CN111604561A - Automatic solder coating device applied to cooler - Google Patents
Automatic solder coating device applied to cooler Download PDFInfo
- Publication number
- CN111604561A CN111604561A CN202010599391.9A CN202010599391A CN111604561A CN 111604561 A CN111604561 A CN 111604561A CN 202010599391 A CN202010599391 A CN 202010599391A CN 111604561 A CN111604561 A CN 111604561A
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- Prior art keywords
- solder
- plate
- cooler
- conveying
- spray gun
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
- B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
- B05B13/0221—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work characterised by the means for moving or conveying the objects or other work, e.g. conveyor belts
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B14/00—Arrangements for collecting, re-using or eliminating excess spraying material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
- B05B15/20—Arrangements for agitating the material to be sprayed, e.g. for stirring, mixing or homogenising
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B9/00—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour
- B05B9/01—Spray pistols, discharge devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Abstract
The invention provides an automatic solder coating device applied to a cooler, which relates to the field of cooler production and processing, and comprises a solder conveying device for automatically conveying solder, a solder spraying device for spraying the solder at fixed points and a cooler plate conveying belt for conveying cooler plates; the solder conveying device comprises a stirring motor, a solder storage bin and a solder conveying pipeline; the solder spraying device comprises a pressure spray gun which is fixedly arranged and is used for facing the upper surface of the cooler plate conveying belt; one end of the solder conveying pipeline is communicated with the solder storage bin, and the other end of the solder conveying pipeline is communicated with the pressure spray gun; the pressure spray gun automatically sprays the solder to the surface of the cooler plate under the pressure control. According to the automatic solder coating device, the cooler plate is coated with the solder in an automatic mode, and compared with a manual solder coating mode, the automatic solder coating device is high in coating efficiency, stable in coating quality, greatly reduced in labor cost and beneficial to guaranteeing of the yield of the welded finished product of the cooler.
Description
Technical Field
The invention relates to the technical field of cooler production and processing, in particular to an automatic solder coating device applied to a cooler.
Background
The oil cooler comprises an upper plate sheet, a lower plate sheet and fins, wherein the fins are of groove-shaped structures with concave-convex grains, and the upper plate sheet and the lower plate sheet are plate-shaped. In the process of actually processing and producing the cooler, the fins are arranged between the upper chip and the lower chip through a brazing process, and the fins or the plates are fully coated with the brazing material before brazing, so that the oil cooler after brazing has reliable sealing performance, and the cooling effect is prevented from being influenced by medium leakage during the operation of the cooler.
In the prior art, when a cooler is processed, the coating mode of the solder is as follows: workers manually apply cream solder to the convex parts of the fins one by using a painting tool or apply the cream solder to the upper chip and the lower chip, so that the convex parts of the plate surface of the fins can be fully contacted with the upper chip and the lower chip through the solder, and further brazing molding is facilitated. However, the manual solder coating method has problems of uneven coating and uncontrollable individual quality due to different individual techniques and forces of workers, which leads to a phenomenon of missing solder during later brazing, resulting in a decrease in yield of cooler molded products. On the other hand, the manual coating mode of workers causes the solder coating efficiency of the cooler to be low, and the labor cost generated by the manual coating mode is high, so that the economic benefit of enterprises is not benefited.
Disclosure of Invention
In view of the existing problems, the invention provides an automatic solder coating device applied to a cooler, which is used for coating solder on a plate (an upper plate and/or a lower plate) of the cooler through automatic coating equipment, and has stable coating quality and high coating efficiency.
In order to achieve the purpose, the technical scheme provided by the invention is as follows:
the invention provides an automatic solder coating device applied to a cooler, which comprises a machine base; the machine base is provided with a solder conveying device for automatically conveying solder, a solder spraying device for spraying the solder at fixed points and a cooler plate conveying belt for conveying cooler plates; the solder conveying device comprises a stirring motor, a solder storage bin and a solder conveying pipeline; the solder spraying device comprises a pressure spray gun; the pressure spray gun is fixedly arranged above the cooler plate conveyor belt, and a nozzle of the pressure spray gun is arranged towards the upper surface of the cooler plate conveyor belt; one end of the solder conveying pipeline is communicated with the solder storage bin, and the other end of the solder conveying pipeline is communicated with the pressure spray gun; the pressure spray gun is used for automatically spraying the solder to the surface of the cooler plate under the pressure control action.
The invention provides an automatic solder coating device applied to a cooler, which preferably comprises a spraying cabin in a bottomless cubic structure; the material spraying cabin is fixed on the base and is covered above the cooler plate conveying belt; the pressure spray gun is fixedly arranged in the material spraying cabin; a strip-shaped inlet and a strip-shaped outlet are respectively formed in the material spraying cabin along the conveying direction of the cooler plate conveying belt; the strip-shaped inlet and the strip-shaped outlet are in clearance fit with the cooler plate in the height direction.
The invention provides an automatic solder coating device applied to a cooler, which preferably further comprises a solder negative pressure pipeline and a first solder recovery container; a solder recovery pipe orifice is formed in the side wall of the material spraying cabin; one end of the solder negative pressure pipeline is communicated with the material spraying cabin through the solder recovery pipe orifice, and the other end of the solder negative pressure pipeline is communicated with the first solder recovery container; the first solder recovery container is arranged on the base.
The automatic solder coating device applied to the cooler provided by the invention preferably further comprises a vertical baffle plate; the vertical baffle is vertically and fixedly arranged in the material spraying cabin, and a distance gap for the cooler plate to pass through is formed between the bottom end face of the vertical baffle and the upper surface of the cooler plate conveying belt; the vertical baffle divides the material spraying cabin into a plate outlet chamber and a plate inlet chamber; the strip-shaped inlet is communicated with the strip-shaped outlet through the plate sheet inlet chamber and the plate sheet outlet chamber in sequence; the pressure spray gun is fixed on the wall surface of the vertical baffle plate positioned on one side of the plate sheet inlet chamber; the solder recovery pipe orifice is arranged on the side wall surface of the material spraying cabin positioned on one side of the plate feeding chamber.
The invention provides an automatic solder coating device applied to a cooler, preferably, the cooler plate conveying belt is an annular belt pulley; a scraping plate fixedly arranged below the cooler plate piece conveying belt and used for scraping solder and a second solder recovery container used for recovering the solder are arranged below the cooler plate piece conveying belt; the second solder recovery container is arranged on the stand; the top end face of the scraper abuts against the bottom surface of the cooler plate conveyor belt, and the bottom end face of the scraper is fixed in the second solder recovery container.
The invention provides an automatic solder coating device applied to a cooler, which is characterized in that a pressure regulating valve is preferably fixed on the side wall of a material spraying cabin; and the pressure regulating valve is connected with the pressure spray gun through a gas circuit.
The invention provides an automatic solder coating device applied to a cooler, preferably, the top wall of a material spraying cabin is provided with an observation window opening; a transparent observation window plate is movably arranged on the observation window opening; the transparent viewing window panel is openably and sealingly disposed over the viewing window opening.
The automatic solder coating device applied to the cooler provided by the invention preferably further comprises a plate positioning mechanism; the plate positioning mechanism comprises a first fixing plate and a second fixing plate which are respectively arranged at two sides of the inlet of the cooler plate conveying belt; a plurality of transverse screw rods are rotatably arranged between the first fixing plate and the second fixing plate; the plate surfaces of the first fixing plate and the second fixing plate extend towards the conveying direction of the cooler plate conveying belt; one end of the transverse screw rod penetrates through the first fixing plate, and the other end of the transverse screw rod penetrates through the second fixing plate; a plurality of positioning screw rod sections used for limiting cooler plates are arranged on the transverse screw rod; each positioning screw rod section comprises a positive thread rod body, a screw rod connector and a reverse thread rod body which are coaxially connected; the screw threads on the reverse-threaded rod body and the screw threads on the positive-threaded rod body are arranged on two sides of the screw rod connector in a mirror symmetry mode, and the center line of the screw rod connector is opposite to the center line of the pressure spray gun; the positioning screw rod section is also provided with a first vertical limiting plate and a second vertical limiting plate; the first vertical limiting plate is in threaded connection with the positive thread rod body, and the second vertical limiting plate is in threaded connection with the reverse thread rod body; the adjacent positioning screw rod sections are coaxially fixed through a coupler; the outer diameter of the coupler is larger than the inner diameters of the first vertical limiting plate and the second vertical limiting plate.
The invention provides an automatic solder coating device applied to a cooler, preferably, a square groove is arranged at the end part of a positive thread rod body; a first threaded hole is punched in the direction from the inner wall of the groove to the outer wall of the positive threaded rod body; a square bump is arranged at the end part of the reverse-thread rod body; a second threaded hole penetrates through the square bump; the cube groove of the positive thread rod body is in concave-convex fit with the cube bump of the negative thread rod body; when the positive threaded rod body is coaxially connected with the reverse threaded rod body, the cube groove can be in snap fit with the cube bump, and the first threaded hole and the second threaded hole can be in the same straight line; the lead screw connector is in a circular column shape; the screw rod connector is detachably sleeved at the buckling matching part of the positive thread rod body and the negative thread rod body; a third threaded hole penetrates through the side wall of the lead screw connector towards the center; when the cube groove is matched with the cube lug in a buckling mode, the internal threads of the first threaded hole, the second threaded hole and the third threaded hole can be coplanar.
According to the automatic solder coating device applied to the cooler, the surfaces of the first fixing plate, the second fixing plate, the first vertical limiting plate and the second vertical limiting plate are of square structures; through holes for rotatably fixing the transverse screw rods are formed in four corners of the first fixing plate and the second fixing plate; a chain wheel transmission mechanism is arranged on the second fixing plate, and a bearing is arranged at the penetrating and fixing position of the first fixing plate and the transverse screw rod; the chain wheel transmission mechanism comprises four chain wheels and chains in transmission connection with the four chain wheels; the four chain wheels are respectively and coaxially arranged at one ends of the four transverse screw rods; a rocker arm is arranged at the end part of one of the chain wheels; the centers of the surfaces of the first fixing plate, the second fixing plate, the first vertical limiting plate and the second vertical limiting plate are provided with a supporting polished rod in a penetrating mode in a collinear mode.
The technical scheme has the following advantages or beneficial effects:
the invention provides an automatic solder coating device applied to a cooler, which comprises a solder conveying device, a solder spraying device and a cooler plate conveying belt for conveying cooler plates, wherein the solder conveying device is used for conveying the cooler plates; the solder conveying device comprises a stirring motor, a solder storage bin for storing solder and a solder conveying pipeline; the solder spraying device comprises a pressure spray gun which is fixedly arranged and used for facing the upper surface of the plate conveying belt; one end of the solder conveying pipeline is communicated with the solder storage bin, and the other end of the solder conveying pipeline is communicated with the pressure spray gun; the pressure spray gun is used for automatically spraying the solder to the surface of the cooler plate under the pressure control. According to the automatic solder coating device, the plate of the cooler is coated with the solder in an automatic mode, and compared with a manual solder coating mode, the automatic solder coating device is high in coating efficiency, high in coating quality controllability, and less in solder waste, reduces the labor cost and the material cost generated in the coating process of the plate of the cooler, improves the production and processing efficiency of the cooler, and is beneficial to guaranteeing the yield of the welded finished product of the cooler.
Drawings
The invention and its features, aspects and advantages will become more apparent from reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings. Like reference symbols in the various drawings indicate like elements. The drawings are not necessarily to scale, emphasis instead being placed upon illustrating the principles of the invention.
FIG. 1 is a schematic structural view of an automatic solder coating apparatus applied to a cooler according to embodiment 1 of the present invention;
FIG. 2 is a schematic front view of a plate positioning mechanism in an automatic solder coating apparatus for a cooler according to embodiment 1 of the present invention;
FIG. 3 is a schematic top view of a plate positioning mechanism in an automatic solder coating apparatus for a cooler according to embodiment 1 of the present invention;
FIG. 4 is a schematic structural diagram of a positive-threaded rod body in a positioning screw section in an automatic solder coating apparatus applied to a cooler according to embodiment 1 of the present invention;
FIG. 5 is a schematic structural view of a reverse-threaded rod body in a positioning screw section in an automatic solder coating apparatus for a cooler according to embodiment 1 of the present invention;
fig. 6 is a schematic structural diagram of a lead screw connector in a positioning lead screw section in an automatic solder coating apparatus applied to a cooler according to embodiment 1 of the present invention.
Detailed Description
In the description of the present invention, it should be noted that, as the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. appear, their indicated orientations or positional relationships are based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. The terms "mounted," "connected," and "connected" should be construed broadly and may include, for example, fixed connections, removable connections, or integral connections; they may be mechanically coupled, directly coupled, indirectly coupled through intervening media, or may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art. The embodiments and features of the embodiments in the present application may be combined with each other without conflict. It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. When the terms "comprises" and/or "comprising" are used in this specification, as used herein, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof. The appearances of the terms first, second, and third, if any, are used for descriptive purposes only and are not intended to be limiting or imply relative importance.
In the following, the technical solutions in the embodiments of the present invention are clearly and completely described with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the invention without making creative efforts, belong to the protection scope of the invention.
Example 1:
the automatic solder coating device applied to the cooler provided by the embodiment 1 of the invention, referring to fig. 1, comprises a machine base 1; the machine base 1 is provided with a solder conveying device for automatically conveying solder, a solder spraying device for spraying the solder at fixed points and a cooler plate conveying belt 4 for conveying cooler plates 5; the solder conveying device comprises a stirring motor 21, a solder storage bin 22 for storing solder and a solder conveying pipeline 23; the solder spraying device comprises a pressure spray gun 31; the pressure spray gun 31 is fixedly arranged above the cooler plate conveyor belt 4, and a nozzle of the pressure spray gun 31 is arranged towards the upper surface of the cooler plate conveyor belt 4; one end of the solder conveying pipeline 23 is communicated with the solder storage bin 22, and the other end is communicated with the pressure spray gun 31; the pressure spray gun 31 is used for automatically spraying the solder to the surface of the cooler plate 5 under the pressure control.
In the automatic solder coating device applied to the cooler provided in embodiment 1 of the present invention, the solder conveying device is provided, and the output shaft of the stirring motor 21 is disposed in the solder storage bin 22, so that the solder in the solder storage bin 22 can be stirred, and the solder in the solder storage bin 22 is prevented from being condensed to affect the normal operation of the solder coating process. The solder storage bin 22, which is also a pressurizing bin, can store solder and can convey the solder under the control of external air pressure, and the solder is continuously conveyed to the pressure spray gun 31 through the solder conveying pipeline 23. The solder spray device includes a pressure spray gun 31 fixedly disposed above the cooler plate conveyor 4, and the position and support manner of the fixedly disposed pressure spray gun is not limited to a specific structure as long as the coating station can be fixed. The nozzle of the pressure spray gun 31 is arranged facing the upper surface of the cooler plate conveyor 4 and can be controlled by an external controller to spray absorbed solder under pressure. To specifically explain the embodiment of the automatic solder coating apparatus applied to a cooler provided in embodiment 1 of the present invention, the solder coating pressure of the pressure spray gun 31 may be set by an external air pressure source when the pressure spray gun 31 performs an automatic solder spraying control function, when the cooler plate 5 reaches a predetermined conveyor position (the stop at the spraying station may be controlled by a pipeline device), a nozzle of the pressure spray gun 31 is aligned with the plate surface of the cooler plate 5, the external air pressure source further pressurizes a pneumatic chamber of the pressure spray gun 31 via a negative pressure pipeline and pushes a piston in the pressure spray gun 31 to perform a fine motion, the piston further pressurizes the solder in the solder chamber transferred to the pressure spray gun 31, so that the solder is automatically sprayed from the nozzle and coated on the plate surface of the cooler plate 5 (the structure of the pressure spray gun 31 cooperating with the external air pressure source is not shown in the drawing) It is shown, but the working manner of the pressure spray gun 31 can be understood by those skilled in the art based on the text disclosed in the specification, and is not described herein in detail), thereby achieving that the pressure spray gun 31 is controlled to spray the atomized solder to the cooler plates 5 on the cooler plate conveyor 4 sufficiently, and the start and stop control of the pressure spray gun 31 can also be performed by using an external air pressure source for pressurization and pressure relief control, which is not described herein again. Thus, compared with the traditional manner of manually coating the solder on the cooler plate, the automatic solder coating device applied to the cooler provided by the embodiment 1 of the invention has higher spraying efficiency, spraying stability and spraying thickness consistency, can be used for orderly spraying the plate surfaces of the cooler plates 5 passing through in sequence along with the slow transmission of the cooler plate conveyor belt 4, has higher automation level, greatly reduces labor cost and labor consumption, has higher spraying quality controllability through the automatic parameter control of a machine, is favorable for ensuring the subsequent brazing molding quality of the cooler, and prolongs the service life of the cooler in processing molding.
As a preferred embodiment, referring to fig. 1, the solder spraying apparatus includes a material spraying chamber 32 having a bottomless cubic structure; the material spraying cabin 32 is fixed on the machine base 1 and is covered above the cooler plate conveying belt 4; the pressure spray gun 31 is fixedly arranged in the material spraying cabin 32; a strip-shaped inlet 321 and a strip-shaped outlet (not shown in the figure) are respectively formed in the material spraying cabin 32 along the conveying direction of the cooler plate conveying belt 4; the strip-shaped inlet 321 and the strip-shaped outlet are in clearance fit with the cooler plates 5 in the height direction.
Referring to fig. 1, a material spraying cabin 32 is fixed on a machine base 1, the material spraying cabin 32 is of a cover-type bottomless structure, the side wall of the material spraying cabin 32 is fixed on the machine base 1, the bottom surface of the top wall directly faces a cooler plate conveyor belt 4, a pressure spray gun 31 is fixedly arranged in the material spraying cabin 32, and a strip-shaped inlet 321 and a strip-shaped outlet with the height approximately consistent with that of the cooler plate 5 are formed in the material spraying cabin, so that when the cooler plate 5 is conveyed on the conveyor belt, the material can enter the material spraying cabin 32 through the strip-shaped inlet 321 with clearance fit, after being sprayed by the pressure spray gun 31 at a fixed point position in the material spraying cabin 32, the solder can be sent out from the strip-shaped outlet under the action of the cooler plate conveyor belt 4, the sealing strength of the whole solder spraying device is improved, and when the pressure spray gun 31 performs spraying work on the cooler plate 5 passing through the conveyor belt, can be isolated from the influence of certain external environment, personnel and interference, so that the solder coating efficiency is higher and the quality control effect is better.
It should be noted that, in order to ensure the effect of the post-cooler brazing formation, the solder used by the applicant in the automatic solder coating device applied to the cooler provided in embodiment 1 of the present invention is a copper-free solder, and the cost thereof is much higher than that of a general copper solder. The solder is in a paste state in the solder storage bin 22, is in a fog state after being sprayed out by the pressure spray gun 31, and in order to fully spray the surface of the cooler plate 3 so as to facilitate subsequent welding, the fog solder can continuously escape under the action of pressure, so that certain solder waste is caused, and cost control of enterprises is not facilitated. In view of this problem, the automatic solder coating apparatus applied to a cooler according to embodiment 1 of the present invention further includes, referring to fig. 1, a solder negative pressure pipeline 6 and a first solder recovery container 7; a solder recovery pipe orifice 325 is arranged on the side wall of the material spraying cabin 32; one end of the solder negative pressure pipeline 6 is communicated with the material spraying cabin 32 through the solder recovery pipe orifice 325, and the other end of the solder negative pressure pipeline 6 is communicated with the first solder recovery container 7; the first solder recovery vessel 7 is provided on the housing 1.
In the automatic solder coating device applied to the cooler provided in embodiment 1 of the present invention, by providing the solder negative pressure pipeline 6 and the first solder recovery container 7, when the pressure spray gun 31 performs uninterrupted spraying on the plate surface of the cooler plate 5 conveyed in the material spray cabin 32, the solder negative pressure pipeline 6 can absorb the solder which has been atomized and escaped from the material spray cabin 32 into the first solder recovery container 7. In addition, the first solder recovery container 7 is arranged on the base 1, so that the solder negative pressure pipeline 6 can be arranged as short as possible, the cost of the whole device can be reduced, the rate of the solder absorbed by the pipe body in the process of recovering the solder is reduced, and the solder recovery efficiency is improved. Moreover, because the material spraying cabin 32 has relative tightness, the solder negative pressure pipeline 6 absorbs the redundant solder in the cabin under the power action of the external negative pressure pump, so that the cleanliness and the speed of the recovered solder can be improved to a certain extent, the secondary utilization rate of solder resources is improved, and the loss of enterprise cost caused by the waste of the solder is avoided.
As a specific and preferred embodiment, referring to fig. 1, the automatic solder coating apparatus for a cooler according to example 1 of the present invention further includes a vertical baffle 33; the vertical baffle 33 is vertically and fixedly arranged in the material spraying cabin 32, and a distance gap for the cooler plates 5 to pass through is formed between the bottom end face of the vertical baffle 33 and the upper surface of the cooler plate conveyor belt 4; the vertical baffle 33 divides the material spraying cabin 32 into a plate outlet chamber 332 and a plate inlet chamber 331; the strip-shaped inlet 321 is communicated with the strip-shaped outlet through the plate inlet chamber 331 and the plate outlet chamber 332 in sequence; the pressure spray gun 31 is fixed on the wall surface of the vertical baffle 33 at one side of the plate inlet chamber 331; the solder recovery nozzle 325 is opened on the side wall of the material spray chamber 32 on the side of the plate inlet chamber 331.
According to the automatic solder coating device applied to the cooler provided by the embodiment 1 of the invention, the vertical baffle 33 is arranged, the pressure spray gun 31 is reasonably fixed in the material spraying cabin 32, the space layout occupied by the automatic solder coating device is reduced, the whole volume is compact, the sealing performance when solder spraying is carried out on the cooler plate 5 is improved, and the automatic solder coating device is not easily influenced by external environmental factors when a spraying process is carried out. Meanwhile, the vertical baffle 33 further divides the space of the spray cabin 32, and when the nozzle of the pressure spray gun 31 faces the cooler plate 5 on the conveyor belt, the escaped fog-shaped solder can be retarded to a certain extent on the vertical baffle 33, so that the escaped range of the fog-shaped solder is reduced; then, the solder recovery pipe orifice 325 is arranged on the side wall surface of the material spraying cabin 32 on the side where the plate entrance chamber 331 is located, so that the escaped foggy solder can be folded back on the vertical baffle 33 and then further absorbed into the first solder recovery container 7, better solder spraying concentration is realized, and the solder recovery efficiency and effect are improved.
Further, it is considered that a part of the mist solder which is continuously precipitated by the pressure lance 31 is adsorbed on the cooler plate conveyor 4 while the cooler plate 5 is automatically solder-sprayed. In view of this problem, referring to fig. 1, in the automatic solder coating apparatus applied to a cooler according to embodiment 1 of the present invention, the cooler plate conveyor belt 4 is an endless pulley; a scraping plate 8 for scraping solder and a second solder recovery container 9 for recovering solder are fixedly arranged below the cooler plate conveyor belt 4; the second solder recovery container 9 is arranged on the stand 1; the top end surface of the scraper 8 abuts against the bottom surface of the cooler plate conveyor 4, and the bottom end surface of the scraper 8 is fixed in the second solder recovery container 9.
Through further setting up second solder recovery container 9 and scraper blade 8 on frame 1, when cooler plate conveyer belt 4 constantly moves, scraper blade 8 is fixed in second solder recovery container 9, when the conveyer belt moves, the position of scraper blade 8 is relatively fixed, and the top of scraper blade 8 can be with the surface butt of conveyer belt, so, can further strike off the surperficial unnecessary solder of conveyer belt behind material spraying cabin 32, not only played the effect of solder recovery, also carried the surface of conveyer belt to the cleaning process simultaneously, can avoid causing the pollution to follow-up cooler plate 5 of treating the coating to a certain extent, also can prevent to cause the pollution (because there is heavy metal in the solder) to environment and personnel. Scraper blade 8 can select the material of passivity when implementing, prevents to cause the damage to the surface of cooler plate conveyer belt 4, and cooler plate conveyer belt 4 can select comparatively smooth plain noodles material, and the easy cleaning after the conveyer belt stops of one side, and on the other hand has also played the effect of strengthening the solder and scraping recovery efficiency.
Further, in the automatic solder coating apparatus applied to the cooler provided in embodiment 1 of the present invention, referring to fig. 1, a pressure regulating valve 34 is fixed on a side wall of the material spraying chamber 32; the pressure regulating valve 34 is connected with the pressure spray gun 31 in an air path. By arranging the pressure regulating valve 34, when the automatic solder coating device operates, the nozzle spraying pressure of the pressure spray gun 31 is adjustable, and the pressure can be adjusted based on the working condition or the specific condition of the cooler plate 5, so that the flexible and optimal control is realized, and the optimal coating efficiency is obtained.
In the automatic solder coating device applied to the cooler provided in embodiment 1 of the present invention, preferably, referring to fig. 1, an observation window opening is formed in a top wall of the material spraying chamber 32; a transparent observation window plate 322 is movably arranged on the observation window opening; the transparent viewing window panel 322 is openably sealingly disposed over the viewing window opening. Through set up transparent observation window board 322 on the roof in material spraying cabin 32, be convenient for observe the spraying process of pressure spray gun 31 to cooler plate 5 from the top, can in time intervene when running into the problem in the automatic spraying process, transparent observation window board 322 can be opened sealed the setting on the observation window opening in addition, the solder is followed the top and is escaped when having prevented pressure spray gun 31 spraying solder, also be convenient for open at any time and maintain pencil such as pressure spray gun 31 and the gas circuit of inside, pipeline, the convenience of maintaining has been improved.
In order to enable the automatic solder coating device applied to the cooler provided by the embodiment 1 of the invention to have better spraying quality controllability, as a preferred embodiment, the automatic solder coating device is understood by referring to fig. 2 and 3, and further comprises a plate positioning mechanism; the plate positioning mechanism comprises a first fixing plate 101 and a second fixing plate 102 which are arranged at two sides of the inlet of the cooler plate conveying belt 4; a plurality of transverse screws 11 are rotatably arranged between the first fixing plate 101 and the second fixing plate 102; the plate surfaces of the first fixing plate 101 and the second fixing plate 102 extend in the conveying direction of the cooler plate conveyor 4; one end of the transverse screw 11 penetrates through the first fixing plate 101, and the other end penetrates through the second fixing plate 102; a plurality of positioning screw rod sections 111 for limiting the cooler plates 5 are arranged on the transverse screw rod 11; each positioning screw rod section 111 comprises a positive thread rod body 1111, a screw rod connector 1113 and a negative thread rod body 1112 which are coaxially connected; the threads on the reverse-threaded rod body 1112 and the threads on the positive-threaded rod body 111 are arranged on two sides of the screw rod connector 1113 in a mirror symmetry manner, and the center line of the screw rod connector 1113 is over against the center line of the pressure spray gun 31; the positioning screw section 111 is further provided with a first vertical limiting plate 121 and a second vertical limiting plate 122; the first vertical limiting plate 121 is connected to the positive threaded rod 111 in a threaded manner, and the second vertical limiting plate 122 is connected to the negative threaded rod 1112 in a threaded manner; the adjacent positioning screw sections 111 are coaxially fixed through a coupling 112; the outer diameter of the coupling 112 is larger than the inner diameters of the first vertical limiting plate 121 and the second vertical limiting plate 122.
In the automatic solder coating apparatus applied to a cooler in embodiment 1 of the present invention, a plurality of transverse screws 11 are rotatably disposed through a first fixing plate 101 and a second fixing plate 102 (as will be understood with reference to fig. 2 and 3, the first fixing plate 101 and the second fixing plate 102 may be part of a positioning frame 10 to ensure support stability, the positioning frame 10 may be fixed on a machine base 1 or on the ground to fix the position of the positioning frame relative to a cooler plate conveyor 4), one end of each transverse screw 11 penetrates through the first fixing plate 101, the other end penetrates through the second fixing plate 102, the transverse screws 11 are rotated in a coaxial transmission manner to further drive a positioning screw segment 111 disposed on the transverse screws 11 to rotate, when the positioning screw segment 111 rotates, since threads of a coaxially disposed positive thread rod 1111 and a reverse thread rod 1112 are in a mirror image state relative to a screw connector 1113, the thread turning directions are opposite, so that when the transverse lead screw 11 rotates, the first vertical limiting plate 121 and the second vertical limiting plate 122 can be driven to move back to back or move towards each other in the horizontal direction, the distance between the limiting plates can be adjusted, and through adjusting the distance between the limiting plates, the cooler plates 5 to be coated with the solder in different sizes can be arranged on the cooler plate conveyor belt 4 between the first vertical limiting plate 121 and the second vertical limiting plate 122, so that the positioning effect towards the initial conveying direction of the material spraying cabin 32 is realized. During the positioning process, since the threads on the reverse-threaded rod body 1112 and the threads on the forward-threaded rod body 1111 are mirror-symmetrical along the center line of the screw rod connector 1113, i.e. the thread turning directions are opposite, the thread pitches are the same, and the thread lengths are the same, and the screw rod connector 1113 is exactly positioned at the centers of the forward-threaded rod body 1111 and the reverse-threaded rod body 1112 which are coaxially arranged, the center line of the screw rod connector 1113 is directly opposite to the center line of the pressure spray gun 31, (in the present invention, it is understood that the center line of the screw rod connector 1113 and the projection of the center line of the pressure spray gun 31 fixedly arranged in the spray cabin 32 on the cooler plate conveyor belt 4 are in a straight line), therefore, no matter how the transverse screw rod 11 rotates, the distance between the plates is adjusted in a way that the center line is unchanged for the vertical limiting plates (121, 122) arranged, after the cooler plates 5 are positioned at the entrance of the cooler plate conveyor belt 4 according to the adjusted inter-plate distance, after the conveying action of the conveyor belt reaches the material spraying cabin 32, the center of the plate surface of the cooler plates 5 still can be just under the nozzle of the pressure spray gun 31, namely, the solder can be fully coated by the pressure spray gun 31 in the material spraying cabin 32, the probability that the solder is sprayed on the cooler plate conveyor belt 4 is reduced, the coating control precision and efficiency are greatly improved, the waste caused by coating the solder to the outside of the plate is reduced, and the enterprise material cost is saved. In the automatic solder coating apparatus applied to the cooler provided in embodiment 1 of the present invention, the plate positioning manner of the cooler plates 5 at the entrance of the cooler plate conveyor 4 is simple, the number of the positioning screw segments 111 can be set according to the number of the pressure spray guns 31 in the material spraying cabin 32 (referring to the embodiment provided in fig. 2, there are two positioning screw segments 111, the positioning distance between two sets of limiting plates can be adjusted in parallel by rotating the transverse screw 11, when there are multiple positioning screw segments 111, the self-adaptive expansion and disassembly can be conveniently performed by the coupler 112, it is worth noting that each positioning screw segment 111 has the same specification in the present invention), because the adjacent positioning screw segments 111 are coaxially fixed by the coupler 112, and the outer diameter of the coupler 112 is larger than the inner diameters of the first vertical limiting plate 121 and the second vertical limiting plate 122, thus, when the vertical limiting plates (121 and 122) are used for adjusting the plate spacing (to adapt to different sizes of the cooler plates 5), the adjustable spacing range is controllable, and the vertical limiting plates cannot be deviated to other positioning screw rod sections 111 due to overlarge rotation amplitude of the transverse screw rod 11 during adjustment. In implementation, after the distance between the first vertical limiting plate 121 and the second vertical limiting plate 122 is adjusted, the positioning of the cooler plates 5 on the conveyor belt is completed, referring to fig. 2 and 3, the cooler plates 5 are placed between the first vertical limiting plate 121 and the second vertical limiting plate 122 (the bottom end surfaces of the first vertical limiting plate 121 and the second vertical limiting plate 122 and the surface of the cooler plate conveyor belt 4 are spaced, which can be understood by those skilled in the art, so as not to interfere with the normal conveying of the cooler plate conveyor belt 4), that is, the effective positioning of the cooler plates 5 can be realized, and the problems of low coating efficiency of the pressure spray gun 31, uncontrollable coating quality and waste of solder caused by the inclination or deviation of the conveying position of the cooler plates 5 at the entrance of the conveyor belt are effectively prevented.
Further, in order to facilitate the processing and assembling of the transverse lead screw 11, the automatic solder coating apparatus applied to the cooler according to embodiment 1 of the present invention, referring to fig. 4, 5 and 6, the end of the positive threaded rod 1111 is provided with a square groove 11111; a first threaded hole 11112 is punched in the direction from the inner wall of the groove 11111 to the outer wall of the positive threaded rod 1111; a square lug 11121 is arranged at the end part of the inverse thread rod body 1112; a second threaded hole 11122 penetrates through the square bump 11121; the cube groove 11111 of the positive thread rod body 1111 is matched with the cube projection 11121 of the negative thread rod body 1112 in a concave-convex manner; when the positive-threaded rod 1111 and the negative-threaded rod 1112 are coaxially connected, the cube recess 11111 may be in snap fit with the cube projection 11121, and the first threaded hole 11112 may be aligned with the second threaded hole 11122; the lead screw connector 1113 is in a circular column shape; the screw rod connector 1113 is detachably sleeved at the buckling fit position of the positive thread rod body 1111 and the negative thread rod body 1112; a third threaded hole 11131 penetrates through the side wall of the lead screw connector 1113 towards the center; when the cube recess 11111 is snap-fitted with the cube protrusion 11121, the internal threads of the first threaded hole 11112, the second threaded hole 11122, and the third threaded hole 11131 are coplanar.
By further providing a detachable structure of the positioning lead screw section 111, the automatic solder coating device applied to the cooler provided by embodiment 1 of the present invention can conveniently assemble and disassemble the positive lead screw rod 1111, the negative lead screw rod 1112, and the lead screw connector 1113, and is convenient for maintenance. Set up to square recess 11111 through the tip with the positive thread body of rod 1111, then set up square lug 11121 at the tip of the contrary thread body of rod 1112, the shape is simple, and processing is convenient, for cylindric convex part and concave part cooperation shape, is convenient for dash and establishes the screw hole, carries out the mutual aim at between the screw hole more conveniently simultaneously, need not frequently adjust and aims at the angle and adjust the screw hole well, has improved assembly efficiency greatly. When the automatic solder coating device applied to the cooler provided in embodiment 1 of the present invention is implemented, when the positioning of the screw rod section 111 is required, only the cylindrical screw rod connector 1113 needs to be pre-sleeved on the outer surface of the positive threaded rod 1111 or the negative threaded rod 1112, then the cube protrusion 11121 on the negative threaded rod 1112 is clamped in the cube groove 11111 of the positive threaded rod 1111, and then the screw rod connector 1113 is moved to the fastening connection between the positive threaded rod 1111 and the negative threaded rod 1112, and the third threaded hole 11131 is aligned to the first threaded hole 11112 and the second threaded hole 11122, so that the inner threads of the third threaded hole 11131 are located on a cylindrical surface, and the bolt is assembled.
As a preferred embodiment, referring to fig. 2 and 3, in the automatic solder coating apparatus applied to a cooler provided in example 1 of the present invention, the first fixing plate 101, the second fixing plate 102, the first vertical limiting plate 121, and the second vertical limiting plate 122 have a square plate surface; through holes for rotatably fixing the transverse screw rod 11 are formed at four corners of the first fixing plate 101 and the second fixing plate 102; a chain wheel transmission mechanism is arranged on the second fixing plate 102, and a bearing (not shown in the figure) is arranged at the penetrating and fixing position of the first fixing plate 101 and the transverse screw rod 11; the chain wheel transmission mechanism comprises four chain wheels 141 and chains 142 in transmission connection with the four chain wheels; the four chain wheels 141 are coaxially arranged at one ends of the four transverse screw rods 11 respectively; the end of one of the chain wheels 141 is provided with a rocker arm 15; the centers of the plate surfaces of the first fixing plate 101, the second fixing plate 102, the first vertical limiting plate 121 and the second vertical limiting plate 122 are also provided with a supporting beam 13 in a penetrating manner in a collinear manner.
According to the automatic solder coating device applied to the cooler provided by the embodiment 1 of the invention, the first fixing plate 101, the second fixing plate 102, the first vertical limiting plate 121 and the second vertical limiting plate 122 are processed into square structures, so that the processing is convenient, and the implementation cost is low. The through holes have all been seted up in four bights of first fixed plate 101 and second fixed plate 102, make can fix a position and adjust first vertical limiting plate 121 and the vertical limiting plate 122 of second through four horizontal lead screws 11, when implementing, through rocking arm 15, can drive four sprocket 141 rotations simultaneously through the sprocket drive mechanism that its transmission is connected, and then drive four horizontal lead screws 11 and rotate together, comparatively laborsaving, four horizontal lead screws 11 then can drive the first vertical limiting plate 121 and the vertical limiting plate 122 of second on the multiunit location lead screw section 111 of setting and move simultaneously, realize the parallel regulation of distance between the multiunit piece, higher synchronous adjustment efficiency has. The bearing is arranged at the contact part of the first fixing plate 101 and the transverse lead screw 11, which is fixedly penetrated through, so that the friction coefficient of the transverse lead screw 11 in the movement process can be reduced, and the rotation precision of the transverse lead screw is ensured. Further, the supporting light bar 13 can further support the whole device, and the stability of the device is guaranteed.
In the automatic solder coating device applied to the cooler provided by the embodiment 1 of the invention, during implementation, the rocker arm 15 is used for providing rotating power, and as the cooler plate 5 circulates on the cooler plate conveyor belt 4 in batches to enter the material spraying cabin 32 before the solder spraying process is carried out, frequent adjustment is not needed in the automatic solder coating process, workers on site can manually rotate the rocker arm 15 to drive the chain to simultaneously rotate the four chain wheels 141, and the chain wheels 141 further drive the four transverse lead screws 11 which are respectively and coaxially arranged to rotate; compared with an additional control motor for synchronously rotating the transverse lead screw 11, the manual rotating rocker arm 15 has the advantages of lower implementation cost, mechanism complexity reduction, flexible and independent adjustment, and no delay in the spraying process in the spraying cabin 32 during adjustment. The transverse screw 11 drives a plurality of groups of vertical limiting plate pieces (a first vertical limiting plate 121 and a second vertical limiting plate 122) on the transverse screw through the coaxial transmission of the chain wheel 141 to adjust the positioning distance, so that the positioning device is suitable for positioning cooler plates 5 with different sizes at the inlet of the cooler plate conveyor belt 4, in the adjusting process, because the screw rod connector 1113 is fixed in the central position relative to the pressure spray gun 31 in the spray cabin 32 in advance, no matter how the transverse screw rod 11 rotates, and how the vertical limiting plate moves, the cooler plates 5 can be positioned and enter the spray cabin 32, can be positioned below the nozzle of the pressure spray gun 31 as much as possible, reduces the position deviation of the cooler plates 5 on the conveyor belt, and then the pressure spray gun 31 is sprayed on the conveyor belt too much to cause waste of the solder, and the efficiency of solder coating can be improved to a certain extent.
Those skilled in the art will appreciate that variations may be implemented by those skilled in the art in combination with the prior art and the above-described embodiments, and will not be described in detail herein. Such variations do not affect the essence of the present invention and are not described herein.
The above description is of the preferred embodiment of the invention. It is to be understood that the invention is not limited to the particular embodiments described above, in that devices and structures not described in detail are understood to be implemented in a manner common in the art; it will be understood by those skilled in the art that various changes and modifications may be made, or equivalents may be modified, without departing from the spirit of the invention. Therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention are still within the scope of the protection of the technical solution of the present invention, unless the contents of the technical solution of the present invention are departed.
Claims (10)
1. The automatic solder coating device applied to the cooler is characterized by comprising a machine base; the machine base is provided with a solder conveying device for automatically conveying solder, a solder spraying device for spraying the solder at fixed points and a cooler plate conveying belt for conveying cooler plates; the solder conveying device comprises a stirring motor, a solder storage bin and a solder conveying pipeline; the solder spraying device comprises a pressure spray gun; the pressure spray gun is fixedly arranged above the cooler plate conveyor belt, and a nozzle of the pressure spray gun is arranged towards the upper surface of the cooler plate conveyor belt; one end of the solder conveying pipeline is communicated with the solder storage bin, and the other end of the solder conveying pipeline is communicated with the pressure spray gun; the pressure spray gun is used for automatically spraying the solder to the surface of the cooler plate under the pressure control action.
2. The automatic solder coating apparatus applied to a cooler as set forth in claim 1, wherein said solder spraying means comprises a spraying chamber of a bottomless cubic structure; the material spraying cabin is fixed on the base and is covered above the cooler plate conveying belt; the pressure spray gun is fixedly arranged in the material spraying cabin; a strip-shaped inlet and a strip-shaped outlet are respectively formed in the side wall of the material spraying cabin along the conveying direction of the cooler plate conveying belt; the strip-shaped inlet and the strip-shaped outlet are in clearance fit with the cooler plate in the height direction.
3. The automatic solder coating apparatus applied to the cooler as claimed in claim 2, further comprising a solder negative pressure line and a first solder recovery vessel; a solder recovery pipe orifice is formed in the side wall of the material spraying cabin; one end of the solder negative pressure pipeline is communicated with the material spraying cabin through the solder recovery pipe orifice, and the other end of the solder negative pressure pipeline is communicated with the first solder recovery container; the first solder recovery container is arranged on the base.
4. The automatic solder coating apparatus for a cooler as set forth in claim 3, further comprising a vertical baffle; the vertical baffle is vertically and fixedly arranged in the material spraying cabin, and a distance gap for the cooler plate to pass through is formed between the bottom end face of the vertical baffle and the upper surface of the cooler plate conveying belt; the vertical baffle divides the material spraying cabin into a plate outlet chamber and a plate inlet chamber; the strip-shaped inlet is communicated with the strip-shaped outlet through the plate sheet inlet chamber and the plate sheet outlet chamber in sequence; the pressure spray gun is fixed on the wall surface of the vertical baffle plate positioned on one side of the plate sheet inlet chamber; the solder recovery pipe orifice is arranged on the side wall of the material spraying cabin positioned on one side of the plate inlet chamber.
5. The automatic solder coating apparatus for a cooler according to any one of claims 1 to 4, wherein the cooler plate conveyer belt is an endless pulley; a scraping plate fixedly arranged below the cooler plate piece conveying belt and used for scraping solder and a second solder recovery container used for recovering the solder are arranged below the cooler plate piece conveying belt; the second solder recovery container is arranged on the stand; the top end face of the scraper abuts against the bottom surface of the cooler plate conveying belt, and the bottom end face of the scraper is fixedly arranged in the second solder recovery container.
6. The automatic solder coating apparatus applied to a cooler as claimed in claim 2, wherein a pressure regulating valve is fixed to a side wall of the material spraying chamber; and the pressure regulating valve is connected with the pressure spray gun through a gas circuit.
7. The automatic solder coating device applied to the cooler as claimed in claim 2, wherein the top wall of the material spraying chamber is provided with an observation window opening; a transparent observation window plate is movably arranged on the observation window opening; the transparent viewing window panel is openably and sealingly disposed over the viewing window opening.
8. The automatic solder coating apparatus for a cooler according to any one of claims 1, 2, 3, 4, 6 and 7, further comprising a plate positioning mechanism; the plate positioning mechanism comprises a first fixing plate and a second fixing plate which are respectively arranged at two sides of the inlet of the cooler plate conveying belt; a plurality of transverse screw rods are rotatably arranged between the first fixing plate and the second fixing plate; the plate surfaces of the first fixing plate and the second fixing plate extend towards the conveying direction of the cooler plate conveying belt; one end of the transverse screw rod penetrates through the first fixing plate, and the other end of the transverse screw rod penetrates through the second fixing plate; a plurality of positioning screw rod sections used for limiting cooler plates are arranged on the transverse screw rod; each positioning screw rod section comprises a positive thread rod body, a screw rod connector and a reverse thread rod body which are coaxially connected; the screw threads on the reverse-threaded rod body and the screw threads on the positive-threaded rod body are arranged on two sides of the screw rod connector in a mirror symmetry mode, and the center line of the screw rod connector is opposite to the center line of the pressure spray gun; the positioning screw rod section is also provided with a first vertical limiting plate and a second vertical limiting plate; the first vertical limiting plate is in threaded connection with the positive thread rod body, and the second vertical limiting plate is in threaded connection with the reverse thread rod body; the adjacent positioning screw rod sections are coaxially fixed through a coupler; the outer diameter of the coupler is larger than the inner diameters of the first vertical limiting plate and the second vertical limiting plate.
9. The automatic solder coating apparatus applied to a cooler according to claim 8, wherein the end of the positive-threaded rod body is provided with a square groove; a first threaded hole is punched in the direction from the inner wall of the groove to the outer wall of the positive threaded rod body; a square bump is arranged at the end part of the reverse-thread rod body; a second threaded hole penetrates through the square bump; the cube groove of the positive thread rod body is in concave-convex fit with the cube bump of the negative thread rod body; when the positive threaded rod body is coaxially connected with the reverse threaded rod body, the cube groove can be in snap fit with the cube bump, and the first threaded hole and the second threaded hole can be in the same straight line; the lead screw connector is in a circular column shape; the screw rod connector is detachably sleeved at the buckling matching part of the positive thread rod body and the negative thread rod body; a third threaded hole penetrates through the side wall of the lead screw connector towards the center; when the cube groove is matched with the cube lug in a buckling mode, the internal threads of the first threaded hole, the second threaded hole and the third threaded hole are coplanar.
10. The automatic solder coating device applied to the cooler as claimed in claim 8, wherein the first fixing plate, the second fixing plate, the first vertical limiting plate and the second vertical limiting plate are of a square structure; through holes for rotatably fixing the transverse screw rods are formed in four corners of the first fixing plate and the second fixing plate; a chain wheel transmission mechanism is arranged on the second fixing plate, and a bearing is arranged at the penetrating and fixing position of the first fixing plate and the transverse screw rod; the chain wheel transmission mechanism comprises four chain wheels and chains in transmission connection with the four chain wheels; the four chain wheels are respectively and coaxially arranged at one ends of the four transverse screw rods; a rocker arm is arranged at the end part of one of the chain wheels; the centers of the surfaces of the first fixing plate, the second fixing plate, the first vertical limiting plate and the second vertical limiting plate are provided with a supporting polished rod in a penetrating mode in a collinear mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010599391.9A CN111604561A (en) | 2020-06-28 | 2020-06-28 | Automatic solder coating device applied to cooler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010599391.9A CN111604561A (en) | 2020-06-28 | 2020-06-28 | Automatic solder coating device applied to cooler |
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|---|---|
| CN111604561A true CN111604561A (en) | 2020-09-01 |
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| CN202010599391.9A Pending CN111604561A (en) | 2020-06-28 | 2020-06-28 | Automatic solder coating device applied to cooler |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113145972A (en) * | 2021-01-25 | 2021-07-23 | 上海磬采电力科技开发有限公司 | Semiconductor device solder spraying device |
| CN114011613A (en) * | 2021-11-03 | 2022-02-08 | 深圳市思创新精密科技有限公司 | Nano-solution surface spraying equipment for SMT laser template |
| CN114225460A (en) * | 2021-12-29 | 2022-03-25 | 云南龙镁环境科技有限公司 | Tower plate assembly of absorption tower for sewage treatment plant |
-
2020
- 2020-06-28 CN CN202010599391.9A patent/CN111604561A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113145972A (en) * | 2021-01-25 | 2021-07-23 | 上海磬采电力科技开发有限公司 | Semiconductor device solder spraying device |
| CN114011613A (en) * | 2021-11-03 | 2022-02-08 | 深圳市思创新精密科技有限公司 | Nano-solution surface spraying equipment for SMT laser template |
| CN114225460A (en) * | 2021-12-29 | 2022-03-25 | 云南龙镁环境科技有限公司 | Tower plate assembly of absorption tower for sewage treatment plant |
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