CN111586532A - Linear array audio power amplifier - Google Patents
Linear array audio power amplifier Download PDFInfo
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- CN111586532A CN111586532A CN202010420299.1A CN202010420299A CN111586532A CN 111586532 A CN111586532 A CN 111586532A CN 202010420299 A CN202010420299 A CN 202010420299A CN 111586532 A CN111586532 A CN 111586532A
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R3/00—Circuits for transducers, loudspeakers or microphones
- H04R3/12—Circuits for transducers, loudspeakers or microphones for distributing signals to two or more loudspeakers
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/20—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R3/00—Circuits for transducers, loudspeakers or microphones
- H04R3/04—Circuits for transducers, loudspeakers or microphones for correcting frequency response
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Abstract
The invention relates to a linear array audio power amplifying device which comprises an audio transmission interface module, a DSP audio processing module, a control interface module and a power amplifier module. The DSP audio processing module is respectively connected with the audio transmission interface module, the control interface module and the power amplifier module. The DSP audio processing module is an 8-input 16-output DSP audio processing module, the DSP audio processing module comprises 8 transmission links, and each transmission link comprises an audio signal source selector, a noise gate, input gain, input delay, input phase, an input high-low frequency booster, an input 9-section parameter equalizer, an input RMS amplitude limiter, an input mute switch, a channel router, output gain, output delay, output phase, an output RMS amplitude limiter, an output 8-section parameter equalizer, an output high-low pass filter, an output FIR filter and an output mute switch which are sequentially connected in series; the 8 transmission links are connected with each other by built-in high-low pass filters. The purpose of integrating multiple functions into a whole is achieved.
Description
Technical Field
The invention relates to the technical field of audio processing, in particular to a linear array audio power amplifying device.
Background
The linear array power amplifier is named as a linear array audio power amplifier, is used for pushing a plurality of array loudspeakers to produce sound, and is a power amplification device for reproducing the sound, and is suitable for most loudspeaker units. The traditional linear array audio power amplification equipment can only realize the function of sound amplification singly, and when other functions are realized, a large number of external equipment is needed, for example, when a professional performance system is required to be formed, auxiliary equipment such as a signal processor, equipment and devices for control, display, various ports and the like, and complicated signal transmission lines are also needed to be connected, so that very complicated operation and workload are brought to the use of a user. It can be seen that the conventional linear array audio power amplification device has the problem of single function.
Disclosure of Invention
Based on this, it is necessary to provide a multifunctional integrated linear array audio power amplifying device.
In order to achieve the above purpose, the embodiment of the invention adopts the following technical scheme:
the embodiment of the invention provides a linear array audio power amplification device, which comprises an audio transmission interface module, a DSP audio processing module, a control interface module and a power amplification module, wherein the DSP audio processing module is respectively connected with the audio transmission interface module, the control interface module and the power amplification module;
the DSP audio processing module is an 8-input 16-output DSP audio processing module, the DSP audio processing module comprises 8 transmission links, and each transmission link comprises an audio signal source selector, a noise gate, input gain, input delay, input phase, an input high-low frequency booster, an input 9-section parameter equalizer, an input RMS amplitude limiter, an input mute switch, a channel router, output gain, output delay, output phase, an output RMS amplitude limiter, an output 8-section parameter equalizer, an output high-low pass filter, an output FIR filter and an output mute switch which are sequentially connected in series; the 8 transmission links are connected with each other by built-in high-low pass filters.
In one embodiment, the power amplifier module comprises a power amplifier unit and an independent switch power supply with an active PFC and an automatic voltage sensor, the power amplifier unit is connected with the independent switch power supply, and the power amplifier unit is connected with the DSP audio processing module.
In one embodiment, the power amplifier unit is a PowerSoftLiteMod4HCD type power amplifier or a Pascal L-PRO2SD type power amplifier.
In one embodiment, the power amplifier module further comprises a circuit protection unit for protecting overcurrent, overvoltage, undervoltage, high temperature and output short circuit, and the circuit protection unit is connected with the power amplifier unit.
In one embodiment, the input gain is an input gain control circuit with a volume increase and decrease range of-infinity dB to +12 dB; the input delay is an input delay control circuit with a delay range of 000.0000mS to 680.979 mS; the noise gate is an input noise gate which suppresses channel background noise within the range of less than a threshold value of-100 dBfs to-65 dBfs, and has the start control time of 1ms to 1000ms and the release time of 1ms to 1000 ms;
the input high-low frequency booster is an input low/high frequency loudness booster with low frequency boosting and high frequency boosting ratios of 0-100%; the input 9 sections of parameter equalizers are equalizing filters with the frequency range of 20Hz to 20kHz, the gain of-15 dB to +15dB and the bandwidth of 0.4oct to 128 oct;
the input RMS limiter is an RMS compressor with a threshold range of-30 dBF to +0dBu, a limit inflection point of 0% to 100%, a start-up time of 5ms to 200ms, a release time of 100s to 15000s, a compression ratio of 2:1 to 32:1, and a compression output compensation of 0dB to 12 dB.
In one embodiment, the output gain is an output gain control circuit with a volume increase and decrease range of-infinity dB to +12 dB; the output delay is an output delay control circuit with the delay range of 0ms to 340.979 ms;
the RMS compressor outputs an RMS limiter with a threshold range of-30 dBfs to +0dBu, a voltage limit inflection point of 0% to 100%, a start control time of 0.1ms to 1000ms, a release time of 100s to 15000s, a compression ratio of 2:1 to 32:1 and a compression output compensation of 0dB to 12 dB;
the output limiter is a limiter with a threshold range of-30 dBfs to 0dBfs, a release time of 100ms to 6000ms and a start-control time of 1ms to 1000 ms; outputting 8 sections of parameter equalizers; the output 8-segment parameter equalizer is an equalizing filter with the frequency range of 20Hz to 20kHz, the gain of-15 dB to +15dB and the bandwidth of 0.4oct to 128 oct.
In one embodiment, the control interface module includes a touch screen control module, a WIFI control interface, an ethernet control interface and a USB control interface, and the touch screen control module is connected to the WIFI control interface, the ethernet control interface, the USB control interface and the DSP audio processing module respectively.
In one embodiment, the audio transmission interface module comprises a network audio transmission module and a digital audio input module.
In one embodiment, the linear array audio power amplifying device further comprises an analog-to-digital conversion module and a digital-to-analog conversion module, the analog-to-digital conversion module is connected with the DSP audio processing module, and the DSP audio processing module is connected with the power amplifier module through the digital-to-analog conversion module.
In one embodiment, the linear array audio power amplifier further includes a chassis, and the audio transmission interface module, the DSP audio processing module, the control interface module, and the power amplifier module are respectively disposed in the chassis.
One of the above technical solutions has the following advantages and beneficial effects:
the linear array audio power amplifying device is designed by the device structure of the audio transmission interface module, the DSP audio processing module, the control interface module and the power amplifier module and the link structure of the DSP audio processing module, the audio transmission interface module is used for providing rich interfaces connected with various types of audio signals of external audio equipment, and the DSP audio processing module is used for carrying out digital careful processing on input audio signals and outputting high-quality audio signals. The power amplification module is used for carrying out power amplification processing on the audio signals. The control interface module is used for providing rich interfaces connected with external equipment, carrying out data interaction communication on the external equipment, facilitating a user to operate and use the whole linear array audio power amplification device, and achieving the purpose of integrating multiple functions into a whole by controlling more connection modes of the linear array audio power amplification device.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments or the conventional technologies of the present application, the drawings used in the descriptions of the embodiments or the conventional technologies will be briefly introduced below, it is obvious that the drawings in the following descriptions are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic diagram of a first module architecture of a linear array audio power amplifying device according to an embodiment;
FIG. 2 is a schematic diagram of a link structure of a DSP audio processing module of an embodiment;
fig. 3 is a schematic diagram of a second module architecture of the linear array audio power amplifying device according to an embodiment;
fig. 4 is a schematic diagram of a third module architecture of a linear array audio power amplifying device according to an embodiment;
fig. 5 is a schematic diagram of a fourth module architecture of a linear array audio power amplifying device according to an embodiment;
fig. 6 is a schematic component distribution diagram of a linear array audio power amplifying device according to an embodiment;
fig. 7 is a schematic structural diagram of a chassis panel according to an embodiment.
Detailed Description
To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Embodiments of the present application are set forth in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or be connected to the other element through intervening elements. In addition, "connection" in the following embodiments is understood to mean "electrical connection", "communication connection", or the like, if the connected circuits, modules, units, or the like have transmission of electrical signals or data therebetween.
As used herein, it is also to be understood that the terms "comprises/comprising" or "having," etc., specify the presence of stated features, integers, components, parts, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, components, parts, or combinations thereof.
As shown in fig. 1 and fig. 2, in an embodiment, a linear array audio power amplifying device 100 is provided, and as shown in fig. 1, a general framework structure of the device includes an audio transmission interface module 12, a DSP audio processing module 14, a control interface module 16, and a power amplifier module 18, where the DSP audio processing module 14 is connected to the audio transmission interface module 12, the control interface module 16, and the power amplifier module 18, respectively.
As shown in fig. 2, the DSP audio processing module 14 is an 8-in 16-out DSP audio processing module 14, the DSP audio processing module 14 includes 8 transmission links, and a single transmission link includes an audio signal source selector, a noise gate, an input gain, an input delay, an input phase, an input high and low frequency booster, an input 9-segment parameter equalizer, an input RMS limiter, an input mute switch, a channel router, an output gain, an output delay, an output phase, an output RMS (RMS Rate-monotonic scheduling) limiter, an output 8-segment parameter equalizer, an output high and low pass filter, an output FIR filter, and an output mute switch, which are sequentially connected in series; the 8 transmission links are connected with each other by built-in high-low pass filters.
The AUX (i.e., Auxiliary) output in fig. 2 represents an AUX output interface on the output side of the link. The DNT (i.e., ethernet-based digital audio network transport by Audinate, Dante, australia) output, represents the DNT output interface on the output side of the link. It can be understood that the power amplifier module 18 is used for performing power amplification processing on the signal, and ensuring that the output signal can meet the requirements of each site. Specifically, the applied power amplifier modules 18 may be of various types or of various specifications, and different power amplifier modules 18 may provide different power amplification ratios, so that the whole linear array audio amplifier 100 may have more choices when matching with speaker units, and may allow users to have more choices. Different types of power amplifier modules 18 can be selected according to the use requirements of customers. The modules can be realized by designing and building device circuits through devices supplied by a purchasing manufacturer and designing and building links of the DSP audio processing module 14, and different devices can be selected to build the modules and signal links thereof according to different application fields, so that the application requirements of different application fields are met.
The DSP audio processing module 14 is configured to perform digital and fine processing on the input audio signal and output a high-quality audio signal. Specifically, the DSP audio processing module 14 is an 8-in 16-out DSP audio processing module 14 to adapt to the driving of the linear array sound. The core processing part of the DSP audio processing module 14 is a DSP processor, adopts SAM5000 series DSP chips of DREAM company, supports 56bit MAC operation and 48bit double precision operation, and the core frequency is 196.6 MHz. The DSP chip integrates a 32k parameter RAM and a 16k data RAM32k x 24, has excellent low-level signal performance, and a dynamic processor of the DSP chip adopts an advanced multi-breakpoint algorithm.
The SAM5000 series DSP chip has 32-channel Digital input and output and stereo S/PDIF (Sony/Philips Digital Interface Format) input and output in TDM (time division multiplexing) mode, and the external device may configure the control and parameters needed when using the DSP chip through a four-wire SPI (Serial Peripheral Interface) port, or may perform online programming simulation through the port, and may use a graphic tool to develop and program.
The analog audio conversion digital audio part of the DSP audio processing module 14 adopts AK5554 audio conversion chip of AKM company, 32-bit, 768kHz sampling and differential input digital audio, and the signal-to-noise ratio reaches 115 dB. The digital audio conversion analog audio part of the DSP audio processing module 14 adopts AKM AK4454 audio conversion chip, the sampling is supported at the highest 768kHz, the signal-to-noise ratio reaches 115dB, and the hardware matching sampling frequency selection is supported. The MCU of the DSP audio processing module 14 adopts ST company STM32F107VCT6 chip. A perfect 8-in 16-out routing matrix is adopted in the 8-in 16-out DSP audio processing module 14, input signals of any input channel can be routed and output through any output channel, and the high-quality pushing requirement of the linear array sound can be met.
The audio signal source is selected to provide smooth switching of three signal sources, analog, digital and Dante, for each input channel, supporting audio devices in a cascade connection manner. The control interface module 16 is used for providing rich interfaces for connecting with external devices, and performing data interactive communication on the external devices (such as various display devices, peripherals for input operation, and the like). Those skilled in the art will appreciate that the linear array audio power amplifier 100 and external devices, such as audio devices, linear array speakers, and other peripherals for display and input operations, may be connected to each other through audio cables, data cables, and other cables in the application scenario.
The linear array audio power amplifier 100 is designed by the device structures of the audio transmission interface module 12, the DSP audio processing module 14, the control interface module 16 and the power amplifier module 18 and the link structure of the DSP audio processing module 14, wherein the audio transmission interface module 12 is configured to provide rich interfaces for connecting with multiple types of audio signals of external audio devices, and the DSP audio processing module 14 is configured to perform digital and fine processing on the input audio signals and output high-quality audio signals. The power amplifier module 18 is used for performing power amplification processing on the audio signal. The control interface module 16 is used for providing rich interfaces connected with external equipment, performing data interaction communication on the external equipment, facilitating the operation and use of the whole linear array audio power amplification device by a user, and providing more connection mode selections for the user to control the linear array audio power amplification device, thereby achieving the purpose of integrating multiple functions into a whole.
In one embodiment, the Power amplifier module 18 includes a Power amplifier unit and a separate switching Power supply having an active PFC (Power factor correction) and an automatic voltage sensor. The power amplifier unit is connected with the independent switch power supply and the DSP audio processing module 14.
It can be understood that each power amplifier unit is matched with two independent switch power supplies, and the independent switch power supply with active PFC and automatic voltage sensing functions can effectively improve the conversion efficiency of the power amplifier unit (the conversion efficiency of the output stage can be as high as 90%). Therefore, the independent switch power supply is arranged for matching the power amplifier unit, so that the conversion efficiency of the power amplifier power supply is improved, and the output performance of the whole linear array audio power amplification device 100 is effectively improved.
In one embodiment, the power amplifier unit is a PowerSoftLiteMod4HCD type power amplifier or a Pascal L-PRO2SD type power amplifier.
It can be understood that, in this embodiment, the power amplifier unit may adopt two schemes, one scheme is to use a PowerSoftLiteMod4 HCD-type power amplifier, and the lieter Mod4HC provides three power distribution modes of 8 × 750W @4 Ω or 8 × 400W @8 Ω and 2 × 400W @8 Ω, 2 × 750W @4 Ω and 4 × 750W @4 Ω. The other scheme is that a Pascal L-PRO2S D-type power amplifier is used, three matching modes of 8 x 800W @4 omega or 8 x 400W @8 omega and 8 x 1200W @2.7 omega are provided by L-PRO2S + L-A2, and the matching modes are matched with the modules, so that the power matching mode output to the linear array of the sound equipment can be effectively increased, for example, a power amplifier unit can select 8 700W4ohm outputs, also can select 4 1400W8ohm outputs, and also can select 2 2400W4ohm outputs to the linear array sound equipment, which is not possessed by the traditional power amplifier.
By adopting the power amplifier, the expansion of the power matching mode of the linear array sound equipment can be effectively realized, so that the pushing performance of the linear array sound equipment is effectively improved.
In one embodiment, the power amplifier module 18 further includes a circuit protection unit for protecting over-current, over-voltage, under-voltage, high-temperature and output short circuit, and the circuit protection unit is connected to the power amplifier unit.
It can be understood that the circuit protection unit may adopt a customized dedicated protection circuit or a general protection circuit that is already on the market, and may be specifically selected according to the protection requirement of the power amplifier unit. In this embodiment, each power amplifier unit is matched with two independent switch power supplies and a single circuit protection unit, the independent switch power supply with active PFC and automatic voltage sensing functions can effectively improve the conversion efficiency of the power amplifier unit (the output stage conversion efficiency can be as high as 90%), and the application of the circuit protection unit is matched, so that the protection capability of the power amplifier unit in the high-efficiency output working process can be effectively improved, and the power amplifier unit is prevented from generating faults of overcurrent, overvoltage, undervoltage, high temperature or output short circuit and the like in the working state of high conversion efficiency output, thereby further improving the output performance of the whole linear array audio power amplifier 100 and greatly improving the reliability of the amplifier.
In one embodiment, the input gain is an input gain control circuit with a volume increase and decrease range of-infinity dB to +12 dB. The input delay is an input delay control circuit with a delay range of 000.0000mS to 680.979 mS. The noise gate is an input noise gate which suppresses channel background noise within the range of less than a threshold value of-100 dBfs to-65 dBfs, and has the start control time of 1ms to 1000ms and the release time of 1ms to 1000 ms. The input high-low frequency booster is an input low/high frequency loudness booster with low frequency boosting and high frequency boosting ratios of 0% to 100%. The input 9-stage parametric equalizer is an equalizing filter with the frequency range of 20Hz to 20kHz, the gain of-15 dB to +15dB and the bandwidth of 0.4oct to 128 oct. The input RMS limiter is an RMS compressor with a threshold range of-30 dBF to +0dBu, a limit inflection point of 0% to 100%, a start-up time of 5ms to 200ms, a release time of 100s to 15000s, a compression ratio of 2:1 to 32:1, and a compression output compensation of 0dB to 12 dB.
It will be appreciated that in this embodiment, the noise signal generator of the DSP audio processing block 14 may be used to provide both white and pink noise speaker unit test signals for each input channel. The input gain can be used for adjusting and controlling the volume of the input signal of the input channel within a range of- ∞ dB to +12 dB. The input delay can carry out delay control output on the input signals of the input channels within the range of 000.0000mS to 680.979 mS. The input phase can perform state processing of a positive phase "Normal" and an inverted phase "invers" on the input signal of each input channel. The noise gate can suppress the background noise of the input channel within the range of less than a threshold value of-100 dBfs to-65 dBfs, the starting and controlling time of 1m to 1000ms, and the releasing time of 1ms to 1000 ms.
The input high-low frequency booster is also called as an input low/high frequency loudness booster, and can correspondingly boost the input signal in a fixed frequency band, wherein the low frequency boost can be performed in the range of 0% to 100% of the boost ratio, and the high frequency boost can be performed in the range of 0% to 100% of the boost ratio. The input 9-section parameter equalizer can perform independent 9-section equalization adjustment on input signals, and can adjust the input signals with the frequency range of 20Hz to 20kHz, the gain range of + -15dB and the bandwidth of 0.4oct to 128 oct. Each parameter equalizer of the input 9-segment parameter equalizer can also select BELL, a Freund filter, high pass, low pass, band pass, notch and all-pass filtering, and the specific types of the parameter equalizer comprise the following types which can be selected: High-Shield, 1 st/Hi-Shield, 2 nd/Hi-Shield, Q/Lo-Shield, 1 st/Lo-Shield, 2 nd/Lo-Shield, Q/Low-Shield, 1 st/Low-Shield, 2nd/High Pass, 1st/High Pass, 2nd/High Pass, Q/Band Pass, Filter/Notch, Filter/All Pass or 1st/All Pass 2 nd. The specific type selection of the parameter equalizer can be selected according to the promotion of linear array sound equipment in different application fields and the customization needs of customers.
The input RMS amplitude limiter is also called as an input RMS compressor, can carry out effective value compression on input signals of an input channel, and carries out limit output on the intensity of the input signals in the range of threshold value range of-30 dBfs to +0dBu, pressure limit inflection point of 0% to 100%, start control time of 5ms to 200ms, release time of 100s to 15000s, compression ratio (input and output) of 2:1 to 32:1 and compression output compensation of 0dB to 12dB, thereby being capable of meeting the adjustment of the maximum protection parameters of the linear array of the sound (loudspeaker) required by customers. The input mute switch may perform an off (mute) process or an on (mute cancel) process on the input signal. A channel router may transmit an input signal for any input channel to any one or more output channels.
By adopting the specific input link, the efficient processing of the input signals of each input channel can be ensured, and the performance is stable and the reliability is high.
In one embodiment, the output gain is an output gain control circuit with a volume increase and decrease range of-infinity dB to +12 dB. The output delay is an output delay control circuit with the delay range of 0ms to 340.979 ms. The output RMS limiter is an RMS compressor with a threshold range of-30 dBfs to +0dBu, a limit inflection point of 0% to 100%, a start-up time of 0.1ms to 1000ms, a release time of 100s to 15000s, a compression ratio of 2:1 to 32:1 and a compression output compensation of 0dB to 12 dB. The output limiter is a limiter with a threshold range of-30 dBfs to 0dBfs, a release time of 100ms to 6000ms and a start-control time of 1ms to 1000 ms; and outputting the 8-segment parameter equalizer. The output 8-segment parameter equalizer is an equalizing filter with the frequency range of 20Hz to 20kHz, the gain of-15 dB to +15dB and the bandwidth of 0.4oct to 128 oct.
It is understood that in the present embodiment, the output gain can be adjusted to increase or decrease the volume of the processed signal of the output channel within the range of- ∞ dB to +12 dB. The output delay can delay and control the output of the processed signal of the output channel within the range of 0ms to 340.979 ms. The output phase can perform state processing of positive phase "Normal" and inverse phase "Invert" on the processed signal of the output channel.
The output RMS amplitude limiter can perform RMS compression on signals processed by an output channel, and limit and output the intensity of the output signals in the range of threshold value range of-30 dBfs to +0dBu, pressure limit inflection point of 0% to 100%, starting control time of 0.1ms to 1000ms, release time of 100s to 15000s, compression ratio (input and output) of 2:1 to 32:1 and compression output compensation of 0dB to 12dB, thereby being capable of meeting the maximum protection parameter adjustment of linear array sound (loudspeaker) required by customers. The output limiter can limit amplitude of signals processed by the output channel, can be adjusted within the range of threshold value range of-30 dBfs to 0dBfs, release time of 100ms to 6000ms and start control time of 1ms to 1000ms, and can play an important protection role in linear array sound of a client.
The output 8-section parameter equalizer can perform independent 8-section equalization adjustment on output signals, the output signals with the frequency range of 20Hz to 20kHz, the gain of + -15dB and the bandwidth of 0.4oct to 128oct can be adjusted, each parameter equalizer can also select BELL, a Freund filter, high pass, low pass, band pass, notch and all-pass filtering, and the specific types of the parameter equalization filters can be selected from the following types: High-Shield, 1 st/Hi-Shield, 2 nd/Hi-Shield, Q/Lo-Shield, 1 st/Lo-Shield 2 nd/Lo-Shield, Q/Low-Shield, 1 st/Low-Shield, 2 nd/Low-Shield Q/High Pass, 1st/High Pass, 2nd/High Pass, Q/Band Pass, Filter/Notch, Filter/All Pass or 1st/All Pass 2 nd. The specific type selection of the parameter equalizer can be selected according to the promotion of linear array sound equipment in different application fields and the customization needs of customers.
The output high-low pass filter filters the output signal of the output channel, and filters the frequency band which does not accord with the linear array loudspeaker unit (sound) in the output signal. The output high-low pass filter can filter out the frequency channel selection and setting, and its filterable frequency channel range is 20Hz to 20kHz, and optional bandwidth has: bypass, -6dB/Oct BW, -12dB/Oct LZ, -12dB/Oct BS, -18dB/Oct BW, -24dB/Oct LZ, -24dB/Oct BS, -36dB/Oct BW, -36dB/Oct LZ, -48dB/Oct BW, and-48 dB/Oct LZ.
A 512taps asymmetric output FIR filter can be provided on the output channel, which can add or subtract FIR delay by computing the filter factors using a built-in existing Wizard tool, or by importing resources from existing third party software to generate the required FIR filter factors for phase correction. The output mute switch may perform off (mute) processing or on (unmute) processing on the signal processed by the output channel.
By adopting the specific output link, the efficient processing of the output signals of each output channel can be ensured, and the performance is stable and the reliability is high.
As shown in fig. 3, in one embodiment, control interface module 16 includes a touch screen control module 162, a WIFI control interface 164, an ethernet control interface 166, and a USB control interface 168. The touch screen control module 162 is connected to the WIFI control interface 164, the ethernet control interface 166, the USB control interface 168, and the DSP audio processing module 14, respectively.
It is understood that each module may be powered by a power supply module. The power supply module may be a power interface circuit or a storage battery, and may be specifically determined according to the power supply facility conditions of the application site of the linear array audio power amplification device 100. In the present embodiment, the control interface module 16 is used to provide rich interfaces for connecting with external devices, such as a WIFI control interface 164, a wired network (i.e., ethernet) control interface, and a USB control interface 168. After the interfaces are connected with external devices through cables, the interfaces can be used for data interactive communication with the external devices, such as but not limited to control an external touch or non-touch display screen (LCD or LED), and the control interface module 16 can adopt an STM32F103VET6 microprocessor MCU of ST corporation. In some embodiments, the external touch screen may be a liquid crystal display screen with a 4.3 inch, 480x270 dot matrix, TFT-LCD, 8led B/L white backlight, or capacitive touch panel.
Through the control interface module 16, data interactive communication with external equipment can be realized, so that the use by customers is more convenient, and the functions are richer.
As shown in FIG. 4, in one embodiment, the audio transport interface module 12 includes a network audio transport module 122 and a digital audio input module 124.
It will be appreciated that in the present embodiment, the audio transport interface module 12 is configured to provide a rich transport interface, and in particular, the audio transport interface module 12 includes a network audio transport module 122(Dante module) and a digital audio input module 124(AES3 digital audio input). In practical applications, the network audio transmission module 122 is an off-the-shelf solution specifically applied to high-performance digital audio network devices. Based on a Dante ultimo singlechip, the bidirectional audio channels with 4 low delays at most are supported, and the sampling frequency is up to 96 kHz. The network audio transmission module 122 may have two versions: single port ethernet versions and dual port ethernet versions. The single-port Ethernet version is a high-cost-performance Dante network solution and is suitable for 100Mbps Ethernet ports. The dual port ethernet version is equipped with two ethernet ports at 1 Gbps.
The network audio transmission module 122 supports audio devices (such as linear array speakers) in a cascade connection manner, while maintaining low delay for audio systems for live performances. A full set of high quality sampling frequency transducers is provided on the network audio transmission module 122 so that the customer can run the connected audio system at different sampling frequencies. In addition, the network audio transmission module 122 is provided with a low-jitter clock generation circuit with good quality for providing a sampling precision synchronization for each device connected through the network. The network audio transport module 122 uses a standard I2S interface, and the client can easily connect the network audio transport module 122 to the DSP audio slave system. Optionally, the network audio transmission module 122 includes a network audio transmission module 122 with an audio sampling frequency of 48 khz and a network audio transmission module 122 with an audio sampling frequency of 96khz, that is, the network audio transmission module 122 can simultaneously support the audio sampling frequency of 48 khz and the audio sampling frequency of 96khz, so as to meet different requirements of a client and bring greater convenience to the client.
As shown in fig. 5, in one embodiment, the linear array audio power amplifying device 100 further includes an analog-to-digital conversion module 20 and a digital-to-analog conversion module 22. The analog-to-digital conversion module 20 is connected with the DSP audio processing module 14, and the DSP audio processing module 14 is connected with the power amplifier module 18 through the digital-to-analog conversion module 22.
It will be appreciated that the particular type of the analog-to-digital conversion module 20 and the digital-to-analog conversion module 22 may be selected from any available type of conversion module according to the operational requirements of the overall apparatus. Among the input audio signals, analog audio signals are input to the DSP audio processing module 14 through the analog-to-digital conversion module 20, and the DSP audio processing module 14 performs audio processing on the received audio signals (including analog audio signals, digital audio signals, and network audio signals) and outputs the processed digital signals; the processed digital signal enters the power amplification module 18 through the digital-to-analog conversion module 22 for power amplification and then is output.
By applying the above conversion module, the use of more external devices of different signal output types can be expanded, thereby further improving the adaptability of the linear array audio power amplification device 100.
As shown in fig. 6 and 7, in one embodiment, the linear array audio power amplification device 100 further includes a cabinet 23. The audio transmission interface module 12, the DSP audio processing module 14, the control interface module 16 and the power amplifier module 18 are respectively disposed in the case 23.
It is understood that the casing 23 may be a box body with a square, wedge, oval or other regular (or irregular) geometric shape, and the specific shape may not be limited as long as it can meet the use requirement of the application field and the installation and protection of each module inside. The wall surface of the case 23 is provided with mounting holes with various shapes and sizes for matching with external interface components of each module, and the shapes, sizes and distribution positions of the mounting holes on the wall surface can be determined according to the mounting requirements of the external interface components of each module to be mounted in the case 23. The installation frame is disposed in the case 23 and used for installing and fixing the modules, and the structural shape and size of the installation frame can be determined according to the shape and size of each module and the limiting and fixing manner.
In the component mounting diagram shown in fig. 6, a denotes a power supply module of the DSP audio processing module 14, and B denotes the network audio transmission module 122 of the DSP audio processing module 14, the control interface module 16, and the audio transmission interface module 12. In the schematic diagram of the panel of the enclosure 23 shown in fig. 7, W1 represents a network audio input/output interface, W2 represents a digital/analog audio input interface, W3 represents a Line output interface, and W4 represents a power amplifier output interface.
Specifically, each module is embedded in the case 23, so that the modules can be prevented from being damaged by external force in the external environment, and the linear array audio power amplification device 100 can be conveniently carried and placed for use, thereby better improving the service efficiency and reliability of the linear array audio power amplification device 100, and better customer experience is achieved.
In the description herein, reference to the description of the terms "one embodiment," "one of the embodiments," "another embodiment," and "the embodiment," etc., means that a particular feature or structure described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, a schematic description of the above terminology may not necessarily refer to the same embodiment or example.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A linear array audio power amplifying device is characterized by comprising an audio transmission interface module, a DSP audio processing module, a control interface module and a power amplifier module, wherein the DSP audio processing module is respectively connected with the audio transmission interface module, the control interface module and the power amplifier module;
the DSP audio processing module is an 8-input 16-output DSP audio processing module, the DSP audio processing module comprises 8 transmission links, and each transmission link comprises an audio signal source selector, a noise gate, an input gain, an input delay, an input phase, an input high-low frequency booster, an input 9-section parameter equalizer, an input RMS amplitude limiter, an input mute switch, a channel router, an output gain, an output delay, an output phase, an output RMS amplitude limiter, an output 8-section parameter equalizer, an output high-low pass filter, an output FIR filter and an output mute switch which are sequentially connected in series; and 8 built-in high-low pass filters of the transmission links are connected with each other.
2. The linear array audio power amplifier device according to claim 1, wherein the power amplifier module comprises a power amplifier unit and an independent switch power supply having an active PFC and an automatic voltage sensor, the power amplifier unit is connected to the independent switch power supply, and the power amplifier unit is connected to the DSP audio processing module.
3. The linear array audio power amplifier device of claim 2, wherein the power amplifier unit is a PowerSoft Lite Mod4HC class D power amplifier or a Pascal L-PRO2SD power amplifier.
4. The linear array audio power amplifier device according to claim 2, wherein the power amplifier module further comprises a circuit protection unit for overcurrent, overvoltage, undervoltage, high temperature and output short circuit protection, and the circuit protection unit is connected to the power amplifier unit.
5. The linear array audio power amplification device according to any one of claims 1 to 4, wherein the input gain is an input gain control circuit with a volume increase/decrease range of- ∞ dB to +12 dB; the input delay is an input delay control circuit with a delay range of 000.0000mS to 680.979 mS; the noise gate is an input noise gate which suppresses channel background noise within the range of less than a threshold value of-100 dBfs to-65 dBfs, and has the start control time of 1ms to 1000ms and the release time of 1ms to 1000 ms;
the input high-low frequency booster is an input low/high frequency loudness booster with low frequency boosting and high frequency boosting ratios of 0-100%; the input 9 sections of parameter equalizers are equalizing filters with the frequency range of 20Hz to 20kHz, the gain of-15 dB to +15dB and the bandwidth of 0.4oct to 128 oct;
the input RMS limiter is an RMS compressor with a threshold range of-30 dBfs to +0dBu, a limit inflection point of 0% to 100%, a start control time of 5ms to 200ms, a release time of 100s to 15000s, a compression ratio of 2:1 to 32:1 and a compression output compensation of 0dB to 12 dB.
6. The linear array audio power amplifying device according to any one of claims 1 to 4, wherein the output gain is an output gain control circuit with a volume increase/decrease range of- ∞ dB to +12 dB; the output delay is an output delay control circuit with a delay range of 0ms to 340.979 ms;
the output RMS amplitude limiter is an RMS compressor with a threshold range of-30 dBfs to +0dBu, a voltage limit inflection point of 0% to 100%, a start control time of 0.1ms to 1000ms, a release time of 100s to 15000s, a compression ratio of 2:1 to 32:1 and a compression output compensation of 0dB to 12 dB;
the output limiter is a limiter with a threshold range of-30 dBfs to 0dBfs, a release time of 100ms to 6000ms and a start-control time of 1ms to 1000 ms; the output 8-segment parameter equalizer; the output 8-section parameter equalizer is an equalizing filter with the frequency range of 20Hz to 20kHz, the gain of-15 dB to +15dB and the bandwidth of 0.4oct to 128 oct.
7. The linear array audio power amplification device of claim 1, wherein the control interface module comprises a touch screen control module, a WIFI control interface, an ethernet control interface and a USB control interface, and the touch screen control module is connected to the WIFI control interface, the ethernet control interface, the USB control interface and the DSP audio processing module, respectively.
8. The linear array audio power amplification device of claim 1 or 7, wherein the audio transmission interface module comprises a network audio transmission module and a digital audio input module.
9. The linear array audio power amplifying device according to claim 1, further comprising an analog-to-digital conversion module and a digital-to-analog conversion module, wherein the analog-to-digital conversion module is connected with the DSP audio processing module, and the DSP audio processing module is connected with the power amplifier module through the digital-to-analog conversion module.
10. The linear array audio power amplifier device according to claim 1, further comprising a chassis, wherein the audio transmission interface module, the DSP audio processing module, the control interface module and the power amplifier module are respectively disposed in the chassis.
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| CN202010420299.1A CN111586532A (en) | 2020-05-18 | 2020-05-18 | Linear array audio power amplifier |
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Application publication date: 20200825 |