CN111621146B - Low-water-absorption polyamide material and preparation method thereof - Google Patents
Low-water-absorption polyamide material and preparation method thereof Download PDFInfo
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- CN111621146B CN111621146B CN202010624136.5A CN202010624136A CN111621146B CN 111621146 B CN111621146 B CN 111621146B CN 202010624136 A CN202010624136 A CN 202010624136A CN 111621146 B CN111621146 B CN 111621146B
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- 239000000463 material Substances 0.000 title claims abstract description 46
- 238000010521 absorption reaction Methods 0.000 title claims abstract description 39
- 239000004952 Polyamide Substances 0.000 title claims abstract description 31
- 229920002647 polyamide Polymers 0.000 title claims abstract description 31
- 238000002360 preparation method Methods 0.000 title claims abstract description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 37
- 229920005989 resin Polymers 0.000 claims abstract description 30
- 239000011347 resin Substances 0.000 claims abstract description 30
- -1 alkyl phenol-formaldehyde Chemical compound 0.000 claims abstract description 24
- 229920006122 polyamide resin Polymers 0.000 claims abstract description 18
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 13
- 239000000314 lubricant Substances 0.000 claims abstract description 9
- 230000000087 stabilizing effect Effects 0.000 claims abstract description 9
- 239000000654 additive Substances 0.000 claims abstract description 8
- 230000000996 additive effect Effects 0.000 claims abstract description 8
- 229920002545 silicone oil Polymers 0.000 claims abstract description 8
- 229920002292 Nylon 6 Polymers 0.000 claims description 15
- 229920002302 Nylon 6,6 Polymers 0.000 claims description 12
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 claims description 8
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 7
- 239000004698 Polyethylene Substances 0.000 claims description 6
- 238000002156 mixing Methods 0.000 claims description 6
- 229920000573 polyethylene Polymers 0.000 claims description 6
- 229920002943 EPDM rubber Polymers 0.000 claims description 4
- 239000004743 Polypropylene Substances 0.000 claims description 4
- 239000003963 antioxidant agent Substances 0.000 claims description 4
- 230000003078 antioxidant effect Effects 0.000 claims description 4
- 229920001577 copolymer Polymers 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 4
- 238000001125 extrusion Methods 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 229920001155 polypropylene Polymers 0.000 claims description 4
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- 239000004953 Aliphatic polyamide Substances 0.000 claims description 2
- 101100501135 Escherichia coli O157:H7 ehaG gene Proteins 0.000 claims description 2
- OKOBUGCCXMIKDM-UHFFFAOYSA-N Irganox 1098 Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)NCCCCCCNC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 OKOBUGCCXMIKDM-UHFFFAOYSA-N 0.000 claims description 2
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 claims description 2
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 claims description 2
- 229920003231 aliphatic polyamide Polymers 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 claims description 2
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical class OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims 2
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 claims 1
- 239000008116 calcium stearate Substances 0.000 claims 1
- 235000013539 calcium stearate Nutrition 0.000 claims 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000002861 polymer material Substances 0.000 abstract description 2
- 230000000052 comparative effect Effects 0.000 description 13
- 125000004029 hydroxymethyl group Chemical group [H]OC([H])([H])* 0.000 description 9
- 125000003368 amide group Chemical group 0.000 description 7
- MCPSMQGVSYDFLC-UHFFFAOYSA-N formaldehyde;2-octylphenol Chemical compound O=C.CCCCCCCCC1=CC=CC=C1O MCPSMQGVSYDFLC-UHFFFAOYSA-N 0.000 description 4
- 229920003986 novolac Polymers 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 239000000945 filler Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- DUIOKRXOKLLURE-UHFFFAOYSA-N 2-octylphenol Chemical compound CCCCCCCCC1=CC=CC=C1O DUIOKRXOKLLURE-UHFFFAOYSA-N 0.000 description 1
- LBBOQIHGWMYDPM-UHFFFAOYSA-N 2-tert-butylphenol;formaldehyde Chemical compound O=C.CC(C)(C)C1=CC=CC=C1O LBBOQIHGWMYDPM-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- UTGQNNCQYDRXCH-UHFFFAOYSA-N N,N'-diphenyl-1,4-phenylenediamine Chemical compound C=1C=C(NC=2C=CC=CC=2)C=CC=1NC1=CC=CC=C1 UTGQNNCQYDRXCH-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 125000004018 acid anhydride group Chemical group 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 229920003233 aromatic nylon Polymers 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006664 bond formation reaction Methods 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 125000002843 carboxylic acid group Chemical group 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229910052901 montmorillonite Inorganic materials 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001470 polyketone Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
Abstract
The invention relates to a polyamide material with low water absorption and a preparation method thereof, belonging to the technical field of high polymer materials. The material comprises the following components in parts by weight: 94-98 parts of polyamide resin, 1-3 parts of graft, 1-3 parts of alkyl phenol-formaldehyde vulcanized resin, 0.5-0.8 part of heat stabilizing additive, 0.3-0.8 part of processing lubricant and 0.03-0.05 part of silicone oil. The addition of a certain amount of alkyl phenol-formaldehyde vulcanized resin and grafts into the polyamide resin can effectively reduce the water absorption rate of the finally prepared polyamide material, solve the problems of poor dimensional stability, mechanical property, electrical property and the like of the polyamide material caused by hygroscopicity, and have the advantages of less addition, high efficiency, low cost, no influence on the material property and the like. The preparation method of the material is simple, easy to operate, low in equipment requirement and suitable for expanded production.
Description
Technical Field
The invention belongs to the technical field of high polymer materials, and particularly relates to a low-water-absorption polyamide material and a preparation method thereof.
Background
Polyamide 6 (PA 6) and polyamide 66 (PA 66) have become one of the most widely used engineering plastics due to their excellent combination properties, and are widely used in the fields of automobiles, aerospace, general machinery, electronics, electrical appliances, instruments, household appliances, office appliances, and the like. However, in the later use process of the PA6 and PA66 products, the-NHCO-group in the molecular chain has stronger polarity, so that hydrogen bonds are easily formed with water molecules in the environment, the product has larger water absorption rate increase, and the size stability, mechanical property and electrical property of the PA6 and PA66 products are poor, so that the use of the products is affected.
In order to reduce the water absorption of PA6, PA66, researchers have proposed various solutions, mainly the following three methods: 1. fillers (glass fiber, talcum powder, montmorillonite, wollastonite and the like) are added, and the water absorption rate is reduced by reducing the content of PA6 and PA66 in the composite material; 2. adding low water absorption materials (polyolefin, polyketone, aromatic nylon, PPS, PPO and the like), and reducing the water absorption by adding the low water absorption materials and the forms of PA6 and PA66 alloy; 3. the water absorption is reduced by adding a low water absorption auxiliary agent (monomer reactive with amide groups, acid anhydride groups, carboxylic acid groups, grafts reactive with amide groups, wax playing a barrier role, silicone, etc.), by reducing the hydrogen bond formation of amide with water and shielding water from contact with amide groups. Although the method can reduce the water absorption of the PA6 and the PA66, the method has the problems of large addition amount of filler and low water absorption material, limited efficiency, influence on the whole material performance, high cost, color and the like, and limits the application range of the PA6 and the PA66.
Disclosure of Invention
Accordingly, it is an object of the present invention to provide a low water absorption polyamide material; and the second aim is to provide a preparation method of the polyamide material with low water absorption rate.
In order to achieve the above purpose, the present invention provides the following technical solutions:
1. a low water absorption polyamide material comprising the following components in parts by weight: 94-98 parts of polyamide resin, 1-3 parts of graft, 1-3 parts of alkyl phenol-formaldehyde vulcanized resin, 0.5-0.8 part of heat stabilizing additive, 0.3-0.8 part of processing lubricant and 0.03-0.05 part of silicone oil.
Preferably, the polyamide resin is an aliphatic polyamide resin.
Preferably, the polyamide resin is one or more of polyamide 6 (PA 6) or polyamide 66 (PA 66).
Preferably, the graft is one or more of ethylene-octene copolymer grafted maleic anhydride (POE-g-MAH), ethylene-octene copolymer grafted glycidyl methacrylate (POE-g-GMA), ethylene-propylene-diene rubber grafted maleic anhydride (EPDM-g-MAH), ethylene-propylene-diene rubber grafted glycidyl methacrylate (EPDM-g-GMA), polyethylene grafted maleic anhydride (PE-g-MAH), polyethylene grafted glycidyl methacrylate (PE-g-GMA), polypropylene grafted maleic anhydride (PP-g-MAH) or polypropylene grafted glycidyl methacrylate (PP-g-GMA).
Preferably, the hydroxymethyl content of the alkyl phenol-formaldehyde vulcanized resin is 4-15%.
Preferably, the alkyl phenol-formaldehyde vulcanized resin is one of octyl phenol-formaldehyde vulcanized resin or tert-butyl phenol-formaldehyde vulcanized resin.
Preferably, the heat stabilizing auxiliary is one or more of antioxidant 1010, antioxidant 168, antioxidant 1098, antioxidant 1076, antioxidant H10 or antioxidant H161.
Preferably, the processing lubricant is one or more of polyethylene wax, silicone, hard zinc or hard calcium.
2. The preparation method of the low-water-absorption polyamide material comprises the following steps: the polyamide resin, the graft, the alkyl phenol-formaldehyde vulcanized resin, the heat stabilizing additive, the processing lubricant and the silicone oil are added into an extruder after being uniformly mixed, and the mixture is subjected to melting, blending, extrusion, drawing, granulating and drying.
Preferably, the extruder is a co-rotating twin screw extruder having an aspect ratio of 40.
Preferably, the thread combination of the co-rotating twin-screw extruder is as follows: 48×3, 32, 22×2, K48×30 °, 22, K32×45 °, K22×60 °, 22, K32×45 °, K22×60 °, 32, K32×90 °, 11L, 48×3, 32×2, 22×3, K32×45 °, K22×60 °, 22, K32×45 °, L, 22, K32×45 °, K22×60 °, 22, K32×90 °, 11L, 48×4, 32×4, 22×3, screw head.
Preferably, the temperature of each section of the extruder from the main feed inlet to the machine head is as follows: 50 ℃, 90-150 ℃, 220-270 ℃ and 230-270 ℃, 220-260 ℃.
Preferably, the rotating speed of the extruder is 250-300r/min.
The invention has the beneficial effects that: the invention provides a low-water-absorption polyamide material and a preparation method thereof, wherein a certain amount of alkyl phenolic aldehyde vulcanized resin and grafts are added into polyamide resin, so that the water absorption of the finally prepared polyamide material can be effectively reduced, the problems of poor dimensional stability, mechanical property, electrical property and the like of the polyamide material caused by hygroscopicity are solved, and the low-water-absorption polyamide material has the advantages of small addition amount, high efficiency, low cost, no influence on the material property and the like. Wherein, the hydroxymethyl and phenolic groups in the alkyl phenol-formaldehyde vulcanized resin can act preferentially to the amide groups in the polyamide resin and effectively reduce the formation of hydrogen bonds between the amide groups and water molecules, thereby reducing the water absorption rate of the finally prepared polyamide material. In addition, the addition of the graft can increase the compatibility of the alkyl phenol-formaldehyde vulcanized resin and the polyamide resin, so that on one hand, the contact between the hydroxymethyl and the phenolic groups in the alkyl phenol-formaldehyde vulcanized resin and the middle amide groups of the polyamide resin is increased, the hydroxymethyl and the phenolic groups in the alkyl phenol-formaldehyde vulcanized resin can act with the middle amide groups of the polyamide resin to the greatest extent, and the low water absorption rate of the finally prepared polyamide material is further ensured; on the other hand, the alkyl phenol-formaldehyde vulcanized resin is uniformly dispersed in the polyamide resin, so that the mechanical property of the finally prepared polyamide material can be ensured. The preparation method of the material is simple, easy to operate, low in equipment requirement and suitable for expanded production.
Additional advantages, objects, and features of the invention will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from practice of the invention. The objects and other advantages of the invention may be realized and obtained by means of the instrumentalities and combinations particularly pointed out in the specification.
Detailed Description
Other advantages and effects of the present invention will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present invention with reference to specific examples. The invention may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present invention.
Example 1
The low water absorption polyamide material comprises the following components in parts by weight: 96 parts of PA6, 2 parts of POE-g-MAH, 2 parts of octyl phenol-formaldehyde vulcanized resin with 10 percent of hydroxymethyl content, 0.4 part of antioxidant H, 0.5 part of silicone and 0.03 part of silicone oil.
Example 2
The difference from example 1 is that 98 parts of PA6, 1 part of POE-g-MAH and 1 part of octyl phenol-formaldehyde vulcanized resin with 10 percent of hydroxymethyl content.
Example 3
The difference from example 1 is that 94 parts of PA6, 3 parts of POE-g-MAH and 3 parts of octyl phenol-formaldehyde-curing resin with a hydroxymethyl content of 10%.
Example 4
The difference from example 1 is that POE-g-MAH is replaced by EPDM-g-MAH.
Example 5
The difference from example 2 is that POE-g-MAH is replaced by EPDM-g-MAH.
Example 6
The difference from example 3 is that POE-g-MAH is replaced by EPDM-g-MAH.
Examples 7 to 12
PA6 was replaced with PA66 in each of examples 1 to 6.
Comparative example 1
The difference from example 1 is that the octylphenol vulcanizing resin is replaced with a novolac resin.
Comparative example 2
The difference from example 1 is that PA6 98 parts, octyl phenol resin 0 parts with 10% hydroxymethyl content.
Comparative example 3
The difference from example 7 is that the octylphenol vulcanizing resin is replaced with a novolac resin.
Comparative example 4
The difference from example 7 is that 98 parts of PA66 and 0 part of octyl phenol-formaldehyde vulcanized resin with 10 percent of hydroxymethyl content.
The low water absorption polyamide materials of examples 1 to 6 and the polyamide materials of comparative examples 1 to 2 were each prepared as follows: uniformly stirring and mixing polyamide resin, grafts, alkyl phenolic vulcanized resin, a heat stabilizing additive, a processing lubricant and silicone oil, adding into a homodromous double-screw extruder with the length-diameter ratio (L/D) of 40, and carrying out melting, blending, extrusion, drawing, granulating and drying, wherein the screw combination of the extruder is as follows: 48×3, 32, 22×2, K48×30 °, 22, K32×45 °, K22×60 °, 22, K32×45 °, K22×60 °, 32, K32×90 °, 11L, 48×3, 32×2, 22×3, K32×45 °, K22×60 °, 22, K32×45 ° L, 22, K32×45 °, K22×60 °, 22, K32×90 °, 11L, 48×4, 32×4, 22×3, screw head; the temperature of each section of the extruder from the main feed inlet to the machine head is as follows: 50 ℃, 90 ℃, 220 ℃, 230 ℃, 220 ℃ and the rotating speed of the extruder is 300r/min.
The low water absorption polyamide materials of examples 7 to 12 and the polyamide materials of comparative examples 3 to 4 were each prepared as follows: uniformly stirring and mixing polyamide resin, grafts, alkyl phenolic vulcanized resin, a heat stabilizing additive, a processing lubricant and silicone oil, adding into a homodromous double-screw extruder with the length-diameter ratio (L/D) of 40, and carrying out melting, blending, extrusion, drawing, granulating and drying, wherein the screw combination of the extruder is as follows: 48×3, 32, 22×2, K48×30 °, 22, K32×45 °, K22×60 °, 22, K32×45 °, K22×60 °, 32, K32×90 °, 11L, 48×3, 32×2, 22×3, K32×45 °, K22×60 °, 22, K32×45 ° L, 22, K32×45 °, K22×60 °, 22, K32×90 °, 11L, 48×4, 32×4, 22×3, screw head; the temperature of each section of the extruder from the main feed inlet to the machine head is as follows: 50 ℃, 150 ℃, 260 ℃, 250 ℃ and the rotating speed of the extruder is 300r/min.
The low water absorption polyamide materials of examples 1 to 12 and the polyamide materials of comparative examples 1 to 4 were tested for tensile strength, impact strength, notched impact strength, flexural modulus, heat distortion temperature, density and water absorption, and the test results are shown in Table 1.
TABLE 1
As can be seen from table 1, the materials of examples 1 to 6 and examples 7 to 12 all had lower water absorption after the addition of the alkylphenol-type vulcanizing resin.
The water absorption of the materials of comparative example 1, comparative example 1 and comparative example 2 was found to be lower after the addition of the alkylphenol-based vulcanizing resin to the material of example 1 than that of the material of both the novolac resin and the non-novolac resin, and likewise, the water absorption of the materials of comparative example 7, comparative example 3 and comparative example 4 was found to be lower after the addition of the alkylphenol-based vulcanizing resin to the material of example 7.
Finally, it is noted that the above embodiments are only for illustrating the technical solution of the present invention and not for limiting the same, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications and equivalents may be made thereto without departing from the spirit and scope of the present invention, which is intended to be covered by the claims of the present invention.
Claims (9)
1. A low water absorption polyamide material, characterized in that it comprises the following components in parts by weight: 94-98 parts of polyamide resin, 1-3 parts of graft, 1-3 parts of alkyl phenol-formaldehyde vulcanized resin, 0.5-0.8 part of heat stabilizing additive, 0.3-0.8 part of processing lubricant and 0.03-0.05 part of silicone oil;
the processing lubricant is one or more of polyethylene wax, silicone, zinc stearate or calcium stearate.
2. A low water absorption polyamide material according to claim 1 wherein said polyamide resin is an aliphatic polyamide resin.
3. A low water absorption polyamide material according to claim 2 wherein said polyamide resin is one or more of polyamide 6 or polyamide 66.
4. The low water absorption polyamide material of claim 1 wherein the grafts are one or more of ethylene-octene copolymer grafted maleic anhydride, ethylene-octene copolymer grafted glycidyl methacrylate, ethylene-propylene-diene monomer grafted maleic anhydride, ethylene-propylene-diene monomer grafted glycidyl methacrylate, polyethylene grafted maleic anhydride, polyethylene grafted glycidyl methacrylate, polypropylene grafted maleic anhydride, or polypropylene grafted glycidyl methacrylate.
5. A low water absorption polyamide material according to claim 1 wherein said alkylphenol-phenolic-cured resin has a methylol content of 4-15%.
6. The low water absorption polyamide material of claim 1 wherein the heat stabilizing additive is one or more of antioxidant 1010, antioxidant 168, antioxidant 1098, antioxidant 1076, antioxidant H10 or antioxidant H161.
7. A process for the preparation of a low water absorption polyamide material according to any one of claims 1 to 6, characterized in that it comprises the following steps: the polyamide resin, the graft, the alkyl phenol-formaldehyde vulcanized resin, the heat stabilizing additive, the processing lubricant and the silicone oil are added into an extruder after being uniformly mixed, and the mixture is subjected to melting, blending, extrusion, drawing, granulating and drying.
8. The method of claim 7, wherein the extruder has a temperature of each section from the main feed port to the head of: 50 ℃, 90-150 ℃, 220-270 ℃ and 230-270 ℃, 220-260 ℃.
9. The method of claim 7, wherein the extruder is rotated at a speed of 250-300r/min.
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| CN202010624136.5A CN111621146B (en) | 2020-06-30 | 2020-06-30 | Low-water-absorption polyamide material and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US4845162A (en) * | 1987-06-01 | 1989-07-04 | Allied-Signal Inc. | Curable phenolic and polyamide blends |
| JPH1121448A (en) * | 1997-06-30 | 1999-01-26 | Kishimoto Sangyo Kk | Low moisture-absorptive, superhigh-impact polyamide composition |
| WO2009069725A1 (en) * | 2007-11-30 | 2009-06-04 | Toray Industries, Inc. | Polyamide resin composition and molded article |
| CN101429333A (en) * | 2008-12-02 | 2009-05-13 | 汤阴县超贝工程设备有限公司 | Method for producing rare earth oil-containing alloy-nylon composite material |
| FR2958652B1 (en) * | 2010-04-13 | 2013-09-06 | Rhodia Operations | THERMOPLASTIC COMPOSITION BASED ON POLYAMIDE AND POLYCETONE. |
| CN102040830B (en) * | 2010-12-20 | 2014-04-30 | 金发科技股份有限公司 | Polyamide composition and preparation method thereof |
| CN102863786A (en) * | 2012-09-13 | 2013-01-09 | 江苏安格特新材料科技有限公司 | Low-water-absorption reinforced polyamide compound and preparation method thereof |
| KR101769264B1 (en) * | 2014-06-10 | 2017-08-17 | 셍기 테크놀로지 코. 엘티디. | Halogen-free resin composition, and prepreg and laminated board for printed circuit using same |
| CN105331053B (en) * | 2014-07-22 | 2017-12-05 | 广东生益科技股份有限公司 | A kind of halogen-free resin composition and use its prepreg and laminate for printed circuits |
| CN105367914A (en) * | 2015-11-24 | 2016-03-02 | 安徽都邦电器有限公司 | High-strength anti-aging ethylene propylene diene monomer rubber pipe |
| CN105778487A (en) * | 2016-05-11 | 2016-07-20 | 合肥工业大学 | High-toughness and high-strength PA6/EPDM-g-MAH alloy and preparation method thereof |
| CA3052838A1 (en) * | 2017-02-28 | 2018-09-07 | SUMITOMO CHEMICAL ADVANCED TECHNOLOGIES LLC, d.b.a. SUMIKA ELECTRONIC MATERIALS | Novolac resins and use in rubber compositions |
| CN109722014A (en) * | 2018-12-17 | 2019-05-07 | 会通新材料股份有限公司 | A kind of ultra-toughness low-temperature impact-resistant polyamide material and preparation method thereof |
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