CN111611698B - Ultra-thin body heat transfer simulation method - Google Patents
Ultra-thin body heat transfer simulation method Download PDFInfo
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- CN111611698B CN111611698B CN202010403640.2A CN202010403640A CN111611698B CN 111611698 B CN111611698 B CN 111611698B CN 202010403640 A CN202010403640 A CN 202010403640A CN 111611698 B CN111611698 B CN 111611698B
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- G06F30/20—Design optimisation, verification or simulation
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- G06F2119/08—Thermal analysis or thermal optimisation
Abstract
The invention discloses an ultrathin body heat transfer simulation method, which comprises the steps of firstly respectively establishing geometric models of an ultrathin body, a heat transfer carrier and a cooling medium, secondly discretizing a calculation region of the geometric models, importing the discretized calculation region into numerical simulation software, and carrying out boundary condition setting, physical property parameter setting and numerical iteration calculation in the numerical simulation software; and finally obtaining a three-dimensional temperature field distribution diagram of the ultrathin body. The method is suitable for simulating the coupling heat transfer simulation among the ultrathin body, the heat transfer carrier and the cooling medium, greatly reduces the number of grids in the whole calculation area by thickening the ultrathin body, simplifies the model during simulation, improves the calculation efficiency, can quickly simulate the three-dimensional temperature field distribution of the ultrathin body, and can accurately acquire the microcosmic information distribution characteristics of the ultrathin body, the heat transfer carrier and the cooling medium in the three-dimensional simulation.
Description
Technical Field
The invention belongs to the technical field of heat transfer simulation, and particularly relates to a heat transfer simulation method for an ultrathin body.
Background
With the increasing development of computer simulation technology, more and more researches tend to quantitatively explore the coupled flow heat transfer problem by a numerical method. For the problem of heat transfer simulation of the ultrathin body, due to the fact that the length-width ratio of the ultrathin body is too large, the number of grids is huge when a real geometric model 1:1 is used for modeling, and numerical calculation is seriously influenced. Taking the cast film industry as an example, the film thickness is in the micron level, if a real geometric model is adopted, the length, width and thickness of the cast film are respectively as follows: 4.4m 6.6m 10e-6m, if 5 cells are divided in the thickness direction and the aspect ratio is not more than 20, the number of cells of this film alone can be calculated as:
the number of the grids is only the number of the films, the magnitude of the number of the grids reaches billions, and in addition, the number of the grids is increased by ten times or one hundred times on the basis, and the grids cannot be divided at all and cannot be subjected to numerical calculation.
In order to avoid the problems caused by the huge number of grids, researchers do not need to carry out simulation research on the ultrathin body when studying the flowing heat transfer of the ultrathin body, or carry out certain simplified processing, such as converting a transient problem into a steady state for simulation, converting a real three-dimensional geometric model into a two-dimensional or even one-dimensional problem for simulation, applying a one-dimensional or two-dimensional simulation result of the ultrathin body as a boundary condition to the three-dimensional model and then carrying out three-dimensional simulation and the like.
Disclosure of Invention
The invention aims to provide a heat transfer simulation method for an ultrathin body, which can quickly simulate the three-dimensional temperature field distribution of the ultrathin body and can accurately acquire the microcosmic information distribution characteristics of the ultrathin body in three-dimensional simulation.
In order to achieve the purpose, the technical scheme of the invention is as follows: a heat transfer simulation method for an ultrathin body is characterized by comprising the following steps: the method comprises the following steps: s1: respectively establishing geometric models of the ultrathin body, the heat transfer carrier and the cooling medium, wherein the thickness of the ultrathin body is increased by P times, P is more than or equal to 10, and other dimensions are modeled according to the proportion of 1:1; modeling the heat transfer carrier and the cooling medium according to the proportion of 1:1; the cooling medium and the ultrathin body are respectively positioned at two sides of the heat transfer carrier;
s2: respectively carrying out calculation area discretization on the geometric models of the ultrathin body, the heat transfer carrier and the cooling medium;
s3: importing the scattered calculation region into numerical simulation software, and performing boundary condition setting, physical property parameter setting and numerical iteration calculation in the numerical simulation software; wherein the boundary conditions include thermal boundary conditions, coupling heat transfer boundary conditions, and inlet and outlet boundary conditions; setting physical parameters including density, heat conductivity and specific heat; for the heat conductivity coefficient of the ultrathin body, the heat conductivity lambda 1 of the ultrathin body along the thickness direction, and the heat conductivity lambda 2 of the ultrathin body along other directions, wherein lambda 1/lambda 2 is more than or equal to 10; the specific heat of the ultrathin body is one N times of the real specific heat; or the density is one N times of the actual density;
when the ultrathin body is a cuboid, N = P;
when the ultrathin body is a circular cylinder, if the outer diameter is increased by P times from R1 to R2, i.e., P = (R2-R)/(R1-R), then
Wherein R is the inner diameter of the annular ultrathin body, R1 is the outer diameter of the real geometric model, and R2 is the outer diameter after thickening;
s4: after the numerical simulation software is calculated, three-dimensional temperature field distribution patterns and heat exchange quantity information of the ultrathin body, the heat transfer carrier and the cooling medium are obtained.
Further, when the ultrathin body is of a cuboid structure, the heat transfer carrier is a heat transfer pipeline with a rectangular cross section. When the ultrathin body is of a circular cylinder structure, the heat transfer carrier comprises two layers of concentric circular cylinders, and the two layers of circular cylinders are connected through guide vanes; the guide vane is a straight guide vane or a spiral guide vane.
Further, the numerical simulation software is one of ANSYS, ABAQUS, STAR-CCM and OPENFOAM simulation software.
The invention has the beneficial effects that: the method is suitable for simulating the coupling heat transfer simulation among the ultrathin body, the heat transfer carrier and the cooling medium, greatly reduces the number of grids in the whole calculation area by thickening the ultrathin body, simplifies the model during simulation, improves the calculation efficiency, can quickly simulate the three-dimensional temperature field distribution of the ultrathin body, and can accurately acquire the microcosmic information distribution characteristics of the ultrathin body, the heat transfer carrier and the cooling medium in the three-dimensional simulation.
The invention is suitable for heat transfer simulation of ultrathin bodies made of plastic films, steel, aluminum, alloys and other materials.
Description of the drawings:
the invention is further described in detail below with reference to the accompanying drawings.
FIG. 1 is a schematic diagram of a simulation flow;
FIG. 2 is a schematic diagram of heat transfer of an ultrathin body with a circular cylindrical structure;
FIG. 3 is a schematic diagram of heat transfer of an ultrathin body with a cuboid structure;
FIG. 4 is a schematic diagram of temperature distribution of a simulation result of a circular cylinder structure.
In the figure: 1. an ultra-thin body; 2. a heat transfer carrier; 3. a cooling medium.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be further described in detail with reference to the accompanying fig. 1-2 and the embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
As shown in FIG. 1, the heat transfer simulation method for the ultrathin body of the invention comprises the following steps:
s1: respectively establishing geometric models of the ultrathin body, the heat transfer carrier and the cooling medium, wherein the thickness of the ultrathin body is increased by P times, P is larger than or equal to 10, for example, the thickness of the real ultrathin body is 1mm, and the geometric modeling thickness can be 10mm; other dimensions were modeled at the scale of 1:1. The heat transfer carrier and cooling medium were modeled at the ratio 1:1.
The ultrathin body means that the ratio of the longest side line to the shortest side line (thickness) of the ultrathin body is more than 10, wherein when the ultrathin body is rectangular, the longest side line is the length; when the ultrathin body is a circular cylinder, the longest side line is the outer circumference line or the axial length, and the largest of the two dimensions is taken as the longest side line. The cooling medium refers to fluid medium, such as water, air and the like, and flows in the heat transfer carrier to realize heat transfer. The cooling medium and the ultrathin body are respectively arranged at two sides of the heat transfer carrier, and the ultrathin body realizes heat transfer with the cooling medium through the heat transfer carrier.
S2: and respectively carrying out calculation area discretization on the geometric models of the ultrathin body, the heat transfer carrier and the cooling medium. Specifically, grid division forms such as tetrahedral grids, hexahedral grids, mixed grids and the like are adopted.
S3: importing the discretized calculation area into numerical simulation software, and performing boundary condition setting, physical property parameter setting and numerical iteration calculation in the numerical simulation software; wherein the boundary conditions include thermal boundary conditions, coupling heat transfer boundary conditions, and inlet and outlet boundary conditions; setting physical parameters including density, heat conductivity and specific heat; for the heat conductivity coefficient of the ultrathin body, the heat conductivity lambda 1 of the ultrathin body along the thickness direction, and the heat conductivity lambda 2 of the ultrathin body along other directions, wherein lambda 1/lambda 2 is more than or equal to 10; the specific heat of the ultrathin body is one N times of the actual specific heat, or the density is one N times of the actual density.
Specifically, the ultrathin body 1 may be a rectangular parallelepiped structure, a circular cylinder structure, or other thin body structures, and the rectangular parallelepiped structure and the circular cylinder structure are respectively described below.
As shown in fig. 2, when the ultra-thin body 1 is a rectangular parallelepiped structure, the heat transfer carrier 2 is a heat transfer pipe with a rectangular cross section, the cooling medium 3 is a fluid in the heat transfer pipe, and the cooling medium 3 and the ultra-thin body are respectively disposed on the inner side and the outer side of the heat transfer carrier. By the formula: calculating heat transfer by Q = C M Δ T = C ρ V Δ T, wherein Q-heat transfer, C-specific heat, M-mass, Δ T-temperature difference, ρ -density, and V-volume; the thickness of the ultrathin body is increased by P times, the volume is also increased by N times, and the specific heat in the simulation is one N times of the real specific heat (N = P).
As shown in fig. 3, when the ultrathin body 1 is a circular cylinder, the heat transfer carrier 2 includes two layers of concentric circular cylinders, specifically, an inner circular cylinder 21 and an outer circular cylinder 22, the inner circular cylinder 21 and the outer circular cylinder 22 are connected by a guide vane 23, and the cooling medium 3 is a fluid flowing between the two layers of concentric circular cylinders along the guide vane 23. Specifically, the guide vane 23 may be a straight guide vane, a spiral guide vane, or another guide vane.
Also according to the formula: q = C M Δ T = C ρ V Δ T, and the heat transfer amount was calculated, thereby obtaining an ultrathin bodyThe thickness of the heat pipe is increased by P times, the volume is also increased by N times, and the specific heat in simulation is one N times of the real specific heat. Specifically, if the outer diameter of the ultrathin body of the circular cylinder is from R 1 Increased by P times to become R 2 Volume magnification in simulation
In the formula, R is the inner diameter of the annular ultrathin body, R1 is the outer diameter of the real geometric model, and R2 is the outer diameter after thickening treatment.
Further, the numerical simulation software is one of ANSYS, ABAQUS, STAR-CCM and OPENFOAM numerical simulation software.
S4: and obtaining the distribution diagram of the ultrathin three-dimensional temperature field after the numerical simulation software is used for calculation.
Finally, it should be noted that the above-mentioned contents are only used for illustrating the patent technical solutions of the present invention, and not for limiting the protection scope of the patent of the present invention, and that a person skilled in the art can make simple modifications or equivalent substitutions to the technical solutions of the present invention without departing from the spirit and scope of the patent technical solutions of the present invention.
Claims (5)
1. A heat transfer simulation method for an ultrathin body is characterized by comprising the following steps: the method comprises the following steps:
s1: respectively establishing geometric models of the ultrathin body, the heat transfer carrier and the cooling medium, wherein the thickness of the ultrathin body is increased by P times, P is more than or equal to 10, and other dimensions are modeled according to the proportion of 1:1; modeling the heat transfer carrier and the cooling medium according to the proportion of 1:1; the cooling medium and the ultrathin body are respectively positioned at two sides of the heat transfer carrier;
s2: respectively carrying out calculation area discretization on the geometric models of the ultrathin body, the heat transfer carrier and the cooling medium;
s3: importing the scattered calculation region into numerical simulation software, and performing boundary condition setting, physical property parameter setting and numerical iteration calculation in the numerical simulation software;
wherein the boundary conditions include thermal boundary conditions, coupling heat transfer boundary conditions, and inlet and outlet boundary conditions; setting physical parameters including density, heat conductivity and specific heat; for the heat conductivity coefficient of the ultrathin body, the heat conductivity lambda 1 of the ultrathin body along the thickness direction, and the heat conductivity lambda 2 of the ultrathin body along other directions, wherein lambda 1/lambda 2 is more than or equal to 10; the specific heat of the ultrathin body is one N times of the real specific heat; or the density is one N times of the actual density;
when the ultrathin body is a cuboid, N = P;
when the ultrathin body is a circular cylinder, if the outer diameter is increased by P times from R1 to R2, i.e., P = (R2-R)/(R1-R), then
Wherein R is the inner diameter of the annular ultrathin body, R1 is the outer diameter of the real geometric model, and R2 is the outer diameter after thickening;
s4: after the numerical simulation software is calculated, the three-dimensional temperature field distribution diagram and the heat exchange amount information of the ultrathin body, the heat transfer carrier and the cooling medium are obtained.
2. The ultra-thin body heat transfer simulation method of claim 1, wherein: when the ultrathin body is of a cuboid structure, the heat transfer carrier is a heat transfer pipeline with a rectangular cross section.
3. The ultra-thin body heat transfer simulation method of claim 1, wherein: when the ultrathin body is of a circular cylinder structure, the heat transfer carrier comprises two layers of concentric circular cylinders, and the two layers of circular cylinders are connected through guide vanes.
4. The ultra-thin body heat transfer simulation method of claim 3, wherein: the guide vane is a straight guide vane or a spiral guide vane.
5. The ultra-thin body heat transfer simulation method of any of claims 1-4, wherein: the numerical simulation software is one of ANSYS, ABAQUS, STAR-CCM and OPENFOAM simulation software.
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| WO2017084105A1 (en) * | 2015-11-20 | 2017-05-26 | 田川 | System and method for numerical simulation of plasma discharges |
| CN110110479A (en) * | 2019-05-20 | 2019-08-09 | 合肥美的电冰箱有限公司 | Temperature Field Simulation method, terminal and the readable storage medium storing program for executing of refrigeration equipment |
| CN111079337A (en) * | 2019-12-23 | 2020-04-28 | 畔星科技(浙江)有限公司 | Multi-physical-field coupling simulation method for proton exchange membrane fuel cell |
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| WO2017084105A1 (en) * | 2015-11-20 | 2017-05-26 | 田川 | System and method for numerical simulation of plasma discharges |
| CN110110479A (en) * | 2019-05-20 | 2019-08-09 | 合肥美的电冰箱有限公司 | Temperature Field Simulation method, terminal and the readable storage medium storing program for executing of refrigeration equipment |
| CN111079337A (en) * | 2019-12-23 | 2020-04-28 | 畔星科技(浙江)有限公司 | Multi-physical-field coupling simulation method for proton exchange membrane fuel cell |
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