CN111592846A - Epoxy adhesive for preparing prefabricated wallboard mold and preparation method thereof - Google Patents
Epoxy adhesive for preparing prefabricated wallboard mold and preparation method thereof Download PDFInfo
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- CN111592846A CN111592846A CN201910867442.9A CN201910867442A CN111592846A CN 111592846 A CN111592846 A CN 111592846A CN 201910867442 A CN201910867442 A CN 201910867442A CN 111592846 A CN111592846 A CN 111592846A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/44—Amides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention provides an epoxy adhesive for preparing an assembly type prefabricated wallboard mould and a preparation method thereof, wherein the epoxy adhesive comprises the following raw materials in parts by weight: 35-40 parts of bisphenol A epoxy resin E5135-40 parts, 5-10 parts of glycidyl ether, 0.1-0.3 part of defoaming agent, 0.1-0.3 part of coupling agent, 50-60 parts of active silicon powder, 5-10 parts of aluminum hydroxide, 30-40 parts of 4' diaminodiphenylmethane, 20-30 parts of propylene carbonate, 10-20 parts of Mannich amine, 10-40 parts of polyamide, 0.1-0.3 part of dibutyltin dilaurate and 0.1-0.5 part of thixotropic agent. The prefabricated wallboard manufacturing die for the prefabricated building manufactured by the scheme has the advantages of high compressive strength, high temperature resistance, good toughness, strong wear resistance, strong scratch resistance, high surface smoothness, high reuse rate and good durability. The number of the prefabricated wall panels of the prefabricated building manufactured by one mold is increased by several times, so that the manufacturing cost of each prefabricated wall panel of the prefabricated building is reduced to one fourth of the original manufacturing cost, and the prefabricated wall panel has great economic benefit.
Description
Technical Field
The invention relates to the technical field of adhesives, in particular to an epoxy adhesive for preparing an assembly type prefabricated wallboard mold and a preparation method thereof.
Background
With the rapid progress of urbanization in China, the demand for house reconstruction and new construction is increasing, and the modular assembly type building has the characteristics of energy conservation, water conservation, land conservation, material conservation and environmental protection.
The mass production of the prefabricated wall panels greatly improves the production efficiency, reduces the energy conservation in all aspects and has great economic benefit. Because the prefabricated wall panels need different designs and patterns and different sizes, the mass production of the prefabricated wall panels needs a large number of manufacturing molds, and the importance of mold forming materials is highlighted.
The existing mould forming material generally selects unsaturated resin as the forming material, the unsaturated resin contains a large amount of solvent, the smell is very big, volatile substances (styrene) account for 25-30%, the components of the used curing agent and the accelerator are peroxide and heavy metal, the mould forming material has the characteristics of flammability and explosiveness, the danger coefficient is increased in the processes of storage, transportation and use, and the threat to the physical health of operators and the protection of the environment are caused to different degrees.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides an epoxy adhesive for preparing an assembly type prefabricated wallboard mould and a preparation method thereof.
In order to achieve the purpose, the invention is realized by the following technical scheme:
an epoxy adhesive for preparing an assembly type prefabricated wallboard mould comprises the following raw materials in parts by weight: 35-40 parts of bisphenol A epoxy resin E5135-40 parts, 5-10 parts of glycidyl ether, 0.1-0.3 part of defoaming agent, 0.1-0.3 part of coupling agent, 50-60 parts of active silicon powder, 5-10 parts of aluminum hydroxide, 30-40 parts of 4' diaminodiphenylmethane, 20-30 parts of propylene carbonate, 10-20 parts of Mannich amine, 10-40 parts of polyamide, 0.1-0.3 part of dibutyltin dilaurate and 0.1-0.5 part of thixotropic agent.
Preferably, the epoxy adhesive comprises the following raw materials in parts by weight: bisphenol A epoxy resin E5137-40 parts, glycidyl ether 7-10 parts, defoaming agent 0.1-0.2 part, coupling agent 0.1-0.2 part, active silicon micropowder 55-60 parts, aluminum hydroxide 7-10 parts, 4' diaminodiphenylmethane 35-40 parts, propylene carbonate 25-30 parts, Mannich amine 10-15 parts, polyamide 20-30 parts, dibutyltin dilaurate 0.1-0.2 part and thixotropic agent 0.2-0.5 part.
Preferably, the coupling agent is a silane coupling agent kh 550.
The preparation method of the epoxy adhesive for preparing the prefabricated wallboard mould comprises the following steps:
(1) weighing the raw materials of the component A in sequence by mass: bisphenol A type epoxy resin E51, glycidyl ether, a defoaming agent and a coupling agent, sequentially adding the components into a high-speed dispersion machine for dispersion, weighing and adding active silicon micro powder and aluminum hydroxide after dispersing to uniform liquid, and then continuously dispersing at high speed to uniform viscous liquid to obtain a mixture A1;
(2) weighing the raw materials of the component B in parts by weight: 4' diaminodiphenylmethane and propylene carbonate are sequentially added into a heating reaction kettle, the heating reaction kettle is heated for 3.5 to 4 hours under a certain temperature condition, and then the mannite and the polyamide are weighed and added, and the mixture B1 is obtained after the mixture is stirred to be uniform liquid;
(3) adding the mixed solution A1 and the mixed solution B1 into a reaction kettle, simultaneously adding dibutyltin dilaurate and a thixotropic agent, and stirring for a certain time until the mixed solution A1 and the mixed solution B1 are uniformly mixed to obtain the composite material.
Preferably, the speed of the two high-speed dispersions in the step (1) is 700-800 r/min.
Preferably, the heating temperature in the step (2) is 85-90 ℃.
Preferably, the stirring time in the step (3) is 5 to 10 minutes.
The invention has the beneficial effects that:
(1) in the scheme, the polyamide used as the curing agent is liquid low-molecular-weight resin, has small volatility, no toxicity and good compatibility with bisphenol A epoxy resin, has a toughening effect, is used for preparing the epoxy adhesive and improves the impact strength of the epoxy adhesive.
(2) In the scheme, hydroxyl in the bisphenol A type epoxy resin and ether bonds in the glycidyl ether have high polarity, so that electrostatic attraction is generated between the epoxy resin and an interface, and the epoxy resin can also react with free radicals on the surface of a medium to form chemical bonds, so that the bonding force of the prepared epoxy adhesive is enhanced.
(3) In the scheme, the amide group on the polyamide can react with phenolic hydroxyl in bisphenol A epoxy resin, so that the reaction activity is greatly enhanced, the curing reaction speed of the amide group and an epoxy group is increased, a highly-meshed cross-linking structure is easily formed, and meanwhile, the thermal deformation temperature is further increased due to the phenolic aldehyde skeleton structure, the defects of heat resistance and corrosion resistance of a cured resin are overcome, so that the polyamide is used for synthesizing an epoxy adhesive, and the heat resistance and corrosion resistance of the epoxy adhesive are improved.
(4) The active silicon micro powder is non-toxic and tasteless, has the advantages of high hardness, high temperature resistance, acid and alkali corrosion resistance and chemical stability, and is used for preparing the epoxy adhesive, so that the hardness of the epoxy adhesive is enhanced.
(5) The prefabricated wallboard manufacturing die for the prefabricated building manufactured by the scheme has the advantages of high compressive strength, high temperature resistance, good toughness, strong wear resistance, strong scratch resistance, high surface smoothness, high reuse rate and good durability. The number of the prefabricated wall panels of the prefabricated building manufactured by one mold is increased by several times, so that the manufacturing cost of each prefabricated wall panel of the prefabricated building is reduced to one fourth of the original manufacturing cost, and the prefabricated wall panel has great economic benefit.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1:
an epoxy adhesive for preparing an assembly type prefabricated wallboard mould comprises the following raw materials in parts by weight: the coating comprises, by weight, 5135 parts of bisphenol A epoxy resin E, 10 parts of glycidyl ether, 0.1 part of a defoaming agent, 0.3 part of a coupling agent, 50 parts of active silicon micropowder, 10 parts of aluminum hydroxide, 30 parts of 4' diaminodiphenylmethane, 30 parts of propylene carbonate, 10 parts of Mannich amine, 40 parts of polyamide, 0.1 part of dibutyltin dilaurate and 0.5 part of a thixotropic agent.
The preparation method of the epoxy adhesive for preparing the prefabricated wallboard mould comprises the following steps:
(1) weighing the raw materials of the component A in sequence by mass: the preparation method comprises the following steps of (1) sequentially adding bisphenol A type epoxy resin E51, glycidyl ether, a defoaming agent and a coupling agent into a high-speed dispersion machine, dispersing all the components into uniform liquid at the rotating speed of 700r/min, weighing and adding active silicon micro powder and aluminum hydroxide, and then continuously dispersing into uniform viscous liquid at the rotating speed of 800r/min to obtain a mixture A1;
(2) weighing the raw materials of the component B in parts by weight: 4' diaminodiphenylmethane and propylene carbonate are sequentially added into a heating reaction kettle, the heating reaction kettle is heated for 4 hours at the temperature of 85 ℃, and then the Mannich amine and the polyamide are weighed and added, and the mixture is stirred to be uniform liquid, so that a mixture B1 is obtained;
(3) and adding the mixed solution A1 and the mixed solution B1 into a reaction kettle, simultaneously adding dibutyltin dilaurate and a thixotropic agent, and stirring for 5 minutes to obtain the catalyst.
Example 2:
an epoxy adhesive for preparing an assembly type prefabricated wallboard mould comprises the following raw materials in parts by weight: the coating comprises, by weight, 5140 parts of bisphenol A epoxy resin E, 5 parts of glycidyl ether, 0.3 part of a defoaming agent, 0.1 part of a coupling agent, 60 parts of active silicon micropowder, 5 parts of aluminum hydroxide, 40 parts of 4' diaminodiphenylmethane, 20 parts of propylene carbonate, 20 parts of Mannich amine, 10 parts of polyamide, 0.1 part of dibutyltin dilaurate and 0.5 part of a thixotropic agent.
The preparation method of the epoxy adhesive for preparing the prefabricated wallboard mould comprises the following steps:
(1) weighing the raw materials of the component A in sequence by mass: the preparation method comprises the following steps of (1) sequentially adding bisphenol A type epoxy resin E51, glycidyl ether, a defoaming agent and a coupling agent into a high-speed dispersion machine, dispersing all the components into uniform liquid at the rotating speed of 800r/min, weighing and adding active silicon micro powder and aluminum hydroxide, and then continuously dispersing into uniform viscous liquid at the rotating speed of 700r/min to obtain a mixture A1;
(2) weighing the raw materials of the component B in parts by weight: 4' diaminodiphenylmethane and propylene carbonate are sequentially added into a heating reaction kettle, the heating reaction kettle is heated for 3.5 hours at the temperature of 90 ℃, and then the mannite and the polyamide are weighed and added, and the mixture is stirred to be uniform liquid, so that a mixture B1 is obtained;
(3) adding the mixed solution A1 and the mixed solution B1 into a reaction kettle, simultaneously adding dibutyltin dilaurate and a thixotropic agent, and stirring for 10 minutes to obtain the catalyst.
Example 3:
an epoxy adhesive for preparing an assembly type prefabricated wallboard mould comprises the following raw materials in parts by weight: the coating comprises, by weight, 5137 parts of bisphenol A epoxy resin, 10 parts of glycidyl ether, 0.1 part of a defoaming agent, 0.2 part of a coupling agent, 55 parts of active silicon micropowder, 10 parts of aluminum hydroxide, 35 parts of 4' diaminodiphenylmethane, 30 parts of propylene carbonate, 10 parts of Mannich amine, 30 parts of polyamide, 0.1 part of dibutyltin dilaurate and 0.5 part of a thixotropic agent.
The preparation method of the epoxy adhesive for preparing the prefabricated wallboard mould comprises the following steps:
(1) weighing the raw materials of the component A in sequence by mass: the preparation method comprises the following steps of (1) sequentially adding bisphenol A type epoxy resin E51, glycidyl ether, a defoaming agent and a coupling agent into a high-speed dispersion machine, dispersing all the components into uniform liquid at the rotating speed of 700r/min, weighing and adding active silicon micro powder and aluminum hydroxide, and then continuously dispersing into uniform viscous liquid at the rotating speed of 800r/min to obtain a mixture A1;
(2) weighing the raw materials of the component B in parts by weight: 4' diaminodiphenylmethane and propylene carbonate are sequentially added into a heating reaction kettle, the heating reaction kettle is heated for 4 hours at the temperature of 85 ℃, and then the Mannich amine and the polyamide are weighed and added, and the mixture is stirred to be uniform liquid, so that a mixture B1 is obtained;
(3) and adding the mixed solution A1 and the mixed solution B1 into a reaction kettle, simultaneously adding dibutyltin dilaurate and a thixotropic agent, and stirring for 5 minutes to obtain the catalyst.
Example 4:
an epoxy adhesive for preparing an assembly type prefabricated wallboard mould comprises the following raw materials in parts by weight: the coating comprises, by weight, 5140 parts of bisphenol A epoxy resin E, 7 parts of glycidyl ether, 0.2 part of a defoaming agent, 0.1 part of a coupling agent, 60 parts of active silicon micropowder, 7 parts of aluminum hydroxide, 40 parts of 4' diaminodiphenylmethane, 25 parts of propylene carbonate, 15 parts of Mannich amine, 20 parts of polyamide, 0.2 part of dibutyltin dilaurate and 0.2 part of a thixotropic agent.
The preparation method of the epoxy adhesive for preparing the prefabricated wallboard mould comprises the following steps:
(1) weighing the raw materials of the component A in sequence by mass: the preparation method comprises the following steps of (1) sequentially adding bisphenol A type epoxy resin E51, glycidyl ether, a defoaming agent and a coupling agent into a high-speed dispersion machine, dispersing all the components into uniform liquid at the rotating speed of 800r/min, weighing and adding active silicon micro powder and aluminum hydroxide, and then continuously dispersing into uniform viscous liquid at the rotating speed of 700r/min to obtain a mixture A1;
(2) weighing the raw materials of the component B in parts by weight: 4' diaminodiphenylmethane and propylene carbonate are sequentially added into a heating reaction kettle, the heating reaction kettle is heated for 3.5 hours at the temperature of 90 ℃, and then the mannite and the polyamide are weighed and added, and the mixture is stirred to be uniform liquid, so that a mixture B1 is obtained;
(3) adding the mixed solution A1 and the mixed solution B1 into a reaction kettle, simultaneously adding dibutyltin dilaurate and a thixotropic agent, and stirring for 10 minutes to obtain the catalyst.
The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (7)
1. The epoxy adhesive for preparing the prefabricated wallboard mould is characterized by comprising the following raw materials in parts by weight: 35-40 parts of bisphenol A epoxy resin E5135-40 parts, 5-10 parts of glycidyl ether, 0.1-0.3 part of defoaming agent, 0.1-0.3 part of coupling agent, 50-60 parts of active silicon powder, 5-10 parts of aluminum hydroxide, 30-40 parts of 4' diaminodiphenylmethane, 20-30 parts of propylene carbonate, 10-20 parts of Mannich amine, 10-40 parts of polyamide, 0.1-0.3 part of dibutyltin dilaurate and 0.1-0.5 part of thixotropic agent.
2. The epoxy adhesive for preparing the prefabricated wallboard mold of claim 1, wherein the epoxy adhesive comprises the following raw materials in parts by weight: bisphenol A epoxy resin E5137-40 parts, glycidyl ether 7-10 parts, defoaming agent 0.1-0.2 part, coupling agent 0.1-0.2 part, active silicon micropowder 55-60 parts, aluminum hydroxide 7-10 parts, 4' diaminodiphenylmethane 35-40 parts, propylene carbonate 25-30 parts, Mannich amine 10-15 parts, polyamide 20-30 parts, dibutyltin dilaurate 0.1-0.2 part and thixotropic agent 0.2-0.5 part.
3. The epoxy resin concrete for grouting at a bridge expansion joint and a road-bridge joint according to claim 2, wherein the coupling agent is a silane coupling agent kh 550.
4. A method for preparing an epoxy glue for the preparation of prefabricated wall panel forms according to any one of claims 1 to 3, characterized in that it comprises the following steps:
(1) weighing the raw materials of the component A in sequence by mass: bisphenol A type epoxy resin E51, glycidyl ether, a defoaming agent and a coupling agent, sequentially adding the components into a high-speed dispersion machine for dispersion, weighing and adding active silicon micro powder and aluminum hydroxide after dispersing to uniform liquid, and then continuously dispersing at high speed to uniform viscous liquid to obtain a mixture A1;
(2) weighing the raw materials of the component B in parts by weight: 4' diaminodiphenylmethane and propylene carbonate are sequentially added into a heating reaction kettle, the heating reaction kettle is heated for 3.5 to 4 hours under a certain temperature condition, and then the mannite and the polyamide are weighed and added, and the mixture B1 is obtained after the mixture is stirred to be uniform liquid;
(3) adding the mixed solution A1 and the mixed solution B1 into a reaction kettle, simultaneously adding dibutyltin dilaurate and a thixotropic agent, and stirring for a certain time until the mixed solution A1 and the mixed solution B1 are uniformly mixed to obtain the composite material.
5. The method for preparing epoxy adhesive for preparing prefabricated wallboard mold according to claim 4, wherein the speed of the two high speed dispersions in the step (1) is 700-800 r/min.
6. The method for preparing an epoxy glue for the preparation of prefabricated wall panel molds according to claim 4, wherein the heating temperature in the step (2) is 85-90 ℃.
7. The method for preparing an epoxy glue for the preparation of prefabricated wall panel molds according to claim 4, wherein the stirring time in the step (3) is 5-10 minutes.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910867442.9A CN111592846A (en) | 2019-09-12 | 2019-09-12 | Epoxy adhesive for preparing prefabricated wallboard mold and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910867442.9A CN111592846A (en) | 2019-09-12 | 2019-09-12 | Epoxy adhesive for preparing prefabricated wallboard mold and preparation method thereof |
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| CN111592846A true CN111592846A (en) | 2020-08-28 |
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Citations (5)
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|---|---|---|---|---|
| US20080199717A1 (en) * | 2007-02-15 | 2008-08-21 | Barker Michael J | Fast cure epoxy adhesive with enhanced adhesion to toughened sheet molding compound |
| CN102516502A (en) * | 2011-12-07 | 2012-06-27 | 湖南大学 | Preparation method of novel Mannich water-based epoxy curing agent |
| CN105925228A (en) * | 2016-06-06 | 2016-09-07 | 北京中德新亚建筑技术有限公司 | Multi-purpose modified epoxy resin adhesive |
| CN106753132A (en) * | 2016-12-29 | 2017-05-31 | 南通高盟新材料有限公司 | A kind of halogen-free flame-resistant high-temperature-resistant tough epoxy adhesive and preparation method thereof |
| CN107674622A (en) * | 2017-10-10 | 2018-02-09 | 山西省交通科学研究院 | A kind of band water environment reinforcing engineering high performance structural adhesives and preparation method thereof |
-
2019
- 2019-09-12 CN CN201910867442.9A patent/CN111592846A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080199717A1 (en) * | 2007-02-15 | 2008-08-21 | Barker Michael J | Fast cure epoxy adhesive with enhanced adhesion to toughened sheet molding compound |
| CN102516502A (en) * | 2011-12-07 | 2012-06-27 | 湖南大学 | Preparation method of novel Mannich water-based epoxy curing agent |
| CN105925228A (en) * | 2016-06-06 | 2016-09-07 | 北京中德新亚建筑技术有限公司 | Multi-purpose modified epoxy resin adhesive |
| CN106753132A (en) * | 2016-12-29 | 2017-05-31 | 南通高盟新材料有限公司 | A kind of halogen-free flame-resistant high-temperature-resistant tough epoxy adhesive and preparation method thereof |
| CN107674622A (en) * | 2017-10-10 | 2018-02-09 | 山西省交通科学研究院 | A kind of band water environment reinforcing engineering high performance structural adhesives and preparation method thereof |
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| Title |
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| 李广宇: "《世界精细化学产品质量标准汇编》", 31 January 2006 * |
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