CN111595507A - Pressure sensor module - Google Patents
Pressure sensor module Download PDFInfo
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- CN111595507A CN111595507A CN202010427086.1A CN202010427086A CN111595507A CN 111595507 A CN111595507 A CN 111595507A CN 202010427086 A CN202010427086 A CN 202010427086A CN 111595507 A CN111595507 A CN 111595507A
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- 238000007789 sealing Methods 0.000 claims abstract description 108
- 230000008094 contradictory effect Effects 0.000 claims 1
- 230000035945 sensitivity Effects 0.000 abstract description 19
- 238000009434 installation Methods 0.000 abstract description 12
- 230000001105 regulatory effect Effects 0.000 description 10
- 230000000694 effects Effects 0.000 description 6
- 238000013461 design Methods 0.000 description 4
- 238000013459 approach Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/08—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of piezoelectric devices, i.e. electric circuits therefor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
- G01L19/0618—Overload protection
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The invention relates to the technical field of pressure sensor modules, in particular to a pressure sensor module, which comprises a shell, wherein an air inlet pipe is arranged on the right side of the lower end of the shell, and an outlet pipe is arranged on the right side of the upper end of the shell; a first cavity, an installation cavity and a third cavity are sequentially arranged in the shell from bottom to top, the first cavity is communicated with the air inlet pipe through an airflow channel, the installation cavity is communicated with the wire outlet pipe through a wiring hole, and a sealing plug is arranged in the wire outlet pipe; under the condition that the maximum deformation of the pressure chip is not changed, the pressure chip deforms downwards in a reverse direction under small pressure and deforms upwards in a forward direction under large pressure by arranging the second cavity and the first cavity, and the sensitivity and the measuring range of the pressure sensor module are improved in proportion under the condition of low cost.
Description
Technical Field
The invention relates to the technical field of pressure sensor modules, in particular to a pressure sensor module.
Background
The gas pressure sensor module is an integrated pressure sensor module, and is widely applied to the fields of pneumatic control, pressure switches and controllers, portable pressure meters and pressure gauges, MAP (modified absolute pressure sensor) and the like, and the fields have high requirements on the sensitivity, stability and durability of the pressure sensor module, simple requirements on a packaging process, low cost requirements, economy and applicability.
The existing chinese patent (application number CN2017204888694) discloses a small silicon piezoresistive gas pressure sensor module structure, which comprises a housing, a ceramic base, a pressure chip, and a circuit board; a cavity is formed in the shell, the ceramic base is arranged in the cavity of the shell, and the pressure chip is arranged on the ceramic base and communicated with external air; the circuit board is arranged in the cavity and electrically connected with the pressure chip, and the circuit board outputs signals through a cable. When the pressure sensing device is used, gas acts on a pressure sensing surface of the pressure chip through a pipeline, the pressure chip deforms and converts a pressure signal into a voltage signal, the voltage signal is connected with the circuit board through the lead, the circuit board processes an output voltage signal of the pressure chip, and finally the output voltage signal is transmitted outwards through the cable. However, most of the existing pressure chips are flat-film structures, and the pressure chips are transformed from flat to positive deformation when being pressed, and the pressure signal range corresponding to the maximum deformation range obtained by the transformation is the measurement range, so the piezoelectric performance of the pressure chip directly relates to the sensitivity and the measurement range of the pressure sensor module, and the more the pressure chip with good piezoelectric performance is, the higher the price cost is, and therefore how to realize higher sensitivity and larger measurement range by adopting the pressure chip with low piezoelectric performance becomes a difficult problem to be solved urgently.
The pressure sensor module is designed for the company, a sealing cavity capable of changing the volume is arranged on one side of the pressure chip, so that reverse deformation is applied to the pressure chip, the maximum deformation range of the pressure chip is further improved, and the sensitivity and the measuring range of the pressure sensor module are improved under the condition of not increasing the cost.
Disclosure of Invention
In order to make up for the defects of the prior art and solve the problem of how to realize higher sensitivity and larger measuring range by adopting a pressure chip with low piezoelectric performance, the invention provides a pressure sensor module.
The technical scheme adopted by the invention for solving the technical problems is as follows: a pressure sensor module comprises a shell, wherein an air inlet pipe is arranged on the right side of the lower end of the shell, and an outlet pipe is arranged on the right side of the upper end of the shell; a first cavity, an installation cavity and a third cavity are sequentially arranged in the shell from bottom to top, the first cavity is communicated with the air inlet pipe through an airflow channel, the installation cavity is communicated with the wire outlet pipe through a wiring hole, and a sealing plug is arranged in the wire outlet pipe; an annular boss coaxial with the first cavity is arranged in the mounting cavity, a sealing cover capable of moving up and down is sleeved outside the annular boss, a flexible base for sealing the top end of the first cavity is arranged at the lower end of the annular boss, a pressure chip is arranged on the flexible base, a lead of the pressure chip extends out of the wire outlet pipe through a wiring hole, a sealing space formed among the pressure chip, the annular boss and the sealing cover is a second cavity, and the cross-sectional area of the second cavity is larger than that of the first cavity; the lower end of the third cavity is communicated with the upper end of the mounting cavity, and the upper end of the third cavity is communicated with the air inlet pipe through a drainage channel.
When the pressure booster is used, a part of gas enters the first cavity through the gas inlet pipe and the gas flow channel to squeeze the lower surface of the pressure chip, meanwhile, a part of gas enters the third cavity through the flow guide channel and continues to enter the mounting cavity through the third cavity, the upper surface of the sealing cover is squeezed to enable the sealing cover to move downwards, the sealing cover moves downwards to squeeze air in the second cavity to boost the pressure of the air in the second cavity due to the fact that the second cavity is a sealed space, the boosting amplitude of the second cavity is larger than that of the mounting cavity due to the fact that the outer diameter of the sealing cover is larger than the inner diameter of the sealing cover, and the pressure of the mounting cavity is the same as that of the first cavity, so that the pressure P of the second2Greater than the pressure P of the first cavity1The pressure chip is deformed in a downward reverse direction and follows P1Gradually approaches the maximum reverse deformation of the pressure chip until the sealing cover moves down to the bottom of the mounting cavity, at which time the pressure chip reaches the maximum reverse deformation, and then, no matter P1How much, the second cavity is no longer compressed, thus reaching the P after the maximum deformation in the opposite direction2Is a fixed value PMAXFollowing P1The pressure chip gradually eliminates the reverse deformation and changes the reverse deformation into the forward deformation until the maximum forward deformation is reached; thus, the span of the pressure sensor module at this time is measuredThe proportion is improved to the originally designed measuring range, and the corresponding sensitivity is also greatly improved.
Specifically, in the first stage, before the pressure chip reaches the maximum deformation in the reverse direction, the stress F of the pressure chip is equal to (P)1-P2) S, where S is the effective active area of the pressure chip and P2And P1The stress F is equal to K0P1S，K0The constant K can be ensured by reasonably designing structures such as a sealing cover and the like0The value is between-1 and 0, and the measurable P can be effectively improved corresponding to the maximum stress of the pressure chip1The measuring range of the pressure sensor module is further improved; in the second stage, after the pressure chip reaches the maximum deformation in the reverse direction, the stress F of the pressure chip is equal to (P)1-PMAX)S＝P1S-PMAXS, due to PMAXIs a fixed value, so that the corresponding measuring range can be increased by P when the pressure chip is subjected to reverse maximum deformationMAXEven if its range is increased.
Preferably, an annular limiting table is arranged in the sealing cover above the annular boss and used for limiting the downward movement of the sealing cover; the arrangement of the annular boss avoids the situation that the pressure chip is damaged due to the fact that the pressure chip bears pressure exceeding the rated pressure of reverse deformation because the pressure difference between the second cavity and the first cavity is too large as the sealing cover continues to descend, and the effect of protecting the pressure chip is achieved; can also be used for regulating PMAXThe specific numerical value of (2) to meet the preparation of pressure sensor modules with different measuring ranges.
Preferably, the cross-sectional area of the second cavity is larger than that of the third cavity, a sealing column is fixedly arranged in the middle of the upper end of the sealing cover, and the upper end of the sealing column extends into the third cavity and is in sliding sealing with the third cavity; a sealing column and a third cavity are arranged, and K is changed mainly through the structure0A constant is used for adjusting the deformation speed of the pressure chip in the first stage, namely, the corresponding sensitivity is adjusted; simultaneously, the sealing column and the third cavity can also play a role in guiding, so that the sealing cover can move downwards vertically better, and the inclined clamping is avoided.
Preferably, the sealing column is connected with the top end of the third cavity through a spring; on one hand, the dead weight of the sealing column and the sealing cover can be counteracted through the spring, and the problem that the air of the second cavity is compressed by the dead weight of the sealing column and the sealing cover to generate an initial pressure to influence the measuring accuracy is avoided; on the other hand, the spring can also play the effect that sealed post and sealed cowling reset when gaseous pressure release.
Preferably, an adjusting rod abutting against the top end of the sealing column is arranged in the third cavity, the adjusting rod penetrates through the top of the third cavity and extends out of the shell, an adjusting knob is arranged at the upper end of the adjusting rod, and the adjusting rod and the shell are in sliding sealing; when the pressure-regulating device is used, the regulating knob rotates to drive the regulating rod to move downwards, so that the regulating rod extrudes the sealing column to move downwards, the sealing cover is pushed to move downwards to compress air in the second cavity, and an initial constant pressure P is generated0When we locate the adjusting rod at the lowest position to make the pressure P constant0＝PMAXIn this case, the pressure chip can directly start the deformation in the second stage by skipping the deformation in the first stage, and therefore the maximum pressure that can be measured is the maximum deformation pressure and P of the pressure chipMAXAnd S, the sensitivity and the measuring range of the pressure sensor module are improved in proportion, and the maximum measuring range can be twice of the original design measuring range.
Preferably, a plurality of grooves matched with the adjusting rod and the sealing plug are formed in the shell, and a plurality of groups of sealing rings are arranged in the grooves. A stamping type fully-closed structure is formed in the shell in a sealing ring mode, and the problem that the poor sealing performance influences the pressure of the mounting cavity or the third cavity and further influences the detection sensitivity is avoided.
The invention has the following beneficial effects:
1. according to the pressure sensor module, under the condition that the maximum deformation of the pressure chip is not changed, the pressure chip deforms downwards in a reverse direction under small pressure and deforms upwards in a forward direction under large pressure through the arrangement of the second cavity and the first cavity, the sensitivity and the measuring range of the pressure sensor module are improved in proportion under the condition of low cost, and the maximum measuring range can be twice of the original design measuring range.
2. According to the pressure sensor module, the annular limiting table is arranged, so that the situation that the pressure chip is damaged due to the fact that the pressure chip bears pressure exceeding the rated pressure of reverse deformation because the pressure difference between the second cavity and the first cavity is too large due to the fact that the sealing cover continues to move downwards is avoided, and the effect of protecting the pressure chip is achieved; can also be used for regulating PMAXThe specific numerical value of (2) to meet the preparation of pressure sensor modules with different measuring ranges.
3. The pressure sensor module provided by the invention is provided with the sealing column and the third cavity, and the K is changed mainly through the structure0A constant is used for adjusting the deformation speed of the pressure chip in the first stage, namely, the corresponding sensitivity is adjusted; simultaneously, the sealing column and the third cavity can also play a role in guiding, so that the sealing cover can move downwards vertically better, and the inclined clamping is avoided.
4. According to the pressure sensor module, the gas is introduced into the mounting cavity in the mode of the gas flow channel to provide reverse pressure, and extra medium is not required to be injected into the upper part of the pressure chip, so that the structure is simplified, the integral sealing performance is improved, and the stability and the accuracy of the pressure sensor module are improved.
Drawings
The invention will be further explained with reference to the drawings.
FIG. 1 is a perspective view of the present invention;
FIG. 2 is a top view of the present invention;
FIG. 3 is a cross-sectional view taken along line A-A of FIG. 2;
FIG. 4 is an enlarged view of a portion of FIG. 3 at B;
FIG. 5 is an enlarged view of a portion of FIG. 3 at C;
in the figure:
the air inlet pipe comprises a shell 1, an air inlet pipe 2, an air outlet pipe 3, an adjusting rod 4, a first cavity 5, an air flow channel 6, an annular boss 7, a flexible base 8, a pressure chip 9, a sealing cover 10, a second cavity 11, a mounting cavity 12, a sealing column 13, a drainage channel 14, a third cavity 15, a wiring hole 16, a sealing plug 17, an annular limiting table 18 and a spring 19.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
As shown in fig. 1 to 5, the technical solution adopted by the present invention to solve the technical problem is: a pressure sensor module comprises a shell 1, wherein an air inlet pipe 2 is arranged on the right side of the lower end of the shell 1, and an outlet pipe 3 is arranged on the right side of the upper end of the shell 1; a first cavity 5, a mounting cavity 12 and a third cavity 15 are sequentially arranged in the shell 1 from bottom to top, the first cavity 5 is communicated with the air inlet pipe 2 through an airflow channel 6, the mounting cavity 12 is communicated with the wire outlet pipe 3 through a wiring hole 16, and a sealing plug 17 is arranged in the wire outlet pipe 3; an annular boss 7 coaxial with the first cavity 5 is arranged in the mounting cavity 12, a sealing cover 10 capable of moving up and down is sleeved outside the annular boss 7, a flexible base 8 for sealing the top end of the first cavity 5 is arranged at the lower end of the annular boss 7, a pressure chip 9 is arranged on the flexible base 8, a lead of the pressure chip 9 extends out of the wire outlet pipe 3 through a wiring hole 16, a sealing space formed among the pressure chip 9, the annular boss 7 and the sealing cover 10 is a second cavity 11, and the cross sectional area of the second cavity 11 is larger than that of the first cavity 5; the lower end of the third cavity 15 is communicated with the upper end of the mounting cavity 12, and the upper end of the third cavity is communicated with the air inlet pipe 2 through a drainage channel 14.
When the air pressure booster is used, a part of air enters the first cavity 5 through the air inlet pipe 2 and the air flow channel 6 to squeeze the lower surface of the pressure chip 9, meanwhile, a part of air enters the third cavity 15 through the flow guide channel 14 and continues to enter the installation cavity 12 through the third cavity 15, the upper surface of the sealing cover 10 is squeezed to enable the sealing cover 10 to move downwards, the sealing cover 10 moves downwards to squeeze air in the second cavity 11 to boost the pressure due to the fact that the second cavity 11 is a sealed space, the boosting amplitude of the second cavity 11 is larger than that of the installation cavity 12 due to the fact that the outer diameter of the sealing cover 10 is larger than the inner diameter of the sealing cover, the pressure boosting amplitude of the second cavity 11 is larger than that of the installation cavity 12, and the pressure of the installation cavity 12 is the same as that of the first cavity2Greater than the pressure P of the first cavity 51At this time, the pressure chip 9 is deformed in a downward reverse direction and follows P1Gradually approaches the reverse maximum deformation of the pressure chip 9 until the sealing cap 10 is moved down to the bottom of the mounting cavity 12, at which time the pressure chip 9 reaches the reverse maximum deformation, and then, regardless of P1In any case, the second cavity 11 is no longer compressed, thus reaching the maximum deformation P after reversal2Is a fixed value PMAXFollowing P1The pressure chip 9 gradually eliminates the reverse deformation and changes into the forward deformation until the maximum forward deformation is reached; therefore, the measuring range of the pressure sensor module is proportionally increased to the originally designed measuring range, and the corresponding sensitivity is also greatly improved.
Specifically, in the first stage, before the pressure chip 9 reaches the maximum deformation in the reverse direction, the pressure chip 9 is stressed by F ═ P (P)1-P2) S, where S is the effective active area of the pressure chip 9 and P2And P1The pressure chip 9 is stressed by F-K0P1S，K0The K can be constant by reasonably designing the structures of the sealing cover 10 and the like0The value is between-1 and 0, and the measurable P can be effectively improved corresponding to the maximum stress of the pressure chip 91The measuring range of the pressure sensor module is further improved; in the second stage, after the pressure chip 9 reaches the maximum deformation in the reverse direction, the pressure chip 9 is stressed by F ═ P1-PMAX)S＝P1S-PMAXS, due to PMAXIs a fixed value, so that the corresponding measuring range when the pressure chip 9 is subjected to reverse maximum deformation can be increased by PMAXEven if its range is increased.
As an embodiment of the present invention, an annular limiting table 18 is arranged in the sealing cover 10 above the annular boss 7, and is used for limiting the downward movement of the sealing cover 10; the arrangement of the annular boss 7 avoids the situation that the pressure chip 9 is damaged due to the fact that the pressure chip 9 bears pressure exceeding the rated pressure of reverse deformation because the pressure difference between the inside of the second cavity 11 and the first cavity 5 is too large as the sealing cover 10 continues to descend, and the effect of protecting the pressure chip 9 is achieved; can also be used for regulating PMAXSpecific numerical values ofSo as to meet the preparation of pressure sensor modules with different measuring ranges.
As an embodiment of the present invention, the cross-sectional area of the second cavity 11 is larger than that of the third cavity 15, a sealing post 13 is fixedly disposed in the middle of the upper end of the sealing cover 10, and the upper end of the sealing post 13 extends into the third cavity 15 and is in sliding seal with the third cavity 15; a sealing column 13 and a third cavity 15 are arranged, and K is changed mainly through the structure0A constant, so as to adjust the deformation speed of the pressure chip 9 in the first stage, i.e. adjust the corresponding sensitivity; meanwhile, the sealing column 13 and the third cavity 15 can also play a role in guiding, so that the sealing cover 10 can better vertically move downwards, and the inclined clamping is avoided.
In one embodiment of the invention, the sealing column 13 is connected with the top end of the third cavity 15 through a spring 19; on one hand, the dead weight of the sealing column 13 and the sealing cover 10 can be counteracted through the spring 19, so that the problem that the air of the second cavity 11 is compressed by the dead weight of the sealing column 13 and the sealing cover 10 to generate initial pressure to influence the measuring accuracy is avoided; on the other hand, the spring 19 can also function to return the seal post 13 and the seal cover 10 when the gas is released.
As an embodiment of the present invention, an adjusting rod 4 abutting against the top end of the sealing column 13 is arranged in the third cavity 15, the adjusting rod 4 extends out of the housing 1 through the top of the third cavity 15, an adjusting knob is arranged at the upper end of the adjusting rod 4, and the adjusting rod 4 and the housing 1 are in sliding seal; when the pressure-regulating device is used, the regulating knob rotates to drive the regulating rod 4 to move downwards, so that the regulating rod 4 extrudes the sealing column 13 to move downwards, the sealing cover 10 is further pushed to move downwards to compress air in the second cavity 11, and an initial constant pressure P is generated0When we position the adjusting rod 4 at the lowest position to make the pressure P constant0＝PMAXIn this case, since the pressure chip 9 can be caused to skip the first-stage deformation and start the second-stage deformation directly, the maximum pressure that can be measured is the maximum deformation pressure and P of the pressure chip 9MAXAnd S, the sensitivity and the measuring range of the pressure sensor module are improved in proportion, and the maximum measuring range can be twice of the original design measuring range.
As an embodiment of the present invention, grooves matching with the adjusting rod 4 and the sealing plug 17 are provided in the housing 1, and a plurality of sets of sealing rings are provided in the grooves. A stamping type full-closed structure is formed in the shell 1 in a sealing ring mode, and the influence of poor sealing performance on the pressure of the mounting cavity 12 or the third cavity 15 and further on the detection sensitivity is avoided.
When the air pressure booster is used, a part of air enters the first cavity 5 through the air inlet pipe 2 and the air flow channel 6 to squeeze the lower surface of the pressure chip 9, meanwhile, a part of air enters the third cavity 15 through the flow guide channel 14 and continues to enter the installation cavity 12 through the third cavity 15, the upper surface of the sealing cover 10 is squeezed to enable the sealing cover 10 to move downwards, the sealing cover 10 moves downwards to squeeze air in the second cavity 11 to boost the pressure due to the fact that the second cavity 11 is a sealed space, the boosting amplitude of the second cavity 11 is larger than that of the installation cavity 12 due to the fact that the outer diameter of the sealing cover 10 is larger than the inner diameter of the sealing cover, the pressure boosting amplitude of the second cavity 11 is larger than that of the installation cavity 12, and the pressure of the installation cavity 12 is the same as that of the first cavity2Greater than the pressure P of the first cavity 51At this time, the pressure chip 9 is deformed in a downward reverse direction and follows P1Gradually approaches the reverse maximum deformation of the pressure chip 9 until the sealing cap 10 is moved down to the bottom of the mounting cavity 12, at which time the pressure chip 9 reaches the reverse maximum deformation, and then, regardless of P1In any case, the second cavity 11 is no longer compressed, thus reaching the maximum deformation P after reversal2Is a fixed value PMAXFollowing P1The pressure chip 9 gradually eliminates the reverse deformation and changes into the forward deformation until the maximum forward deformation is reached; therefore, at the moment, the measuring range of the pressure sensor module is increased to the originally designed measuring range in proportion, and the corresponding sensitivity is also greatly improved; the arrangement of the annular boss 7 avoids the situation that the pressure chip 9 is damaged due to the fact that the pressure chip 9 bears pressure exceeding the rated pressure of reverse deformation because the pressure difference between the inside of the second cavity 11 and the first cavity 5 is too large as the sealing cover 10 continues to descend, and the effect of protecting the pressure chip 9 is achieved; can also be used for regulating PMAXTo meet the pressure of different measuring rangesPreparing a sensor module; a sealing column 13 and a third cavity 15 are arranged, and K is changed mainly through the structure0A constant, so as to adjust the deformation speed of the pressure chip 9 in the first stage, i.e. adjust the corresponding sensitivity; meanwhile, the sealing column 13 and the third cavity 15 can also play a role in guiding, so that the sealing cover 10 can better vertically move downwards, and the inclined clamping is avoided; the spring 19 is arranged, on one hand, the dead weight of the sealing column 13 and the sealing cover 10 can be counteracted through the spring 19, and the problem that the air of the second cavity 11 is compressed by the dead weight of the sealing column 13 and the sealing cover 10 to generate an initial pressure to influence the measuring accuracy is avoided; on the other hand, the spring 19 can also play a role in resetting the sealing column 13 and the sealing cover 10 when the air is released; the adjusting rod 4 is arranged, the adjusting rod 4 can be manually adjusted to enable the pressure chip 9 to be subjected to reverse maximum deformation, and the measured maximum pressure is the maximum deformation pressure and P of the pressure chipMAXAnd S, the sensitivity and the measuring range of the pressure sensor module are improved in proportion, and the maximum measuring range can be twice of the original design measuring range.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. A pressure sensor module, characterized by: the air inlet pipe comprises a shell (1), wherein an air inlet pipe (2) is arranged on the right side of the lower end of the shell (1), and an air outlet pipe (3) is arranged on the right side of the upper end of the shell (1); a first cavity (5), a mounting cavity (12) and a third cavity (15) are sequentially arranged in the shell (1) from bottom to top, the first cavity (5) is communicated with the air inlet pipe (2) through an airflow channel (6), the mounting cavity (12) is communicated with the wire outlet pipe (3) through a wiring hole (16), and a sealing plug (17) is arranged in the wire outlet pipe (3); an annular boss (7) coaxial with the first cavity (5) is arranged in the mounting cavity (12), a sealing cover (10) capable of moving up and down is sleeved outside the annular boss (7), a flexible base (8) for sealing the top end of the first cavity (5) is arranged at the lower end of the annular boss (7), a pressure chip (9) is arranged on the flexible base (8), a lead of the pressure chip (9) extends out of the wire outlet pipe (3) through a wiring hole (16), a sealing space formed among the pressure chip (9), the annular boss (7) and the sealing cover (10) is a second cavity (11), and the cross-sectional area of the second cavity (11) is larger than that of the first cavity (5); the lower end of the third cavity (15) is communicated with the upper end of the mounting cavity (12), and the upper end of the third cavity is communicated with the air inlet pipe (2) through a drainage channel (14).
2. A pressure sensor module according to claim 1, characterized in that: an annular limiting table (18) is arranged in the sealing cover (10) above the annular boss (7) and used for limiting the descending of the sealing cover (10).
3. A pressure sensor module according to claim 2, characterized in that: the cross-sectional area of second cavity (11) is greater than the cross-sectional area of third cavity (15), fixed sealing post (13) that is provided with in sealed cowling (10) upper end middle part, sealing post (13) upper end extends to in third cavity (15) and with third cavity (15) sliding seal.
4. A pressure sensor module according to claim 3, characterized in that: the sealing column (13) is connected with the top end of the third cavity (15) through a spring (19).
5. A pressure sensor module according to claim 3 or 4, characterized in that: be provided with in third cavity (15) and adjust pole (4) of contradicting with sealed post (13) top, adjust pole (4) and pass third cavity (15) top and extend to outside casing (1), it is provided with adjust knob to adjust pole (4) upper end, it is sliding seal between pole (4) and casing (1) to adjust.
6. A pressure sensor module according to claim 5, characterized in that: the novel adjustable sealing device is characterized in that grooves matched with the adjusting rod (4) and the sealing plug (17) are formed in the shell (1), a plurality of groups of sealing rings are arranged in the grooves, and the sealing rings are arranged in the grooves.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010427086.1A CN111595507A (en) | 2020-05-19 | 2020-05-19 | Pressure sensor module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010427086.1A CN111595507A (en) | 2020-05-19 | 2020-05-19 | Pressure sensor module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111595507A true CN111595507A (en) | 2020-08-28 |
Family
ID=72187401
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010427086.1A Withdrawn CN111595507A (en) | 2020-05-19 | 2020-05-19 | Pressure sensor module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111595507A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112161730A (en) * | 2020-09-27 | 2021-01-01 | 张红卫 | Pressure sensor and protective sleeve structure |
-
2020
- 2020-05-19 CN CN202010427086.1A patent/CN111595507A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112161730A (en) * | 2020-09-27 | 2021-01-01 | 张红卫 | Pressure sensor and protective sleeve structure |
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Application publication date: 20200828 |
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| WW01 | Invention patent application withdrawn after publication |