CN111601406A - Far infrared carbon crystal heating chip and processing technology thereof - Google Patents
Far infrared carbon crystal heating chip and processing technology thereof Download PDFInfo
- Publication number
- CN111601406A CN111601406A CN202010539361.9A CN202010539361A CN111601406A CN 111601406 A CN111601406 A CN 111601406A CN 202010539361 A CN202010539361 A CN 202010539361A CN 111601406 A CN111601406 A CN 111601406A
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- far infrared
- carbon crystal
- plate
- conductive plate
- insulation layer
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 88
- 229910052799 carbon Inorganic materials 0.000 title claims abstract description 88
- 239000013078 crystal Substances 0.000 title claims abstract description 81
- 238000010438 heat treatment Methods 0.000 title claims abstract description 54
- 238000005516 engineering process Methods 0.000 title claims abstract description 15
- 238000009413 insulation Methods 0.000 claims abstract description 50
- 238000005520 cutting process Methods 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 10
- 238000000465 moulding Methods 0.000 claims description 8
- 239000002131 composite material Substances 0.000 claims description 6
- 238000013329 compounding Methods 0.000 claims description 4
- 239000003365 glass fiber Substances 0.000 claims description 4
- 239000002994 raw material Substances 0.000 claims description 4
- 238000005538 encapsulation Methods 0.000 claims description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000005304 joining Methods 0.000 description 10
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 239000008358 core component Substances 0.000 description 2
- 238000005485 electric heating Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 239000000306 component Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002937 thermal insulation foam Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
- H05B3/06—Heater elements structurally combined with coupling elements or holders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/145—Carbon only, e.g. carbon black, graphite
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/017—Manufacturing methods or apparatus for heaters
Abstract
The invention discloses a far infrared carbon crystal heating chip and a processing technology thereof, and relates to the technical field of the far infrared carbon crystal heating chip. The invention has the beneficial effects that: the device can play a role in heat insulation on the bottom of the far infrared carbon crystal heating chip by arranging the heat insulation layer, so that heat cannot be lost from the bottom, the insulating layer can perform insulation protection on the outer side below the current conducting plate, and the use safety is improved.
Description
Technical Field
The invention relates to the technical field of far infrared carbon crystal heating chips, in particular to a far infrared carbon crystal heating chip and a processing technology thereof.
Background
The finished carbon crystal far infrared warmer comprises a heating sheet, an aluminum film (reflecting far infrared energy to the front), a back insulation foam sheet (protecting convection heat from being dispersed from the back), a back aluminum sheet and four stable aluminum frames, wherein the carbon crystal far infrared warmer converts 99% of electric energy into heat energy, 30% of heat energy is heated by convection, and 70% of heat energy becomes infrared energy.
The existing far infrared carbon crystal heating chip is poor in insulation effect, insufficient in safety and single in heating effect, cannot be used in cooperation with a carbon crystal heating plate, is complex in processing process and cannot adapt to large-scale assembly line production, and therefore the far infrared carbon crystal heating chip and the processing technology thereof are provided.
Disclosure of Invention
The invention aims to provide a far infrared carbon crystal heating chip and a processing technology thereof, and aims to solve the problems that the existing far infrared carbon crystal heating chip in the background technology is poor in insulation effect, insufficient in safety, single in heating effect, incapable of being matched with a carbon crystal heating plate, complex in processing process and incapable of adapting to large-scale flow line production.
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a brilliant chip that generates heat of far infrared carbon, includes insulating layer, the brilliant board of carbon and equipment mechanism, the top of insulating layer is fixed with the insulating layer, and the current conducting plate is installed to the top of insulating layer, the brilliant board of carbon is fixed in the top of current conducting plate, both ends are all embedded to have electrically conductive copper bar about the current conducting plate, and the inside of current conducting plate is provided with the far infrared chip, equipment mechanism is fixed in the upper and lower both sides of current conducting plate.
Preferably, the heat insulation layer, the insulating layer, the conductive plate and the carbon crystal plate are all rectangular structures, and symmetry centers of the heat insulation layer, the insulating layer, the conductive plate and the carbon crystal plate are overlapped.
Preferably, the far infrared chips are arranged at equal intervals, and are uniformly distributed in a symmetrical manner about the central line of the conductive plate.
Preferably, the assembling mechanism comprises a connecting block, a clamping groove, a connecting groove and a clamping block, the connecting block is fixed on two sides of the upper portion of the current-conducting plate, the clamping groove is formed in the middle of the inner portion of the connecting block, the connecting groove is formed in two sides of the lower portion of the current-conducting plate, and the clamping block is fixed in the middle of the inner portion of the connecting groove.
Preferably, the size of the joining block is matched with that of the joining groove, and a clamping structure is formed between a clamping groove in the inside of the joining block and a clamping block in the inside of the joining groove.
Preferably, the processing technology of the far infrared carbon crystal heating chip comprises the following specific steps:
s1: selecting raw materials
Selecting a glass fiber board as a main material of the heat insulation layer, selecting insulating rubber as a main material of the heat insulation layer, and selecting a finished product of a current conducting plate, a carbon crystal board, a conductive copper strip and a far infrared chip as a processing material of the far infrared carbon crystal heating chip;
s2: cutting process
Cutting a far infrared chip matched with the size of the design requirement according to the standard requirement of the size design, and a heat insulation layer, an insulation layer, a conductive plate and a carbon crystal plate with corresponding sizes, cutting the heat insulation layer, the conductive plate and the carbon crystal plate into rectangular structures with uniform sizes, and cutting a standard reserved groove at the position of the connecting groove;
s3: composite assembly
Finally, the cut plate is moved to an assembly table, the far infrared chip is installed inside the conductive plate, and then the thermal insulation layer, the insulating layer, the conductive plate and the carbon crystal plate are sequentially installed and fixed in sequence, and the hot press molding mode can be adopted for compounding;
s4: encapsulation molding
The assembled far infrared carbon crystal heating chip plates are integrally packaged, the outer frame is assembled, and the assembling mechanism is welded and fixed on the upper outer portion and the lower outer portion of the outer frame, so that the subsequent assembly and connection among the plurality of far infrared carbon crystal heating chip plates are facilitated.
The invention provides a far infrared carbon crystal heating chip and a processing technology thereof, and the far infrared carbon crystal heating chip has the following beneficial effects:
1. the heat insulation layer is arranged on the bottom of the far infrared carbon crystal heating chip, so that heat cannot be lost from the bottom, the insulating layer can insulate and protect the outer side below the current conducting plate, so that the use safety is improved, the current conducting plate and the conductive copper strip can be electrically connected, and the carbon crystal plate, namely the carbon crystal electric heating plate, takes the carbon crystal heating plate as a core component, and has the advantages of long service life, high heat efficiency, uniform heat dissipation, quick temperature rise and the like.
2. The far infrared chips arranged at equal intervals can uniformly heat, and the far infrared chips are electrified and heated by means of the carbon fiber film far infrared rays to radiate far infrared waves of a human body and are heated by the far infrared light waves.
3. According to the invention, the assembly mechanism is arranged to facilitate mutual splicing and assembly of a plurality of groups of far infrared carbon crystal heating chip plates, wherein the connecting blocks are matched with the connecting grooves in size, and the clamping grooves are matched with the clamping blocks in size, so that the assembly of two far infrared carbon crystal heating chip plates is facilitated through the clamping between the connecting blocks and the connecting grooves and the clamping between the clamping grooves and the clamping blocks, the use is convenient, and the phenomenon of dislocation during assembly is avoided.
4. The invention can realize the integral processing of the far infrared carbon crystal heating chip plate by four processing steps of material selection, cutting processing, composite assembly and packaging molding, has relatively simple processing flow and is suitable for large-scale production, products with different sizes and specifications can be cut according to requirements in the cutting processing, the components are tightly connected by adopting a hot-press molding mode in the composite assembly process, and the products can be stored and transported by the packaging molding to finish the processing flow of the products.
Drawings
FIG. 1 is a schematic view of an internal cross-sectional structure of a far infrared carbon crystal heating chip according to the present invention;
FIG. 2 is a schematic diagram of an external three-dimensional structure of a far infrared carbon crystal heating chip according to the present invention;
fig. 3 is a schematic front view of a conductive plate of a far infrared carbon crystal heating chip according to the present invention.
In the figure: 1. a thermal insulation layer; 2. an insulating layer; 3. a conductive plate; 4. a carbon crystal plate; 5. a conductive copper bar; 6. a far infrared chip; 7. an assembly mechanism; 701. a joining block; 702. a card slot; 703. a joining groove; 704. and (7) clamping blocks.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, "a plurality" means two or more unless otherwise specified; the terms "upper", "lower", "left", "right", "inner", "outer", "front", "rear", "head", "tail", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the invention. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "connected" and "connected" are to be interpreted broadly, e.g., as being fixed or detachable or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1-3, the present invention provides a technical solution: a far infrared carbon crystal heating chip and a processing technology thereof comprise a heat insulation layer (1), an insulation layer (2), a conductive plate (3), a carbon crystal plate (4), a conductive copper bar (5), a far infrared chip (6), an assembling mechanism (7), a connecting block (701), a clamping groove (702), a connecting groove (703) and a clamping block (704), wherein the insulation layer (2) is fixed above the heat insulation layer (1), the conductive plate (3) is installed above the insulation layer (2), the carbon crystal plate (4) is fixed above the conductive plate (3), the heat insulation layer (1), the insulation layer (2), the conductive plate (3) and the carbon crystal plate (4) are all in a rectangular structure, symmetrical centers among the heat insulation layer (1), the insulation layer (2), the conductive plate (3) and the carbon crystal plate (4) are coincided, the arrangement of the heat insulation layer (1) can play a heat insulation role on the bottom of the carbon crystal heating chip, the insulating layer (2) can perform insulating protection on the outer side below the conductive plate (3) so as to improve the use safety, the conductive plate (3) can play a role of power connection, and the carbon crystal plate (4), namely the carbon crystal electric heating plate, takes the carbon crystal heating plate as a core component and has the advantages of long service life, high heat efficiency, uniform heat dissipation, quick temperature rise and the like;
the electric conduction plate is characterized in that conductive copper strips (5) are embedded at the left end and the right end of the electric conduction plate (3), far infrared chips (6) are arranged in the electric conduction plate (3), the far infrared chips (6) are arranged at equal intervals, the far infrared chips (6) are symmetrically and uniformly distributed about the central line of the electric conduction plate (3), the far infrared chips (6) arranged at equal intervals can uniformly heat, the far infrared chips (6) are electrified and heat by relying on carbon fiber films to radiate far infrared waves of a human body, the assembly mechanism (7) is fixed at the upper side and the lower side of the electric conduction plate (3), the assembly mechanism (7) comprises a joining block (701), a clamping groove (702), a joining groove (703) and a clamping block (704), the two sides above the electric conduction plate (3) are fixed with the joining block (701), and the clamping groove (702) is arranged in the middle of the interior of the joining block (701), the carbon crystal heating chip plate is characterized in that connecting grooves (703) are formed in two sides of the lower portion of the conductive plate (3), clamping blocks (704) are fixed in the middle of the inner portion of each connecting groove (703), the connecting blocks (701) are matched with the connecting grooves (703) in size, clamping grooves (702) in the connecting blocks (701) are matched with the clamping blocks (704) in the connecting grooves (703) to form clamping structures, the clamping blocks (701) in the connecting blocks (701) are clamped with the connecting grooves (703) and the clamping grooves (702) are clamped with the clamping blocks (704), assembly between the two far infrared carbon crystal heating chip plates is facilitated, use is convenient, and the phenomenon of dislocation during assembly is avoided.
The processing technology of the far infrared carbon crystal heating chip comprises the following specific steps:
s1: selecting raw materials
Selecting a glass fiber board as a main material of the heat insulation layer (1), selecting insulating rubber as a main material of the heat insulation layer (2), and selecting a finished product of a current conducting plate (3), a carbon crystal board (4), a conducting copper bar (5) and a far infrared chip (6) as processing materials of the far infrared carbon crystal heating chip;
s2: cutting process
According to the standard requirement of size design, cutting a far infrared chip (6) matched with the size of the design requirement, a heat insulation layer (1), an insulation layer (2), a conductive plate (3) and a carbon crystal plate (4) with corresponding sizes, cutting the heat insulation layer (1), the insulation layer (2), the conductive plate (3) and the carbon crystal plate (4) into rectangular structures with uniform sizes, and cutting a standard reserved groove at the position of a connecting groove (703);
s3: composite assembly
Finally, the cut plate is moved to an assembly table, a far infrared chip (6) is installed inside a conductive plate (3), and then a heat insulation layer (1), an insulation layer (2), the conductive plate (3) and a carbon crystal plate (4) are sequentially installed and fixed in sequence, and the hot-press forming mode can be adopted for compounding;
s4: encapsulation molding
The installed far infrared carbon crystal heating chip plates are integrally packaged, the outer frame is installed, and the assembling mechanism (7) is welded and fixed on the upper portion and the lower portion of the outer frame, so that the subsequent assembly and connection among the plurality of far infrared carbon crystal heating chip plates are facilitated.
To sum up, the far infrared carbon crystal heating chip and the processing technology thereof have the following specific steps in use:
s1: selecting raw materials: selecting a glass fiber board as a main material of the heat insulation layer (1), selecting insulating rubber as a main material of the heat insulation layer (2), and selecting a finished product of a current conducting plate (3), a carbon crystal board (4), a conducting copper bar (5) and a far infrared chip (6) as processing materials of the far infrared carbon crystal heating chip;
s2: cutting and processing: according to the standard requirement of size design, cutting a far infrared chip (6) matched with the size of the design requirement, a heat insulation layer (1), an insulation layer (2), a conductive plate (3) and a carbon crystal plate (4) with corresponding sizes, cutting the heat insulation layer (1), the insulation layer (2), the conductive plate (3) and the carbon crystal plate (4) into rectangular structures with uniform sizes, and cutting a standard reserved groove at the position of a connecting groove (703);
s3: and (3) composite assembly: finally, the cut plate is moved to an assembly table, a far infrared chip (6) is installed inside a conductive plate (3), and then a heat insulation layer (1), an insulation layer (2), the conductive plate (3) and a carbon crystal plate (4) are sequentially installed and fixed in sequence, and the hot-press forming mode can be adopted for compounding;
s4: packaging and molding: the installed far infrared carbon crystal heating chip plates are integrally packaged, the outer frame is installed, and the assembling mechanism (7) is welded and fixed on the upper outer portion and the lower outer portion of the outer frame, so that the subsequent assembly connection among the plurality of far infrared carbon crystal heating chip plates is facilitated, and the use process of the whole far infrared carbon crystal heating chip and the processing technology of the far infrared carbon crystal heating chip is completed.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be able to cover the technical scope of the present invention and the equivalent alternatives or modifications according to the technical solution and the inventive concept of the present invention within the technical scope of the present invention.
Claims (6)
1. The utility model provides a brilliant chip that generates heat of far infrared carbon, includes insulating layer (1), brilliant board of carbon (4) and equipment mechanism (7), its characterized in that: insulating layer (2) are fixed with to the top of insulating layer (1), and conductive plate (3) are installed to the top of insulating layer (2), carbon crystal plate (4) are fixed in the top of conductive plate (3), both ends are all embedded to have electrically conductive copper bar (5) about conductive plate (3), and the inside of conductive plate (3) is provided with far infrared chip (6), equipment mechanism (7) are fixed in the upper and lower both sides of conductive plate (3).
2. The far infrared carbon crystal heating chip according to claim 1, characterized in that: insulating layer (1), insulating layer (2), current conducting plate (3) and brilliant board of carbon (4) all are the rectangle column structure, and the coincidence of the symmetry center between insulating layer (1), insulating layer (2), current conducting plate (3) and the brilliant board of carbon (4).
3. The far infrared carbon crystal heating chip according to claim 1, characterized in that: the far infrared chips (6) are arranged at equal intervals, and the far infrared chips (6) are symmetrically and uniformly distributed around the center line of the conductive plate (3).
4. The far infrared carbon crystal heating chip according to claim 1, characterized in that: the assembling mechanism (7) comprises an engaging block (701), a clamping groove (702), an engaging groove (703) and a clamping block (704), the engaging block (701) is fixed on two sides of the upper portion of the conductive plate (3), the clamping groove (702) is arranged in the middle of the inner portion of the engaging block (701), the engaging groove (703) is arranged on two sides of the lower portion of the conductive plate (3), and the clamping block (704) is fixed in the middle of the inner portion of the engaging groove (703).
5. The far infrared carbon crystal heating chip according to claim 4, characterized in that: the size of the connection block (701) is matched with that of the connection groove (703), and a clamping structure is formed between a clamping groove (702) in the connection block (701) and a clamping block (704) in the connection groove (703).
6. The processing technology of far infrared carbon crystal heating chip according to claims 1 to 4, characterized in that the processing technology of far infrared carbon crystal heating chip comprises the following specific steps:
s1: selecting raw materials
Selecting a glass fiber board as a main material of the heat insulation layer (1), selecting insulating rubber as a main material of the heat insulation layer (2), and selecting a finished product of a current conducting plate (3), a carbon crystal board (4), a conducting copper bar (5) and a far infrared chip (6) as processing materials of the far infrared carbon crystal heating chip;
s2: cutting process
According to the standard requirement of size design, cutting a far infrared chip (6) matched with the size of the design requirement, a heat insulation layer (1), an insulation layer (2), a conductive plate (3) and a carbon crystal plate (4) with corresponding sizes, cutting the heat insulation layer (1), the insulation layer (2), the conductive plate (3) and the carbon crystal plate (4) into rectangular structures with uniform sizes, and cutting a standard reserved groove at the position of a connecting groove (703);
s3: composite assembly
Finally, the cut plate is moved to an assembly table, a far infrared chip (6) is installed inside a conductive plate (3), and then a heat insulation layer (1), an insulation layer (2), the conductive plate (3) and a carbon crystal plate (4) are sequentially installed and fixed in sequence, and the hot-press forming mode can be adopted for compounding;
s4: encapsulation molding
The installed far infrared carbon crystal heating chip plates are integrally packaged, the outer frame is installed, and the assembling mechanism (7) is welded and fixed on the upper portion and the lower portion of the outer frame, so that the subsequent assembly and connection among the plurality of far infrared carbon crystal heating chip plates are facilitated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010539361.9A CN111601406A (en) | 2020-06-14 | 2020-06-14 | Far infrared carbon crystal heating chip and processing technology thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010539361.9A CN111601406A (en) | 2020-06-14 | 2020-06-14 | Far infrared carbon crystal heating chip and processing technology thereof |
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| Publication Number | Publication Date |
|---|---|
| CN111601406A true CN111601406A (en) | 2020-08-28 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN202010539361.9A Pending CN111601406A (en) | 2020-06-14 | 2020-06-14 | Far infrared carbon crystal heating chip and processing technology thereof |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201474260U (en) * | 2009-08-03 | 2010-05-19 | 飞迅科技(苏州)有限公司 | Novel plastic floor |
| CN205566681U (en) * | 2016-03-22 | 2016-09-07 | 湖南盛世名嘉装饰建材科技有限公司 | Brilliant epoxy far infrared heat -generating body of graphite olefinic carbon |
| CN205654030U (en) * | 2016-04-25 | 2016-10-19 | 范贤东 | Nanometer far infrared heating ceramic tile |
| CN209141473U (en) * | 2018-12-17 | 2019-07-23 | 广东鹏威塑胶股份有限公司 | A kind of plastics moist-proof board docking assembling |
| CN111218994A (en) * | 2020-01-08 | 2020-06-02 | 袁志广 | House building material heated board of convenient equipment |
-
2020
- 2020-06-14 CN CN202010539361.9A patent/CN111601406A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201474260U (en) * | 2009-08-03 | 2010-05-19 | 飞迅科技(苏州)有限公司 | Novel plastic floor |
| CN205566681U (en) * | 2016-03-22 | 2016-09-07 | 湖南盛世名嘉装饰建材科技有限公司 | Brilliant epoxy far infrared heat -generating body of graphite olefinic carbon |
| CN205654030U (en) * | 2016-04-25 | 2016-10-19 | 范贤东 | Nanometer far infrared heating ceramic tile |
| CN209141473U (en) * | 2018-12-17 | 2019-07-23 | 广东鹏威塑胶股份有限公司 | A kind of plastics moist-proof board docking assembling |
| CN111218994A (en) * | 2020-01-08 | 2020-06-02 | 袁志广 | House building material heated board of convenient equipment |
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Application publication date: 20200828 |