CN111564479B - Manufacturing method of display panel, display panel and display device - Google Patents
Manufacturing method of display panel, display panel and display device Download PDFInfo
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- CN111564479B CN111564479B CN202010430538.1A CN202010430538A CN111564479B CN 111564479 B CN111564479 B CN 111564479B CN 202010430538 A CN202010430538 A CN 202010430538A CN 111564479 B CN111564479 B CN 111564479B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
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Abstract
The invention provides a manufacturing method of a display panel, the display panel and a display device, and relates to the technical field of display. According to the embodiment of the invention, the first pixel defining layer is formed in the display area of the substrate, and the first retaining wall and the second retaining wall are formed in the non-display area of the substrate; the first pixel definition layer divides the display area into a plurality of first sub-pixel areas, the virtual plate is arranged between the first retaining wall and the second retaining wall, the virtual plate comprises a virtual substrate and a second pixel definition layer, the first retaining wall and the second retaining wall divide the virtual substrate into a plurality of second sub-pixel areas, an organic functional layer is formed in the first sub-pixel areas and the second sub-pixel areas, the substrate with the organic functional layer is subjected to drying treatment, so that the edge of the virtual substrate is warped in the direction deviating from the substrate, the virtual plate is separated from the substrate, and the substrate is cut off at redundant places in the edge non-display area after packaging, thereby realizing narrow-frame display.
Description
Technical Field
The present invention relates to the field of display technologies, and in particular, to a method for manufacturing a display panel, and a display device.
Background
An OLED (Organic Light-Emitting Diode) is known as a new generation display technology, and has a wide application prospect due to the advantages of high response, high contrast, flexibility, and the like. Among the film forming technologies of OLEDs, inkjet printing technologies are considered as an important way to realize mass production of large-sized OLEDs due to their high material utilization.
However, in the printing process of the organic functional layer, in the display area of the substrate, since the solvent in the sub-pixel area at the edge of the substrate is different from the solvent atmosphere in the sub-pixel area in the middle of the substrate, the solvent in the edge sub-pixel area is easy to volatilize, so that the dryness of the organic functional layer in the middle area of the substrate is different from that of the organic functional layer in the edge area of the substrate, and further, the thickness of the organic functional layer in the middle area of the substrate is different from that of the organic functional layer in the edge area of the substrate, and the thickness of the organic functional layer in the middle area of the substrate is different from that of the organic functional layer in the edge area of the substrate, so that mura is easy to generate in the display panel, and poor display of the display panel is caused.
In order to solve the problem in the prior art, a sub-pixel area is formed in a non-display area of a substrate base plate, the sub-pixel area in the non-display area is the same as the sub-pixel area in the display area, and functional materials can drop into the sub-pixel area in the non-display area during printing, so that the solvent atmosphere in the sub-pixel area in the edge area of the display area is increased, the problem can be effectively relieved, but the width of the non-display area is increased, the frame of the display panel is widened, and the narrow-frame display cannot be realized. Disclosure of Invention
The invention provides a manufacturing method of a display panel, the display panel and a display device, and aims to solve the problems that in the prior art, in order to improve the thickness of an organic functional layer in the edge area of a substrate, a sub-pixel area is formed in a non-display area of the substrate, so that the frame of the display panel is widened and narrow-frame display cannot be realized.
In order to solve the above problems, the present invention discloses a method for manufacturing a display panel, comprising:
providing a substrate base plate; the substrate comprises a display area and a non-display area surrounding the display area;
forming a first pixel defining layer on the display region on the substrate, and forming a first retaining wall and a second retaining wall on the non-display region on the substrate; the first pixel defining layer divides the display area into a plurality of first sub-pixel areas;
disposing a virtual plate between the first retaining wall and the second retaining wall; the virtual board comprises a virtual substrate and a second pixel defining layer arranged on one side of the virtual substrate far away from the substrate, and the virtual substrate is divided into a plurality of second sub-pixel areas by the second pixel defining layer, the first retaining wall and the second retaining wall;
forming an organic functional layer in the first sub-pixel region and the second sub-pixel region;
drying the substrate with the organic functional layer formed thereon to warp the edge of the virtual substrate in a direction away from the substrate;
and separating the virtual board from the substrate base plate.
Optionally, before the step of forming the first pixel defining layer in the display area on the substrate, and forming the first retaining wall and the second retaining wall in the non-display area on the substrate, the method further includes:
forming a mortise structure in the non-display area on the substrate;
the virtual board further comprises a mortise and tenon structure arranged on one side, close to the substrate, of the virtual substrate, and the mortise and tenon structure is mutually embedded with the mortise and tenon structure, so that the virtual board is embedded with the substrate.
Optionally, the step of forming a mortise structure in the non-display area on the substrate includes:
coating photoresist on the substrate;
exposing and developing the photoresist;
and etching the substrate which is not covered by the photoresist after development to form the tenon hole structure.
Optionally, the step of forming a mortise structure in the non-display area on the substrate includes:
and etching the non-display area on the substrate by using a laser beam to form the tenon hole structure.
Optionally, the height of the mortise structure is greater than or equal to the height of the mortise structure, the length of the mortise structure is greater than or equal to the length of the mortise structure, and the width of the mortise structure is greater than or equal to the width of the mortise structure.
Optionally, the height of the mortise and tenon structure is 20-50 μm, and the length and the width of the mortise and tenon structure are 0.1-1 mm.
Optionally, the material of the virtual substrate is a memory alloy.
Optionally, the first pixel defining layer and the second pixel defining layer each have a height of 1 μm to 3 μm, and the first pixel defining layer and the second pixel defining layer each have a width of 10 μm to 20 μm in a direction extending from the non-display region to the display region; the heights of the first retaining wall and the second retaining wall are 5-10 mu m, and the widths of the first retaining wall and the second retaining wall in the direction extending from the non-display area to the display area are 10-50 mu m.
Optionally, the mortise structure and the mortise structure are in an I shape or a Z shape.
Optionally, the temperature of the drying treatment is 50-150 ℃.
Optionally, after the step of separating the dummy plate from the substrate base plate, the method further includes:
forming a first electrode on the substrate base plate on which the organic functional layer is formed;
forming an encapsulation layer on the first electrode;
and cutting off the area, which is not covered by the packaging layer, of the substrate.
In order to solve the problems, the invention also discloses a display panel which is manufactured by adopting the manufacturing method of the display panel.
In order to solve the problems, the invention also discloses a display device which comprises the display panel.
Compared with the prior art, the invention has the following advantages:
in an embodiment of the invention, a substrate base plate is provided; the substrate includes a display region and a non-display region surrounding the display region; forming a first pixel defining layer in a display area on a substrate, and forming a first retaining wall and a second retaining wall in a non-display area on the substrate; the first pixel defining layer divides the display area into a plurality of first sub-pixel areas; the virtual plate is arranged between the first retaining wall and the second retaining wall; the virtual board comprises a virtual substrate and a second pixel defining layer arranged on one side of the virtual substrate far away from the substrate; the virtual substrate is divided into a plurality of second sub-pixel areas by the second pixel defining layer, the first retaining wall and the second retaining wall; forming an organic functional layer in the first sub-pixel region and the second sub-pixel region; drying the substrate with the organic functional layer so as to warp the edge of the virtual substrate in a direction away from the substrate; the dummy plate is separated from the substrate base plate. The virtual board is arranged between the first retaining wall and the second retaining wall of the substrate, the organic functional layer is formed in the second sub-pixel area in the virtual board and the first sub-pixel area on the substrate at the same time, so that the thickness of the organic functional layer in the first sub-pixel area at the edge of the display area on the substrate is ensured, mura can not be generated when the display panel displays, the problem of poor display is avoided, when the organic functional layer is subjected to drying treatment, the edge of the virtual board is warped in the direction away from the substrate by heating, the virtual board can be separated from the substrate, the substrate after the virtual board is separated can be cut off from an excessive place in the edge non-display area after packaging, and therefore narrow-frame display can be realized.
Drawings
Fig. 1 is a flowchart of a method for manufacturing a display panel according to a first embodiment of the present invention;
fig. 2 is a flowchart of a method for manufacturing a display panel according to a second embodiment of the invention;
fig. 3 is a schematic diagram showing a structure before a substrate having an organic functional layer formed thereon is baked according to an embodiment of the present invention;
fig. 4 is a schematic diagram showing a structure of a substrate on which an organic functional layer is formed after a baking process in an embodiment of the present invention;
fig. 5 shows a schematic view of a mortise and tenon joint structure in an embodiment of the invention.
Detailed Description
In order that the above-recited objects, features and advantages of the present invention will become more readily apparent, a more particular description of the invention will be rendered by reference to the appended drawings and appended detailed description.
Example 1
Referring to fig. 1, a flowchart of a method for manufacturing a display panel according to a first embodiment of the present invention may specifically include the following steps:
step 110, providing a substrate base plate; the substrate includes a display region and a non-display region surrounding the display region.
In the embodiment of the present invention, as shown in fig. 3, a substrate 10 is provided, where the substrate 10 includes a display area 101 and a non-display area 102 surrounding the display area 101, and the substrate 10 may be a glass substrate or a plastic substrate, which is not limited in the embodiment of the present invention, the display area 101 may transmit light, and the non-display area 102 may not transmit light.
Step 120, forming a first pixel defining layer in the display area on the substrate, and forming a first retaining wall and a second retaining wall in the non-display area on the substrate; the first pixel defining layer divides the display area into a plurality of first sub-pixel areas.
In the embodiment of the present invention, the first pixel defining layer 104 is formed on the display area 101 on the substrate 10, and meanwhile, the first barrier 105 and the second barrier 106 are formed on the non-display area 102 on the substrate 10, the first barrier 105 is disposed close to the display area 101, and the second barrier 106 is disposed far away from the display area 101, wherein the materials of the first barrier 105 and the second barrier 106, and the first pixel defining layer 104 are all photosensitive resin-based organic materials, which may be any one of benzocyclobutene (BCB), photoresist, phenol-based resin, polypropylene-based resin, polyimide-based resin, acryl-based resin, and the like.
Specifically, the first pixel defining layer 104, the first retaining wall 105 and the second retaining wall 106 are formed by: the substrate 10 is coated with a photosensitive resin organic material, the photosensitive resin organic material is exposed and developed by a halftone mask, and the first pixel defining layer 104, the first barrier rib 105 and the second barrier rib 106 are obtained after development. The first pixel defining layer 104 divides the display area 101 into a plurality of first sub-pixel areas, and provides a printing area for the subsequent printing of the organic functional layer 107.
Step 130, disposing a virtual plate between the first retaining wall and the second retaining wall; the virtual board comprises a virtual substrate and a second pixel defining layer arranged on one side, far away from the substrate, of the virtual substrate, and the second pixel defining layer, the first retaining wall and the second retaining wall divide the virtual substrate into a plurality of second sub-pixel areas.
In the embodiment of the present invention, a dummy plate 20 is disposed between the first retaining wall 105 and the second retaining wall 106 and contacts the substrate 10; the dummy plate 20 includes a dummy substrate 201 and a second pixel defining layer 202 disposed on a side of the dummy substrate 201 away from the substrate 10, wherein the material of the second pixel defining layer 202 is also a photosensitive resin organic material, the second pixel defining layer 202 is formed by coating the photosensitive resin organic material on the dummy substrate 201, and the second pixel defining layer 202, the first barrier wall 105 and the second barrier wall 106 divide the dummy substrate 201 into a plurality of second sub-pixel regions through exposure and development.
The second sub-pixel area in the non-display area 102 has the same structure as the first sub-pixel area in the display area 101, and is used for providing the first sub-pixel area at the edge of the display area 101 with the same solution environment as the first sub-pixel area in the middle of the display area 101 when the organic functional layer 107 is printed, and at least one column of the first sub-pixel area is located in the non-display area 102 on one side of the first retaining wall 105, which is close to the display area 101, so that the uniformity of the film thickness when the organic functional layer is printed in the first sub-pixel area in the display area 101 can be ensured.
And 140, forming an organic functional layer in the first sub-pixel area and the second sub-pixel area.
In the embodiment of the present invention, the organic functional layer 107 is formed in the first sub-pixel area and the second sub-pixel area by using an inkjet printing technology, wherein the organic functional layer 107 includes a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer, and of course, the organic functional layer 107 may include only the light emitting layer.
Specifically, the first sub-pixel region is located in the display region 101, the second sub-pixel region is located in the non-display region 102, and the non-display region 102 is disposed around the display region 101, so that the second sub-pixel region is disposed around the first sub-pixel region, and the second sub-pixel region is close to the first sub-pixel region at the middle edge of the display region 101, so that after the organic functional layer 107 is formed in the first sub-pixel region and the second sub-pixel region, the solution environment of the organic functional layer 107 in the first sub-pixel region at the edge of the display region 101 close to the first sub-pixel region can be increased, and the solution environment of the organic functional layer 107 in the first sub-pixel region at the middle region of the display region 101 is the same as the solution environment of the organic functional layer 107 in the first sub-pixel region at the middle region of the display region 101.
And 150, drying the substrate with the organic functional layer so that the edge of the virtual substrate warps in a direction away from the substrate.
In the embodiment of the present invention, after the organic functional layer 107 is formed in the first sub-pixel region and the second sub-pixel region, the substrate 10 on which the organic functional layer 107 is formed is baked, and at this time, the dummy plate 20 is already disposed between the first wall 105 and the second wall 106 on the substrate 10, so that when the substrate 10 on which the organic functional layer 107 is formed is baked, the dummy plate 20 is baked, and in the baking process, not only the organic functional layer 107 in the substrate 10 and the dummy plate 20 is baked, but also the dummy substrate 201 in the dummy plate 20 is deformed, as shown in fig. 4, and after the baking process, the edge of the dummy substrate 201 is warped in a direction away from the substrate 10, so that the dummy plate 20 is separated from the substrate 10.
And step 160, separating the virtual board from the substrate base plate.
In the embodiment of the present invention, after the edge of the virtual substrate 201 warps in a direction away from the substrate 10, the virtual board 20 is separated from the substrate 10, and when the virtual board 20 is separated, the virtual board 20 may be separated from the substrate 10 by using a vacuum adsorption device, or other separation methods may be used, which is not limited in the embodiment of the present invention, and after the substrate 10 with the virtual board 20 separated is packaged, the redundant area in the non-display area 102 at the edge may be cut off, so as to realize narrow frame display.
In the embodiment of the invention, the virtual board is arranged between the first retaining wall and the second retaining wall of the substrate, the organic functional layer is formed in the second sub-pixel area in the virtual board and in the first sub-pixel area on the substrate at the same time, so that the thickness of the organic functional layer in the first sub-pixel area at the edge of the display area on the substrate is ensured, mura can not be generated when the display panel displays, the problem of poor display is avoided, the edge of the virtual board is warped in the direction away from the substrate by heating when the organic functional layer is dried, the virtual board can be separated from the substrate, and the substrate after the virtual board is separated can be cut off from the redundant place in the non-display area at the edge after encapsulation, so that narrow frame display can be realized.
Example two
Referring to fig. 2, a flowchart of a method for manufacturing a display panel according to a second embodiment of the present invention may specifically include the following steps:
step 210, providing a substrate base plate; the substrate includes a display region and a non-display region surrounding the display region.
This step is similar to the step 110 of the first embodiment, and will not be described again.
Step 220, forming a mortise structure in the non-display area on the substrate base plate; the virtual board further comprises a mortise and tenon structure arranged on one side, close to the substrate, of the virtual substrate, and the mortise and tenon structure is mutually embedded with the mortise and tenon structure, so that the virtual board is embedded with the substrate.
In the embodiment of the present invention, after the substrate 10 is obtained, the mortise structure 103 is formed in the non-display area 102 on the substrate 10, in order to prevent the virtual board 20 from sliding relative to the substrate 10 during the manufacturing process of the display panel, the mortise structure 103 needs to be formed in the non-display area 102 on the substrate 10, and the mortise structure 203 adapted to the mortise structure 103 needs to be disposed on the virtual board 201, and then the mortise structure 103 and the mortise structure 203 may be embedded together when the virtual board 20 is disposed between the first retaining wall 105 and the second retaining wall 106.
Specifically, the forming process of the mortise and tenon structure 203 in the virtual board 20 is as follows: the photoresist is coated on the virtual substrate 201, the photoresist on the virtual substrate 201 is exposed and developed through a mask plate, and the photoresist which is not washed by the developer solution forms a mortise and tenon structure 203.
In an alternative embodiment of the present invention, step 220 may specifically be: coating photoresist on the substrate; exposing and developing the photoresist; and etching the substrate which is not covered by the photoresist after development to form the tenon hole structure.
Specifically, photoresist is coated on the substrate 10, the photoresist is exposed and developed through a mask plate, the substrate 10 uncovered by the photoresist after development is etched through an etching process, a mortise structure 103 is formed, the formed mortise structure 103 can be used for fixing the virtual plate 20, and the mortise structure 103 does not penetrate through the substrate 10.
In another alternative embodiment of the present invention, step 220 may specifically be: and etching the non-display area on the substrate by using a laser beam to form the tenon hole structure.
Specifically, after the substrate 10 is obtained, the non-display area 102 on the substrate 10 may be etched by using a laser beam to form a mortise structure 103 for fixing the dummy plate 20.
In the embodiment of the present invention, as shown in fig. 5, the mortise structure 103 and the mortise structure 203 are in an i-shape or a Z-shape, and by setting the mortise structure 203 and the mortise structure 103 in an i-shape or a Z-shape, the virtual board 20 formed by mutually fitting the mortise structure 203 and the mortise structure 103 is more stable relative to the substrate board 10, so that the substrate board 10 can be ensured to be stably fitted on the substrate board 10 without sliding or deflecting during the transmission process of the substrate board 10.
Step 230, forming a first pixel defining layer in the display area on the substrate, and forming a first retaining wall and a second retaining wall in the non-display area on the substrate; the first pixel defining layer divides the display area into a plurality of first sub-pixel areas.
This step is similar to the step 120 of the first embodiment, and will not be described again.
In an embodiment of the present invention, before step 230, the method further includes:
a gate electrode, a gate insulating layer, an active layer, a source electrode, a drain electrode, and a passivation layer having a via hole penetrating the passivation layer are sequentially formed on the substrate 10 formed with the mortise structure 103 by a patterning process, and a driving element of the display panel is formed by the gate electrode, the gate insulating layer, the active layer, the source electrode, the drain electrode, and the passivation layer to supply a driving signal to the display panel.
Further, after forming a passivation layer with a via hole on the substrate base 10, a second electrode is formed on the passivation layer, the second electrode is connected to the drain electrode through the via hole penetrating through the passivation layer, and the second electrode is used for transmitting a driving signal of a driving element in the display panel to the organic functional layer 107, wherein the second electrode is an anode.
Step 240, disposing a virtual plate between the first retaining wall and the second retaining wall; the virtual board comprises a virtual substrate and a second pixel defining layer arranged on one side, far away from the substrate, of the virtual substrate, and the second pixel defining layer, the first retaining wall and the second retaining wall divide the virtual substrate into a plurality of second sub-pixel areas.
In the embodiment of the present invention, the virtual plate 20 is disposed between the first retaining wall 105 and the second retaining wall 106; the dummy plate 20 includes a dummy substrate 201 and a second pixel defining layer 202 disposed on a side of the dummy substrate 201 away from the substrate 10, the second pixel defining layer 202, the first barrier wall 105, and the second barrier wall 106 dividing the dummy substrate 201 into a plurality of second sub-pixel regions.
Specifically, the second pixel defining layer 202 in the virtual plate 20 is formed by: the photosensitive resin-based organic material is coated on the dummy substrate 201 in the dummy plate 20, exposed and developed through the mask plate, and the photosensitive resin-based organic material which is not washed out by the developing solution after development forms the second pixel defining layer 202.
Further, the dummy plate 20 further includes a mortise and tenon structure 203 provided at a side of the dummy substrate 201 near the substrate 10, and when the dummy plate 20 is provided between the first and second retaining walls 105 and 106, the mortise and tenon structure 203 and the mortise structure 103 are engaged with each other, so that the dummy plate 20 and the substrate 10 are engaged with each other,
specifically, the height of the mortise structure 103 is greater than or equal to the height of the mortise structure 203, the length of the mortise structure 103 is greater than or equal to the length of the mortise structure 203, and the width of the mortise structure 103 is greater than or equal to the width of the mortise structure 203, so that the mortise structure 203 can be embedded into the mortise structure 103. Wherein the height H1 of the mortise and tenon structure 203 in the direction perpendicular to the substrate base plate 10 is 20 μm to 50 μm, the width W1 of the mortise and tenon structure 203 in the first direction is 0.1mm to 1mm, and the length L1 of the mortise and tenon structure 203 in the second direction is 0.1mm to 1mm, the first direction refers to the direction extending from the non-display area 102 to the display area 101, and the second direction refers to the direction on the plane parallel to the substrate base plate 10 and perpendicular to the first direction.
In an alternative embodiment of the present invention, the step 240 may further include removing a film structure formed on the substrate base 10 between the first and second barrier ribs 105 and 106, the film structure including a gate insulating layer and a passivation layer.
By removing the film structure between the first retaining wall 105 and the second retaining wall 106, it is possible to prevent water molecules from being transferred to the display area 101 through the film structure of the non-display area 102, affecting the lifetime of the display panel.
In another alternative embodiment of the present invention, the step 240 may further include cutting the film layer between the first wall 105 and the second wall 106 in a direction from the non-display area 102 toward the display area 101, where the cutting position may be any position between the first wall 105 and the second wall 106. By cutting off the film layer between the first and second barriers 105 and 106, water molecules can be prevented from being transferred from the non-display area 102 to the display area 101, affecting the lifetime of the display panel.
In the embodiment of the present invention, the heights H2 and H3 of the first pixel defining layer 104 and the second pixel defining layer 202 in the direction perpendicular to the substrate base plate 10 are each 1 μm to 3 μm, and the widths W2 and W3 of the first pixel defining layer 104 and the second pixel defining layer 202 in the direction extending from the non-display area 102 to the display area 101 are each 10 μm to 20 μm; the heights H4 and H5 of the first and second barriers 105 and 106 in the direction perpendicular to the substrate 10 are 5 μm to 10 μm, and the widths W4 and W5 of the first and second barriers 105 and 106 in the direction extending from the non-display area 102 to the display area 101 are 10 μm to 50 μm, so that the frame glue of the non-display area 102 can be effectively blocked from entering the display area 101 during packaging by setting the heights of the first and second barriers 105 and 106 higher.
In step 250, an organic functional layer is formed in the first sub-pixel region and the second sub-pixel region.
This step is similar to the step 140 of the first embodiment, and will not be described again.
And 260, drying the substrate with the organic functional layer so that the edge of the virtual substrate warps in a direction away from the substrate.
In the embodiment of the present invention, the material of the dummy substrate 201 is a memory alloy, and the materials that can be used for the memory alloy include: fe-Pt, ti-Ni-Pd, ti-Nb, U-Nb, fe-Mn-Si, au-Cd, ag-Cd, cu-Zn-Sn, cu-Zn-Al, cu-Zn-Si, cu-Sn, cu-Zn-Ga, in-Ti, au-Cu-Zn, niAl, and the like. The memory alloy has a double-pass memory effect, i.e., a shape of a high-temperature phase is recovered when heated and a shape of a low-temperature phase is recovered when cooled, and because the virtual substrate 201 has the double-pass memory effect, when the substrate 10 on which the organic functional layer 107 is formed is baked, the virtual substrate 201 is deformed after being heated to a certain temperature, so that the edge of the virtual substrate 201 is warped in a direction away from the substrate 10, and the edge of the virtual substrate 201 is separated from the substrate 10.
In the embodiment of the present invention, the temperature at which the substrate 10 on which the organic functional layer 107 is formed is baked is 50 ℃ to 150 ℃, at which the dummy substrate 201 is deformed, so that the edge of the dummy substrate 201 is separated from the substrate 10.
In another alternative embodiment of the present invention, the method further comprises, before step 260, placing the substrate with the organic functional layer formed thereon in a vacuum environment for preliminary drying; wherein said at least one ofThe vacuum degree of the vacuum environment is as follows: 10 -6 torr-10 -4 torr。
In the embodiment of the invention, the substrate 10 with the organic functional layer 107 formed thereon is placed in a vacuum environment for preliminary drying, so that the organic functional layers in the first sub-pixel area and the second sub-pixel area can be dried preliminarily, and the uniformity of the film thickness of the organic functional layer 107 in the first sub-pixel area and the second sub-pixel area during the subsequent drying treatment can be improved.
Step 270, separating the dummy plate from the substrate base plate.
In the embodiment of the present invention, the virtual board 20 is separated from the substrate 10 by using the vacuum adsorption device, after the virtual board 20 is separated from the substrate 10, the virtual board 20 may be cooled to restore the original shape, and the second pixel defining layer 202, the organic functional layer 107 and the mortise and tenon structure 203 on the virtual board 20 are cleaned, so that the virtual board 201 may be reused, and the material utilization rate is improved.
Alternatively, the second pixel defining layer 202, the organic functional layer 107 and the mortise and tenon structure 203 on the virtual board 20 may be cleaned, or only the organic functional layer 107 and the second pixel defining layer 202 may be cleaned, and then the virtual substrate 201 may be cooled to recover for reuse.
And 280, forming a first electrode on the substrate base plate formed with the organic functional layer.
And 290, forming an encapsulation layer on the first electrode.
And 300, cutting off the area, which is not covered by the packaging layer, of the substrate.
In the embodiment of the present invention, after the dummy plate 20 is separated from the substrate 10, a first electrode is formed on the substrate 10 on which the organic functional layer 107 is formed, the first electrode is a cathode, and then a packaging layer is formed on the first electrode, so as to package the structures such as the organic functional layer 107 and the first electrode formed on the substrate 10, and after packaging, the area of the substrate 10 not covered by the packaging layer is cut off, thereby realizing narrow frame display.
The packaging layer can be a glass packaging layer, an organic film packaging layer or a packaging layer formed by separating and distributing organic film layers and inorganic film layers.
In the embodiment of the invention, the mortise structure is formed in the non-display area of the substrate, when the virtual plate is arranged between the first retaining wall and the second retaining wall of the substrate, the mortise structure is embedded with the mortise structure arranged in the virtual plate, so that the virtual plate is stably embedded on the substrate, the phenomenon that the virtual plate slides relative to the substrate in the transmission process is prevented, in addition, the organic functional layers are simultaneously formed in the second sub-pixel area in the virtual plate and in the first sub-pixel area on the substrate, so as to ensure the thickness of the organic functional layer in the first sub-pixel area at the edge of the display area on the substrate, thus the problem of poor display is avoided, and as the virtual substrate material is a memory alloy, the edge of the virtual substrate is warped in the direction away from the substrate when the substrate with the organic functional layer is subjected to drying treatment, the virtual plate positioned in the non-display area is separated from the substrate, and the non-display area is cut off after packaging, so that the non-display area is realized.
Example III
The third embodiment of the invention provides a display panel, which is manufactured by adopting the manufacturing method of the display panel.
In an embodiment of the invention, the display panel comprises a substrate, a grid electrode insulating layer, an active layer, a source electrode, a drain electrode, a passivation layer, a second electrode, a first pixel defining layer, an organic functional layer, a first electrode, a packaging layer and other structures.
The specific description of the manufacturing method of the display panel can refer to the description of the first embodiment and the second embodiment, and the third embodiment of the present invention will not be repeated.
The embodiment of the invention also provides a display device which comprises the display panel.
In practical application, the display device may be: any product or component with display function such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a navigator and the like.
In the embodiment of the invention, the virtual board is arranged between the first retaining wall and the second retaining wall of the substrate, the organic functional layer is formed in the second sub-pixel area in the virtual board and in the first sub-pixel area on the substrate at the same time, so that the thickness of the organic functional layer in the first sub-pixel area at the edge of the display area on the substrate is ensured, mura can not be generated when the display panel displays, the problem of poor display is avoided, the edge of the virtual board is warped in the direction away from the substrate by heating when the organic functional layer is dried, the virtual board can be separated from the substrate, and the substrate after the virtual board is separated can be cut off from the redundant place in the non-display area at the edge after encapsulation, so that narrow frame display can be realized.
For the foregoing method embodiments, for simplicity of explanation, the methodologies are shown as a series of acts, but one of ordinary skill in the art will appreciate that the present invention is not limited by the order of acts, as some steps may, in accordance with the present invention, occur in other orders or concurrently. Further, those skilled in the art will also appreciate that the embodiments described in the specification are all preferred embodiments, and that the acts and modules referred to are not necessarily required for the present invention.
In this specification, each embodiment is described in a progressive manner, and each embodiment is mainly described by differences from other embodiments, and identical and similar parts between the embodiments are all enough to be referred to each other.
Finally, it is further noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article or apparatus that comprises the element.
The above description of the method for manufacturing a display panel, the display panel and the display device provided by the invention applies specific examples to illustrate the principles and embodiments of the invention, and the above examples are only used to help understand the method and core ideas of the invention; meanwhile, as those skilled in the art will have variations in the specific embodiments and application scope in accordance with the ideas of the present invention, the present description should not be construed as limiting the present invention in view of the above.
Claims (12)
1. A method for manufacturing a display panel, comprising:
providing a substrate base plate; the substrate comprises a display area and a non-display area surrounding the display area;
forming a first pixel defining layer on the display region on the substrate, and forming a first retaining wall and a second retaining wall on the non-display region on the substrate; the first pixel defining layer divides the display area into a plurality of first sub-pixel areas;
disposing a virtual plate between the first retaining wall and the second retaining wall; the virtual board comprises a virtual substrate and a second pixel defining layer arranged on one side of the virtual substrate far away from the substrate, and the virtual substrate is divided into a plurality of second sub-pixel areas by the second pixel defining layer, the first retaining wall and the second retaining wall;
forming an organic functional layer in the first sub-pixel region and the second sub-pixel region;
drying the substrate and the virtual board on which the organic functional layer is formed, so that the edge of the virtual board warps in a direction away from the substrate;
separating the dummy plate from the substrate base plate;
separating the dummy plate from the substrate base plate, comprising:
separating the dummy substrate and the second pixel defining layer from the substrate;
forming a first pixel defining layer on the display region on the substrate, and before the step of forming a first barrier and a second barrier in the non-display region on the substrate, further comprising:
forming a mortise structure in the non-display area on the substrate;
the virtual board further comprises a mortise and tenon structure arranged on one side, close to the substrate, of the virtual substrate, and the mortise and tenon structure is mutually embedded with the mortise and tenon structure, so that the virtual board is embedded with the substrate.
2. The method of claim 1, wherein the step of forming a mortise structure in the non-display area on the substrate includes:
coating photoresist on the substrate;
exposing and developing the photoresist;
and etching the substrate which is not covered by the photoresist after development to form the tenon hole structure.
3. The method of claim 1, wherein the step of forming a mortise structure in the non-display area on the substrate includes:
and etching the non-display area on the substrate by using a laser beam to form the tenon hole structure.
4. The method of claim 1, wherein the height of the mortise structure is greater than or equal to the height of the mortise structure, the length of the mortise structure is greater than or equal to the length of the mortise structure, and the width of the mortise structure is greater than or equal to the width of the mortise structure.
5. The method according to claim 4, wherein the height of the mortise and tenon joint structure is 20 μm to 50 μm, and the length and width of the mortise and tenon joint structure are 0.1mm to 1mm.
6. The method of claim 1, wherein the material of the virtual substrate is a memory alloy.
7. The method of claim 1, wherein the first and second pixel-defining layers each have a height of 1-3 μιη, and wherein the first and second pixel-defining layers each have a width in a direction extending from the non-display region to the display region of 10-20 μιη; the heights of the first retaining wall and the second retaining wall are 5-10 mu m, and the widths of the first retaining wall and the second retaining wall in the direction extending from the non-display area to the display area are 10-50 mu m.
8. The method of claim 1, wherein the mortise and tenon structures are i-shaped or zigzagged in shape.
9. The method of claim 1, wherein the temperature of the drying process is 50 ℃ to 150 ℃.
10. The method according to any one of claims 1 to 9, further comprising, after the step of separating the virtual board from the substrate base plate:
forming a first electrode on the substrate base plate on which the organic functional layer is formed;
forming an encapsulation layer on the first electrode;
and cutting off the area, which is not covered by the packaging layer, of the substrate.
11. A display panel manufactured by the manufacturing method of the display panel according to any one of claims 1 to 10.
12. A display device comprising the display panel according to claim 11.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107799575A (en) * | 2017-10-31 | 2018-03-13 | 京东方科技集团股份有限公司 | Display base plate, its manufacture method, display and compensation member paster |
| CN109285455A (en) * | 2018-09-28 | 2019-01-29 | 京东方科技集团股份有限公司 | The manufacturing method and manufacture component of flexible display substrates |
| CN110165081A (en) * | 2019-05-30 | 2019-08-23 | 京东方科技集团股份有限公司 | Show backboard and preparation method thereof |
| CN110224013A (en) * | 2019-06-19 | 2019-09-10 | 京东方科技集团股份有限公司 | A kind of display panel and preparation method thereof, display device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107799575A (en) * | 2017-10-31 | 2018-03-13 | 京东方科技集团股份有限公司 | Display base plate, its manufacture method, display and compensation member paster |
| CN109285455A (en) * | 2018-09-28 | 2019-01-29 | 京东方科技集团股份有限公司 | The manufacturing method and manufacture component of flexible display substrates |
| CN110165081A (en) * | 2019-05-30 | 2019-08-23 | 京东方科技集团股份有限公司 | Show backboard and preparation method thereof |
| CN110224013A (en) * | 2019-06-19 | 2019-09-10 | 京东方科技集团股份有限公司 | A kind of display panel and preparation method thereof, display device |
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