CN111621238A - Manufacturing process of red high-temperature-resistant polymer adhesive tape - Google Patents

Manufacturing process of red high-temperature-resistant polymer adhesive tape Download PDF

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CN111621238A
CN111621238A CN202010500868.3A CN202010500868A CN111621238A CN 111621238 A CN111621238 A CN 111621238A CN 202010500868 A CN202010500868 A CN 202010500868A CN 111621238 A CN111621238 A CN 111621238A
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temperature
parts
adhesive tape
materials
composition
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王如华
杨福梓
余粲丞
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Siwei Lutou Brand Dongguan Precision Materials Co ltd
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Siwei Lutou Brand Dongguan Precision Materials Co ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/245—Vinyl resins, e.g. polyvinyl chloride [PVC]
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
    • C09J123/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
    • C09J123/22—Copolymers of isobutene; Butyl rubber ; Homo- or copolymers of other iso-olefines
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2327/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers
    • C08J2327/02—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment
    • C08J2327/04—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment containing chlorine atoms
    • C08J2327/06—Homopolymers or copolymers of vinyl chloride
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2433/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
    • C08J2433/04—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters
    • C08J2433/06—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters of esters containing only carbon, hydrogen, and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C08J2433/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/12—Esters; Ether-esters of cyclic polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2427/00—Presence of halogenated polymer
    • C09J2427/006—Presence of halogenated polymer in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C09J2433/006—Presence of (meth)acrylic polymer in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesive Tapes (AREA)

Abstract

The invention discloses a manufacturing process of a red high-temperature-resistant polymer adhesive tape, which specifically comprises the following steps: s1, selecting and preparing a high-molecular base material: the invention relates to the technical field of adhesive tape manufacturing, and discloses a method for manufacturing an adhesive tape by stirring high-molecular polyvinyl chloride, a plasticizer, polyethylacrylate, polybutylacrylate and an accelerator in a high-speed stirrer. This red high temperature resistant polymer adhesive tape preparation technology, through adopting polymer polyvinyl chloride to be the preparation major ingredient of substrate, still adopted the plasticizer to make the substrate have the effect of high temperature resistant irradiation and environmental protection for the auxiliary material, the promoter has then reduced the shrinkage factor and the coefficient of thermal expansion of sizing material, the heat resistance and the persistence of adhesive tape have been improved through adding sulphur and graphite alkene powder in the gluing agent simultaneously, make the problem that the adhesive tape can not drop under high temperature, make the adhesive tape possess good tensile elasticity through the addition of ethyl acrylate and polybutyl acrylate simultaneously, the viscidity of adhesive tape has also been increased.

Description

Manufacturing process of red high-temperature-resistant polymer adhesive tape
Technical Field
The invention relates to the technical field of adhesive tape manufacturing, in particular to a manufacturing process of a red high-temperature-resistant polymer adhesive tape.
Background
The adhesive tape can be divided into: the adhesive tape has different effects suitable for different industry requirements, two or more unconnected objects are connected together by adhesion, a layer of adhesive is coated on the surface of the unconnected objects, the earliest adhesive is from animals and plants, and in the nineteenth century, rubber is the main component of the adhesive; however, various polymers are widely used in modern times, the adhesive can stick things because the molecules of the adhesive and the molecules of the articles to be connected form bonds which can firmly bond the molecules together, and the components of the adhesive have various polymers according to different brands and different types.
The adhesive tape plays an important role in various packaging operations, the adhesive tape is composed of a base material and an adhesive, after the existing adhesive tape is attached, the base material is easy to shrink under certain high-temperature environments, and the adhesive tape is easy to generate thermal aging under the environments for a long time, so that the problem that an adhesive layer falls off is caused, the viscosity of the adhesive tape is influenced, the overall performance of the adhesive tape is reduced under the high-temperature condition, and meanwhile, the tensile toughness of the adhesive tape is still to be improved.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a process for manufacturing a red high-temperature-resistant polymer adhesive tape, which solves the problems that a base material is easy to shrink under a high-temperature environment, and the adhesive tape is easy to generate thermal aging under the environment for a long time, so that an adhesive layer falls off and the adhesion of the adhesive tape is influenced.
(II) technical scheme
In order to achieve the purpose, the invention is realized by the following technical scheme: the utility model provides a red high temperature resistant polymer sticky tape preparation technology, through the preparation major ingredient that adopts polymer polyvinyl chloride to the substrate, still adopted the plasticizer to make the substrate have the effect of high temperature resistant irradiation and environmental protection for the auxiliary material, the promoter has then reduced the shrinkage factor and the coefficient of thermal expansion of sizing material, the heat resistance and the persistence of sticky tape have been improved through adding sulphur and graphite alkene powder in the gluing agent simultaneously, make the sticky tape can not the problem that drops under high temperature, make the sticky tape possess good tensile elasticity through the addition of ethyl acrylate and polybutyl acrylate simultaneously, the viscidity of sticky tape has also been increased, the wholeness ability of sticky tape has been improved greatly, specifically include following step:
s1, selecting and preparing a high-molecular base material: putting high molecular polyvinyl chloride, a plasticizer, polyethyl acrylate, polybutyl acrylate and an accelerator into a high-speed stirrer for stirring, stirring for 1.5-2h at the rotating speed of 2000r/min, heating the materials to 80-90 ℃ after uniform stirring, preserving heat for 30-45min, taking out the materials, putting the materials into drying equipment for drying, stretching and pressing the materials into a film after drying, soaking the film in an ethanol solution for 30-45min, irradiating the film for 40S by using an ultraviolet high-pressure mercury lamp after the soaking is finished, and finally obtaining a base material for later use;
s2, preparation of composition A: putting sulfur, epoxy resin, graphene powder, butyl rubber and a dispersing agent into a reaction kettle in sequence, heating the temperature inside the reaction kettle to 80-100 ℃ for dissolving, standing in the reaction kettle after dissolving, cooling to 30 ℃ to obtain a composition A, waiting for standby, wherein the sulfur is named as sulfur, colloidal sulfur and sulfur blocks, is faint yellow brittle crystals or powder in appearance, has special odor, has a molecular weight of 32.06, vapor pressure of 0.13kPa, a flash point of 207 ℃, a melting point of 118 ℃, a boiling point of 444.6 ℃, a relative density (water =1) of 2.0, is insoluble in water, slightly soluble in ethanol and ether, is easily soluble in carbon disulfide and serves as a flammable solid, and the sulfur is mainly used for manufacturing dyes, pesticides, matches, gunpowder, rubber, artificial filaments and the like;
s3, preparation of composition B: sequentially placing the propyl acid oil glue, the red pigment, the organic solvent and the stabilizer into a stirring kettle, dispersing at a high speed for 40-60min, controlling the temperature at 75-80 ℃ to fully and uniformly disperse the materials, standing the materials and the inside of the reaction kettle after dispersion, cooling the materials to 30 ℃ to obtain a composition B, and waiting for later use;
s4, preparing a high-temperature-resistant adhesive: placing the composition A in the S2 and the composition B in the S3 into a reaction kettle for high-temperature smelting, controlling the smelting temperature at 200-280 ℃, and obtaining the high-temperature-resistant adhesive after the smelting is finished;
s5, preparing the high-temperature polymer adhesive tape: unreeling the substrate prepared in the step S1 again, coating the adhesive prepared in the step S4 on one surface of the substrate through gluing equipment, then placing the substrate into drying equipment to be dried at the temperature of 120-150 ℃, cooling to room temperature, then attaching a release film to the other surface of the substrate, and finally packaging and forming after slitting, checking and rolling.
Preferably, the red high-temperature-resistant polymer adhesive tape comprises the following raw materials in parts by weight: 10-12 parts of high-molecular polyvinyl chloride, 3-5 parts of plasticizer, 8-10 parts of polyethyl acrylate, 7-9 parts of polybutyl acrylate, 25-35 parts of ethanol solution, 5-7 parts of sulfur, 3-5 parts of accelerator, 6-8 parts of epoxy resin, 6-8 parts of graphene powder, 10-12 parts of butyl rubber, 10-12 parts of acrylic acid oil glue, 2-4 parts of red pigment, 3-5 parts of dispersant, 5-7 parts of organic solvent and 6-8 parts of stabilizer.
Preferably, the organic solvent in step S3 is one of amyl acetate, ethyl acetate, chloroform, diethyl ether and lauric acid, and the dispersant in step S3 is polyvinyl alcohol.
Preferably, the smelting time in the step S4 is 4 h.
Preferably, the plasticizer in step S1 is one or more of dibutyl phthalate, di-sec-octyl phthalate and diisodecyl phthalate.
(III) advantageous effects
The invention provides a manufacturing process of a red high-temperature-resistant polymer adhesive tape. The method has the following beneficial effects: the manufacturing process of the red high-temperature-resistant polymer adhesive tape comprises the following steps of S1, selection and preparation of polymer base materials: putting high molecular polyvinyl chloride, a plasticizer, polyethyl acrylate, polybutyl acrylate and an accelerator into a high-speed stirrer for stirring, stirring for 1.5-2h at the rotating speed of 2000r/min, heating the materials to 80-90 ℃ after uniform stirring, preserving heat for 30-45min, taking out the materials, putting the materials into drying equipment for drying, stretching and pressing the materials into a film after drying, soaking the film in an ethanol solution for 30-45min, irradiating the film for 40S by using an ultraviolet high-pressure mercury lamp after the soaking is finished, and finally obtaining a base material for later use; s2, preparation of composition A: sequentially putting sulfur, epoxy resin, graphene powder, butyl rubber and a dispersing agent into a reaction kettle, heating the temperature inside the reaction kettle to 80-100 ℃ for dissolving, standing in the reaction kettle after dissolving, cooling to 30 ℃ to obtain a composition A, and waiting for later use; s3, preparation of composition B: sequentially placing the propyl acid oil glue, the red pigment, the organic solvent and the stabilizer into a stirring kettle, dispersing at a high speed for 40-60min, controlling the temperature at 75-80 ℃ to fully and uniformly disperse the materials, standing the materials and the inside of the reaction kettle after dispersion, cooling the materials to 30 ℃ to obtain a composition B, and waiting for later use; s4, preparing a high-temperature-resistant adhesive: placing the composition A in the S2 and the composition B in the S3 into a reaction kettle for high-temperature smelting, controlling the smelting temperature at 200-280 ℃, and obtaining the high-temperature-resistant adhesive after the smelting is finished; s5, preparing the high-temperature polymer adhesive tape: unreeling the base material prepared in the step S1 again, coating the adhesive prepared in the step S4 on one surface of the base material through gluing equipment, then placing the base material into drying equipment to be dried at the temperature of 120-150 ℃, cooling to room temperature, then attaching a release film to the other surface of the base material, finally cutting, inspecting, rolling and packaging for molding, adopting high-molecular polyvinyl chloride as a main material for preparing the base material, adopting a plasticizer as an auxiliary material to enable the base material to have high-temperature irradiation resistance and environmental protection effects, reducing the shrinkage and thermal expansion coefficient of the adhesive material through an accelerator, improving the heat resistance and durability of the adhesive tape by adding sulfur and graphene powder into the adhesive, enabling the adhesive tape not to fall off at high temperature, enabling the adhesive tape to have good tensile elasticity and increasing the viscosity of the adhesive tape through the addition of polyethylacrylate and polybutylacrylate, the overall performance of the adhesive tape is greatly improved.
Drawings
FIG. 1 is a flow chart of a fabrication process of the present invention;
FIG. 2 is a table of the experiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-2, the embodiment of the present invention provides three technical solutions: a manufacturing process of a red high-temperature-resistant polymer adhesive tape specifically comprises the following steps;
example one
S1, selecting and preparing a high-molecular base material: 10 parts of high-molecular polyvinyl chloride, 3 parts of plasticizer, 8 parts of polyethyl acrylate, 7 parts of polybutyl acrylate and 3 parts of accelerator are placed in a high-speed stirrer for stirring, the stirring is carried out for 1.5 hours under the condition of the rotating speed of 2000r/min, after the stirring is uniform, the materials are heated to 80 ℃, the temperature is kept for 30 minutes, then the materials are taken out and placed in drying equipment for drying, the materials are stretched and pressed into a film after the drying, the film is soaked in ethanol solution for 30 minutes, and after the completion, the ultraviolet high-pressure mercury lamp is used for irradiating for 40 seconds, and finally the base material is obtained and is ready for use;
s2, preparation of composition A: sequentially putting sulfur, 6 parts of epoxy resin, 6 parts of graphene powder, 10 parts of butyl rubber and 3 parts of dispersing agent into a reaction kettle, heating the internal temperature of the reaction kettle to 80 ℃ for dissolving, standing in the reaction kettle after dissolving, cooling to 30 ℃ to obtain a composition A, and waiting for later use;
s3, preparation of composition B: sequentially putting 10 parts of acrylic acid oil glue, 2 parts of red pigment, 5 parts of organic solvent and 6 parts of stabilizer into a stirring kettle, dispersing at a high speed for 40min, controlling the temperature at 75 ℃ to fully and uniformly disperse the materials, standing the materials and the inside of the reaction kettle after dispersion, cooling the materials to 30 ℃ to obtain a composition B, and waiting for standby;
s4, preparing a high-temperature-resistant adhesive: placing the composition A in the S2 and the composition B in the S3 into a reaction kettle for high-temperature smelting, controlling the smelting temperature at 200 ℃, and obtaining the high-temperature-resistant adhesive after the smelting is finished;
s5, preparing the high-temperature polymer adhesive tape: unreeling the base material prepared in the step S1 again, coating the adhesive prepared in the step S4 on one surface of the base material through gluing equipment, then putting the base material into drying equipment to be dried at the temperature of 120 ℃, cooling the base material to room temperature, then attaching a release film to the other surface of the base material, and finally packaging and forming after slitting, checking and rolling.
Example two
S1, selecting and preparing a high-molecular base material: putting 11 parts of high-molecular polyvinyl chloride, 4 parts of plasticizer, 9 parts of polyethyl acrylate, 8 parts of polybutyl acrylate and 4 parts of accelerator into a high-speed stirrer for stirring, stirring for 1.8h at the rotating speed of 2000r/min, heating the materials to 85 ℃ after uniform stirring, preserving heat for 40min, taking out the materials, putting the materials into drying equipment for drying, stretching and pressing the materials into a film after drying, soaking the film in ethanol solution for 40min, irradiating the film for 40S by using an ultraviolet high-pressure mercury lamp after the completion, and finally obtaining a base material for later use;
s2, preparation of composition A: sequentially putting 6 parts of sulfur, 7 parts of epoxy resin, 7 parts of graphene powder, 11 parts of butyl rubber and 4 parts of dispersing agent into a reaction kettle, heating the internal temperature of the reaction kettle to 90 ℃ for dissolving, standing in the reaction kettle after dissolving, cooling to 30 ℃ to obtain a composition A, and waiting for later use;
s3, preparation of composition B: sequentially putting 11 parts of acrylic acid oil glue, 3 parts of red pigment, 6 parts of organic solvent and 7 parts of stabilizer into a stirring kettle, dispersing at a high speed for 50min, controlling the temperature at 78 ℃ to fully and uniformly disperse the materials, standing the materials and the inside of the reaction kettle after dispersion, cooling the materials to 30 ℃ to obtain a composition B, and waiting for standby;
s4, preparing a high-temperature-resistant adhesive: placing the composition A in the S2 and the composition B in the S3 into a reaction kettle for high-temperature smelting, controlling the smelting temperature at 260 ℃, and obtaining the high-temperature-resistant adhesive after the smelting is finished;
s5, preparing the high-temperature polymer adhesive tape: unreeling the base material prepared in the step S1 again, coating the adhesive prepared in the step S4 on one surface of the base material through gluing equipment, then putting the base material into drying equipment, drying the base material at the temperature of 140 ℃, cooling the base material to room temperature, then attaching a release film to the other surface of the base material, and finally, packaging and forming the base material after slitting, checking and rolling.
EXAMPLE III
S1, selecting and preparing a high-molecular base material: putting 12 parts of high-molecular polyvinyl chloride, 5 parts of plasticizer, 10 parts of polyethyl acrylate, 9 parts of polybutyl acrylate and 5 parts of accelerator into a high-speed stirrer for stirring, stirring for 2 hours at the rotating speed of 2000r/min, heating the materials to 90 ℃ after uniform stirring, keeping the temperature for 45 minutes, taking out the materials, putting the materials into drying equipment for drying, stretching and pressing the materials into a film after drying, soaking the film in an ethanol solution for 45 minutes, irradiating the film for 40 seconds by using an ultraviolet high-pressure mercury lamp after the completion of the drying, and finally obtaining a base material for later use;
s2, preparation of composition A: sequentially placing 7 parts of sulfur, 8 parts of epoxy resin, 8 parts of graphene powder, 12 parts of butyl rubber and 5 parts of dispersing agent into a reaction kettle, heating the internal temperature of the reaction kettle to 100 ℃ for dissolving, standing in the reaction kettle after dissolving, cooling to 30 ℃ to obtain a composition A, and waiting for later use;
s3, preparation of composition B: sequentially putting 12 parts of acrylic acid oil glue, 4 parts of red pigment, 7 parts of organic solvent and 8 parts of stabilizer into a stirring kettle, dispersing at a high speed for 60min, controlling the temperature at 80 ℃ to fully and uniformly disperse the materials, standing the materials and the inside of the reaction kettle after dispersion, cooling the materials to 30 ℃ to obtain a composition B, and waiting for standby;
s4, preparing a high-temperature-resistant adhesive: placing the composition A in the S2 and the composition B in the S3 into a reaction kettle for high-temperature smelting, controlling the smelting temperature at 280 ℃, and obtaining the high-temperature-resistant adhesive after the smelting is finished;
s5, preparing the high-temperature polymer adhesive tape: unreeling the base material prepared in the step S1 again, coating one surface of the base material with the adhesive prepared in the step S4 through gluing equipment, then putting the base material into drying equipment, drying at the temperature of 150 ℃, cooling to room temperature, then attaching a release film to the other surface of the base material, and finally, packaging and forming after slitting, checking and rolling.
Comparative experiment
A certain tape production mechanism performs detection work on the high-temperature-resistant polymer tapes and the common tapes respectively manufactured in the embodiments 1, 2 and 3, and counts shrinkage rate, high temperature resistance and tensile strength data of the four groups of tapes simultaneously in the detection process.
As can be seen from fig. 2, the high temperature resistant polymer adhesive tape produced in example 2 of the present invention has the lowest shrinkage, the best high temperature resistance and the highest tensile strength among four comparative samples, so that the present invention adopts polymer polyvinyl chloride as a main material for preparing a base material, and also adopts a plasticizer as an auxiliary material to make the base material have high temperature irradiation resistance and environmental protection effects, the accelerator reduces the shrinkage and the thermal expansion coefficient of a rubber material, and simultaneously, the heat resistance and the durability of the adhesive tape are improved by adding sulfur and graphene powder into an adhesive, so that the adhesive tape does not fall off at a high temperature, and meanwhile, the adhesive tape has good tensile elasticity, the viscosity of the adhesive tape is also increased by adding polyethylacrylate and polybutylacrylate, so that the overall performance of the adhesive tape is greatly improved.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (5)

1. A manufacturing process of a red high-temperature-resistant polymer adhesive tape is characterized by comprising the following steps: the method specifically comprises the following steps:
s1, selecting and preparing a high-molecular base material: putting high molecular polyvinyl chloride, a plasticizer, polyethyl acrylate, polybutyl acrylate and an accelerator into a high-speed stirrer for stirring, stirring for 1.5-2h at the rotating speed of 2000r/min, heating the materials to 80-90 ℃ after uniform stirring, preserving heat for 30-45min, taking out the materials, putting the materials into drying equipment for drying, stretching and pressing the materials into a film after drying, soaking the film in an ethanol solution for 30-45min, irradiating the film for 40S by using an ultraviolet high-pressure mercury lamp after the soaking is finished, and finally obtaining a base material for later use;
s2, preparation of composition A: sequentially putting sulfur, epoxy resin, graphene powder, butyl rubber and a dispersing agent into a reaction kettle, heating the temperature inside the reaction kettle to 80-100 ℃ for dissolving, standing in the reaction kettle after dissolving, cooling to 30 ℃ to obtain a composition A, and waiting for later use;
s3, preparation of composition B: sequentially placing the propyl acid oil glue, the red pigment, the organic solvent and the stabilizer into a stirring kettle, dispersing at a high speed for 40-60min, controlling the temperature at 75-80 ℃ to fully and uniformly disperse the materials, standing the materials and the inside of the reaction kettle after dispersion, cooling the materials to 30 ℃ to obtain a composition B, and waiting for later use;
s4, preparing a high-temperature-resistant adhesive: placing the composition A in the S2 and the composition B in the S3 into a reaction kettle for high-temperature smelting, controlling the smelting temperature at 200-280 ℃, and obtaining the high-temperature-resistant adhesive after the smelting is finished;
s5, preparing the high-temperature polymer adhesive tape: unreeling the substrate prepared in the step S1 again, coating the adhesive prepared in the step S4 on one surface of the substrate through gluing equipment, then placing the substrate into drying equipment to be dried at the temperature of 120-150 ℃, cooling to room temperature, then attaching a release film to the other surface of the substrate, and finally packaging and forming after slitting, checking and rolling.
2. The manufacturing process of the red high-temperature-resistant polymer adhesive tape according to claim 1, characterized in that: the red high-temperature-resistant polymer adhesive tape comprises the following raw materials in parts by weight: 10-12 parts of high-molecular polyvinyl chloride, 3-5 parts of plasticizer, 8-10 parts of polyethyl acrylate, 7-9 parts of polybutyl acrylate, 25-35 parts of ethanol solution, 5-7 parts of sulfur, 3-5 parts of accelerator, 6-8 parts of epoxy resin, 6-8 parts of graphene powder, 10-12 parts of butyl rubber, 10-12 parts of acrylic acid oil glue, 2-4 parts of red pigment, 3-5 parts of dispersant, 5-7 parts of organic solvent and 6-8 parts of stabilizer.
3. The manufacturing process of the red high-temperature-resistant polymer adhesive tape according to claim 1, characterized in that: the organic solvent in the step S3 is one of amyl acetate, ethyl acetate, chloroform, diethyl ether and lauric acid, and the dispersant in the step S3 is polyvinyl alcohol.
4. The manufacturing process of the red high-temperature-resistant polymer adhesive tape according to claim 1, characterized in that: the smelting time in the step S4 is 4 h.
5. The manufacturing process of the red high-temperature-resistant polymer adhesive tape according to claim 1, characterized in that: the plasticizer in the step S1 is one or more of dibutyl phthalate, di-sec-octyl phthalate and diisodecyl phthalate.
CN202010500868.3A 2020-06-04 2020-06-04 Manufacturing process of red high-temperature-resistant polymer adhesive tape Pending CN111621238A (en)

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Application publication date: 20200904