CN111615267A - Preparation method for preparing biodegradable electronic device by printed electronic technology - Google Patents
Preparation method for preparing biodegradable electronic device by printed electronic technology Download PDFInfo
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- CN111615267A CN111615267A CN202010426641.9A CN202010426641A CN111615267A CN 111615267 A CN111615267 A CN 111615267A CN 202010426641 A CN202010426641 A CN 202010426641A CN 111615267 A CN111615267 A CN 111615267A
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- 238000005516 engineering process Methods 0.000 title claims abstract description 25
- 238000002360 preparation method Methods 0.000 title claims abstract description 16
- 238000007639 printing Methods 0.000 claims abstract description 39
- 238000000034 method Methods 0.000 claims abstract description 33
- 239000002105 nanoparticle Substances 0.000 claims abstract description 22
- 239000012776 electronic material Substances 0.000 claims abstract description 20
- 239000000463 material Substances 0.000 claims abstract description 15
- 239000004020 conductor Substances 0.000 claims abstract description 12
- 239000004065 semiconductor Substances 0.000 claims abstract description 12
- 239000012212 insulator Substances 0.000 claims abstract description 9
- 239000002135 nanosheet Substances 0.000 claims abstract description 9
- 239000002070 nanowire Substances 0.000 claims abstract description 9
- 239000006185 dispersion Substances 0.000 claims abstract description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 21
- 229910052725 zinc Inorganic materials 0.000 claims description 20
- 239000011701 zinc Substances 0.000 claims description 20
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 18
- 239000010703 silicon Substances 0.000 claims description 18
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 17
- 239000003960 organic solvent Substances 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 13
- 239000000243 solution Substances 0.000 claims description 10
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 9
- 238000007650 screen-printing Methods 0.000 claims description 9
- 239000005543 nano-size silicon particle Substances 0.000 claims description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 238000000498 ball milling Methods 0.000 claims description 6
- 239000002994 raw material Substances 0.000 claims description 6
- 238000000015 thermotherapy Methods 0.000 claims description 6
- 238000002604 ultrasonography Methods 0.000 claims description 4
- 108010022355 Fibroins Proteins 0.000 claims description 3
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- 229910000577 Silicon-germanium Inorganic materials 0.000 claims description 3
- DPXJVFZANSGRMM-UHFFFAOYSA-N acetic acid;2,3,4,5,6-pentahydroxyhexanal;sodium Chemical compound [Na].CC(O)=O.OCC(O)C(O)C(O)C(O)C=O DPXJVFZANSGRMM-UHFFFAOYSA-N 0.000 claims description 3
- 239000001768 carboxy methyl cellulose Substances 0.000 claims description 3
- 229910052681 coesite Inorganic materials 0.000 claims description 3
- 229920001577 copolymer Polymers 0.000 claims description 3
- 229910052906 cristobalite Inorganic materials 0.000 claims description 3
- 229910052732 germanium Inorganic materials 0.000 claims description 3
- 238000007646 gravure printing Methods 0.000 claims description 3
- 238000007641 inkjet printing Methods 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 229910052749 magnesium Inorganic materials 0.000 claims description 3
- 238000003760 magnetic stirring Methods 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000011259 mixed solution Substances 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 229910052750 molybdenum Inorganic materials 0.000 claims description 3
- 229920001606 poly(lactic acid-co-glycolic acid) Polymers 0.000 claims description 3
- 239000004626 polylactic acid Substances 0.000 claims description 3
- 230000008569 process Effects 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 235000019812 sodium carboxymethyl cellulose Nutrition 0.000 claims description 3
- 229920001027 sodium carboxymethylcellulose Polymers 0.000 claims description 3
- 229910052682 stishovite Inorganic materials 0.000 claims description 3
- 238000004448 titration Methods 0.000 claims description 3
- 229910052905 tridymite Inorganic materials 0.000 claims description 3
- 229910052721 tungsten Inorganic materials 0.000 claims description 3
- 239000003990 capacitor Substances 0.000 claims description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims description 2
- 235000012239 silicon dioxide Nutrition 0.000 claims description 2
- 238000002560 therapeutic procedure Methods 0.000 claims description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc oxide Inorganic materials [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 2
- 239000002904 solvent Substances 0.000 claims 1
- 239000002086 nanomaterial Substances 0.000 abstract description 3
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- 238000001704 evaporation Methods 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
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- 238000000059 patterning Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 230000007281 self degradation Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/04—Printing inks based on proteins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
- C09D11/104—Polyesters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
Abstract
The invention discloses a preparation method for preparing a biodegradable electronic device by a printed electronic technology, and belongs to the technical field of preparation of engineering materials, printed electronic materials, biodegradable electronic devices and flexible electronic devices. The method relates to the dispersion of traditional biodegradable nano materials (including conductors, semiconductors, insulators and the like), such as nano particles, nano wires, nano sheets and the like, in biodegradable organic polymer materials to form functional printing ink applicable to printing electronic technology, and is particularly suitable for the preparation of low-cost and large-scale biodegradable electronic device systems.
Description
Technical Field
The invention discloses a preparation method for preparing a biodegradable electronic device by a printed electronic technology, and belongs to the technical field of engineering materials, printed electronic materials, biodegradable electronic devices and flexible electronic preparation.
Background
In recent years, biodegradable electronic devices and systems have attracted much attention due to their characteristics of being pollution-free and degradable. Unlike the long term, stable requirements of traditional silicon-based microelectronics, biodegradable electronics are capable of self-degradation after they have performed their intended function. Biodegradable electronic devices have the advantage of being unique in biomedical devices, particularly implantable electronic devices. After the implant is implanted into a living body and the functions of detection, treatment and the like of the living body are completed, the electronic device can be automatically degraded without taking out the electronic device by a secondary operation, so that the pain, the operation risk, the medical cost and the like of a patient are greatly reduced. In the aspect of environmental protection, the biodegradable electronic device does not need additional tissues or personnel to carry out independent degradation treatment on the biodegradable electronic device, and the protection of ecological environment is facilitated.
At present, the preparation technology for realizing the biodegradable electronic device and system is mainly based on the traditional silicon-based microelectronic preparation process, and relates to the process steps of material patterning, dry/wet etching, material evaporation and the like, and finally the prepared device or circuit is transferred to a degradable substrate. Although the methods have relatively high maturity, the methods still have the problems of high equipment cost, complex and tedious process steps and the like. Therefore, how to prepare biodegradable electronic devices with low cost and high efficiency is the key for further development. Printed electronics is a currently available solution for the fabrication of functional electronic devices and circuits, and is primarily based on fast, efficient, and low cost printing techniques to directly form conductive circuits or patterns on a substrate. In theory, any existing functional electronic circuit or system can be implemented using printed electronics. In view of the above, how to prepare biodegradable electronic devices and systems by using mature printed electronic technology becomes necessary.
Disclosure of Invention
In light of the above technical background, the present invention aims to provide a method for preparing a biodegradable electronic device by printed electronics technology, wherein a functional printing ink applicable to printed electronics technology is formed by dispersing traditional biodegradable nano materials (including conductors, semiconductors, insulators, etc.), such as nanoparticles, nanowires, nanosheets, etc., in a biodegradable organic polymer material, and is particularly suitable for preparing a low-cost and large-scale biodegradable electronic device system.
In order to achieve the above objects and other related objects, the present invention provides a method for manufacturing a biodegradable electronic device by printed electronics, the method comprising the steps of:
s1, providing a biodegradable electronic material, wherein the electronic material comprises a semiconductor, a conductor, an insulator and the like; providing an organic solvent, wherein the organic solvent is a biodegradable material;
s2, dispersing the biodegradable electronic material in a biodegradable organic solvent to form uniform and stable printing ink;
and S3, preparing the biodegradable electronic element or system by utilizing the printing electronic technology and combining the printing ink.
Alternatively,
s11, selecting the silicon nanoparticles as biodegradable semiconductor raw materials, and obtaining the silicon nanoparticles in a silicon wafer ball milling mode, wherein the size of the nanoparticles is controlled to be about 100 nm;
s12, selecting zinc nanoparticles as a biodegradable conductor raw material, and obtaining the zinc nanoparticles in a silicon wafer ball milling mode, wherein the size of the zinc nanoparticles is controlled to be about 100 nm.
S21, mixing the silicon nanoparticles and the zinc nanoparticles in a ratio of 1: 4, respectively dispersing the mixture in ethanol and methanol solution, and treating the mixed solution for ten minutes by using high-power ultrasound;
and S22, selecting sodium carboxymethyl cellulose as a biodegradable substrate, and obtaining the biodegradable substrate by a titration curing mode.
S31, printing a thin layer of silicon on the biodegradable substrate as a resistance element by using a screen printing technology;
s32, printing a thin zinc seat conductive electrode or interconnection line at two ends of the silicon resistor element obtained in the step 5 by using screen printing metal;
s33, integrating the biodegradable thermal therapy device consisting of the heating module of the silicon resistor element and the lead part of the zinc thin layer on the biodegradable flexible substrate in a two-part printing mode;
s34: and (4) improving the electrical conductivity of the heating element and the electronic lead obtained in the steps S31-S32 through heating treatment, so that the preparation of the biodegradable thermotherapy device is completed.
Optionally, the biodegradable conductor material includes Zn, Mg, Fe, W, Mo, but is not limited to the above.
Optionally, the biodegradable semiconductor material includes Si, Ge, SiGe, ZnO, but is not limited to the above.
Optionally, the biodegradable insulator material includes SiO2, Si3N4, MgO, but is not limited to the above.
Optionally, the biodegradable electronic material has a structural form of nanoparticles, nanowires or nanosheets.
Optionally, the biodegradable organic solvent material includes fibroin solution, lactic acid-glycolic acid copolymer (PLGA) solution, polylactic acid (PLA), but is not limited to the above.
Optionally, the dispersion method employs a high power ultrasonic or magnetic stirring system.
Alternatively, the viscosity coefficient of the printing ink may be controlled by adjusting the ratio of the organic solvent to the electronic material, thereby being respectively suitable for an inkjet printing technique, a screen printing technique, a gravure printing technique, and the like.
Optionally, the biological teaching electronic device or system includes a single element such as a transistor, a memristor, a diode, a resistor, an inductor, a capacitor, or an integrated system composed of the above elements, but is not limited to the above.
As described above, the present invention provides a method for manufacturing a biodegradable electronic device by printed electronics. The invention has the following advantages and prominent technical effects: the biodegradable electronic material is selected and uniformly and stably dispersed in an organic solvent to form printing ink, and the biodegradable electronic device and the system are prepared by combining the printing electronic technology. The invention avoids the complex process steps of photoetching, dry/wet etching, material evaporation and the like adopted in the prior art when preparing the biodegradable electronic device, adopts the mode of printing one by one and printing layer by layer, greatly reduces the preparation cost of the biodegradable electronic device, simplifies the process steps and improves the preparation efficiency.
Drawings
Fig. 1 shows a schematic diagram of the steps for preparing a biodegradable electronic device by the printed electronic technology of the present invention.
Detailed Description
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.
It should be noted that the present embodiment provides only a specific step of preparing the biodegradable thermotherapy device to illustrate the basic idea of the present invention, and only the relevant contents related to the present embodiment are shown in the step. In practice, the printing ink material, the device structure layout, the size and the like can be changed as required, and the layout of the components can be more complicated.
Fig. 1 shows a method for manufacturing a biodegradable electronic device by printed electronics, comprising at least the following steps: 1) providing a biodegradable electronic material, wherein the biodegradable electronic material mainly comprises a conductor, a semiconductor and an insulator; the structure of the biodegradable electronic material mainly comprises nano particles, nano wires and nano sheets; 2) dispersing the biodegradable electronic material in an organic solvent to form functional printing ink for printing electronic technology, wherein the organic solvent has biodegradable characteristics; 3) the biodegradable electronic device is prepared by using the printing ink and combining a printing electronic technology.
Optionally, the degradable conductor comprises Zn, Mg, Fe, W, Mo.
Optionally, the degradable semiconductor comprises Si, Ge, SiGe, ZnO-.
Optionally, the degradable insulator comprises SiO2、Si3N4、MgO。
Optionally, the nanoparticle has a particle size in the range of 10-500 nm.
Optionally, the length of the nanowire ranges from 10 nm to 1000 nm; the diameter range of the nanowire is 10-1000 nm.
Optionally, the size range of the nano-sheet is 10-10000 nm; the thickness range of the nano-sheet is 10-100 nm.
The above-described materials are dispersed in an organic solvent.
Optionally, the organic solvent is a biodegradable material.
Optionally, the dispersion method is performed substantially in a high power ultrasound system or a magnetic stirring system.
Optionally, the biodegradable organic solvent includes fibroin solution, lactic acid-glycolic acid copolymer (PLGA) solution, and polylactic acid (PLA).
The process flow diagram of the method of the invention comprises the following steps:
1) silicon nanoparticles are selected as biodegradable semiconductor raw materials and can be obtained by ball milling a silicon wafer, and the size of the nanoparticles is controlled to be about 100 nm;
2) the zinc nanoparticles are selected as biodegradable conductor raw materials and can be obtained by ball milling a silicon wafer, and the size of the nanoparticles is controlled to be about 100 nm;
3) mixing the silicon nanoparticles and the zinc nanoparticles in a ratio of 1: 4, respectively dispersing the mixture in ethanol and methanol solution, and treating the mixed solution for ten minutes by using high-power ultrasound;
4) sodium carboxymethylcellulose is selected as a biodegradable substrate and can be obtained by a titration curing mode;
5) printing a thin layer of silicon on the biodegradable substrate as a resistance element by using a screen printing technology, wherein the size and the thickness of the resistance element can be controlled randomly according to requirements;
6) printing a thin zinc seat conductive electrode or interconnection line on two ends of the silicon resistor element obtained in the step 5 by utilizing screen printing metal;
7) the biodegradable thermotherapy device composed of the heating module of the silicon resistor element and the lead part of the zinc thin layer is integrated on the biodegradable flexible substrate in a two-part printing mode;
8) and (4) improving the electrical conductivity of the heating element and the electronic lead obtained in the step (5-6) by heating treatment, so that the preparation of the biodegradable thermotherapy device is completed.
It should be noted that, for convenience in this embodiment, the biodegradable electronic material and device are prepared by taking the printing ink based on silicon and zinc nanoparticles and the biodegradable thermotherapy device as an example, but other biodegradable electronic materials and devices facing printed electronics technology are also within the scope of the present invention.
In summary, the method for preparing the biodegradable electronic material and the device facing the printed electronic technology of the present invention comprises dispersing the biodegradable functional nano-material in the biodegradable organic solvent in a uniform and stable manner to form the functional printing ink comprising a conductor, a semiconductor and an insulator; then, the biodegradable electronic components or the electronic circuits formed by the electronic components are prepared by utilizing the printing electronic technology, including ink-jet printing, silk-screen printing, gravure printing and the like, in a mode of printing one by one and printing layer by layer. The invention utilizes the advantages of simplicity, high efficiency, low cost and the like of the printing electronic technology, combines the printing ink based on the biodegradable electronic material, greatly reduces the complexity of the preparation of the biodegradable electronic component or the electronic circuit, and reduces the process cost. Therefore, the invention effectively overcomes various defects in the prior art and has high industrial utilization value.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (10)
1. A method for preparing a biodegradable electronic device by printed electronics technology, characterized by comprising at least the following steps: s1, providing a biodegradable electronic material, wherein the biodegradable electronic material mainly comprises a conductor, a semiconductor and an insulator; the structure of the biodegradable electronic material mainly comprises nano particles, nano wires and nano sheets;
s2, dispersing the biodegradable electronic material in an organic solvent to form the functional printing ink for the printing electronic technology, wherein the organic solvent has biodegradable characteristics;
and S3, preparing the biodegradable electronic device by using the printing ink and combining with a printing electronic technology.
2. The process of the preparation method according to claim 1, characterized in that:
s11, selecting the silicon nanoparticles as biodegradable semiconductor raw materials, and obtaining the silicon nanoparticles in a silicon wafer ball milling mode, wherein the size of the nanoparticles is controlled to be about 100 nm;
s12, selecting zinc nanoparticles as a biodegradable conductor raw material, and obtaining the zinc nanoparticles in a silicon wafer ball milling mode, wherein the size of the zinc nanoparticles is controlled to be about 100 nm.
3. The method of claim 1, wherein:
s21, mixing the silicon nanoparticles and the zinc nanoparticles in a ratio of 1: 4, respectively dispersing the mixture in ethanol and methanol solution, and treating the mixed solution for ten minutes by using high-power ultrasound;
and S22, selecting sodium carboxymethyl cellulose as a biodegradable substrate, and obtaining the biodegradable substrate by a titration curing mode.
4. The method of claim 1, wherein:
s31, printing a thin layer of silicon on the biodegradable substrate as a resistance element by using a screen printing technology;
s32, printing a thin zinc seat conductive electrode or interconnection line at two ends of the silicon resistor element obtained in the step 5 by using screen printing metal;
s33, integrating the biodegradable thermal therapy device consisting of the heating module of the silicon resistor element and the lead part of the zinc thin layer on the biodegradable flexible substrate in a two-part printing mode;
s34: and (4) improving the electrical conductivity of the heating element and the electronic lead obtained in the steps S31-S32 through heating treatment, so that the preparation of the biodegradable thermotherapy device is completed.
5. The method of claim 1, wherein: the viscosity coefficient of the printing ink can be adjusted by adjusting the ratio of the solute to the solvent, and the printing ink can be respectively suitable for ink-jet printing, silk-screen printing and gravure printing technologies; the biodegradable electronic device comprises single elements such as a transistor, a memristor, a diode, a resistor, an inductor, a capacitor and the like, or an integrated system formed by the elements.
6. The method of claim 1, wherein: the degradable conductor comprises Zn, Mg, Fe, W and Mo, the degradable semiconductor comprises Si, Ge, SiGe and ZnO, and the degradable insulator comprises SiO2, Si3N4 and MgO.
7. The method of claim 1, wherein: the particle size range of the nano particles is 10-500 nm.
8. The method of claim 1, wherein: the length range of the nanowire is 10-1000 nm; the diameter range of the nano-wire is 10-1000 nm, and the size range of the nano-sheet is 10-10000 nm; the thickness range of the nano-sheet is 10-100 nm.
9. The method of claim 1, wherein: dispersing the material according to any one of claims 2 to 7 in an organic solvent.
10. The method of claim 8, wherein: the organic solvent is a biodegradable material; the dispersion method is fully carried out in a high-power ultrasonic system or a magnetic stirring system; the biodegradable organic solvent comprises fibroin solution, lactic acid-glycolic acid copolymer (PLGA) solution and polylactic acid (PLA).
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| JP2005254773A (en) * | 2004-03-15 | 2005-09-22 | Tdk Corp | Thermal head and its manufacturing method |
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