CN111583397A - Three-dimensional reconstruction method and device - Google Patents
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Abstract
The embodiment of the application provides a three-dimensional reconstruction method and a three-dimensional reconstruction device, an electron beam scanning device can be used for scanning a structure to be detected to obtain an electron beam image, an electron beam imaging model is used for fitting to obtain model parameters corresponding to the electron beam image, the model parameters can reflect the three-dimensional characteristics of the structure to be detected, namely, the electron beam image can be processed to obtain the three-dimensional characteristics of the structure to be detected, and therefore the model parameters reflecting the three-dimensional characteristics of the structure to be detected can be used for carrying out three-dimensional reconstruction on the structure to be detected. Because the electron beam imaging model can fit the electron beam image and depends on the corresponding relation between the model parameters and the image information, the electron beam imaging model is not influenced by the edge angle, can be suitable for the three-dimensional reconstruction of the structure to be measured at each edge angle, improves the accuracy of the three-dimensional reconstruction of the structure to be measured at a high edge angle, and further improves the accuracy of monitoring the process quality.
Description
Technical Field
The present application relates to the field of integrated circuits, and in particular, to a three-dimensional reconstruction method and apparatus.
Background
In the field of integrated circuits, the three-dimensional morphology of a device can reflect the process quality and the structural characteristics of the device, and how to obtain the three-dimensional morphology of the device is an important problem. At present, an electron beam microscopic device can be used for scanning a device structure to obtain electron beam imaging intensities at different positions, and then a three-dimensional reconstruction technology is used for analyzing the electron beam imaging intensities to obtain the three-dimensional appearance of the device structure.
Generally speaking, the device structure can be divided into a continuous gradual change structure and a vertical edge structure, wherein in the continuous gradual change structure, the height change of the surface is slow, so that the three-dimensional topography of the device structure can be well reconstructed by using the functional relationship between the imaging intensity of the electron beam and the structure, and the height change of the vertical edge structure at a certain position is fast, so that the functional relationship between the imaging intensity of the electron beam and the structure is not accurate enough, and therefore, the three-dimensional topography of the device structure is difficult to obtain.
How to carry out three-dimensional reconstruction on a vertical edge structure is a problem to be solved urgently in the field.
Disclosure of Invention
In order to solve the above technical problems, embodiments of the present application provide a three-dimensional reconstruction method and apparatus, which expand the application range of the three-dimensional reconstruction technology and improve the accuracy of three-dimensional reconstruction.
The embodiment of the application provides a three-dimensional reconstruction method, which comprises the following steps:
acquiring an electron beam image, wherein the electron beam image is obtained by scanning a structure to be detected by using electron beam scanning equipment;
utilizing an electron beam imaging model to obtain model parameters corresponding to the electron beam image through fitting; the model parameters embody the three-dimensional characteristics of the structure to be tested;
and performing three-dimensional reconstruction on the structure to be detected by using the model parameters.
Optionally, the method further includes: extracting the contour of the electron beam image to obtain at least one contour line, and then fitting to obtain model parameters corresponding to the electron beam image by using an electron beam imaging model, wherein the method comprises the following steps:
and fitting to obtain model parameters corresponding to each line as the model parameters corresponding to the electron beam image based on gray distribution information on at least one line perpendicular to the contour line by using an electron beam imaging model.
Optionally, the electron beam image is subjected to contour extraction by using an edge contour algorithm, where the contour algorithm includes at least one of the following algorithms: absolute threshold algorithm, relative threshold algorithm, frequency domain algorithm, correlation algorithm.
Optionally, the electron beam imaging model includes a first scattering model and a second scattering model, an edge angle corresponding to the first scattering model is smaller than or equal to a preset angle, and an edge angle corresponding to the second scattering model is greater than the preset angle, and then the model parameters corresponding to the electron beam image are obtained by fitting using the electron beam imaging model, including:
and determining whether the edge angle corresponding to the electron beam image is larger than a preset angle, if so, fitting by using the second scattering model to obtain a model parameter corresponding to the electron beam image, and if not, fitting by using the first scattering model to obtain a model parameter corresponding to the electron beam image.
Optionally, the model parameters include at least one of the following parameters: structure width, structure height, rising edge inclination angle, falling edge inclination angle, imaging attenuation length, rising edge coordinate and falling edge coordinate.
Optionally, a fitting algorithm is used to fit to obtain model parameters corresponding to the electron beam image, where the fitting algorithm includes one of the following fitting methods: parameter value traversal method, Newton method, gradient descent method, conjugate gradient method, least square method, neural network method, machine learning method.
Optionally, the structure to be tested includes: raised line structures, groove structures or hole-type structures.
An embodiment of the present application further provides a three-dimensional reconstruction apparatus, including:
the device comprises an image acquisition unit, a data acquisition unit and a data processing unit, wherein the image acquisition unit is used for acquiring an electron beam image, and the electron beam image is obtained by scanning a structure to be detected by using electron beam scanning equipment;
the parameter obtaining unit is used for obtaining model parameters corresponding to the electron beam image through fitting by using an electron beam imaging model; the model parameters embody the three-dimensional characteristics of the structure to be tested;
and the reconstruction unit is used for performing three-dimensional reconstruction on the structure to be measured by using the model parameters.
Optionally, the parameter obtaining unit includes:
the contour extraction unit is used for carrying out contour extraction on the electron beam image to obtain at least one contour line;
and the parameter obtaining subunit is used for fitting to obtain a model parameter corresponding to each line based on the gray distribution information on at least one line perpendicular to the contour line by using an electron beam imaging model, and the model parameter is used as the model parameter corresponding to the electron beam image.
Optionally, the electron beam image is subjected to contour extraction by using an edge contour algorithm, where the contour algorithm includes at least one of the following algorithms: absolute threshold algorithm, relative threshold algorithm, frequency domain algorithm, correlation algorithm.
Optionally, the electron beam imaging model includes a first scattering model and a second scattering model, an edge angle corresponding to the first scattering model is smaller than or equal to a preset angle, and an edge angle corresponding to the second scattering model is greater than the preset angle, and then the parameter obtaining unit is specifically configured to:
and determining whether the edge angle corresponding to the electron beam image is larger than a preset angle, if so, fitting by using the second scattering model to obtain a model parameter corresponding to the electron beam image, and if not, fitting by using the first scattering model to obtain a model parameter corresponding to the electron beam image.
Optionally, the model parameters include at least one of the following parameters: structure width, structure height, rising edge inclination angle, falling edge inclination angle, imaging attenuation length, rising edge coordinate and falling edge coordinate.
Optionally, a fitting algorithm is used to fit to obtain model parameters corresponding to the electron beam image, where the fitting algorithm includes one of the following fitting methods: parameter value traversal method, Newton method, gradient descent method, conjugate gradient method, least square method, neural network method, machine learning method.
Optionally, the structure to be tested includes: raised line structures, groove structures or hole-type structures.
The embodiment of the application provides a three-dimensional reconstruction method and a three-dimensional reconstruction device, an electron beam scanning device can be used for scanning a structure to be detected to obtain an electron beam image, an electron beam imaging model is used for fitting to obtain model parameters corresponding to the electron beam image, the model parameters can reflect the three-dimensional characteristics of the structure to be detected, namely, the electron beam image can be processed to obtain the three-dimensional characteristics of the structure to be detected, and therefore the model parameters reflecting the three-dimensional characteristics of the structure to be detected can be used for carrying out three-dimensional reconstruction on the structure to be detected. Because the electron beam imaging model can fit the electron beam image and depends on the corresponding relation between the model parameters and the image information, the electron beam imaging model is not influenced by the edge angle, can be suitable for the three-dimensional reconstruction of the structure to be measured at each edge angle, improves the accuracy of the three-dimensional reconstruction of the structure to be measured at a high edge angle, and further improves the accuracy of monitoring the process quality.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings can be obtained by those skilled in the art according to the drawings.
Fig. 1 is a flowchart of a three-dimensional reconstruction method according to an embodiment of the present disclosure;
fig. 2 is a schematic diagram of a structure to be tested according to an embodiment of the present disclosure;
FIG. 3 is a schematic view of an electron beam image provided in an embodiment of the present application;
fig. 4 is a schematic diagram of a gray scale distribution according to an embodiment of the present application;
fig. 5 is a schematic diagram of fitting distribution information obtained by fitting according to an embodiment of the present application;
fig. 6 is a schematic reconstruction structure provided in an embodiment of the present application;
fig. 7 is a block diagram of a three-dimensional reconstruction apparatus according to an embodiment of the present disclosure.
Detailed Description
In order to make the technical solutions of the present application better understood, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the field of integrated circuits, the three-dimensional shape of a device can be obtained by using a three-dimensional reconstruction technology, specifically, the device structure can be scanned by using electron beam microscopy equipment to obtain electron beam imaging intensities at different positions, and then the electron beam imaging intensities are analyzed by using the three-dimensional reconstruction technology to obtain the three-dimensional shape of the device structure.
However, the current three-dimensional reconstruction method can reconstruct the three-dimensional shape of the device structure by using the functional relationship between the electron beam imaging intensity and the structure, for example, the electron beam imaging intensity can be a differential function of the structure surface height, and accordingly, the three-dimensional shape of the device structure can be reconstructed. However, the method can better reconstruct the three-dimensional shape of the continuous slowly-varying structure, and for the vertical edge structure, the differential function between the structure surface height and the electron beam imaging intensity appears fault, and the determined three-dimensional shape is not accurate enough, so that the three-dimensional shape of the device structure with large height variation, such as the three-dimensional shape of the vertical edge structure, cannot be accurately obtained by the three-dimensional reconstruction method.
Based on the above technical problems, embodiments of the present application provide a three-dimensional reconstruction method and apparatus, which may include scanning a structure to be measured by an electron beam scanning device to obtain an electron beam image, and obtaining a model parameter corresponding to the electron beam image by fitting using an electron beam imaging model, where the model parameter may reflect a three-dimensional characteristic of the structure to be measured, that is, the electron beam image may be processed to obtain the three-dimensional characteristic of the structure to be measured, so that the model parameter reflecting the three-dimensional characteristic of the structure to be measured may be used to perform three-dimensional reconstruction of the structure to be measured. Because the electron beam imaging model can fit the electron beam image and depends on the corresponding relation between the model parameters and the image information, the electron beam imaging model is not influenced by the edge angle, can be suitable for the three-dimensional reconstruction of the structure to be measured at each edge angle, improves the accuracy of the three-dimensional reconstruction of the structure to be measured at a high edge angle, and further improves the accuracy of monitoring the process quality.
The following describes in detail a specific implementation manner of the three-dimensional reconstruction method and apparatus in the embodiments of the present application with reference to the drawings.
Referring to fig. 1, a flowchart of a three-dimensional reconstruction method provided in an embodiment of the present application is shown, where the method may include the following steps:
s101, acquiring an electron beam image.
In the embodiment of the application, the structure to be measured can be scanned, the structure to be measured can be an independent structure in a device, the independent structure can be a regular structure such as a raised line structure, a groove structure or a hole type structure, and can also be other raised irregular structures or other recessed irregular structures on a plane, the independent structure can be a structure with violent height change, and also can be a structure with gentler height change. Fig. 2 is a schematic diagram of a structure to be tested according to an embodiment of the present disclosure, where the structure to be tested is a raised line structure, and the raised line structure has a certain height and width.
The Scanning of the structure to be measured may be performed by using an Electron beam Scanning device, for example, a Scanning Electron Microscope (SEM) or a Transmission Electron Microscope (TEM), and the Electron beam Scanning device may emit an Electron beam to the structure to be measured, where the Electron beam interacts with the structure to be measured to excite various physical information, for example, electrons around the structure to be measured may be collected to form an Electron beam image, as shown in fig. 3, a schematic diagram of an Electron beam image provided in this embodiment of the present application, and gray scale distribution information in the Electron beam image represents the number of electrons, so as to represent the interaction between the structure to be measured and the Electron beam.
The angle for scanning the structure to be detected by the electron beam scanning equipment can be a single angle, for example, vertical overlook scanning, so that the problem of difficult operation caused by three-dimensional reconstruction of a plurality of electron beam images obtained by combining a plurality of scanning angles in the prior art is solved.
The electron beam image is obtained by scanning the structure to be measured, and thus, corresponding to the structure to be measured, one structure to be measured may correspond to one electron beam image, and the electron beam image represents the structural characteristics of the structure to be measured corresponding to the electron beam image, for example, if the structure to be measured is a raised line structure, the corresponding electron beam image represents the structural characteristics of the raised line structure.
In actual operation, a device may include a plurality of independent structures, each independent structure may serve as a structure to be measured, the structures to be measured may be scanned simultaneously to obtain an original image, the original image is divided to obtain a plurality of structure regions, each structure region includes only one independent structure, and each structure region may serve as an electron beam image to embody structural characteristics of the independent structure in the structure region. For example, the device comprises a plurality of two structures to be measured, namely a raised line structure and a groove structure, and an electron beam image representing the structural characteristics of the raised line structure and an electron beam image representing the structural characteristics of the groove structure can be obtained by scanning the two structures to be measured.
The electron beam image can reflect the structural characteristics of the structure to be measured, specifically, the profile in the electron beam image reflects the profile characteristics of the structure to be measured, the distance between the profiles can reflect the size of the structure to be measured, and the gray distribution of the electron beam image can reflect the height change of the structure to be measured. After obtaining the electron beam image, the size relationship between the structure to be measured and the electron beam image may be calibrated, and generally, the size relationship between the structure to be measured and the electron beam image is determined by parameters of the electron beam scanning device, so that the size in the electron beam image may be converted into the actual size of the structure to be measured.
And S102, fitting the electron beam imaging model to obtain model parameters corresponding to the electron beam image.
The gray scale distribution information of the electron beam image reflects the interaction between the structure to be detected and the electron beam, so that the three-dimensional characteristic of the structure to be detected can be reflected, the model parameters corresponding to the electron beam image can be obtained by fitting the electron beam imaging model, and the model parameters corresponding to the electron beam image can reflect the three-dimensional characteristic of the structure to be detected, so that the three-dimensional characteristic of the structure to be detected is obtained by processing the electron beam image equivalently. The three-dimensional characteristic of the structure to be measured is obtained by using the electron beam imaging model, the simple functional relation between the height of the structure to be measured and the electron beam imaging intensity is not relied on, and more factors are considered, so that the obtained three-dimensional characteristic of the structure to be measured is more accurate, and the method can be applied to a wider range.
Wherein the model parameters of the electron beam imaging model may include at least one of the following parameters: structure width, structure height, rising edge tilt angle, falling edge tilt angle, imaging attenuation length, rising edge coordinate, falling edge coordinate, and the like. It will be appreciated that the model parameters herein correspond to individual structures, each of which corresponds to a set of model parameters that characterize the three-dimensional nature of the individual structure, such that each electron beam image may correspond to a set of determined model parameters, which may include model parameters for one or more locations.
In the embodiment of the present application, the electron beam imaging model may obtain a corresponding image by using the model parameters, so that the electron beam imaging model is used to obtain the model parameters corresponding to the electron beam image by fitting, and essentially, the model parameters are adjusted to make the obtained image approach the electron beam imaging model, and if the obtained image is consistent with or has a small phase difference with the electron beam imaging model, the model parameters at this time may be used as the model parameters corresponding to the electron beam image, that is, the electron beam image can be obtained under the model parameters.
Specifically, the model parameters corresponding to the electron beam image may be obtained by fitting using a fitting algorithm, where the fitting algorithm may be one of the following fitting methods: parameter value traversal method, Newton method, gradient descent method, conjugate gradient method, least square method, neural network method, machine learning method, etc.
In order to reduce the amount of fitting calculation, features may be extracted in the electron beam image so that the fitting is performed on a targeted basis. Specifically, the contour of the electron beam image may be extracted to obtain at least one contour line, and then the gray scale distribution information on at least one line perpendicular to the contour line may be extracted, and based on the gray scale distribution information on the lines, the model parameters corresponding to the electron beam image may be obtained by fitting using an electron beam imaging model. This is because the gradation is usually not greatly different in the direction parallel to the contour line, and therefore, extracting the gradation distribution information on at least one line perpendicular to the contour line can reduce the data processing amount while extracting important information, thereby improving the three-dimensional reconstruction efficiency.
Specifically, the electron beam image may be subjected to contour extraction by using an edge contour algorithm, where the contour algorithm includes at least one of the following algorithms: absolute threshold algorithms, relative threshold algorithms, frequency domain algorithms, correlation algorithms, and the like. After extracting the profile of the electron beam image, profile parameters can be obtained for embodying profile characteristics, wherein the profile parameters can include profile distance, profile roughness, distance roughness and the like.
In the embodiment of the present application, a relative threshold algorithm may be used to extract a contour of an electron beam image, as shown in fig. 3, where both contour lines are contour lines in a vertical direction, as shown in fig. 4, which is a schematic gray distribution diagram provided in the embodiment of the present application, a dotted line direction is gray distribution information on one line in a horizontal direction in fig. 3, an abscissa of the gray distribution information is a position (position) and has a unit of nanometer (nm), an ordinate of the gray distribution information is an electron intensity (SE) and has a unit of dimensionless (a.u.), and it can be seen that very high electron intensity occurs in the contour lines, and the electron intensity rapidly changes at adjacent positions on both sides of the contour lines and gradually decreases between the two contour lines.
In actual operation, noise may exist in the electron beam image, and the obtained gray scale distribution information has obvious noise, so that the noise of the electron beam image can be removed by using a denoising algorithm, and the denoising manner may include one or more of a neighbor mean effect method, a frequency domain denoising algorithm, a gaussian denoising algorithm, a convolution denoising algorithm and the like, so that more accurate gray scale distribution information can be obtained. The principle of denoising by using a denoising algorithm is that the gray distribution on a plurality of adjacent lines perpendicular to a contour line is averaged, so that the difference between the lines due to the existence of noise can be reduced, and the distance and the number of the adjacent lines can be determined according to the actual situation.
After obtaining the gray scale distribution information on the line perpendicular to the contour line, the electron beam imaging model may be used to fit to obtain the model parameter corresponding to the electron beam image based on the gray scale distribution information on the line perpendicular to the contour line, as shown in fig. 4, the solid line is the fitting distribution information corresponding to the model parameter obtained by fitting the gray scale distribution information, and when the gray scale distribution information is not much different from the fitting distribution information, the model parameter corresponding to the fitting distribution information may be used as the model parameter obtained by fitting.
Because the contour line has a certain length, the gray distribution information of a plurality of lines perpendicular to the contour line can be obtained at different positions of the contour line, and the model parameter corresponding to each line is obtained, so that the model parameters corresponding to the lines are used as the model parameters corresponding to the electron beam image.
Referring to fig. 5, a schematic diagram of fitting distribution information obtained by fitting according to an embodiment of the present application is shown, where a gray scale distribution of the fitting distribution information is similar to a gray scale distribution of an electron beam image shown in fig. 3, and background random noise is suppressed to a certain extent, so that accuracy of image recognition is improved. The model parameters corresponding to the fitting distribution information can be used as model parameters corresponding to the electron beam image and are used for reflecting the three-dimensional characteristics of the structure to be measured corresponding to the electron beam image.
In this embodiment of the application, the electron beam imaging model may be a secondary electron scattering model of the electron beam scanning apparatus during an imaging process, and the electron beam imaging model may include a first scattering model and a second scattering model, where an edge angle corresponding to the first scattering model is smaller than or equal to a preset angle, an edge angle corresponding to the second scattering model is greater than the preset angle, and the preset angle range may be 60 ° to 90 °, for example, may be 70 °, and thus, with respect to the first scattering model, the second scattering model may consider a vertical edge effect to adapt to an actual imaging process with a larger edge angle.
Therefore, different electron beam imaging models can be used for different electron beam images, for example, whether the edge angle corresponding to the electron beam image is larger than a preset angle can be judged, if yes, model parameters corresponding to the electron beam image can be obtained by fitting the second scattering model, and if not, model parameters corresponding to the electron beam image can be obtained by fitting the first scattering model. The edge angle corresponding to electron beam imaging is the edge angle of the individual structures in the electron beam image.
And S103, performing three-dimensional reconstruction on the structure to be detected by using the model parameters corresponding to the electron beam image.
After obtaining the model parameters corresponding to the electron beam image, the model parameters may reflect the three-dimensional characteristics of the structure to be measured, so that the three-dimensional reconstruction of the structure to be measured may be performed using the model parameters, as shown in fig. 6, a schematic diagram of a reconstruction structure provided in an embodiment of the present application may reflect the characteristics of the structure to be measured, such as Height (Height), width, edge angle, and the like, wherein the unused positions in a plane perpendicular to the Height are represented by coordinates (position), and the units therein are nm. Comparing the reconstruction structure of fig. 6 with the structure to be measured of fig. 2, it can be known that the reconstruction structure and the structure to be measured have higher similarity, so the reconstruction effect is good, the accuracy is high, the robustness is good, and meanwhile, the method has an obvious inhibiting effect on some background noises.
In the embodiment of the application, the three-dimensional reconstruction structure can be analyzed and evaluated, the electron beam imaging model is adjusted by using the analysis result, or the edge contour algorithm is reselected, or the fitting method is reselected, or the denoising method is reselected, so that the optimization of the three-dimensional reconstruction method is realized, and the accuracy of the three-dimensional reconstruction is improved.
The embodiment of the application provides a three-dimensional reconstruction method, which can be used for scanning a structure to be detected by using an electron beam scanning device to obtain an electron beam image, and obtaining model parameters corresponding to the electron beam image by using an electron beam imaging model through fitting, wherein the model parameters can reflect the three-dimensional characteristics of the structure to be detected, that is, the electron beam image can be processed to obtain the three-dimensional characteristics of the structure to be detected, so that the three-dimensional reconstruction of the structure to be detected can be carried out by using the model parameters reflecting the three-dimensional characteristics of the structure to be detected. Because the electron beam imaging model can fit the electron beam image and depends on the corresponding relation between the model parameters and the image information, the electron beam imaging model is not influenced by the edge angle, can be suitable for the three-dimensional reconstruction of the structure to be measured at each edge angle, improves the accuracy of the three-dimensional reconstruction of the structure to be measured at a high edge angle, and further improves the accuracy of monitoring the process quality.
Based on the above three-dimensional reconstruction method, an embodiment of the present application further provides a three-dimensional reconstruction device, and as shown in fig. 7, for a structural block diagram of the three-dimensional reconstruction device provided in the embodiment of the present application, the device may include:
an image obtaining unit 110, configured to obtain an electron beam image, where the electron beam image is obtained by scanning a structure to be detected by using an electron beam scanning device;
a parameter obtaining unit 120, configured to obtain, by using an electron beam imaging model, a model parameter corresponding to the electron beam image through fitting; the model parameters embody the three-dimensional characteristics of the structure to be tested;
a reconstruction unit 130, configured to perform three-dimensional reconstruction on the structure to be measured by using the model parameters.
Optionally, the parameter obtaining unit includes:
the contour extraction unit is used for carrying out contour extraction on the electron beam image to obtain at least one contour line;
and the parameter obtaining subunit is used for fitting to obtain a model parameter corresponding to each line based on the gray distribution information on at least one line perpendicular to the contour line by using an electron beam imaging model, and the model parameter is used as the model parameter corresponding to the electron beam image.
Optionally, the electron beam image is subjected to contour extraction by using an edge contour algorithm, where the contour algorithm includes at least one of the following algorithms: absolute threshold algorithm, relative threshold algorithm, frequency domain algorithm, correlation algorithm.
Optionally, the electron beam imaging model includes a first scattering model and a second scattering model, an edge angle corresponding to the first scattering model is smaller than or equal to a preset angle, and an edge angle corresponding to the second scattering model is greater than the preset angle, and then the parameter obtaining unit is specifically configured to:
and determining whether the edge angle corresponding to the electron beam image is larger than a preset angle, if so, fitting by using the second scattering model to obtain a model parameter corresponding to the electron beam image, and if not, fitting by using the first scattering model to obtain a model parameter corresponding to the electron beam image.
Optionally, the model parameters include at least one of the following parameters: structure width, structure height, rising edge inclination angle, falling edge inclination angle, imaging attenuation length, rising edge coordinate and falling edge coordinate.
Optionally, a fitting algorithm is used to fit to obtain model parameters corresponding to the electron beam image, where the fitting algorithm includes one of the following fitting methods: parameter value traversal method, Newton method, gradient descent method, conjugate gradient method, least square method, neural network method, machine learning method.
Optionally, the structure to be tested includes: raised line structures, groove structures or hole-type structures.
The embodiment of the application provides a three-dimensional reconstruction device, can utilize electron beam scanning equipment to scan the structure that awaits measuring and obtain the electron beam image, utilize electron beam imaging model, can fit and obtain the model parameter that the electron beam image corresponds, the model parameter can embody the three-dimensional characteristic of the structure that awaits measuring, that is to say, can handle the electron beam image and acquire the three-dimensional characteristic of the structure that awaits measuring, can utilize the model parameter of embodying the three-dimensional characteristic of the structure that awaits measuring to carry out the three-dimensional reconstruction of the structure that awaits measuring like this. Because the electron beam imaging model can fit the electron beam image and depends on the corresponding relation between the model parameters and the image information, the electron beam imaging model is not influenced by the edge angle, can be suitable for the three-dimensional reconstruction of the structure to be measured at each edge angle, improves the accuracy of the three-dimensional reconstruction of the structure to be measured at a high edge angle, and further improves the accuracy of monitoring the process quality.
The name "first" in the names "first … …", "first … …", etc. mentioned in the embodiments of the present application is only used for name identification, and does not represent the first in sequence. The same applies to "second" etc.
As can be seen from the above description of the embodiments, those skilled in the art can clearly understand that all or part of the steps in the above embodiment methods can be implemented by software plus a general hardware platform. Based on such understanding, the technical solution of the present application may be embodied in the form of a software product, which may be stored in a storage medium, such as a read-only memory (ROM)/RAM, a magnetic disk, an optical disk, or the like, and includes several instructions for enabling a computer device (which may be a personal computer, a server, or a network communication device such as a router) to execute the method according to the embodiments or some parts of the embodiments of the present application.
The embodiments in the present specification are described in a progressive manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, for the apparatus embodiment, since it is substantially similar to the method embodiment, it is relatively simple to describe, and reference may be made to some descriptions of the method embodiment for relevant points. The above-described embodiments of the apparatus and system are merely illustrative, wherein modules described as separate parts may or may not be physically separate, and parts shown as modules may or may not be physical modules, may be located in one place, or may be distributed on a plurality of network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment. One of ordinary skill in the art can understand and implement it without inventive effort.
The above description is only a preferred embodiment of the present application and is not intended to limit the scope of the present application. It should be noted that, for a person skilled in the art, several improvements and modifications can be made without departing from the scope of the present application, and these improvements and modifications should also be considered as the protection scope of the present application.
Claims (10)
1. A method of three-dimensional reconstruction, the method comprising:
acquiring an electron beam image, wherein the electron beam image is obtained by scanning a structure to be detected by using electron beam scanning equipment;
utilizing an electron beam imaging model to obtain model parameters corresponding to the electron beam image through fitting; the model parameters embody the three-dimensional characteristics of the structure to be tested;
and performing three-dimensional reconstruction on the structure to be detected by using the model parameters.
2. The method of claim 1, further comprising: extracting the contour of the electron beam image to obtain at least one contour line, and then fitting to obtain model parameters corresponding to the electron beam image by using an electron beam imaging model, wherein the method comprises the following steps:
and fitting to obtain model parameters corresponding to each line as the model parameters corresponding to the electron beam image based on gray distribution information on at least one line perpendicular to the contour line by using an electron beam imaging model.
3. The method of claim 2, wherein the electron beam image is contour extracted using an edge contour algorithm, the contour algorithm comprising at least one of: absolute threshold algorithm, relative threshold algorithm, frequency domain algorithm, correlation algorithm.
4. The method of claim 1, wherein the electron beam imaging model includes a first scattering model and a second scattering model, an edge angle corresponding to the first scattering model is smaller than or equal to a preset angle, and an edge angle corresponding to the second scattering model is larger than the preset angle, and then the obtaining of the model parameter corresponding to the electron beam image by fitting using the electron beam imaging model includes:
and determining whether the edge angle corresponding to the electron beam image is larger than a preset angle, if so, fitting by using the second scattering model to obtain a model parameter corresponding to the electron beam image, and if not, fitting by using the first scattering model to obtain a model parameter corresponding to the electron beam image.
5. The method according to any of claims 1-4, wherein the model parameters comprise at least one of the following parameters: structure width, structure height, rising edge inclination angle, falling edge inclination angle, imaging attenuation length, rising edge coordinate and falling edge coordinate.
6. The method according to any one of claims 1 to 4, wherein the model parameters corresponding to the electron beam image are fitted by using a fitting algorithm, wherein the fitting algorithm comprises one of the following fitting methods: parameter value traversal method, Newton method, gradient descent method, conjugate gradient method, least square method, neural network method, machine learning method.
7. The method of any of claims 1-4, wherein the structure under test comprises: raised line structures, groove structures or hole-type structures.
8. A three-dimensional reconstruction apparatus, characterized in that the apparatus comprises:
the device comprises an image acquisition unit, a data acquisition unit and a data processing unit, wherein the image acquisition unit is used for acquiring an electron beam image, and the electron beam image is obtained by scanning a structure to be detected by using electron beam scanning equipment;
the parameter obtaining unit is used for obtaining model parameters corresponding to the electron beam image through fitting by using an electron beam imaging model; the model parameters embody the three-dimensional characteristics of the structure to be tested;
and the reconstruction unit is used for performing three-dimensional reconstruction on the structure to be measured by using the model parameters.
9. The method of claim 8, wherein the parameter obtaining unit comprises:
the contour extraction unit is used for carrying out contour extraction on the electron beam image to obtain at least one contour line;
and the parameter obtaining subunit is used for fitting to obtain a model parameter corresponding to each line based on the gray distribution information on at least one line perpendicular to the contour line by using an electron beam imaging model, and the model parameter is used as the model parameter corresponding to the electron beam image.
10. The apparatus according to claim 8, wherein the electron beam imaging model includes a first scattering model and a second scattering model, an edge angle corresponding to the first scattering model is smaller than or equal to a preset angle, and an edge angle corresponding to the second scattering model is larger than the preset angle, and then the parameter obtaining unit is specifically configured to:
and determining whether the edge angle corresponding to the electron beam image is larger than a preset angle, if so, fitting by using the second scattering model to obtain a model parameter corresponding to the electron beam image, and if not, fitting by using the first scattering model to obtain a model parameter corresponding to the electron beam image.
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