CN111565517A - Manufacturing method of auxiliary carrier for improving platelet cleaning - Google Patents

Abstract

The invention relates to a method for manufacturing an auxiliary carrier for improving platelet cleaning, which comprises the following steps of S1: manufacturing a carrier substrate: selecting a plate with the thickness more than 0.5mm larger than the thickness of an actual product as a carrier substrate; s2: depth control groove treatment: carrying out depth control milling on the carrier substrate according to the delivery appearance of an actual product to form a plurality of depth control grooves for placing the product, and keeping the residual thickness with the bottom of the carrier substrate; s3: windowing treatment: windowing according to the position of the actual product solder mask windowing corresponding to the residual thickness surface of the depth control groove; s4: drilling treatment: and drilling in the area except the windowing of the depth control groove, wherein the drilling is realized by drilling a plurality of cleaning exchange holes by adopting a conventional drilling manufacturing method. The manufacturing method of the auxiliary carrier for improving the platelet cleaning has the advantages of improving the product quality, meeting the requirements of different product sizes, having good cleaning and fixing effects and the like.

Description

Manufacturing method of auxiliary carrier for improving platelet cleaning

Technical Field

The invention relates to the technical field of circuit board manufacturing, in particular to a manufacturing method of an auxiliary carrier for improving platelet cleaning.

Background

With the development of electronic information, the thickness of a PCB product is thin and thick, the makeup is developed towards two extreme directions of big and small, in the direction of small development of the makeup, partial products require that the delivery of PCB finished products does not allow continuous delivery due to SMT loading requirements, and single PCS delivery cannot be cleaned horizontally after forming and cutting, so that the product quality is influenced.

Finished products are not allowed to be delivered in a continuous mode, single PCS (minimum 15mm to 20 mm) is required to be delivered, horizontal line cleaning cannot be achieved after forming and after FQC, a high-pressure air gun is used for manual cleaning in the traditional platelet cleaning improvement method, and PP dust on a formed plate surface cannot be effectively removed due to manual operation. The conventional production process of the product comprises the following steps: pre-procedure → molding → manual air gun cleaning → FQC → packaging, this conventional fabrication has the following disadvantages: 1. cleaning a finished product after molding, and improving the dust residue on the board surface by cleaning with a manual air gun; 2. because of the makeup undersize behind the FQC, equipment gyro wheel interval design is minimum about 30mm, and the product size surpasss present trade equipment design ability, can't carry out the level and go out the oxidation and wash, directly arrives the packing after the board is examined to the FQC, and the product is examined the board back at the FQC and is easily the bad circumstances of oxidation appears. The manual air gun cleaning can improve the PP powder residue on the board surface to a certain extent, but cannot thoroughly solve the problem, and the FQC cannot be horizontally deoxidized and cleaned after the board is detected, so that the product is easy to oxidize, and the tin coating performance of the client side of the product is influenced.

Disclosure of Invention

Therefore, the applicant provides a manufacturing method of an auxiliary carrier for improving platelet cleaning, which can clean 100% of PP powder remained on a plate surface during molding, can perform horizontal deoxidation cleaning after an FQC plate is detected, and can remove 100% of oxidation caused by the FQC plate or oxidation caused by a previous process.

In order to achieve the above purpose, the following technical solutions are provided.

A method for manufacturing an auxiliary carrier for improving platelet cleaning comprises the following steps,

s1: manufacturing a carrier substrate: selecting a plate with the thickness more than 0.5mm larger than the thickness of an actual product as a carrier substrate, so as to ensure that the surface of the product is lower than the surface of the carrier after the product is placed in a depth control groove while the carrier keeps the residual thickness in the subsequent depth control milling, and effectively avoid the product from falling off from the depth control groove due to high-pressure water washing during horizontal cleaning;

s2: depth control groove treatment: the method comprises the following steps of carrying out depth control milling on a carrier substrate according to the delivery appearance of an actual product to form a plurality of depth control grooves for placing the product, and reserving surplus thickness with the bottom of the carrier substrate, specifically, designing on the carrier substrate according to the production size capacity of actual equipment, carrying out typesetting on the same carrier substrate according to the size of the actual product, milling a plurality of depth control grooves, and ensuring that the surplus thickness of the bottom of the depth control groove and the bottom of the carrier substrate is reserved, so that the toughness of the connection position of the surplus thickness of the carrier substrate is effectively ensured, and further ensuring that the product loaded into the depth control grooves cannot fall off due to the fracture of the bottom of the carrier substrate;

s3: windowing treatment: windowing is carried out at the position corresponding to the residual thickness surface of the depth control groove according to the actual product solder mask windowing, namely windowing is carried out at the position of the solder mask copper leakage surface non-cover oil on the surface of the PCB, and the cleaning and drying effects of the windowing position are ensured;

s4: drilling treatment: the method comprises the steps of drilling in an area except for windowing of a depth control groove, wherein the drilling is realized by drilling a plurality of cleaning exchange holes by adopting a conventional drilling manufacturing method, specifically, the cleaning exchange holes are drilled in positions where window opening and oil covering are not conducted, namely positions with excess thickness, and liquid medicine and water washing exchange overflow is increased, so that the problems that in the prior art, PP powder residual level is not thoroughly cleaned, and oxidation cleaning cannot be carried out after FQC board inspection are solved.

According to the manufacturing method of the auxiliary jig for improving the platelet cleaning, disclosed by the invention, the carrier substrate is selected, the depth control groove treatment is carried out on the carrier substrate, the window opening treatment is carried out at the residual thickness position in the depth control groove according to an actual product, and the drilling treatment is carried out at the residual thickness position outside the window opening treatment, so that the problems that the PP powder residual level is not thoroughly cleaned and the oxidation cleaning cannot be carried out after the FQC is used for detecting the platelet in the prior art are effectively solved. The auxiliary jig manufactured by the manufacturing method of the auxiliary jig for improving the cleaning of the small plate can clean 100% of PP powder remained on the plate surface during molding, can be horizontally deoxidized and cleaned after the FQC plate detection, and can remove 100% of oxidation caused by the FQC plate detection or oxidation caused by the previous process.

Furthermore, a plurality of depth control grooves processed and milled by the depth control grooves are distributed in an array shape with multiple rows and multiple columns, gaps are reserved between every two adjacent depth control grooves, and a fixed corner block protruding into each depth control groove is arranged in each depth control groove. The design of the plurality of depth control grooves distributed in an array shape enables the carrier to be capable of being filled with a plurality of PCB small plates at one time, cleaning and operating efficiency is effectively improved, and meanwhile, gaps are reserved among the depth control grooves to ensure that the PCB small plates filled into the depth control grooves are independent and not influenced; the retaining and the setting of fixed hornblock effectively ensure that the PCB platelet plays the effect of the fixed product of screens when packing into the accuse deep groove, ensure that the installation of PCB platelet is stable, and not hard up and rock.

Furthermore, a plurality of water guide grooves penetrating through the depth control grooves are formed in the carrier substrate, and the water guide grooves and the depth control grooves are vertically distributed in the length direction. The arrangement of the water guide groove is used for improving the water pool effect of the upper spraying surface when the product is cleaned, improving the liquid medicine exchange capacity and further improving and ensuring the cleaning effect.

Furthermore, the carrier base plate is made of copper-free PP plates, the carrier base plate is made of the copper-free PP plates, the manufactured carrier can be pressed to different thicknesses according to actual product requirements, the copper-free pressing carrier is not prone to deformation, and the carrier made of the PP plates can be compared with the carrier made of a copper-clad plate, so that copper ions can be prevented from being separated out to pollute the liquid medicine tank when liquid medicine is cleaned, the service life of the liquid medicine tank can be shortened, and compared with carriers made of special corrosion-resistant materials such as 316, the carrier has the advantages of corrosion resistance, low cost, light weight, low transmission load of equipment and.

Furthermore, the upper surface of the product is lower than the carrier substrate by more than 0.2mm after the product is placed in the depth control groove, so that the product is prevented from falling off from the depth control groove due to high-pressure water washing during horizontal cleaning, smooth cleaning of the product is further ensured, and the operation efficiency is improved.

Further, after the depth control trench processing in step S2, a residual thickness of 0.3mm or more remains between the bottom of the depth control trench and the bottom of the carrier substrate. The toughness of the residual thickness connecting position is ensured, and further the carrier is ensured not to be broken and not to have poor plate falling.

The invention also provides an auxiliary carrier for improving platelet cleaning, which is prepared by the preparation method. The auxiliary jig manufactured by the manufacturing method of the auxiliary jig for improving the cleaning of the small plate can clean 100% of PP powder remained on the plate surface during molding, can be horizontally deoxidized and cleaned after the FQC plate detection, and can remove 100% of oxidation caused by the FQC plate detection or oxidation caused by the previous process.

The invention also provides a small plate cleaning method, after the small plate is subjected to pretreatment and forming treatment, the small plate is cleaned for the first time by using the auxiliary carrier, and the first cleaning adopts high-pressure water washing and ultrasonic water washing.

Further, the first washing comprises the following steps,

s1: placing the formed plate in a depth control groove on a carrier;

s2: starting a horizontal cleaning line, controlling the depth of the residual thickness surface to be downward, and conveying and placing the carrier through an equipment feeding section;

s3: after the finished board is horizontally cleaned by the aid of the carriers, the carriers are turned by 180 degrees at the discharging section and poured into the board collecting frame to be sent to the next procedure.

Adopt above-mentioned auxiliary carrier, after the PCB platelet is handled through the shaping, when going on washing horizontal cleaning line, wash with ultrasonic wave washing through pressurization water many times, can remain the PP powder 100% sanitization at the face during with the shaping, effectively solve among the prior art air gun clean lead to board PP powder clean not thorough, and then appear the remaining problem of PP powder.

Further, after the platelets are cleaned for the first time, the platelets enter an FQC detection processing procedure, and after the FQC detection processing procedure, the platelets are cleaned for the second time by using the auxiliary carrier of claim 5, wherein the second cleaning is a chemical deoxidation cleaning, and the second cleaning comprises the following steps,

s1: placing the cleaning plate qualified by FQC detection in a depth control groove on a carrier;

s2: starting a horizontal deoxidation line, controlling the depth of the residual thickness surface to be downward, and conveying and placing the carrier through an equipment feeding section;

s3: after the cleaning plate is subjected to horizontal chemical deoxidation cleaning through the assistance of the carrier, the carrier is turned 180 degrees at the discharging section and then poured into a collecting plate frame for packaging and warehousing.

After the PCB platelet is examined through the FQC, adopt above-mentioned same auxiliary carrier, carry out horizontal chemistry to the PCB platelet and go out the oxidation cleaning, when the washing of horizontal oxidation cleaning line, through chemical acid or supporting surface treatment liquid medicine, can examine the oxidation that the board leads to or the oxidation that the preceding processing procedure leads to with the FQC and carry out 100% and get rid of, and then improve the bad problem of going up tin that the face oxidation leads to, effectively promote and improve product quality.

Compared with the prior art, the manufacturing method of the auxiliary carrier for improving platelet cleaning has the following beneficial effects: the auxiliary jig manufactured by the manufacturing method of the auxiliary jig for improving the cleaning of the small plate can clean 100% of PP powder remained on the plate surface during molding, can be horizontally deoxidized and cleaned after the FQC plate detection, and can remove 100% of oxidation caused by the FQC plate detection or oxidation caused by the previous process, thereby effectively improving and improving the product quality.

Drawings

FIG. 1 is a block diagram of a method of making an auxiliary carrier for improved platelet cleaning in accordance with the present invention;

FIG. 2 is a schematic plan view of an auxiliary carrier fabricated by the method of the present invention for improving platelet cleaning;

fig. 3 is an enlarged view of a portion a of fig. 2.

Detailed Description

The following describes the method for manufacturing the auxiliary carrier for improving platelet cleaning according to the present invention in detail with reference to the following embodiments and the accompanying drawings.

Example 1

Referring to fig. 1 to 3, a non-limiting embodiment of the present invention is a method for manufacturing an auxiliary carrier for improving platelet cleaning, the manufactured auxiliary carrier is used in a product manufacturing process for cleaning a product, and the product manufacturing process includes: front process → molding → auxiliary cleaning of special carrier → FQC → auxiliary cleaning of special carrier → packaging. The manufacturing method of the special auxiliary carrier comprises the following steps,

s1: manufacturing a carrier substrate 1: selecting a plate with the thickness more than 0.5mm larger than the thickness of an actual product as a carrier substrate 1, so as to ensure that the surface of a product is lower than the surface of the carrier after the product is placed in a depth control groove 3 while the carrier keeps the residual thickness in the subsequent depth control milling, and effectively avoid the product from falling off from the depth control groove 3 due to high-pressure water washing during horizontal cleaning;

s2: and (3) treatment of a depth control groove: the method comprises the following steps of carrying out depth control milling on a carrier substrate 1 according to the delivery appearance of an actual product to form a plurality of depth control grooves 3 for placing the product, and reserving excess thickness with the bottom of the carrier substrate 1, wherein 32 in the attached drawing 3 is an excess thickness position, specifically, designing the carrier substrate 1 according to the production size capacity of actual equipment, carrying out typesetting according to the size of the actual product on the same carrier substrate 1, milling a plurality of depth control grooves 3, and ensuring that the excess thickness of the bottom of each depth control groove 3 and the bottom of the carrier substrate 1 is reserved, so as to effectively ensure the toughness of the connection position of the excess thickness of the carrier substrate, and further ensure that the product loaded into each depth control groove 3 cannot fall off due to the breakage of the bottom of the carrier substrate 1;

s3: windowing treatment: windowing is carried out according to the position of the actual product solder mask windowing corresponding to the residual thickness surface 32 in the depth control groove 3, namely windowing is carried out at the position of the solder mask copper leakage surface non-cover oil on the surface of the PCB, and the cleaning and drying effects of the windowing position 31 are ensured;

s4: drilling treatment: the drilling treatment is carried out in the area except the windowing treatment of the depth control groove 3, the drilling treatment is to drill a plurality of cleaning exchange holes 33 by adopting a conventional drilling manufacturing method, specifically, the cleaning exchange holes 33 are drilled at the positions of non-windowing oil covering positions, namely the positions of residual thickness, so that the exchange overflow of liquid medicine and water washing is increased, and the problems that in the prior art, the PP powder residual level is not thoroughly cleaned, and the plate cannot be subjected to oxidation cleaning after FQC inspection are solved.

Referring to fig. 1 to 3, a non-limiting embodiment of the present invention provides a method for manufacturing an auxiliary fixture for improving platelet cleaning, which includes selecting a carrier substrate 1, performing a depth control groove 3 treatment on the carrier substrate 1, performing a windowing treatment on a residual thickness position in the depth control groove 3 according to an actual product, and performing a drilling treatment on the residual thickness position outside the windowing treatment, so as to effectively solve the problems of incomplete cleaning of residual levels of PP powder and incapability of deoxidation cleaning after FQC inspection in the prior art. The auxiliary jig manufactured by the manufacturing method of the auxiliary jig for improving the cleaning of the small plate can clean 100% of PP powder remained on the plate surface during molding, can be horizontally deoxidized and cleaned after the FQC plate detection, and can remove 100% of oxidation caused by the FQC plate detection or oxidation caused by the previous process.

Referring to fig. 1 to 3, in a non-limiting embodiment of the present invention, the depth-controlling grooves 3 are formed by processing a plurality of depth-controlling grooves 3 formed by depth-controlling milling and distributed in an array of rows and columns, a gap is left between every two adjacent depth-controlling grooves 3, and a fixed corner block 11 protruding into the depth-controlling groove 3 is disposed in each depth-controlling groove 3. The design of the plurality of depth control grooves 3 distributed in an array shape enables the carrier to be capable of being loaded with a plurality of PCB small plates at one time, effectively improves the cleaning and operating efficiency, and simultaneously, gaps are reserved among the depth control grooves 3 to ensure that the PCB small plates loaded into the depth control grooves 3 are independent and not influenced; the retaining and the setting of the fixed corner block 11 effectively ensure that the PCB small plate plays a role of clamping and fixing a product when being packed into the depth control groove 3, and ensure that the PCB small plate is stably installed without loosening and shaking.

Referring to fig. 1 to 3, in a non-limiting embodiment of the present invention, a plurality of water guiding grooves penetrating through the depth-controlling groove 3 are formed on the carrier substrate 1, and the water guiding grooves are vertically distributed along the length direction of the depth-controlling groove 3. The arrangement of the water guide groove is used for improving the water pool effect of the upper spraying surface when the product is cleaned, improving the liquid medicine exchange capacity and further improving and ensuring the cleaning effect.

Referring to fig. 1 to 3, in a non-limiting embodiment of the present invention, the carrier substrate 1 is made of a copper-free PP plate, and the carrier substrate 1 is made of the copper-free PP plate, so that the carrier can be pressed to different thicknesses according to actual product requirements, and the copper-free pressing carrier is not easy to deform.

Referring to fig. 1 to 3, according to a non-limiting embodiment of the present invention, the height between the upper surface of the product placed in the depth control groove 3 and the carrier substrate 1 is lower by more than 0.2mm, so that the product is prevented from falling off from the depth control groove 3 due to high pressure water washing during horizontal cleaning, thereby ensuring smooth cleaning of the product and improving the operation efficiency.

Referring to fig. 1 to 3, in a non-limiting embodiment of the present invention, after the depth control trench 3 is processed in step S2, the bottom of the depth control trench 3 and the bottom of the carrier substrate 1 remain over 0.3 mm. The toughness of the residual thickness connecting position is ensured, and further the carrier is ensured not to be broken and not to have poor plate falling.

Example 2

Referring to fig. 2 and 3, in a non-limiting embodiment of the present invention, the present invention further provides an auxiliary carrier for improving platelet cleaning, which is manufactured by the above manufacturing method, and includes a carrier substrate 1, wherein a plurality of depth control grooves 3 distributed in an array form and water guide grooves 2 vertically distributed in a length direction of the depth control grooves 3 are distributed on the carrier substrate 1 through depth control milling, and the water guide grooves 2 are communicated with the depth control grooves 3. A windowing position 31 is arranged at a position, corresponding to the actual product windowing, in the depth control groove 3, and windowing is carried out at a position where the solder-resisting copper-leaking surface of the PCB surface is not covered with oil; a plurality of cleaning exchange holes 33 are provided at the position of the window cover oil, that is, the position of the excess thickness. The auxiliary jig manufactured by the manufacturing method of the auxiliary jig for improving the cleaning of the small plate can clean 100% of PP powder remained on the plate surface during molding, can be horizontally deoxidized and cleaned after the FQC plate detection, and can remove 100% of oxidation caused by the FQC plate detection or oxidation caused by the previous process.

Example 3

Referring to fig. 2 and 3, in a non-limiting embodiment of the present invention, the present invention further provides a method for cleaning a small plate, wherein after the small plate is subjected to a pre-process treatment and a forming treatment, the small plate is cleaned by using the auxiliary carrier for the first time, and the first cleaning is performed by using high-pressure water washing and ultrasonic water washing. The first cleaning comprises the following steps of,

s1: placing the formed plate in a depth control groove 3 on a carrier;

s2: starting a horizontal cleaning line, controlling the depth of the residual thickness surface 32 to be downward, and conveying and placing the carrier into the device through an equipment feeding section;

s3: after the finished board is horizontally cleaned by the aid of the carriers, the carriers are turned by 180 degrees at the discharging section and poured into the board collecting frame to be sent to the next procedure.

Referring to fig. 2 and 3, in a non-limiting embodiment of the present invention, after the PCB platelet is formed, when the PCB platelet is cleaned by the horizontal cleaning line, 100% of the PP powder remaining on the board surface during the forming process can be cleaned by multiple pressurized water washing and ultrasonic water washing, which effectively solves the problem of incomplete cleaning of the PP powder of the board due to the cleaning of the air gun in the prior art, and further the residual PP powder.

Referring to fig. 2 and 3, in a non-limiting embodiment of the present invention, after the first cleaning of the small plate, the small plate enters an FQC detection process, and after the FQC detection process, the small plate is cleaned by using the auxiliary carrier of claim 5 for a second time, wherein the second cleaning is a chemical deoxidation cleaning, and the second cleaning comprises the following steps,

s1: placing the cleaning plate qualified by FQC detection in a depth control groove 3 on a carrier;

s2: starting a horizontal deoxidation line, controlling the depth of the residual thickness surface 32 to be downward, and conveying and placing the carrier through an equipment feeding section;

s3: after the cleaning plate is subjected to horizontal chemical deoxidation cleaning through the assistance of the carrier, the carrier is turned 180 degrees at the discharging section and then poured into a collecting plate frame for packaging and warehousing.

Referring to fig. 2 and 3, in a non-limiting embodiment of the present invention, after the PCB is inspected by the FQC, the same auxiliary carrier is used to perform horizontal chemical deoxidation cleaning on the PCB, and during the horizontal deoxidation cleaning line cleaning, oxidation caused by the FQC inspection or oxidation caused by the previous process can be removed by 100% by using a chemical acid or a matching surface treatment chemical, so as to improve the problem of poor tin deposition caused by the oxidation of the board surface and effectively improve the product quality.

The above embodiments are only specific embodiments of the present invention, and the description thereof is specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications are possible without departing from the inventive concept, and such obvious alternatives fall within the scope of the invention.

Claims (10)

1. A manufacturing method of an auxiliary carrier for improving platelet cleaning is characterized in that: comprises the following steps of (a) carrying out,

s1: manufacturing a carrier substrate: selecting a plate with the thickness more than 0.5mm larger than the thickness of an actual product as a carrier substrate;

s2: depth control groove treatment: carrying out depth control milling on the carrier substrate according to the delivery appearance of an actual product to form a plurality of depth control grooves for placing the product, and keeping the residual thickness with the bottom of the carrier substrate;

s3: windowing treatment: windowing according to the position of the actual product solder mask windowing corresponding to the residual thickness surface of the depth control groove;

s4: drilling treatment: and drilling in the area except the windowing of the depth control groove, wherein the drilling is realized by drilling a plurality of cleaning exchange holes by adopting a conventional drilling manufacturing method.

2. The method for manufacturing an auxiliary carrier for improving platelet cleaning according to claim 1, wherein the depth control grooves are formed by milling a plurality of depth control grooves in an array of rows and columns, gaps are left between adjacent depth control grooves, and a fixing angle block protruding into each depth control groove is arranged in each depth control groove.

3. The method as claimed in claim 2, wherein a plurality of water guiding grooves are formed on the carrier substrate, and the water guiding grooves are perpendicular to the depth control grooves in the longitudinal direction.

4. The method as claimed in claim 3, wherein the carrier substrate is made of copper-free PP sheet material.

5. The method as claimed in claim 4, wherein the product is placed in the depth control groove and the height between the upper surface and the carrier substrate is more than 0.2 mm.

6. The method for manufacturing an auxiliary carrier for improving platelet cleaning according to claim 5, wherein the depth control groove bottom and the bottom of the carrier substrate remain an excess thickness of 0.3mm or more after the depth control groove processing in step S2.

7. An auxiliary carrier for improving platelet cleaning is characterized in that: an auxiliary carrier manufactured by the manufacturing method of any one of claims 1 to 4.

8. A method of cleaning a platelet, comprising: after the small plate is processed by the previous process and the forming process, the small plate is cleaned for the first time by using the auxiliary carrier of claim 5.

9. A platelet cleaning method according to claim 8 wherein said first cleaning includes the step of,

s1: placing the formed plate in a depth control groove on a carrier;

s2: starting a horizontal cleaning line, controlling the depth of the residual thickness surface to be downward, and conveying and placing the carrier through an equipment feeding section;

s3: after the finished board is horizontally cleaned by the aid of the carriers, the carriers are turned by 180 degrees at the discharging section and poured into the board collecting frame to be sent to the next procedure.

10. A platelet cleaning method according to claim 8, wherein after the first cleaning, the platelet goes to FQC detection processing, and after the FQC detection processing, the platelet is cleaned for a second time by using the auxiliary carrier according to claim 5, the second cleaning comprises the following steps,

s1: placing the cleaning plate qualified by FQC detection in a depth control groove on a carrier;

s2: starting a horizontal deoxidation line, controlling the depth of the residual thickness surface to be downward, and conveying and placing the carrier through an equipment feeding section;

s3: after the cleaning plate is subjected to horizontal chemical deoxidation cleaning through the assistance of the carrier, the carrier is turned 180 degrees at the discharging section and then poured into a collecting plate frame for packaging and warehousing.

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