CN111599714A - Cooling device for production of recycled wafer semiconductor - Google Patents
Cooling device for production of recycled wafer semiconductor Download PDFInfo
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- CN111599714A CN111599714A CN202010345781.3A CN202010345781A CN111599714A CN 111599714 A CN111599714 A CN 111599714A CN 202010345781 A CN202010345781 A CN 202010345781A CN 111599714 A CN111599714 A CN 111599714A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention belongs to the technical field of semiconductor production, in particular to a cooling device for producing a regenerated wafer semiconductor, which aims at solving the problem that the cooling rate of the cooling device in the patent cannot be changed according to the characteristics of the semiconductor, and sometimes the semiconductor production quality is influenced by too fast cooling. According to the invention, when the wafer semiconductor on the rotating plate rotates and passes through the first cooling cavity, the second cooling cavity and the third cooling cavity respectively, the amount of cooling gas is increased in sequence, so that the wafer semiconductor has an adaptive process in the cooling process, the damage of the semiconductor caused by too fast one-time cooling is prevented, and the production quality of the wafer semiconductor can be effectively improved.
Description
Technical Field
The invention relates to the technical field of semiconductor production, in particular to a cooling device for regenerated wafer semiconductor production.
Background
The wafer refers to a substrate for manufacturing a semiconductor transistor or an integrated circuit, and is called a wafer because of a crystalline material, and the shape of the substrate is circular, and the substrate material includes silicon, germanium and the like.
Through retrieval, chinese patent No. CN203951722U discloses a semiconductor cooling device, which comprises a cooling box including semiconductor heat exchange fins and a sealing isolation plate, for solving the problem that the electrical control element is not well affected by heat dissipation in the electrical control box.
The cooling rate of the cooling process of the cooling device in the above patent cannot be changed according to the characteristics of the semiconductor itself, and sometimes the cooling speed may be too fast to affect the production quality of the semiconductor, which obviously cannot meet the use requirement of people.
Disclosure of Invention
Based on the technical problems that the cooling rate of the cooling process of the cooling device in the patent cannot be changed according to the characteristics of the semiconductor, and the production quality of the semiconductor can be affected by too fast cooling in some cases, the invention provides a cooling device for regenerating a wafer semiconductor.
The invention provides a cooling device for producing a regenerated wafer semiconductor, which comprises a cooling box, wherein a ventilation groove with a cylindrical structure is fixed on the inner wall of the cooling box through a screw, a fixed block is arranged in the middle of the inner wall at the bottom of the ventilation groove, partition plates which are distributed in an annular shape at equal intervals are fixed on the inner wall at the bottom of the ventilation groove through screws, the ventilation groove comprises a first cooling cavity, a second cooling cavity and a third cooling cavity, ventilation holes which are distributed at equal intervals are formed in the inner walls at the bottom of the first cooling cavity, the second cooling cavity and the third cooling cavity, the number of the ventilation holes in the first cooling cavity, the second cooling cavity and the third cooling cavity is sequentially increased, the cross section of the ventilation holes is in a trapezoidal structure, a groove is formed in the outer wall at the top of the fixed block, a motor is arranged on the inner wall of the groove, an output shaft of the motor is connected with a rotating plate through a, one side of the outer wall of the top of the fixing groove is hinged with an arc-shaped cover, and the outer wall of the arc-shaped cover is provided with an air outlet.
Preferably, the bottom inner wall of fixed slot is provided with ventilative net, and the inner wall all around of fixed slot all is provided with the rubber arch.
Preferably, the top outer wall of cooling box has the fan through the fix with screw, and the input and the cooling box of fan communicate mutually, and the output of fan has cup jointed the exhaust fill.
Preferably, the outer wall of one side of the cooling box is provided with a through opening, and the inner wall of the through opening is connected with a sealing cover through a hinge.
Preferably, the edge of ventilative groove top outer wall sets up the spout of loop configuration, and the inner wall sliding connection of spout has the ball, and the top of ball forms sliding fit with the bottom outer wall of commentaries on classics board.
Preferably, the outer wall of the bottom of the ventilation groove is fixed with a first flow guide block through a screw, and the first flow guide block is of a conical structure.
Preferably, the bottom of cooling box has cup jointed the air inlet dish, and the outer wall around the air inlet dish has seted up four to six equidistant annular distribution's air intake, and the inner wall of air intake is provided with the support, and the outer wall of support passes through the fix with screw has the motor, and the output shaft of motor passes through the coupling joint and is connected with the flabellum.
Preferably, the middle part of the inner wall of the bottom of the air inlet disc is provided with a second flow guide block, and the second flow guide block is of a conical structure.
Preferably, the top outer wall and the bottom outer wall of the air inlet disc are provided with mounting holes distributed in an equidistant annular mode, the inner walls of the mounting holes are connected with semiconductor refrigerating pieces in an inserted mode, and the refrigerating ends of the semiconductor refrigerating pieces are located in the air inlet disc.
The beneficial effects of the invention are as follows:
1. this regeneration is cooling device for wafer semiconductor production, through being provided with first cooling chamber, second cooling chamber and third cooling chamber, first cooling chamber, the bleeder vent that the equidistance distributes is all seted up to the bottom inner wall in second cooling chamber and third cooling chamber, and first cooling chamber, the quantity of bleeder vent increases in second cooling chamber and the third cooling chamber in proper order, wafer semiconductor on changeing the board rotates and passes through first cooling chamber respectively, the quantity that second cooling chamber and third cooling chamber received cooling gas increases in proper order, can make wafer semiconductor have the process of an adaptation at refrigerated in-process, prevent that disposable cooling from causing the damage of semiconductor at the excessive speed, wafer semiconductor production quality can effectively be improved.
2. This regeneration wafer is cooling device for semiconductor production, protruding through being provided with arc lid and rubber, the rubber arch can increase the clearance between semiconductor and the fixed slot at the fixed in-process of wafer semiconductor, and the flow cooling of the air of being convenient for, the design of arc lid is making gaseous circulation of forming in the fixed slot for the semiconductor can carry out even cooling, has improved refrigerated efficiency.
3. This regenerating wafer is cooling device for semiconductor production, through being provided with first water conservancy diversion piece, second water conservancy diversion piece and semiconductor refrigeration piece, first water conservancy diversion piece and second water conservancy diversion piece can play good water conservancy diversion effect, can accelerate gaseous flow rate, and the semiconductor refrigeration piece can reduce the temperature that enters into to the cooling box internal gas, has further improved wafer semiconductor's cooling efficiency.
The parts of the device not involved are the same as or can be implemented using prior art.
Drawings
FIG. 1 is a schematic diagram illustrating an overall structure of a cooling apparatus for recycling wafer semiconductor manufacturing according to the present invention;
FIG. 2 is a schematic view of a gas-permeable groove of a cooling device for producing a recycled wafer semiconductor according to the present invention;
FIG. 3 is a schematic view of a rotating plate structure of a cooling device for recycling wafer semiconductor manufacturing according to the present invention;
FIG. 4 is an enlarged schematic view of a cooling apparatus A for manufacturing a recycled wafer semiconductor according to the present invention;
FIG. 5 is a perspective view of a fixing groove structure of a cooling device for manufacturing a recycled wafer semiconductor according to the present invention.
In the figure: the air conditioner comprises a rotating plate 1, a ball 2, 3 air holes, 4 first flow guide blocks, 5 second flow guide blocks, 6 air inlet discs, 7 supports, 8 fan blades, 9 motors, 10 semiconductor refrigeration sheets, 11 air permeable grooves, 12 motors, 13 cooling boxes, 14 air exhaust hoppers, 15 fans, 16 sealing covers, 17 partition plates, 18 fixing blocks, 19 fixing grooves, 20 air permeable nets, 21 rubber bulges, 23 arc-shaped covers and 24 air outlet holes.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
Example 1:
referring to fig. 1-5, a cooling device for producing a recycled wafer semiconductor comprises a cooling box 13, wherein a ventilation groove 11 with a cylindrical structure is fixed on the inner wall of the cooling box 13 through screws, a fixing block 18 is arranged in the middle of the inner wall of the bottom of the ventilation groove 11, partition plates 17 distributed in an equidistant annular mode are fixed on the inner wall of the bottom of the ventilation groove 11 through screws, the ventilation groove 11 comprises a first cooling cavity, a second cooling cavity and a third cooling cavity, air holes 3 distributed in an equidistant mode are formed in the inner walls of the bottoms of the first cooling cavity, the second cooling cavity and the third cooling cavity, the number of the air holes 3 in the first cooling cavity, the second cooling cavity and the third cooling cavity is increased in sequence, the cross section of each air hole 3 is in a trapezoidal structure, a groove is formed in the outer wall of the top of the fixing block 18, a motor 12 is arranged on the inner wall of the groove, and the top outer wall of the rotating plate 1 is provided with fixing grooves 19 which are distributed in an equidistant annular mode, one side of the top outer wall of each fixing groove 19 is hinged with an arc-shaped cover 23, and the outer wall of each arc-shaped cover 23 is provided with an air outlet 24.
In the invention, the inner wall of the bottom of the fixing groove 19 is provided with the ventilating net 20, and the inner walls around the fixing groove 19 are all provided with the rubber bulges 21.
In the invention, a fan 15 is fixed on the outer wall of the top of the cooling box 13 through a screw, the input end of the fan 15 is communicated with the cooling box 13, and the output end of the fan 15 is sleeved with an exhaust hopper 14.
In the present invention, a through opening is formed in an outer wall of one side of the cooling box 13, and a sealing cover 16 is connected to an inner wall of the through opening through a hinge.
In the invention, the edge of the outer wall of the top of the ventilation groove 11 is provided with a chute with an annular structure, the inner wall of the chute is connected with a ball 2 in a sliding way, and the top end of the ball 2 is in sliding fit with the outer wall of the bottom of the rotating plate 1.
In the invention, the outer wall of the bottom of the ventilation groove 11 is fixed with the first flow guide block 4 through a screw, and the first flow guide block 4 is in a conical structure.
In the invention, the bottom end of a cooling box 13 is sleeved with an air inlet disk 6, four to six air inlets which are distributed annularly at equal intervals are arranged on the peripheral outer wall of the air inlet disk 6, a support 7 is arranged on the inner wall of each air inlet, a motor 9 is fixed on the outer wall of each support 7 through screws, and an output shaft of each motor 9 is connected with a fan blade 8 through a coupling.
In the invention, the middle part of the inner wall of the bottom of the air inlet disk 6 is provided with a second flow guide block 5, and the second flow guide block 5 is in a conical structure.
During the use, it arranges the fixed slot 19 in to carry out refrigerated wafer semiconductor with needs, motor 9 work drives flabellum 8 and rotates, send into the air to the cooler bin 13 during flabellum 8 rotates, motor 12 work can drive commentaries on classics board 1 and rotate, wafer semiconductor on changeing board 1 rotates and passes through first cooling chamber respectively, second cooling chamber and third cooling chamber receive the volume of cooling gas and increase in proper order, can make wafer semiconductor have the process of an adaptation at refrigerated in-process, the cooling in proper order of semiconductor from low wind to high wind has been realized, the quality of production has been improved.
Example 2:
referring to fig. 1, in this embodiment, compared with embodiment 1, the cooling device for producing a recycled wafer semiconductor further includes mounting holes annularly distributed at equal intervals on both the top outer wall and the bottom outer wall of the air inlet tray 6, and the semiconductor refrigeration pieces 10 are inserted into the inner walls of the mounting holes, and the refrigeration ends of the semiconductor refrigeration pieces 10 are located in the air inlet tray 6.
The semiconductor chilling plate 10 can reduce the temperature of gas entering the cooling box 13, and further improves the cooling efficiency of the wafer semiconductor.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (9)
1. A cooling device for producing a regenerated wafer semiconductor comprises a cooling box (13) and is characterized in that a ventilating groove (11) of a cylindrical structure is fixed on the inner wall of the cooling box (13) through screws, a fixing block (18) is arranged in the middle of the inner wall of the bottom of the ventilating groove (11), partition plates (17) which are distributed in an equidistant annular mode are fixed on the inner wall of the bottom of the ventilating groove (11) through screws, the ventilating groove (11) comprises a first cooling cavity, a second cooling cavity and a third cooling cavity, air holes (3) which are distributed in an equidistant mode are formed in the inner walls of the bottoms of the first cooling cavity, the second cooling cavity and the third cooling cavity, the number of the air holes (3) in the first cooling cavity, the second cooling cavity and the third cooling cavity is sequentially increased, the cross section of each air hole (3) is of a trapezoidal structure, a groove is formed in the outer wall of the top of each fixing block, and the inner wall of recess is provided with motor (12), the output shaft of motor (12) has commentaries on classics board (1) through the coupling joint, and the top outer wall of commentaries on classics board (1) is provided with fixed slot (19) that the equidistance annular distributes, one side of fixed slot (19) top outer wall articulates there is arc lid (23), and venthole (24) have been seted up to the outer wall of arc lid (23).
2. The cooling device for producing recycled wafer semiconductors as claimed in claim 1, wherein the bottom inner wall of the fixing groove (19) is provided with a gas permeable net (20), and the peripheral inner walls of the fixing groove (19) are provided with rubber protrusions (21).
3. The cooling device for the semiconductor production of the recycled wafers as claimed in claim 1, wherein a fan (15) is fixed on the outer wall of the top of the cooling box (13) through screws, the input end of the fan (15) is communicated with the cooling box (13), and the output end of the fan (15) is sleeved with an exhaust hopper (14).
4. The cooling device for producing recycled wafer semiconductors as claimed in claim 1, wherein the cooling box (13) has a through opening formed on one side of the outer wall, and the inner wall of the through opening is connected to the sealing cover (16) by a hinge.
5. The cooling device for the semiconductor production of recycled wafers as defined in claim 1, wherein the top outer wall of the ventilation groove (11) has a chute with a ring structure at its edge, and the inner wall of the chute is slidably connected with the ball (2), and the top end of the ball (2) is slidably engaged with the bottom outer wall of the rotating plate (1).
6. The cooling device for the semiconductor production of recycled wafers as claimed in claim 1, wherein the bottom outer wall of the ventilation groove (11) is fixed with a first flow guide block (4) by a screw, and the first flow guide block (4) is of a conical structure.
7. The cooling device for the semiconductor production of the recycled wafers as claimed in claim 1, wherein an air inlet disk (6) is sleeved at the bottom end of the cooling box (13), four to six air inlets are formed in the peripheral outer wall of the air inlet disk (6) and are distributed in an annular shape at equal intervals, a support (7) is arranged on the inner wall of each air inlet, a motor (9) is fixed on the outer wall of each support (7) through screws, and an output shaft of each motor (9) is connected with a fan blade (8) through a coupling.
8. The cooling device for semiconductor manufacturing of recycled wafers as claimed in claim 7, wherein the central portion of the bottom inner wall of the air inlet plate (6) is provided with a second flow guiding block (5), and the second flow guiding block (5) has a conical structure.
9. The cooling device for semiconductor production of recycled wafers as claimed in claim 7 or 8, wherein the top outer wall and the bottom outer wall of the air inlet plate (6) are provided with mounting holes distributed annularly at equal intervals, the inner walls of the mounting holes are inserted with semiconductor refrigeration pieces (10), and the refrigeration ends of the semiconductor refrigeration pieces (10) are located in the air inlet plate (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010345781.3A CN111599714A (en) | 2020-04-27 | 2020-04-27 | Cooling device for production of recycled wafer semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010345781.3A CN111599714A (en) | 2020-04-27 | 2020-04-27 | Cooling device for production of recycled wafer semiconductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111599714A true CN111599714A (en) | 2020-08-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010345781.3A Withdrawn CN111599714A (en) | 2020-04-27 | 2020-04-27 | Cooling device for production of recycled wafer semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111599714A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116489836A (en) * | 2023-04-24 | 2023-07-25 | 宇弘研科技(苏州)有限公司 | Semiconductor heating plate structure and semiconductor track device |
-
2020
- 2020-04-27 CN CN202010345781.3A patent/CN111599714A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116489836A (en) * | 2023-04-24 | 2023-07-25 | 宇弘研科技(苏州)有限公司 | Semiconductor heating plate structure and semiconductor track device |
| CN116489836B (en) * | 2023-04-24 | 2023-11-10 | 宇弘研科技(苏州)有限公司 | Semiconductor heating plate structure and semiconductor track device |
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Application publication date: 20200828 |