether the temperature control is triggered or not and the temperature change trend after the triggering; after triggering temperature control, dynamically adjusting according to the current temperature value and the change trend of the current temperature, and realizing the maximum performance of the disc under the temperature condition which can be borne by the disc;
in a preferred embodiment, if the temperature rises and the current temperature value is equal to or exceeds the maximum allowable temperature value in S3 or S4, the die concurrency number is decreased and the temperature control detection period set in S1 is shortened, and when the temperature value is lower than or equal to the maximum allowable temperature value, the temperature control detection period set in S1 is restored, and then the process returns to S3.
In a preferred embodiment, if the temperature of the disk exceeds the limit temperature of the flash, the trimming is exited in S3 or S4, and the process returns to S1.
As a preferred embodiment, when the disc temperature drops below the trigger temperature, the temperature control is turned off, the initial die concurrency number and the fixed detection period are recovered, the die concurrency number when the disc performance is stable before the temperature control is exited is recorded at the time of turning off the temperature control, and when the temperature control is reentered next time, the die concurrency number is directly called to enter S2.
The embodiment of the invention has the functions of saving and memorizing. After the disc exits from the temperature control for the first time, the parameters of the disc when the performance is stable can be stored, and when the temperature control is triggered again, the stored parameters can be directly used as an adjusting basis to reduce the time for the temperature control system to enter the stable state.
Specifically, the self-adaptive temperature control method provided by the embodiment of the invention comprises the following steps:
step 1: and after the temperature control is triggered for the first time, halving the die concurrency number, and simultaneously reducing the detection time (10 seconds) so as to prevent the temperature rising trend in time.
Step 2: if the temperature continues to rise after halving, returning to the step 1 (preventing the temperature from rising all the time and being uncontrollable by subsequent fine adjustment); if the temperature drops or remains unchanged, the fine tuning phase of step 3 is entered.
And step 3: after fine adjustment, if the temperature is reduced, increasing the die concurrency number until the temperature is stable and unchanged, when the temperature is maintained at a temperature value (lower than the maximum bearing temperature value) for more than two detection times, increasing the die concurrency number (which is used for realizing the performance to the maximum), observing the temperature change trend again, if the temperature is reduced or unchanged, repeating the step 3, and increasing the temperature to the step 4.
And 4, step 4: and (3) the temperature trend rises and the current temperature is lower than the maximum bearing temperature value of the die concurrency number, the current concurrency number is kept until the temperature rises to exceed 1 degree, the concurrency number is reduced, the change trend is continuously observed, if the temperature is reduced or unchanged, the step 3 is returned, and otherwise, the step 4 is returned.
And 5: and (3) if the temperature rises and the current temperature value is equal to or exceeds the maximum bearing temperature value during fine adjustment, immediately reducing the die concurrency number and reducing the detection time (5 seconds) until the temperature value is lower than or equal to the limit temperature, and returning to the step (3) after the detection time is recovered (10 seconds).
Step 6: and in the fine adjustment stage, if the temperature rise is too fast due to external factors, and the temperature of the disk exceeds the limit temperature born by the flash, the fine adjustment is quitted, and the step 1 is returned.
And 7: when the temperature of the disc is reduced to be lower than the trigger temperature, the temperature control is immediately closed, the initial die concurrency number and the detection time (1min) are recovered, meanwhile, the die concurrency number of the optimum performance before exiting (namely, when the performance of the disc is stable) is recorded when the temperature control exits, and when the temperature control is entered again next time, the value is directly called to enter the step 2.
The embodiment of the invention can exit immediately after the detection execution every time, and the execution performance of the read-write operation can not be influenced.
FIG. 2 is a schematic diagram of the original temperature control adjustment for a comparative test; FIG. 3 is a schematic diagram of an adaptive temperature control adjustment according to an embodiment of the present invention, in which the abscissa represents the test time; the ordinate represents IOMeter SW performance.
Referring to fig. 2, the chamber temperature change was compared: 65 deg.C (1hrs) - >85 deg.C (1hrs) - >65 deg.C (1 hrs).
Through contrast test, the average performance of the self-adaptive temperature control system is greatly improved after the temperature control is triggered compared with the original temperature control system. From the performance variation trend, the self-adaptive temperature control variation amplitude is smaller, and the trend is smoother.
An embodiment of the present invention further provides an SSD-based adaptive temperature control device, which includes:
a temperature control module for: when the temperature of the disc rises to be higher than the trigger temperature, starting temperature control, carrying out halving treatment on the die concurrency number, setting a temperature control detection period, and if the temperature rises, continuing to carry out halving treatment on the die concurrency number and shortening the temperature control detection period; if the temperature is reduced or unchanged, fine adjustment is carried out on the die concurrence number and the temperature according to the current temperature value and the change trend of the current temperature;
a temperature controlled exit module for: and when the temperature of the disk is reduced to be lower than the trigger temperature, quitting the temperature control, recovering the initial die concurrency number and the original fixed detection period, and recording the die concurrency number when the performance of the disk is stable before quitting the temperature control for calling when the temperature control module starts the temperature control again.
As a preferred embodiment, the temperature control module is specifically configured to:
s1, when the temperature of the disc rises to be higher than the trigger temperature, starting temperature control, carrying out halving treatment on die concurrence, setting a temperature control detection period, and entering S2;
s2, if the temperature rises, returning to S1; if the temperature is reduced or unchanged, entering S3;
s3: increasing die concurrency number until the temperature is stable and unchanged, when the temperature is maintained at a temperature lower than the maximum bearing temperature value for more than two detection times, increasing die concurrency number, observing the temperature change trend, if the temperature is reduced or unchanged, repeating S3, and if the temperature is increased, entering S4;
s4: if the current temperature is lower than the maximum bearing temperature value of the current die concurrency number, keeping the current die concurrency number until the temperature rises to exceed 1 degree, reducing the die concurrency number, observing the temperature change trend, and returning to S3 if the temperature is reduced or unchanged; if the temperature rises, return is made to S4.
In a preferred embodiment, if the temperature rises and the current temperature value is equal to or exceeds the maximum allowable temperature value in S3 or S4, the temperature control module decreases the die concurrency number and shortens the temperature control detection period set in S1, and returns to S3 after recovering the temperature control detection period set in S1 until the temperature value is lower than or equal to the maximum allowable temperature value.
In a preferred embodiment, if the temperature of the disk exceeds the limit temperature of the flash in S3 or S4, the temperature control module exits the fine adjustment and returns to S1.
As a preferred embodiment, the temperature control module is further configured to: when the temperature control is started again, the die concurrency number recorded by the temperature control exit module when the exit temperature control front disc performance is stable is directly called to enter S2.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (10)
1. An SSD-based adaptive temperature control method is characterized by comprising the following steps:
s1, when the temperature of the disc rises to be higher than the trigger temperature, starting temperature control, carrying out halving treatment on die concurrence, setting a temperature control detection period, and entering S2;
s2, if the temperature rises, returning to S1; if the temperature is reduced or unchanged, entering S3;
s3: increasing die concurrency number until the temperature is stable and unchanged, when the temperature is maintained at a temperature lower than the maximum bearing temperature value for more than two detection times, increasing die concurrency number, observing the temperature change trend, if the temperature is reduced or unchanged, repeating S3, and if the temperature is increased, entering S4;
s4: if the current temperature is lower than the maximum bearing temperature value of the current die concurrency number, keeping the current die concurrency number until the temperature rises to exceed 1 degree, reducing the die concurrency number, observing the temperature change trend, and returning to S3 if the temperature is reduced or unchanged; if the temperature rises, return is made to S4.
2. The method of claim 1, wherein: the temperature control detection period is 10 seconds.
3. The method of claim 1, wherein:
if the temperature rises and the current temperature value is equal to or exceeds the maximum allowable temperature value in S3 or S4, the die concurrency number is reduced and the temperature control detection period set in S1 is shortened, and when the temperature value is lower than or equal to the maximum allowable temperature value, the temperature control detection period set in S1 is recovered and then the process returns to S3.
4. The method of claim 1, wherein:
and in S3 or S4, if the temperature of the disk exceeds the limit temperature borne by the flash, exiting fine adjustment and returning to S1.
5. The method of claim 1, wherein:
when the temperature of the disc drops below the trigger temperature, the temperature control is closed, the initial die concurrency number and the fixed detection period are recovered, the die concurrency number when the performance of the disc is stable before the temperature control is exited is recorded when the temperature control is closed, and the die concurrency number is directly called to enter S2 when the temperature control is reentered next time.
6. An adaptive temperature control device based on SSD, comprising:
a temperature control module for: when the temperature of the disc rises to be higher than the trigger temperature, starting temperature control, carrying out halving treatment on the die concurrency number, setting a temperature control detection period, and if the temperature rises, continuing to carry out halving treatment on the die concurrency number and shortening the temperature control detection period; if the temperature is reduced or unchanged, fine adjustment is carried out on the die concurrence number and the temperature according to the current temperature value and the change trend of the current temperature;
a temperature controlled exit module for: and when the temperature of the disk is reduced to be lower than the trigger temperature, quitting the temperature control, recovering the initial die concurrency number and the original fixed detection period, and recording the die concurrency number when the performance of the disk is stable before quitting the temperature control for calling when the temperature control module starts the temperature control again.
7. The apparatus of claim 6, wherein: the temperature control module is specifically used for:
s1, when the temperature of the disc rises to be higher than the trigger temperature, starting temperature control, carrying out halving treatment on die concurrence, setting a temperature control detection period, and entering S2;
s2, if the temperature rises, returning to S1; if the temperature is reduced or unchanged, entering S3;
s3: increasing die concurrency number until the temperature is stable and unchanged, when the temperature is maintained at a temperature lower than the maximum bearing temperature value for more than two detection times, increasing die concurrency number, observing the temperature change trend, if the temperature is reduced or unchanged, repeating S3, and if the temperature is increased, entering S4;
s4: if the current temperature is lower than the maximum bearing temperature value of the current die concurrency number, keeping the current die concurrency number until the temperature rises to exceed 1 degree, reducing the die concurrency number, observing the temperature change trend, and returning to S3 if the temperature is reduced or unchanged; if the temperature rises, return is made to S4.
8. The apparatus of claim 7, wherein:
if the temperature rises and the current temperature value is equal to or exceeds the maximum bearing temperature value in S3 or S4, the temperature control module reduces the die concurrency number and shortens the temperature control detection period set in S1 until the temperature value is lower than or equal to the maximum bearing temperature value, and the temperature control module returns to S3 after recovering the temperature control detection period set in S1.
9. The apparatus of claim 7, wherein:
if the temperature of the disk exceeds the limit temperature borne by the flash in S3 or S4, the temperature control module exits from fine adjustment and returns to S1.
10. The apparatus of claim 7, wherein:
the temperature control module is further configured to: when the temperature control is started again, the die concurrency number recorded by the temperature control exit module when the exit temperature control front disc performance is stable is directly called to enter S2.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112596680A (en) * | 2020-12-25 | 2021-04-02 | 深圳忆联信息系统有限公司 | SSD temperature control performance balancing method and device, computer equipment and storage medium |
| CN112631870A (en) * | 2020-12-29 | 2021-04-09 | 深圳大普微电子科技有限公司 | Temperature control method and device and solid state disk |
| CN113838494A (en) * | 2021-08-10 | 2021-12-24 | 至誉科技（武汉）有限公司 | DRAM DLL time sequence temperature self-adaptive calibration method and system |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102982836A (en) * | 2012-11-21 | 2013-03-20 | 记忆科技(深圳)有限公司 | Method for improving reliability of solid state disk and solid state disk of method |
| US20180067689A1 (en) * | 2015-08-14 | 2018-03-08 | International Business Machines Corporation | Managing temperature of solid state disk devices |
| CN107894941A (en) * | 2017-11-14 | 2018-04-10 | 郑州云海信息技术有限公司 | A kind of SSD Working state monitoring devices and method |
| CN107945820A (en) * | 2017-11-03 | 2018-04-20 | 记忆科技(深圳)有限公司 | A kind of solid state hard disc temprature control method and temperature control modules |
| US20180246649A1 (en) * | 2017-02-28 | 2018-08-30 | Hewlett Packard Enterprise Development Lp | Methods for estimating cost savings using deduplication and compression in a storage system |
| CN110704274A (en) * | 2019-09-06 | 2020-01-17 | 苏州浪潮智能科技有限公司 | Temperature control method, device and equipment for solid state disk |
| CN110825327A (en) * | 2019-11-11 | 2020-02-21 | 深圳忆联信息系统有限公司 | SSD temperature control method and device, computer equipment and storage medium |
-
2020
- 2020-04-21 CN CN202010317801.6A patent/CN111625067B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102982836A (en) * | 2012-11-21 | 2013-03-20 | 记忆科技(深圳)有限公司 | Method for improving reliability of solid state disk and solid state disk of method |
| US20180067689A1 (en) * | 2015-08-14 | 2018-03-08 | International Business Machines Corporation | Managing temperature of solid state disk devices |
| US20180246649A1 (en) * | 2017-02-28 | 2018-08-30 | Hewlett Packard Enterprise Development Lp | Methods for estimating cost savings using deduplication and compression in a storage system |
| CN107945820A (en) * | 2017-11-03 | 2018-04-20 | 记忆科技(深圳)有限公司 | A kind of solid state hard disc temprature control method and temperature control modules |
| CN107894941A (en) * | 2017-11-14 | 2018-04-10 | 郑州云海信息技术有限公司 | A kind of SSD Working state monitoring devices and method |
| CN110704274A (en) * | 2019-09-06 | 2020-01-17 | 苏州浪潮智能科技有限公司 | Temperature control method, device and equipment for solid state disk |
| CN110825327A (en) * | 2019-11-11 | 2020-02-21 | 深圳忆联信息系统有限公司 | SSD temperature control method and device, computer equipment and storage medium |
Cited By (5)
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