CN111592636A - Process for preparing heat-conducting metal substrate by recycling waste epoxy resin - Google Patents
Process for preparing heat-conducting metal substrate by recycling waste epoxy resin Download PDFInfo
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- CN111592636A CN111592636A CN202010547323.8A CN202010547323A CN111592636A CN 111592636 A CN111592636 A CN 111592636A CN 202010547323 A CN202010547323 A CN 202010547323A CN 111592636 A CN111592636 A CN 111592636A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/22—Expanded, porous or hollow particles
- C08K7/24—Expanded, porous or hollow particles inorganic
- C08K7/26—Silicon- containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
Abstract
The invention relates to a process for preparing a heat-conducting metal substrate by recycling waste epoxy resin, which comprises the following steps: grinding diatomite containing waste epoxy resin, carbonizing the obtained ground particles by using a plasma jet process to form a graphite layer, adding other raw material components, mixing to form resin cement, and treating the resin cement to obtain the heat-conducting metal substrate. The invention carries out grinding treatment and plasmatization on the diatomite containing the waste epoxy resin, thereby improving the efficiency of the heat-conducting metal substrate; the invention effectively recycles the diatomite containing the epoxy resin, so that the waste becomes resource materials, the environment poison caused by the waste diatomite containing the epoxy resin can be effectively avoided, the extra carbon dioxide produced by burning the waste diatomite containing the epoxy resin in an incinerator is also avoided, the effect of global warming is relieved, and better environment is strived for the earth and human beings.
Description
Technical Field
The invention relates to the technical field of heat-conducting metal substrates, in particular to a process for preparing a heat-conducting metal substrate by recycling waste epoxy resin, and particularly relates to a heat-conducting metal substrate with good heat dissipation performance formed by recycling diatom ooze which is a byproduct in the process flow of producing epoxy resin and matching with proper materials.
Background
The heat-conducting metal substrate is a new material formed by combining different types of metal foils with epoxy resin and heat-conducting filler by applying an advanced material preparation technology. The heat-conducting metal substrate is mainly a metal circuit board material, belongs to an electronic general assembly, and has the characteristics of excellent heat dissipation, high mechanical strength, good processing performance and the like. The circuit substrate mainly applied to LED lighting materials is used as a requirement for carrying and circuit design, but the service life of the circuit substrate is reduced due to long-term lighting and heat storage of LED lamp particles, and the heat-conducting metal substrate with the heat-radiating function is generated correspondingly.
The propylene glycol and the epoxy chloropropane can be synthesized into propylene glycol type epoxy resin. When the repeating unit is less than 2 (n < 2), it is a low molecular weight epoxy resin having a softening point of less than 50 ℃ and is also called a basic type of propylene glycol type epoxy resin (e.g., NPEL-128 from Nanya plastics). When the repeating unit is between 2 and 5 (n ═ 2-5), it is a medium molecular weight epoxy resin, which has a softening point between about 50 ℃ and 95 ℃. When the repeating unit is more than 5 (n is more than 5), the epoxy resin is high molecular weight epoxy resin, and the softening point of the epoxy resin is more than 100 ℃. In the process for synthesizing the low molecular weight epoxy resin with the repeating unit less than 2 (n is less than 2), sodium chloride is generated in the process because a large amount of sodium hydroxide is used, so that the sodium chloride which is insoluble in the epoxy resin can be filtered completely. The process used porous diatomaceous earth for filtration, but this also produced epoxy-containing diatomaceous earth.
The diatomite containing epoxy resin is a harmful waste, and the produced manufacturers must deal with the qualified and qualified places according to the law of environmental protection and control by waste pollution. The most common mode is to send the epoxy resin to an incinerator for incineration treatment, so as to avoid the environmental toxicity caused by the waste epoxy resin. Incineration is the least economical and produces more carbon dioxide, increasing carbon emissions and causing global warming. How to effectively recycle diatomite containing epoxy resin to change garbage into resource substances and change waste into valuable is a problem to be solved.
Disclosure of Invention
The invention aims to provide a process for preparing a heat-conducting metal substrate by recycling waste epoxy resin, which recycles diatom ooze which is a byproduct in the process flow of producing the epoxy resin, and combines with proper materials to form the heat-conducting metal substrate with good heat dissipation performance, so that garbage is changed into resources, and a better environment is strived for the earth and human beings.
In order to achieve the above object, the present invention provides a process for preparing a heat conductive metal substrate by recycling waste epoxy resin, comprising the steps of: grinding diatomite containing waste epoxy resin, carbonizing the obtained ground particles by using a plasma jet process to form a graphite layer, adding other raw material components, mixing to form resin cement, and treating the resin cement to obtain the heat-conducting metal substrate.
Preferably, in the process for preparing the heat-conducting metal substrate by recycling the waste epoxy resin, the grinding is to grind the diatomite containing the waste epoxy resin to 1-4 μm. The diatomite containing epoxy resin has diatomite with particle size (150-200 μm), which is not suitable for use in heat-conducting metal substrate because of too large particle size. Generally, epoxy resins provide bonding force, but have poor thermal conductivity, and only rely on thermal conductive fillers to improve thermal conductivity. When the heat conductive filler particles are smaller, the gaps between the particles are smaller, and the heat conductive capability is relatively improved. The average particle size of diatomaceous earth for filtration is about 120 μm, particles are too large to be suitable as a heat conductive filler, and the average particle size of the heat conductive filler is about 1 to 4 μm, so that it is necessary to first reduce the particles of diatomaceous earth to a corresponding size; a fine grinding unit is added, and epoxy resin-containing diatomaceous earth (about 60% of diatomaceous earth and 40% of epoxy resin in composition) is placed in a grinder to be finely ground into particles having a diameter of about 1-4 μm, thereby increasing the filling capacity.
Preferably, in the process for preparing the heat-conducting metal substrate by recycling the waste epoxy resin, the plasma jet process comprises the step of carrying out 1300-1500 ℃ high-temperature environment treatment on the ground particles by adopting plasma jet. Fluorescent tubes in life are also applied to plasma flow; in a general fluorescent lamp, a filament coil made of tungsten is used at two ends, then low-pressure argon (or argon-neon mixed gas) and mercury vapor are filled in the tube, and a silver substance is coated on the inner wall of the tube; after the power is on, the current will flow through the filament to heat and release electrons, and further change the gas in the tube into a plasma flow state, and the temperature of the low-temperature plasma flow is 103-104K. The invention uses plasma current to carbonize the epoxy resin on the surface of the diatomite particles to form a graphite layer, and changes the non-heat-conducting surface resin into the easily heat-conducting property by the heat-conducting capability of the graphite, thereby improving the efficiency of the heat-conducting metal substrate.
Preferably, in the process of preparing the heat-conducting metal substrate by recycling the waste epoxy resin, the other raw material components comprise the epoxy resin, a curing agent, an accelerator, a heat-conducting filler and a solvent.
Preferably, in the process for preparing the heat-conducting metal substrate by recycling the waste epoxy resin, the other raw material components include epoxy resin, dicyandiamide, dimethylimidazole and aluminum oxide. Further preferably, in the process for preparing the heat-conducting metal substrate by recycling the waste epoxy resin, the other raw material components comprise, by weight: 13-22% of epoxy resin, 1% of dicyandiamide, 0-0.1% of dimethyl imidazole and 70% of aluminum oxide. Wherein, the weight percentage of the diatomite containing the waste epoxy resin is 8 percent to 16 percent, and the weight of the dimethyl imidazole does not include the endpoint of 0 percent.
Preferably, in the process for preparing the heat-conducting metal substrate by recycling the waste epoxy resin, the treatment comprises the steps of gluing, baking, cutting, overlapping and heating forming.
Preferably, in the process for preparing the heat-conductive metal substrate by recycling the waste epoxy resin, the treatment includes a step of heating and curing the resin mastic into a round cake. Further preferably, the diameter of the tortilla is 40-60mm and the thickness of the tortilla is 8-12 mm. Still more preferably, the diameter of the tortilla is 50mm and the thickness of the tortilla is 10 mm.
The technical scheme provided by the invention has the following beneficial effects: (1) the invention carries out grinding treatment and plasmatization on the diatomite containing the waste epoxy resin, thereby improving the efficiency of the heat-conducting metal substrate; according to the increase and decrease of the proportion of the epoxy resin and the filler, 16 percent of the diatomite containing the epoxy resin after grinding can be recycled; (2) the method emphasizes on the unchanged existing process flow, avoids influencing the existing line of a workshop and saves the arrangement and construction cost of factory equipment, so the diatomite containing the epoxy resin is separately treated, and the diatomite is uniformly mixed in a mixing tank which can be manually or automatically metered after the treatment; (3) the invention effectively avoids environmental toxicity caused by the waste diatomite containing the epoxy resin, also avoids the extra carbon dioxide produced by burning the waste diatomite containing the epoxy resin in an incinerator, slows down the effect of global warming and produces a pile of slag; the invention effectively recycles the diatomite containing the epoxy resin, so that garbage is changed into resource objects, and better environment is strived for by the earth and human beings.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
Fig. 1 is a process flow diagram for preparing a heat-conducting metal substrate by recycling waste epoxy resin provided by the invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. The following examples are only for illustrating the technical solutions of the present invention more clearly, and therefore are only examples, and the protection scope of the present invention is not limited thereby.
The experimental procedures in the following examples are conventional unless otherwise specified. The test materials used in the following examples were purchased from a conventional reagent store unless otherwise specified. In the quantitative tests in the following examples, three replicates were set, and the data are the mean or the mean ± standard deviation of the three replicates.
As shown in fig. 1, the present invention provides a process for preparing a heat conductive metal substrate by recycling waste epoxy resin, comprising the following steps.
The diatomite containing the waste epoxy resin and having the particle size of 150-200 mu m (the epoxy resin containing the diatomite and the diatom ooze) is finely ground in a grinding machine to be ground into particles with the particle size of 1-4 mu m, then the plasma jet process is used for carrying out 1300-1500 ℃ high-temperature environment treatment, the epoxy resin on the surfaces of the diatomite particles is carbonized to form a graphite layer, the non-heat-conducting surface layer resin is changed into a product with the property of easy heat conduction, and the diatomite (thermal plasma liquid) after grinding and plasma jet treatment is obtained.
According to the weight percentage, 8 to 16 percent of diatomite (thermal plasma liquid) after grinding and plasma flow treatment, 13 to 22 percent of epoxy resin, 1 percent of dicyandiamide, 0 to 0.1 percent of dimethyl imidazole and 70 percent of alumina are evenly mixed to form the resin daub.
Gluing the resin daub, baking, cutting into pieces, superposing, heating for forming, heating and curing into a round cake with the diameter of 40-60mm and the thickness of 8-12 mm. Heating to 140 deg.C, placing in iron plate (25 + -1 deg.C), measuring time and surface temperature, and observing heat dissipation capability.
The following will further explain the process for preparing the heat-conducting metal substrate by recycling the waste epoxy resin provided by the invention with reference to specific embodiments.
Example 1
The embodiment provides a process for preparing a heat-conducting metal substrate by recycling waste epoxy resin, which comprises the following steps.
The diatomite containing the waste epoxy resin and having the particle size of 150-200 mu m (the epoxy resin containing the diatomite and the diatom ooze) is finely ground in a grinding machine to be ground into particles with the particle size of 1-4 mu m, then the plasma jet process is used for carrying out high-temperature environment treatment at 1400 ℃, the epoxy resin on the surfaces of the diatomite particles is carbonized to form a graphite layer, the non-heat-conducting surface layer resin is changed into a product with easy heat conducting property, and the diatomite (thermal plasma liquid) after grinding and plasma jet treatment is obtained.
According to the weight percentage, 8 percent of diatomite (thermal plasma liquid) after grinding and plasma flow treatment, 20.9 percent of epoxy resin, 1 percent of dicyandiamide, 0.1 percent of dimethyl imidazole and 70 percent of alumina are evenly mixed to form the resin daub.
Gluing the resin daub, baking, cutting into pieces, superposing, heating for forming, heating and curing into a round cake with the diameter of 50mm and the thickness of 10 mm. Heating to 140 deg.C, placing in iron plate (25 + -1 deg.C), measuring time and surface temperature, and observing heat dissipation capability.
The results obtained are shown in table 1 below.
Table 1 temperature measurement results of example 1
| DEG C/unit | 0 minute | 1 minute | 2 minutes | 3 minutes | 4 minutes | 5 minutes | 6 minutes |
| Example 1 | 140 | 110.2 | 89.8 | 76.9 | 66.8 | 60.2 | 56.2 |
Example 2
The embodiment provides a process for preparing a heat-conducting metal substrate by recycling waste epoxy resin, which comprises the following steps.
The diatomite containing the waste epoxy resin and having the particle size of 150-200 mu m (the epoxy resin containing the diatomite and the diatom ooze) is finely ground in a grinding machine to be ground into particles with the particle size of 1-4 mu m, then the plasma jet process is used for carrying out high-temperature environment treatment at 1400 ℃, the epoxy resin on the surfaces of the diatomite particles is carbonized to form a graphite layer, the non-heat-conducting surface layer resin is changed into a product with easy heat conducting property, and the diatomite (thermal plasma liquid) after grinding and plasma jet treatment is obtained.
According to the weight percentage, 15.9 percent of diatomite (thermal plasma liquid) after grinding and plasma flow treatment, 13 percent of epoxy resin, 1 percent of dicyandiamide, 0.1 percent of dimethyl imidazole and 70 percent of alumina are evenly mixed to form the resin daub.
Gluing resin clay, baking, cutting into pieces, superposing, heating for molding, heating to solidify into round cake with diameter of 50mm and thickness of 10mm, heating to 140 deg.C, placing in iron plate (25 deg.C + -1 deg.C), measuring time and surface temperature, and observing heat dissipation capability.
The results obtained are shown in table 2 below.
Table 2 temperature measurement results of example 2
| DEG C/unit | 0 minute | 1 minute | 2 minutes | 3 minutes | 4 minutes | 5 minutes | 6 minutes |
| Example 2 | 140 | 108.4 | 86.7 | 72.8 | 62.7 | 56.2 | 52.4 |
Comparative example 1 (diatomaceous earth containing waste epoxy resin not added)
The comparative example provides a process for preparing a heat-conducting metal substrate by recycling waste epoxy resin, comprising the following steps.
According to the weight percentage, 28.9 percent of epoxy resin, 1 percent of dicyandiamide, 0.1 percent of dimethyl imidazole and 70 percent of alumina are evenly mixed to form the resin daub.
Gluing the resin daub, baking, cutting into pieces, superposing, heating for forming, heating and curing into a round cake with the diameter of 50mm and the thickness of 10 mm. Heating to 140 deg.C, placing in iron plate (25 + -1 deg.C), measuring time and surface temperature, and observing heat dissipation capability.
The results obtained are shown in table 3 below.
TABLE 3 results of temperature measurement of comparative example 1
| DEG C/unit | 0 minute | 1 minute | 2 minutes | 3 minutes | 4 minutes | 5 minutes | 6 minutes |
| Comparative example 1 | 140 | 111.7 | 92.6 | 80 | 70.7 | 64.5 | 61.4 |
Comparative example 2 (untreated diatomaceous earth containing waste epoxy resin)
The comparative example provides a process for preparing a heat-conducting metal substrate by recycling waste epoxy resin, comprising the following steps.
According to the weight percentage, 8 percent of diatomite (epoxy resin containing diatomite, diatom ooze) containing waste epoxy resin with the particle diameter of 150-200 mu m, 20.9 percent of epoxy resin, 1 percent of dicyandiamide, 0.1 percent of dimethyl imidazole and 70 percent of alumina are evenly mixed to form the resin daub.
Gluing the resin daub, baking, cutting into pieces, superposing, heating for forming, heating and curing into a round cake with the diameter of 50mm and the thickness of 10 mm. Heating to 140 deg.C, placing in iron plate (25 + -1 deg.C), measuring time and surface temperature, and observing heat dissipation capability.
The results obtained are shown in table 4 below.
Table 4 temperature measurement results of comparative example 2
| DEG C/unit | 0 minute | 1 minute | 2 minutes | 3 minutes | 4 minutes | 5 minutes | 6 minutes |
| Comparative example 2 | 140 | 112 | 93.2 | 81.1 | 72.1 | 66.3 | 63.4 |
Comparative example 3 (untreated diatomaceous earth containing waste epoxy resin)
The comparative example provides a process for preparing a heat-conducting metal substrate by recycling waste epoxy resin, comprising the following steps.
According to the weight percentage, 15.9 percent of diatomite (epoxy resin containing diatomite, diatom ooze) containing waste epoxy resin with the particle diameter of 150-200 mu m, 13 percent of epoxy resin, 1 percent of dicyandiamide, 0.1 percent of dimethyl imidazole and 70 percent of alumina are evenly mixed to form the resin daub.
Gluing the resin daub, baking, cutting into pieces, superposing, heating for forming, heating and curing into a round cake with the diameter of 50mm and the thickness of 10 mm. Heating to 140 deg.C, placing in iron plate (25 + -1 deg.C), measuring time and surface temperature, and observing heat dissipation capability.
The results obtained are shown in table 5 below.
TABLE 5 results of temperature measurement of comparative example 3
| DEG C/unit | 0 minute | 1 minute | 2 minutes | 3 minutes | 4 minutes | 5 minutes | 6 minutes |
| Comparative example 3 | 140 | 112.4 | 94 | 82.4 | 73.6 | 68.1 | 65.5 |
It can be seen from the results of the measurements of examples 1-2 and comparative examples 1-3 that the originally discarded epoxy resin-containing diatomaceous earth is not suitable for use in heat-conductive metal substrates, whereas the epoxy resin-containing diatomaceous earth treated by milling and plasma jet according to the present invention is effective in increasing heat-conductive/heat-dissipating efficiency.
The invention also provides a grinding fluid used in fine grinding, which is added into a grinding machine for grinding together in the fine grinding. The ratio of the volume amount of the polishing solution to the mass of the diatomite containing the waste epoxy resin (the diatomite-containing epoxy resin and the diatom ooze) with the particle size of 150-200 mu m is 1 mL: (6-8) g, preferably 1 mL: 7 g. By using the polishing liquid, the heat conduction/dissipation efficiency of the epoxy resin-containing diatomite after polishing and plasma jet treatment can be further improved, and finally the performance of the heat conduction metal substrate can be further improved. The grinding fluid provided by the invention comprises the following raw material components in parts by weight: 8 parts of ethanol water solution with the volume fraction of 30%, 4 parts of ethylene glycol monobutyl ether, 7 parts of dibutyl phthalate, 10 parts of dimethyl silicone oil, 2 parts of pentaerythritol, 11 parts of 2-butyl imidazole, 20 parts of silicon dioxide and 15 parts of organic silicon emulsion; the preparation method of the organic silicon emulsion comprises the following steps: methyl methacrylate, vinyl terminated polydimethylsiloxane and vinyltrimethoxysilane were mixed at a ratio of 7: 1.5: 1, heating at 72 ℃ for 5h, adjusting the pH value to 8.9, and then heating at 64 ℃ for 70 min. The preparation method of the grinding fluid comprises the following steps: s1, selecting the components according to the proportion to finish the burdening; s2, adding ethylene glycol monobutyl ether, dibutyl phthalate and dimethyl silicone oil into an ethanol water solution in sequence, heating to 90 ℃, uniformly stirring, standing and cooling to obtain a first mixed solution; s3, sequentially adding silicon dioxide and the organic silicon emulsion into the first mixed solution, heating to 120 ℃, adjusting the pH value to 6.5, fully stirring for 50min, standing and cooling to obtain a second mixed solution; and S4, adding the other residual raw material components into the second mixed solution, heating to 150 ℃, and uniformly stirring to obtain the grinding fluid.
In addition to example 2, when the waste epoxy resin-containing diatomaceous earth (diatomaceous earth-containing epoxy resin, diatom ooze) having a particle size of 150-200 μm was finely ground, the grinding fluid was added to a grinder, and the volume ratio of the used diatomaceous earth containing waste epoxy resin was 1 mL: 7g, the other steps are the same as the example 2, and the final result is better than the result of the example 2, which specifically comprises the following steps: 0min 140 ℃, 1 min 106.8 ℃, 2 min 82.5 ℃, 3 min 67.4 ℃, 4 min 59.8 ℃, 5 min 53.2 ℃, 6 min 49.8 ℃. As described above, by using the polishing liquid, the heat transfer/dissipation efficiency of the epoxy resin-containing diatomaceous earth after polishing and plasma jet treatment can be further improved, and finally the performance of the heat-conductive metal substrate can be improved.
It is to be noted that, unless otherwise specified, technical or scientific terms used herein shall have the ordinary meaning as understood by those skilled in the art to which the invention pertains. Unless specifically stated otherwise, the relative steps, numerical expressions, and values of the components and steps set forth in these embodiments do not limit the scope of the present invention. In all examples shown and described herein, unless otherwise specified, any particular value should be construed as merely illustrative, and not restrictive, and thus other examples of example embodiments may have different values.
In the description of the present invention, it is to be understood that the terms "first", "second" and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention, and all of the technical solutions are covered in the protective scope of the present invention.
Claims (10)
1. A process for preparing a heat-conducting metal substrate by recycling waste epoxy resin is characterized by comprising the following steps: grinding diatomite containing waste epoxy resin, carbonizing the obtained ground particles by using a plasma jet process to form a graphite layer, adding other raw material components, mixing to form resin cement, and treating the resin cement to obtain the heat-conducting metal substrate.
2. The process for preparing a heat-conducting metal substrate by recycling the waste epoxy resin according to claim 1, wherein: the grinding is to grind the diatomite containing the waste epoxy resin to 1-4 μm.
3. The process for preparing a heat-conducting metal substrate by recycling the waste epoxy resin according to claim 1, wherein: the plasma jet process comprises the step of treating the ground particles in a 1300-1500 ℃ high-temperature environment by adopting plasma jet.
4. The process for preparing a heat-conducting metal substrate by recycling the waste epoxy resin according to claim 1, wherein: the other raw material components comprise epoxy resin, a curing agent, an accelerator, a heat-conducting filler and a solvent.
5. The process for preparing a heat-conducting metal substrate by recycling the waste epoxy resin according to claim 1, wherein: the other raw material components comprise epoxy resin, dicyandiamide, dimethyl imidazole and aluminum oxide.
6. The process for preparing a heat-conducting metal substrate by recycling the waste epoxy resin as claimed in claim 5, wherein: the other raw material components comprise the following components in percentage by weight: 13-22% of epoxy resin, 1% of dicyandiamide, 0-0.1% of dimethyl imidazole and 70% of aluminum oxide.
7. The process for preparing a heat-conducting metal substrate by recycling the waste epoxy resin according to claim 1, wherein: the treatment comprises the steps of gluing, baking, cutting, superposing and heating forming.
8. The process for preparing a heat-conducting metal substrate by recycling the waste epoxy resin according to claim 1, wherein: the treatment comprises the step of heat curing the resin mastic into a wafer.
9. The process for preparing a heat-conducting metal substrate by recycling the waste epoxy resin according to claim 8, wherein: the diameter of the round cake is 40-60mm, and the thickness of the round cake is 8-12 mm.
10. The process for preparing a heat-conducting metal substrate by recycling the waste epoxy resin according to claim 9, wherein: the diameter of the round cake is 50mm, and the thickness of the round cake is 10 mm.
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| CN108795354A (en) * | 2018-04-24 | 2018-11-13 | 湖南省方正达电子科技有限公司 | A kind of heat conduction modified epoxide resin adhesive and preparation method |
| CN109705788A (en) * | 2019-01-07 | 2019-05-03 | 上海灼日新材料科技有限公司 | A kind of high thermal conductivity epoxy sealing glue and preparation method thereof |
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2020
- 2020-06-16 CN CN202010547323.8A patent/CN111592636B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016050697A2 (en) * | 2014-10-03 | 2016-04-07 | Zephyros Inc. | Powdered heat activatable adhesives |
| CN105838028A (en) * | 2016-03-25 | 2016-08-10 | 金安国纪科技（杭州）有限公司 | High-heat-conductive resin composition and preparation method thereof |
| CN108795354A (en) * | 2018-04-24 | 2018-11-13 | 湖南省方正达电子科技有限公司 | A kind of heat conduction modified epoxide resin adhesive and preparation method |
| CN109705788A (en) * | 2019-01-07 | 2019-05-03 | 上海灼日新材料科技有限公司 | A kind of high thermal conductivity epoxy sealing glue and preparation method thereof |
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