CN111572203A - Preparation method of transparent ink-jet head based on MEMS and printing process - Google Patents
Preparation method of transparent ink-jet head based on MEMS and printing process Download PDFInfo
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- CN111572203A CN111572203A CN202010257427.5A CN202010257427A CN111572203A CN 111572203 A CN111572203 A CN 111572203A CN 202010257427 A CN202010257427 A CN 202010257427A CN 111572203 A CN111572203 A CN 111572203A
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- ink
- cavity plate
- ink cavity
- piezoelectric ceramic
- jet head
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- 238000000034 method Methods 0.000 title claims abstract description 47
- 238000002360 preparation method Methods 0.000 title claims abstract description 26
- 238000007639 printing Methods 0.000 title claims abstract description 17
- 239000000919 ceramic Substances 0.000 claims abstract description 33
- 239000011521 glass Substances 0.000 claims abstract description 29
- 235000012431 wafers Nutrition 0.000 claims abstract description 27
- 239000004065 semiconductor Substances 0.000 claims abstract description 9
- 230000007613 environmental effect Effects 0.000 claims abstract description 8
- 238000007650 screen-printing Methods 0.000 claims abstract description 6
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 20
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- 230000010287 polarization Effects 0.000 claims description 7
- 235000012239 silicon dioxide Nutrition 0.000 claims description 6
- 239000000377 silicon dioxide Substances 0.000 claims description 6
- 238000005245 sintering Methods 0.000 claims description 6
- 238000009826 distribution Methods 0.000 claims description 3
- 238000010329 laser etching Methods 0.000 claims description 3
- 238000001259 photo etching Methods 0.000 claims description 3
- 229910052715 tantalum Inorganic materials 0.000 claims description 3
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical group [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000000126 substance Substances 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000001514 detection method Methods 0.000 abstract description 4
- 238000012423 maintenance Methods 0.000 abstract description 4
- 238000001704 evaporation Methods 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1607—Production of print heads with piezoelectric elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/162—Manufacturing of the nozzle plates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
Abstract
The invention discloses a preparation method of a transparent ink-jet head based on MEMS and a printing process, wherein the front end of the ink-jet head comprises an ink cavity plate and a nozzle plate, the ink cavity plate and the nozzle plate are both made of glass wafers, and the preparation of the transparent ink-jet head comprises the following steps: s1, evaporating a lower electrode on the glass wafer of the ink cavity plate, and printing a piezoelectric ceramic layer according to an electrode pattern by utilizing a screen printing process; s2, continuously printing an upper electrode on the piezoelectric ceramic layer; s3, bonding the ink cavity plate and the nozzle plate together through a semiconductor bonding process; and S4, polarizing the piezoelectric ceramics in the piezoelectric ceramic layer in the piezoelectric ceramic polarimeter. The invention enables the internal structure of the ink gun to be observed visually, reduces the fault detection step and the maintenance cost of the ink gun, ensures that the nozzle plate is fixed stably and is suitable for various ink components, and can also simplify the preparation process of the piezoelectric driving end, reduce the use of chemicals and reduce the preparation cost of the piezoelectric driving end so as to meet the requirements of production and environmental protection.
Description
Technical Field
The invention relates to the technical field of printing equipment, in particular to a preparation method of a transparent ink jet head based on MEMS and a printing process.
Background
The casing and nozzles of a typical ink jet head are made of plastic, metal, polymer film or silicon, and these objects are opaque or translucent, so that the color and flow of the ink inside cannot be observed. In addition, in the prior art, the nozzle plates are bonded by glue, the process is complex, the stability is poor, the control is not easy, and the selection of ink components is greatly limited in consideration of the chemical property of the glue; meanwhile, the piezoelectric driving end of the ink gun is prepared by mainly adopting machining, sputtering, gel method and the like at present, the preparation method can realize the preparation of the piezoelectric driving end of the ink gun, but the equipment used for the preparation is expensive, the preparation method also can be suitable for various chemicals, and under the condition of meeting the environmental protection requirement, the investment for processing the residual chemicals needs to be increased, so that the preparation cost is increased.
Disclosure of Invention
The invention aims to provide a preparation method of a transparent ink gun based on MEMS and a printing process, which aims to solve the problems in the prior art, so that the internal structure of the ink gun is visually observed, the fault detection steps and the maintenance cost of the ink gun are reduced, a nozzle plate is stably fixed and is simultaneously suitable for various ink components, the preparation process of a piezoelectric driving end can be simplified, the use of chemicals is reduced, and the preparation cost of the piezoelectric driving end is reduced, so that the production and environmental protection requirements are met.
In order to achieve the purpose, the invention provides the following scheme:
the invention provides a preparation method of a transparent ink-jet head based on MEMS and a printing process, wherein the transparent ink-jet head comprises a piezoelectric driving end and a front end of the ink-jet head, the front end of the ink-jet head comprises an ink cavity plate and a nozzle plate, the ink cavity plate and the nozzle plate are both made of glass wafers, and the preparation of the transparent ink-jet head comprises the following steps:
s1, the piezoelectric driving end comprises a lower electrode, a piezoelectric ceramic layer and an upper electrode which are sequentially stacked from bottom to top and fixedly connected, the lower electrode is evaporated on the glass wafer of the ink cavity plate through a semiconductor process, the lower electrode is a metal layer with a certain thickness, the piezoelectric ceramic layer is printed on the lower electrode according to an electrode pattern through a screen printing process, the piezoelectric ceramic layer and the ink cavity plate are bonded together through the metal layer, and the electrode pattern is formed by a plurality of rectangular islands in an array distribution;
s2, after S1 is completed, continuously printing the upper electrodes on the rectangular islands of the piezoelectric ceramic layer, arranging a plurality of rows of conducting wires on the glass wafer of the ink cavity plate, wherein the conducting wires are respectively connected with all the upper electrodes and all the lower electrodes in a one-to-one correspondence manner, and after the connection is completed, placing the glass wafer in a sintering furnace for sintering;
s3, respectively photoetching an ink cavity structure and a nozzle structure on the ink cavity plate and the nozzle plate by adopting a laser etching process, wherein the position of the ink cavity structure corresponds to the position of the rectangular island, bonding the ink cavity plate and the nozzle plate together by adopting a semiconductor bonding process, and communicating the ink cavity structure and the nozzle structure with each other to obtain the front end of the complete ink gun;
and S4, polarizing the piezoelectric ceramics in the piezoelectric ceramic layer in a piezoelectric ceramic polarimeter, and enabling the voltage needing to be polarized to reach a high voltage of 500V when the piezoelectric ceramics are polarized, and simultaneously raising the environmental temperature of polarization so as to ensure normal polarization.
Preferably, the diameter of the glass wafer of the ink chamber plate is 4-8 inches, and the thickness of the glass wafer of the ink chamber plate is 300-600 microns.
Preferably, the spacing between adjacent rectangular islands is 60-100 microns, and the thickness of the rectangular islands is 20-50 microns.
Preferably, the metal of the metal layer is tantalum, and the thickness of the metal layer is 4-7 microns.
Preferably, the line width of the conducting wire is 30-60 microns and is made of conductive adhesive.
Preferably, the surface of the glass wafer of the ink chamber plate is provided with a silicon dioxide layer, the silicon dioxide layer is a vibration film of the transparent ink jet head, and the vibration film is located between the glass wafer of the ink chamber plate and the lower electrode.
Preferably, the resolution of the transparent ink-jet head is 100-360DPI, the ink drop size of the transparent ink-jet head is 2.5-100PL, and the printing frequency of the transparent ink-jet head is 50 KHZ.
Compared with the prior art, the invention has the following technical effects:
the ink cavity plate and the nozzle plate are made of glass, so that the ink cavity structure and the nozzle structure can be visually observed, and when the ink gun is judged whether to be continuously used or the reason of the fault, the fault detection steps and the overhaul and maintenance cost of the ink gun can be reduced. The ink cavity plate and the nozzle plate are bonded together through a semiconductor bonding process, so that the nozzle plate can be firmly fixed, the limitation of ink component selection in the traditional process is broken, the application field of ink jet is widened, and meanwhile, the processing procedures and the manufacturing cost are reduced. And the piezoelectric ceramic layer is printed on the lower electrode by adopting a screen printing process, so that the preparation process of the piezoelectric driving end is obviously simplified, the use of chemicals is reduced, the preparation cost of the piezoelectric driving end is reduced, and the requirements of production and environmental protection are met.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
FIG. 1 is a schematic view of a transparent ink jet head according to the present invention;
FIG. 2 is a schematic view of a glass wafer after a metal layer is evaporated according to the present invention;
FIG. 3 is a schematic view of a glass wafer after printing rectangular islands according to the present invention;
wherein: 1-ink cavity plate, 2-metal layer, 3-rectangular island, 4-piezoelectric ceramic layer, 5-upper electrode, 6-lead, 7-vibrating membrane, 8-ink cavity structure, 9-nozzle plate and 10-nozzle structure.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without inventive effort based on the embodiments of the present invention, are within the scope of the present invention.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
As shown in fig. 1-3: the embodiment provides a preparation method of a transparent ink-jet head based on MEMS and printing process, the transparent ink-jet head comprises a piezoelectric driving end and a front end of the ink-jet head, the front end of the ink-jet head comprises an ink cavity plate 1 and a nozzle plate 9, the ink cavity plate 1 and the nozzle plate 9 are both made of glass wafers, and the preparation of the transparent ink-jet head comprises the following steps:
s1, the piezoelectric driving end comprises a lower electrode, a piezoelectric ceramic layer 4 and an upper electrode 5 which are sequentially stacked from bottom to top and fixedly connected, the lower electrode is formed by evaporating a metal layer 2 with a certain thickness on a glass wafer of an ink cavity plate 1 through a semiconductor process, the piezoelectric ceramic layer 4 is printed on the lower electrode according to an electrode pattern by utilizing a screen printing process, the piezoelectric ceramic layer 4 and the ink cavity plate 1 are bonded together through the metal layer 2, and the electrode pattern is formed by a plurality of rectangular islands 3 in an array distribution; specifically, the metal of the metal layer 2 is tantalum, and the thickness of the metal layer 2 is 5 microns, so that the adhesive force of the metal layer 2 can be improved, the piezoelectric ceramic layer 4 can be directly bonded with the ink cavity plate 1 through the metal layer 2, and the processing procedure is simplified; the diameter of the glass wafer of the ink cavity plate 1 is 6 inches, and the thickness of the glass wafer of the ink cavity plate 1 is 300-600 microns; preferably, the distance between adjacent rectangular islands 3 is 60-100 micrometers, the thickness of the rectangular island 3 is 20-50 micrometers, and the length x width of the rectangular island 3 is 80 x 200 micrometers; in addition, the surface of the glass wafer of the ink cavity plate 1 is provided with a silicon dioxide layer, the vibration film 7 is positioned between the glass wafer of the ink cavity plate 1 and the lower electrode, the silicon dioxide layer can be directly used as the vibration film 7 of the transparent ink-jet head, the vibration film 7 is not required to be additionally arranged, and the processing procedure of the ink-jet head is further simplified; it should be noted that the lower electrode may be a small local area corresponding to the position of each rectangular island 3, or a lower electrode in which all piezoelectric driving terminals share one large area;
s2, after S1 is completed, continuously printing upper electrodes 5 on the rectangular islands 3 of the piezoelectric ceramic layer 4, arranging a plurality of rows of conducting wires 6 on the glass wafer of the ink cavity plate 1, wherein the line width of each conducting wire 6 is 30-60 microns and is made of conducting adhesive, the conducting wires 6 are respectively connected with all the upper electrodes 5 and all the lower electrodes in a one-to-one correspondence manner, and the conducting wires are placed in a sintering furnace for sintering after the connection is completed;
s3, respectively photoetching an ink cavity structure 8 and a nozzle structure 10 on an ink cavity plate 1 and a nozzle plate 9 by adopting a laser etching process, wherein the position of the ink cavity structure 8 corresponds to the position of the rectangular island 3, bonding the ink cavity plate 1 and the nozzle plate 9 together by a semiconductor bonding process, and aligning and communicating the ink cavity structure 8 and the nozzle structure 10 to obtain the front end of the complete ink gun;
s4, polarizing the piezoelectric ceramic in the piezoelectric ceramic layer 4 in a piezoelectric ceramic polarizer, and when polarizing the piezoelectric ceramic, the voltage needed to be polarized must reach a high voltage of 500V, and because the polarizing voltage is too high, a large current is generated during polarization due to the line width of 40 microns, the circuit is burnt out, so the environmental temperature of polarization must be raised to ensure normal polarization.
The resolution of the transparent ink-jet head prepared by the preparation method is 100-360DPI, the ink drop size of the transparent ink-jet head is 2.5-100PL, and the printing frequency of the transparent ink-jet head is 50 KHZ.
Has the advantages that:
compared with the traditional process, firstly, the ink cavity plate 1 and the nozzle plate 9 are both made of glass, so that the ink cavity structure 8 and the nozzle structure 10 can be visually observed, and when whether the ink gun can be continuously used or the reason of the fault is judged, the fault detection step and the overhaul and maintenance cost of the ink gun can be reduced. Secondly, the ink cavity plate 1 and the nozzle plate 9 are bonded together through a semiconductor bonding process, so that the nozzle plate 9 can be firmly fixed, and the ink gun can adapt to various ink components because the ink gun is not bonded by glue, the limitation of ink component selection is broken, the application field of ink jet is widened, and meanwhile, the processing procedure and the processing cost of the nozzle plate 9 are reduced. And finally, the piezoelectric ceramic layer 4 is printed on the lower electrode by adopting a screen printing process, so that the preparation process of the piezoelectric driving end is obviously simplified, the use of chemicals is reduced, the preparation cost of the piezoelectric driving end is reduced, and the requirements of production and environmental protection are met.
The principle and the implementation mode of the present invention are explained by applying specific examples in the present specification, and the above descriptions of the examples are only used to help understanding the method and the core idea of the present invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, the specific embodiments and the application range may be changed. In view of the above, the present disclosure should not be construed as limiting the invention.
Claims (7)
1. A preparation method of a transparent ink-jet head based on MEMS and printing process is characterized in that: the transparent ink gun comprises a piezoelectric driving end and an ink gun front end, the ink gun front end comprises an ink cavity plate and a nozzle plate, the ink cavity plate and the nozzle plate are both made of glass wafers, and the preparation of the transparent ink gun comprises the following steps:
s1, the piezoelectric driving end comprises a lower electrode, a piezoelectric ceramic layer and an upper electrode which are sequentially stacked from bottom to top and fixedly connected, the lower electrode is evaporated on the glass wafer of the ink cavity plate through a semiconductor process, the lower electrode is a metal layer with a certain thickness, the piezoelectric ceramic layer is printed on the lower electrode according to an electrode pattern through a screen printing process, the piezoelectric ceramic layer and the ink cavity plate are bonded together through the metal layer, and the electrode pattern is formed by a plurality of rectangular islands in an array distribution;
s2, after S1 is completed, continuously printing the upper electrodes on the rectangular islands of the piezoelectric ceramic layer, arranging a plurality of rows of conducting wires on the glass wafer of the ink cavity plate, wherein the conducting wires are respectively connected with all the upper electrodes and all the lower electrodes in a one-to-one correspondence manner, and after the connection is completed, placing the glass wafer in a sintering furnace for sintering;
s3, respectively photoetching an ink cavity structure and a nozzle structure on the ink cavity plate and the nozzle plate by adopting a laser etching process, wherein the position of the ink cavity structure corresponds to the position of the rectangular island, bonding the ink cavity plate and the nozzle plate together by adopting a semiconductor bonding process, and communicating the ink cavity structure and the nozzle structure with each other to obtain the front end of the complete ink gun;
and S4, polarizing the piezoelectric ceramics in the piezoelectric ceramic layer in a piezoelectric ceramic polarimeter, and enabling the voltage needing to be polarized to reach a high voltage of 500V when the piezoelectric ceramics are polarized, and simultaneously raising the environmental temperature of polarization so as to ensure normal polarization.
2. The method of claim 1, wherein the method comprises the steps of: the diameter of the glass wafer of the ink cavity plate is 4-8 inches, and the thickness of the glass wafer of the ink cavity plate is 300-600 microns.
3. The method of claim 1, wherein the method comprises the steps of: the distance between every two adjacent rectangular islands is 60-100 micrometers, and the thickness of each rectangular island is 20-50 micrometers.
4. The method of claim 1, wherein the method comprises the steps of: the metal of the metal layer is tantalum, and the thickness of the metal layer is 4-7 microns.
5. The method of claim 1, wherein the method comprises the steps of: the line width of the conducting wire is 30-60 microns and is made of conducting resin.
6. The method of claim 1, wherein the method comprises the steps of: the surface of the glass wafer of the ink cavity plate is provided with a silicon dioxide layer, the silicon dioxide layer is a vibration film of the transparent ink gun, and the vibration film is positioned between the glass wafer of the ink cavity plate and the lower electrode.
7. The method of claim 1, wherein the method comprises the steps of: the resolution of the transparent ink-jet head is 100-360DPI, and the ink drop size of the transparent ink-jet head is 2.5-100 PL.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010257427.5A CN111572203B (en) | 2020-04-03 | 2020-04-03 | Preparation method of transparent ink-jet head based on MEMS and printing process |
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| CN202010257427.5A CN111572203B (en) | 2020-04-03 | 2020-04-03 | Preparation method of transparent ink-jet head based on MEMS and printing process |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114248550A (en) * | 2022-01-18 | 2022-03-29 | 麦科帕姆智能科技(淄博)有限公司 | Piezoelectric ink jet head |
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