CN111615289A - Water-cooled pressurizing and flow-equalizing heat dissipation system for cabinet - Google Patents
Water-cooled pressurizing and flow-equalizing heat dissipation system for cabinet Download PDFInfo
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- CN111615289A CN111615289A CN201910133664.8A CN201910133664A CN111615289A CN 111615289 A CN111615289 A CN 111615289A CN 201910133664 A CN201910133664 A CN 201910133664A CN 111615289 A CN111615289 A CN 111615289A
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- water
- flow
- heat dissipation
- pipe
- cabinet
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a water-cooled pressurizing and flow-equalizing heat dissipation system for a cabinet, which is used for dissipating heat of a plurality of servers in the cabinet, wherein the servers are sequentially arranged in the cabinet in an arrangement direction; the system comprises a water tank with a diversion delivery pipe, a plurality of diversion modules respectively corresponding to each server and a confluence delivery pipe; each flow distribution module corresponds to each server and is provided with a flow distribution pump and at least one water cooling head which is positioned in the corresponding server, the flow distribution pump of each flow distribution module is respectively communicated between the flow distribution conveying pipe and the water cooling head of the flow distribution module, and the water cooling heads of each flow distribution module are respectively communicated on the confluence conveying pipe according to the arrangement direction.
Description
Technical Field
The present invention relates to a heat dissipation system for a server, and more particularly, to a water-cooled pressurized flow-equalizing heat dissipation system for a rack.
Background
At present, the conventional water-cooling heat dissipation system applied to cabinets such as servers and the like mainly injects working fluid in a water tank into water-cooling heads corresponding to heat sources in different servers respectively in a shunting manner and the like through a master cylinder. Thus, although the effect of water cooling can be achieved, when the working fluid is communicated through the pipeline, the flow of the working fluid is often influenced by the length of the pipeline; for example, when the distance of the pipeline is longer, the flow rate is relatively reduced.
However, inevitably, each server in the rack is usually disposed in the vertical direction, so the distance between the uppermost or lowermost servers is also the longest, and therefore, the connection through the water cooling pipeline inevitably causes the two farthest servers to have different flow rates, and the heat dissipation or cooling effect is uneven. If the minimum heat dissipation or cooling effect is to be satisfied, the power of the pump needs to be increased, which may cause an increase in energy cost and waste.
Disclosure of Invention
The invention mainly aims to provide a water-cooled pressurized flow equalizing heat dissipation system with a flow dividing design for a cabinet.
In order to achieve the above object, the present invention provides a water-cooled pressurized flow-equalizing heat dissipation system for a rack, for providing heat dissipation for a plurality of servers in the rack, wherein the plurality of servers are sequentially arranged in the rack in an arrangement direction, the system comprising: a water tank having a diversion delivery pipe; the plurality of flow distribution modules respectively correspond to each server, each flow distribution module is provided with a flow distribution pump and at least one water cooling head positioned in the corresponding server, and the flow distribution pump of each flow distribution module is respectively communicated between the flow distribution conveying pipe and the water cooling head; the confluence conveying pipe is used for respectively communicating the water cooling heads of the shunting modules with the confluence conveying pipe according to the arrangement direction; and a main pump for driving the working fluid in the water tank to flow to the diversion delivery pipe.
Optionally, the end of the confluence conveying pipe is communicated with a cooling device.
Optionally, the cooling device is a circulation line connected to the water tank.
Optionally, the number of the water cooling heads of each flow splitting module is multiple.
Optionally, the split-flow pump of each split-flow module is respectively communicated with the plurality of water cooling heads by splitting.
Another objective of the present invention is to provide a water-cooled pressurized flow-equalizing heat dissipation system for a cabinet, wherein after flow equalization, each pump does not need to drive a larger flow of working fluid, so that pumps with smaller power can be used to reduce the cost and energy consumption.
In order to achieve the above object, the present invention further provides a water-cooled pressurized flow-equalizing heat dissipation system for a rack, which is used to communicate with a plurality of the water-cooled flow-equalizing heat dissipation systems, and further comprises another flow-dividing duct, another flow-merging duct, and a plurality of flow-dividing modules in expanded communication between the another flow-dividing duct and the another flow-merging duct, wherein the flow-merging duct is communicated to the another flow-dividing duct.
Optionally, the end of the other confluence conveying pipe is communicated with a cooling device.
Optionally, the cooling device is a circulation line connected to the water tank.
Optionally, the number of the water cooling heads of each flow splitting module is multiple.
Optionally, the split-flow pump of each split-flow module is respectively communicated with the plurality of water cooling heads by splitting.
The invention relates to a water-cooled pressurizing and flow-equalizing heat dissipation system for a cabinet, which achieves the aim and effect of flow equalization by the design of flow distribution corresponding to the number of servers.
Drawings
Fig. 1 is a perspective view of a cabinet according to the present invention.
Fig. 2 is a schematic plan view of a first embodiment of the present invention.
Fig. 3 is a schematic plan view of a second embodiment of the present invention.
Fig. 4 is a schematic plan view of a third embodiment of the present invention.
Fig. 5 is a schematic plan view of a fourth embodiment of the present invention.
In the figure:
a water tank 1; shunt ducts 10, 10'; a main pump 11; a shunting module 2, 2'; a splitter pump 20, 20';
a cabinet 5; servers 50, 50'.
Detailed Description
The present invention is further described with reference to the following drawings and specific examples so that those skilled in the art can better understand the present invention and can practice the present invention, but the examples are not intended to limit the present invention.
Fig. 1 and fig. 2 are a schematic perspective view of a cabinet according to the present invention and a schematic plan view of a first embodiment of the present invention. The invention provides a water-cooled pressurizing and flow-equalizing heat dissipation system for a cabinet, which is used for dissipating heat of a plurality of servers 50 in a cabinet 5, wherein the servers 50 are sequentially arranged in the cabinet 5 in an arrangement direction F; the arrangement direction F is generally an up-down or vertical direction; the water-cooled flow equalizing and heat dissipating system comprises a water tank 1, a plurality of shunting modules 2 and a confluence conveying pipe 3; wherein:
the water tank 1 may be disposed outside the cabinet 1, and a working fluid, such as water, for dissipating heat or cooling is mainly loaded therein. The outside of the water tank 1 is communicated with a diversion delivery pipe 10, and the working fluid in the water tank 1 can be delivered to each server 50 on the cabinet 5 through the diversion delivery pipe 10, so as to help the heat source in the server 50 to dissipate heat.
The plurality of flow splitting modules 2 respectively correspond to the servers 50 and each have a flow splitting pump 20 and at least one water cooling head 21 located in the corresponding server 50, and the flow splitting pump 20 of each flow splitting module 2 is respectively communicated between the flow splitting conveying pipe 10 and the water cooling head 21 thereof. As shown in fig. 2, in the present embodiment, each server 50 corresponds to at least one water cooling head 21, and after the water cooling head 21 is communicated with the diversion pump 20, the water tank 1 can divert the conveying pipe 10 to allow the working fluid to flow therein, so as to achieve the purpose of helping the heat source in the server 50 to dissipate heat.
The confluence conveying pipe 3 can be disposed outside each server 50, and the water cooling heads 21 of the shunting modules 2 are respectively communicated with the confluence conveying pipe according to the arrangement direction F. Accordingly, each flow splitting module 2 has a flow splitting pump 20 corresponding to each server 50 of the cabinet 5, so that the water cooling heads 21 located in each server 50 can obtain more even flow splitting in the transmission power of the working fluid; and working fluid of the water cooling heads 21 of the shunting modules 2 is collected by the confluence conveying pipes 3 which are arranged in an extending manner along the arrangement direction F so as to stabilize the flow and the flow velocity, thereby achieving good effects of flow equalization, heat dissipation and cooling.
In addition, the present invention can further use the end of the confluence delivering pipe 3 to communicate with a cooling device 4, the cooling device 4 is used to cool the working fluid confluent into the confluence delivering pipe 3, and further can make the working fluid be recycled through a circulating pipeline 40 communicated to the water tank 1.
Through the structure composition, the water-cooled pressurizing and flow-equalizing heat dissipation system for the cabinet can be obtained.
In addition, as shown in fig. 3, it is a schematic plan view of a second embodiment of the present invention. The present invention can also connect the servers 50, 50' in the cabinets 1 in series to form a cooling loop. In the cabinet 1 of the first embodiment, the converging duct 3 is communicated with another distribution duct 10 ', and the expanded servers 50' provided by the distribution modules 2 'are further cooled or dissipated by the another distribution duct 10'; similarly, each flow splitting module 2 ' also has a flow splitting pump 20 ' and at least one water cooling head 21 ' located in the corresponding server 50 ', and is communicated with the flow splitting pump by a converging duct 3 ', and then working fluid is collected to the cooling device 4 and passes through the circulating pipeline 40, so that the working fluid can be recycled.
As also shown in fig. 4, a schematic plan view of a third embodiment of the present invention is shown. In other embodiments of the present invention, the diversion pumps 20 of each diversion module 2 may correspond to an appropriate number of heat sources or servers 50; for example, the flow dividing pump 20 of each flow dividing module 2 is connected to a plurality of water cooling heads 21a and 21b by flow division, so that each water cooling head 21a and 21b can correspond to a plurality of heat sources or servers 50. Therefore, each split flow module 2 is not limited to a single water head 21, nor is a single split flow pump 20 capable of corresponding to only one water head 21, without affecting the flow rate and flow velocity. The split-flow pump 20 of each split-flow module 2 can still correspond to multiple water cooling heads 21a, 21b, so that multiple water cooling heads 21a, 21b can correspond to multiple heat sources or servers 50.
Fig. 5 is a schematic plan view of a fourth embodiment of the present invention. The present invention can also further drive the working fluid in the main pump 11 to flow to the diversion delivery pipe 10, so as to deliver the working fluid to each server 50 on the cabinet 5, thereby helping the heat source in the server 50 to dissipate heat.
The above-mentioned embodiments are merely preferred embodiments for fully illustrating the present invention, and the scope of the present invention is not limited thereto. The equivalent substitution or change made by the technical personnel in the technical field on the basis of the invention is all within the protection scope of the invention. The protection scope of the invention is subject to the claims.
Claims (10)
1. The utility model provides a water-cooled pressurization cooling system that flow equalizes for in the rack for a plurality of servers provide the heat dissipation in for the rack, and these a plurality of servers in the rack according to a row direction sets gradually, its characterized in that includes:
a water tank having a diversion delivery pipe;
the plurality of flow distribution modules respectively correspond to each server, each flow distribution module is provided with a flow distribution pump and at least one water cooling head positioned in the corresponding server, and the flow distribution pump of each flow distribution module is respectively communicated between the flow distribution conveying pipe and the water cooling head;
the confluence conveying pipe is used for respectively communicating the water cooling heads of the shunting modules with the confluence conveying pipe according to the arrangement direction; and
and the main pump drives the working fluid in the water tank to flow to the diversion delivery pipe.
2. The water-cooled pressurized flow-equalizing heat dissipation system for cabinets of claim 1, wherein the end of the confluence delivering pipe is connected to a cooling device.
3. The water-cooled pressurized flow-equalizing heat dissipating system for a cabinet of claim 2, wherein the cooling device is connected to the water tank through a circulation pipe.
4. The water-cooled pressurized flow-equalizing heat dissipation system for a cabinet according to claim 1, wherein the number of the water-cooled heads of each of the flow-splitting modules is plural.
5. The water-cooled pressurized flow-equalizing heat dissipation system for a cabinet according to claim 4, wherein the flow-dividing pump of each flow-dividing module is connected to the plurality of water-cooling heads by flow-dividing.
6. The water-cooled pressurized current-sharing heat dissipation system for cabinets of claim 1, wherein at least one of the water-cooled pressurized current-sharing heat dissipation systems for cabinets is sequentially connected to the system, and comprises another shunting pipe, another converging pipe, and a plurality of shunting modules in amplified communication between the another shunting pipe and the another converging pipe; wherein the confluence conveying pipe is communicated with the other shunting conveying pipe.
7. The water-cooled pressurized flow-equalizing heat dissipating system for a cabinet of claim 6, wherein the other end of the confluence delivering pipe is connected to a cooling device.
8. The water-cooled pressurized flow-equalizing heat dissipating system for a cabinet of claim 7, wherein the cooling device is connected to the water tank through a circulation pipe.
9. The water-cooled pressurized flow-equalizing heat dissipation system for a cabinet according to claim 6, wherein the number of the water-cooled heads of each of the flow-splitting modules is plural.
10. The water-cooled pressurized flow-equalizing heat dissipation system for a cabinet according to claim 9, wherein the split pump of each split module is connected to the plurality of water cooling heads by splitting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910133664.8A CN111615289A (en) | 2019-02-22 | 2019-02-22 | Water-cooled pressurizing and flow-equalizing heat dissipation system for cabinet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910133664.8A CN111615289A (en) | 2019-02-22 | 2019-02-22 | Water-cooled pressurizing and flow-equalizing heat dissipation system for cabinet |
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| Publication Number | Publication Date |
|---|---|
| CN111615289A true CN111615289A (en) | 2020-09-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910133664.8A Pending CN111615289A (en) | 2019-02-22 | 2019-02-22 | Water-cooled pressurizing and flow-equalizing heat dissipation system for cabinet |
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| CN (1) | CN111615289A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113710068A (en) * | 2021-09-01 | 2021-11-26 | 房盼盼 | Novel capillary cooling net |
| CN113966152A (en) * | 2021-10-29 | 2022-01-21 | 中国电子科技集团公司第二十九研究所 | Three-dimensional shunting device and method for modular mixed liquid cooling rack |
| TWI756925B (en) * | 2020-11-18 | 2022-03-01 | 緯創資通股份有限公司 | Coolant distribution device and electronic apparatus having the same |
| EP4152906A1 (en) * | 2022-08-25 | 2023-03-22 | Ovh | Cooling assembly and method for cooling a plurality of heat-generating components |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1521591A (en) * | 2003-02-14 | 2004-08-18 | 株式会社日立制作所 | Rack-mount server system, its cooling system, rack cabinet and server assembly |
| US20110240281A1 (en) * | 2010-03-31 | 2011-10-06 | Industrial Idea Partners, Inc. | Liquid-Based Cooling System For Data Centers Having Proportional Flow Control Device |
| US10201116B1 (en) * | 2013-12-02 | 2019-02-05 | Amazon Technologies, Inc. | Cooling system for data center rack |
| CN209930785U (en) * | 2019-02-22 | 2020-01-10 | 迈萪科技股份有限公司 | Water-cooled pressurizing and flow-equalizing heat dissipation system for cabinet |
-
2019
- 2019-02-22 CN CN201910133664.8A patent/CN111615289A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1521591A (en) * | 2003-02-14 | 2004-08-18 | 株式会社日立制作所 | Rack-mount server system, its cooling system, rack cabinet and server assembly |
| US20110240281A1 (en) * | 2010-03-31 | 2011-10-06 | Industrial Idea Partners, Inc. | Liquid-Based Cooling System For Data Centers Having Proportional Flow Control Device |
| US10201116B1 (en) * | 2013-12-02 | 2019-02-05 | Amazon Technologies, Inc. | Cooling system for data center rack |
| CN209930785U (en) * | 2019-02-22 | 2020-01-10 | 迈萪科技股份有限公司 | Water-cooled pressurizing and flow-equalizing heat dissipation system for cabinet |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI756925B (en) * | 2020-11-18 | 2022-03-01 | 緯創資通股份有限公司 | Coolant distribution device and electronic apparatus having the same |
| CN113710068A (en) * | 2021-09-01 | 2021-11-26 | 房盼盼 | Novel capillary cooling net |
| CN113966152A (en) * | 2021-10-29 | 2022-01-21 | 中国电子科技集团公司第二十九研究所 | Three-dimensional shunting device and method for modular mixed liquid cooling rack |
| EP4152906A1 (en) * | 2022-08-25 | 2023-03-22 | Ovh | Cooling assembly and method for cooling a plurality of heat-generating components |
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Application publication date: 20200901 |