CN111564478B - Stretchable display substrate, preparation method thereof and display device - Google Patents
Stretchable display substrate, preparation method thereof and display device Download PDFInfo
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- CN111564478B CN111564478B CN202010427432.6A CN202010427432A CN111564478B CN 111564478 B CN111564478 B CN 111564478B CN 202010427432 A CN202010427432 A CN 202010427432A CN 111564478 B CN111564478 B CN 111564478B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Abstract
The application provides a stretchable display substrate, a preparation method thereof and a display device. The stretchable display substrate comprises a flexible substrate, a plurality of display structures and blind holes which are arranged at intervals and located on the flexible substrate, and an encapsulation layer located on the display structures. The blind holes are located between adjacent display structures. The thickness of the part of the flexible substrate below the blind hole is smaller than or equal to the thickness of the part of the flexible substrate below the display structure. The blind hole comprises a first hole part and a second hole part formed by sinking part of the bottom wall of the first hole part downwards. The encapsulation layer includes an inorganic film layer that is continuous at the inner surface of the blind via. The display device includes the stretchable display substrate.
Description
Technical Field
The application relates to the technical field of display, in particular to a stretchable display substrate, a preparation method thereof and a display device.
Background
When the stretchable display panel is in a stretching state, the display panel is unfolded, the display area is increased, and when the stretchable display panel is in a non-stretching state, the volume of the display panel is small, so that the stretchable display panel is convenient to carry. The above advantages make the stretchable display panel get more attention.
When the stretchable display panel is in a stretched state, the inorganic film layer of the encapsulation layer is subjected to a large stress, and a rupture condition may occur, so that the encapsulation performance of the display panel is reduced, and the service life of the stretchable display panel is affected.
Disclosure of Invention
According to a first aspect of embodiments herein, there is provided a stretchable display substrate. The stretchable display substrate includes:
a flexible substrate;
the display structure comprises a flexible substrate, a plurality of display structures and blind holes, wherein the display structures and the blind holes are arranged on the flexible substrate at intervals; the thickness of the part of the flexible substrate below the blind hole is smaller than or equal to that of the part of the flexible substrate below the display structure, and the blind hole comprises a first hole part and a second hole part formed by downwards recessing part of the bottom wall of the first hole part;
and the packaging layer is positioned on the display structure and comprises an inorganic film layer, and the inorganic film layer is continuous on the inner surface of the blind hole.
In one embodiment, a thickness of a portion of the flexible substrate located below the blind hole is less than a thickness of a portion of the flexible substrate located below the display structure.
In one embodiment, a distance between two opposite sidewalls of the second hole portion ranges from 1 μm to 5 μm; and/or the second hole portion has a size ranging from 0.2 μm to 5 μm in the longitudinal direction.
In one embodiment, the bottom wall of the first hole part is provided with a shielding part, the shielding part is positioned at the side part of the second hole part, and the inorganic film layer covers the shielding part.
In one embodiment, the display structure comprises a pixel driving circuit structure on the flexible substrate and a light emitting structure on the pixel driving circuit structure;
the pixel driving circuit structure comprises a thin film transistor and a capacitor, wherein the thin film transistor comprises an active layer, a gate electrode, a first electrode and a second electrode, and the capacitor comprises a first polar plate and a second polar plate positioned on the first polar plate; the light-emitting structure comprises a first electrode layer, an organic light-emitting layer positioned on the first electrode layer and a second electrode layer positioned on the organic light-emitting layer;
one of the gate electrode, the first electrode, the second electrode plate, the active layer and the first electrode layer and the shielding part are completed in one-time composition process.
In one embodiment, the display structure comprises a pixel driving circuit structure on the flexible substrate and a light emitting structure on the pixel driving circuit structure; the display substrate further comprises a retaining wall structure arranged between the light-emitting structure and the blind hole;
the display structure comprises a pixel limiting layer and a planarization layer, and the retaining wall structure and the pixel limiting layer or the planarization layer are formed in a one-time composition process;
and/or the presence of a gas in the gas,
the blind holes comprise a first blind hole extending along a first direction and a second blind hole extending along a second direction, and the first direction is intersected with the second direction.
According to a second aspect of embodiments of the present application, there is provided a display device comprising the stretchable display substrate described above.
According to a third aspect of embodiments of the present application, there is provided a method of manufacturing a stretchable display substrate, the method including:
providing a flexible substrate;
forming a plurality of display structures and blind holes which are arranged at intervals on the flexible substrate, wherein the blind holes are positioned between the adjacent display structures; the bottom of the blind hole comprises a first hole part and a second hole part formed by sinking part of the bottom wall of the first hole part downwards, and the thickness of the part of the flexible substrate below the blind hole is smaller than or equal to that of the part of the flexible substrate below the display structure;
and forming an encapsulation layer on the display structure, wherein the encapsulation layer comprises an inorganic film layer which is continuous on the inner surface of the blind hole.
In one embodiment, the display structure comprises a pixel driving circuit structure on the flexible substrate and a light emitting structure on the pixel driving circuit structure; the pixel driving circuit comprises a thin film transistor and a capacitor;
the formation of a plurality of display structures and blind holes arranged at intervals on the flexible substrate includes:
forming a pixel driving circuit film layer on the flexible substrate, wherein the pixel driving circuit film layer covers the flexible substrate and comprises a plurality of pixel driving circuit structures;
etching the pixel driving circuit film layer and the flexible substrate to form a first hole part penetrating through the pixel driving circuit film layer and part of the flexible substrate, wherein the first hole part is positioned between adjacent pixel driving circuit structures;
forming the light emitting structure on the pixel driving circuit structure;
and etching a part of an area of the flexible substrate exposed by the first hole portion to form the second hole portion.
In one embodiment, before the etching the partial region of the flexible substrate exposed by the first hole portion, the preparation method further includes:
forming a shielding portion on a partial region of a bottom wall of the first hole portion;
the etching a portion of an area of the flexible substrate exposed by the first aperture portion to form the second aperture portion includes:
and etching the area of the flexible substrate, which is exposed by the first hole part and is not shielded by the shielding part, to form the second hole part.
In one embodiment, the forming the light emitting structure on the pixel driving circuit structure includes:
forming a first electrode layer on the pixel driving circuit structure;
forming an organic light emitting layer on the first electrode layer;
forming a second electrode layer on the organic light emitting layer;
the step of forming the first electrode layer on the pixel driving circuit structure is performed in synchronization with the step of forming the shielding portion on the partial region of the bottom wall of the first hole portion.
In one embodiment, the display structure includes a pixel driving circuit structure on the flexible substrate and a light emitting structure on the pixel driving circuit structure, and the manufacturing method further includes: forming a retaining wall between the light-emitting structure and the blind hole;
the pixel driving circuit structure comprises a planarization layer, and the step of forming the retaining wall positioned between the light-emitting structure and the blind hole and the step of forming the planarization layer are carried out synchronously; alternatively, the first and second electrodes may be,
the light emitting structure comprises a pixel limiting layer, and the step of forming the retaining wall between the light emitting structure and the blind hole is performed synchronously with the step of forming the pixel limiting layer.
The embodiment of the application achieves the main technical effects that:
according to the stretchable display substrate, the preparation method thereof and the display device, the blind holes are arranged between the adjacent display structures, the blind holes separate at least partial films of different display structures of the stretchable display substrate, and when the stretchable display substrate is in a stretching state, the stress on the films of the display structures can be reduced, and the risk of breakage of the films of the display structures is reduced; because the blind hole comprises the first hole part and the second hole part formed by the downward recess of the partial bottom wall of the first hole part, the inorganic film layer of the packaging layer is continuous on the inner surface of the blind hole, when the stretchable display substrate is in a stretching state, the stress borne by the inorganic film layer of the packaging layer can be reduced by the second hole part, the risk of breakage of the inorganic film layer is reduced, the packaging performance of the packaging layer can be improved, and the service life of the stretchable display substrate is prolonged.
Drawings
FIG. 1 is a top view of a stretchable display substrate provided in an exemplary embodiment of the present application;
FIG. 2 is a cross-sectional view of the stretchable display substrate shown in FIG. 1 taken along AA;
FIG. 3 is a flow chart of a method of making a stretchable display substrate provided in an exemplary embodiment of the present application;
FIG. 4 is a flow chart of a method of making a stretchable display substrate provided in another exemplary embodiment of the present application;
FIG. 5 is a partial cross-sectional view of a first intermediate structure of a stretchable display substrate provided in an exemplary embodiment of the present application;
FIG. 6 is a partial cross-sectional view of a second intermediate structure of a stretchable display substrate provided in an exemplary embodiment of the present application;
FIG. 7 is a partial cross-sectional view of a third intermediate structure of a stretchable display substrate provided in an exemplary embodiment of the present application;
FIG. 8 is a partial cross-sectional view of a fourth intermediate structure of a stretchable display substrate provided in an exemplary embodiment of the present application.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.
It is to be understood that although the terms first, second, third, etc. may be used herein to describe various information, such information should not be limited to these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the present application. The word "if" as used herein may be interpreted as "at" \8230; "or" when 8230; \8230; "or" in response to a determination ", depending on the context.
The following describes in detail a display substrate, a method for manufacturing the same, and a display device in embodiments of the present application with reference to the drawings. Features in the embodiments described below may complement or be combined with each other without conflict.
In the embodiments of the present application, for convenience of description, the up-down direction is determined by defining the direction from the flexible substrate to the encapsulation layer as up and defining the direction from the encapsulation layer to the flexible substrate as down. It is easy to understand that the different direction definitions do not affect the actual operation of the process and the actual shape of the product.
The embodiment of the application provides a stretchable display substrate. Referring to fig. 1 and 2, the stretchable display substrate includes a flexible substrate 10, a plurality of display structures 20 and blind holes 40 arranged at intervals on the flexible substrate 10, and an encapsulation layer 30 on the display structures 20. The blind holes 40 are located between the adjacent display structures 20, and the thickness of the portion of the flexible substrate 10 located below the blind holes 40 is smaller than or equal to the thickness of the portion of the flexible substrate 10 located below the display structures 20. The blind hole 40 includes a first hole portion 41 and a second hole portion 42 formed by partially recessing a bottom wall of the first hole portion 41. The encapsulation layer 30 includes an inorganic film layer that is continuous on the inner surface of the blind via 40.
According to the stretchable display substrate 100 provided by the embodiment of the application, the blind holes 40 are located between the adjacent display structures 20, and the blind holes 40 separate at least part of the film layers of different display structures 20, so that when the stretchable display substrate 100 is in a stretched state, the arrangement of the blind holes 40 can reduce stress on the film layers of the display structures 20, and reduce the risk of breakage of the film layers of the display structures; since the blind via 40 includes the first via portion 41 and the second via portion 42 formed by recessing a portion of the bottom wall of the first via portion 41 downward, the inorganic film of the encapsulation layer 30 is continuous on the inner surface of the blind via 40, when the stretchable display substrate 100 is in a stretched state, the second via portion 42 can reduce stress applied to the inorganic film of the encapsulation layer 30, reduce a risk of breaking the inorganic film, improve the encapsulation performance of the encapsulation layer 30, and contribute to improving the service life of the stretchable display substrate 100.
In one embodiment, the material of the flexible substrate 10 may be one or more of PI (polyimide), PET (polyethylene terephthalate), and PC (polycarbonate).
In one embodiment, the display structure 20 includes a pixel driving circuit structure 21 and a light emitting structure 22 on the pixel driving circuit structure 21.
The pixel driving circuit structure 21 includes a thin film transistor 50 and a capacitor 60. The thin film transistor 50 includes an active layer 51, a gate electrode 52, a first electrode 53, and a second electrode 54. The capacitor 60 comprises a first plate 61 and a second plate 62 located on a side of the first plate 61 facing away from the flexible substrate 10. The first plate 61 and the gate electrode 52 may be disposed in the same layer and completed in one patterning process. The first electrode 53 and the second electrode 54 may be completed in one patterning process. One of the first electrode 53 and the second electrode 54 is a source electrode, and the other is a drain electrode.
The pixel driving circuit structure 21 may further include a gate insulating layer 211, a capacitor insulating layer 212, an interlayer dielectric layer 213, and a planarization layer 214. The gate insulating layer 211 is located between the active layer 51 and the gate electrode 52, the capacitor insulating layer 212 is located between the gate electrode 52 and the second plate 62, and the interlayer dielectric layer 213 is located on a side of the second plate 62 facing away from the flexible substrate 10. Through holes penetrating through the gate insulating layer 211, the capacitor insulating layer 212 and the interlayer dielectric layer 213 are formed in the gate insulating layer 211, the capacitor insulating layer 212 and the interlayer dielectric layer 213, and the first electrode 53 and the second electrode 54 are electrically connected to the active layer 51 through the through holes, respectively. The planarization layer 214 is located on a side of the first electrode 53 and the second electrode 54 facing away from the flexible substrate 10. The stretchable display substrate may further include a buffer layer 215 between the flexible substrate 10 and the active layer 51.
The light emitting structure 22 includes a first electrode layer 221, an organic light emitting layer 222 on the first electrode layer 221, and a second electrode layer 223 on the organic light emitting layer 222. The light emitting structure 22 may further include a pixel defining structure 224, wherein a pixel opening is disposed on the pixel defining structure 224, the pixel opening exposes a portion of the first electrode layer 221, and the organic light emitting layer 222 is partially disposed in the pixel opening. The first electrode layer 221 may be an anode, and the second electrode layer 223 may be a cathode. The organic light emitting layer 222 includes an organic light emitting material and at least one of an electron injection layer, an electron transport layer, a hole injection layer, and a hole transport layer.
In one embodiment, the encapsulation layer 30 is a thin film encapsulation structure including inorganic film layers and organic film layers alternately stacked. In the illustrated embodiment, the encapsulation layer 30 includes a first inorganic film 31, an organic film 32 on the first inorganic film 31, and a second inorganic film 33 on the organic film 32. The inorganic layers of the encapsulation layer 30 include a first inorganic layer 31 and a second inorganic layer 33, and the first inorganic layer 31 and the second inorganic layer 33 are continuous on the inner surface of the blind via 40. The organic film layer 32 is located in the area above the light emitting structure 22 and the area at the side of the light emitting structure 22, but does not cover the blind via 40. In other embodiments, the encapsulation layer 30 may include two or more organic film layers, and accordingly, the number of inorganic film layers is one more than the number of organic film layers.
In one embodiment, the distance a between the two opposite side walls of the second hole portion 42 ranges from 1 μm to 5 μm in a direction perpendicular to the extension direction of the blind hole 40. With such an arrangement, it is avoided that the distance a between the two opposite sidewalls of the second hole portion 42 is too small, which makes the process not easy to implement, and it is also avoided that the distance a between the two opposite sidewalls of the second hole portion 42 is too large, which makes the size of the blind hole 40 larger, which further makes the size of the display structure smaller, thereby reducing the effective display area of the stretchable display substrate 100. The distance a between the two side walls opposing the second hole portion 42 in the extending direction of the flexible substrate 10 may be, for example, 1 μm, 2 μm, 3 μm, 4 μm, 5 μm, or the like.
In one embodiment, the second hole part 42 has a dimension b in the longitudinal direction ranging from 0.2 μm to 5 μm. With such an arrangement, it is avoided that the dimension of the second hole portion 42 in the longitudinal direction is too small to facilitate the process, and it is also avoided that the dimension of the second hole portion 42 in the longitudinal direction is too large, and the flexible substrate 10 needs to be set to be relatively large when the second hole portion 42 extends to the flexible substrate 10, which is not favorable for realizing the lightness and thinness of the stretchable display substrate. The dimension b of the second hole portion 42 may be 0.2 μm, 0.5 μm, 1 μm, 1.5 μm, 2 μm, 3 μm, 4 μm, 5 μm, or the like, in a direction perpendicular to the extending direction of the flexible substrate 10.
In one embodiment, the number of the second hole portions 42 of the blind hole 40 may be one or more, and when the number of the second hole portions 42 is more than one, the sum of the distances between the two opposite side walls of the plurality of second hole portions 42 ranges from 1 μm to 5 μm. The second hole portion 42 may be a groove type as shown in fig. 2, or may include a groove and a groove of a smaller size formed by recessing a bottom of the groove downward.
In one embodiment, a blind via 40 is disposed between any two adjacent display structures 20 in the stretchable display substrate. Thus, the stress on the film of the structural layer 20 when the stretchable display substrate is in a stretched state can be improved to the greatest extent, which is more helpful for reducing the risk of breaking the film of the structural layer 20. In other embodiments, blind holes 40 may be provided in the stretchable display substrate between only a portion of the display structures 20 and the adjacent display structures 20.
In one embodiment, one blind hole 40 may be disposed between adjacent display structures 20, and two or more blind holes 40 may be disposed. When two or more blind holes 40 are disposed between adjacent display structures 20, stress applied to the inorganic film of the encapsulation layer 30 can be more effectively improved, which is more helpful for reducing the risk of breaking the inorganic film. In the embodiment shown in fig. 1, three blind holes 40 are disposed between two adjacent display structures 20, and in other embodiments, the number of blind holes 40 disposed between two adjacent display structures 20 may be two, or more than three.
In one embodiment, referring again to fig. 1, the blind holes 40 include a first blind hole 401 extending along a first direction x and a second blind hole 402 along a second direction y, the first direction x intersecting the second direction y. As such, the stress on the layers of the structural layer 20 is improved when the stretchable display substrate 100 is stretched along the first direction and the second direction. In the illustrated embodiment, the first direction x is perpendicular to the second direction y. In other embodiments, the angle between the first direction and the second direction may be less than 90 °.
Further, the first blind hole 401 and the adjacent second blind hole 402 may communicate with each other. Thus, it is more beneficial to improve the stress on the film of the stretchable display substrate 100. In other embodiments, the first blind via 401 and the second blind via 402 may not be in communication.
In the embodiment of the present application, the inorganic film layer of the encapsulation layer 30 is continuous on the inner surface of the blind via 40, which means that the inorganic film layer of the encapsulation layer 30 is not broken at any position on the inner surface of the blind via 40. Referring again to fig. 2, the inner surface of the blind hole 40 includes a side wall 411 of the first hole portion 41, a bottom wall 412 of the first hole portion 41, a side wall 421 of the second hole portion 42, and a bottom wall 422 of the second hole portion 42.
In one embodiment, referring to fig. 2, the thickness of the portion of the flexible substrate 10 under the blind hole 40 is smaller than the thickness of the portion of the flexible substrate 10 under the display structure 20, and the first hole portion 41 of the blind hole 40 extends to the flexible substrate 10. In other embodiments, the thickness of the portion of the flexible substrate 10 under the blind hole 40 is equal to the thickness of the portion of the flexible substrate 10 under the display structure 20, and is smaller than the thickness of the portion of the flexible substrate 10 under the display structure 20, for example, the second hole portion 42 of the blind hole 40 extends to the flexible substrate 10, the first hole portion 41 of the blind hole 40 does not extend to the flexible substrate 10, and the thickness of the portion of the flexible substrate 10 under the second hole portion 42 is smaller than the thickness of the portion of the flexible substrate 10 under the display structure 20; the thickness of the portion of the flexible substrate 10 under the first hole portion 41 is equal to the thickness of the portion of the flexible substrate 10 under the display structure 20.
Preferably, the thickness of the portion of the flexible substrate 10 below the blind hole 40 is smaller than the thickness of the portion of the flexible substrate 10 below the display structure 20, and the layers above the flexible substrate 10 are separated at the blind hole 40 except the inorganic layer of the encapsulation layer 30, so that the tensile stress of the stretchable display substrate is smaller when the stretchable display substrate is in a stretched state.
In one embodiment, the distances between the two opposite side walls 411 of the second hole portion 42 and the side wall 421 of the first hole portion 41 on the same side are respectively greater than zero. That is, the bottom wall 411 of the first hole portion 41 is partitioned into discontinuous regions by the second hole portion 42, as shown in fig. 2. Further, the distance between the two opposite side walls 411 of the second hole 42 and the side wall 421 of the first hole 41 on the same side is substantially equal. In this way, the stress on the inorganic film layer of the encapsulation layer 30 at the two sides of the recess 41 is reduced to a substantially equal degree. In other embodiments, an extending direction of one side wall of the second hole portion 42 and an extending direction of one side wall of the first hole portion 41 may coincide.
In one embodiment, a shielding portion 43 is disposed on the bottom wall 412 of the first hole portion 41, the shielding portion 43 is located at a side of the second hole portion 42, the shielding portion 43 covers the entire area of the bottom wall 412 of the first hole portion 41, and the inorganic layer of the encapsulation layer 30 covers the shielding portion 43. When the second hole portion 42 is formed by etching, the shielding portion 43 can protect an area not to be etched, that is, the shielding portion 43 can serve as a mask, so that the number of masks used in the process of manufacturing the stretchable display substrate can be reduced. Moreover, the shielding portion 43 can increase the hardness of the bottom wall 412 of the first hole portion 41, which helps to prevent the display substrate 100 from wrinkling during the subsequent process of bonding the display substrate 100 to the glass cover plate.
In one embodiment, one of the gate electrode 52, the first electrode 53, the second electrode 62, the active layer 51 and the first electrode layer 221 and the shielding portion 43 are completed in one patterning process. With this configuration, the shielding portion 43 can be formed in the same process step as one of the gate electrode 52, the first electrode 53, the second electrode 62, the active layer 51, and the first electrode layer 221, which helps to simplify the manufacturing process.
In one embodiment, the display substrate 100 further includes a retaining wall structure 70 disposed between the light emitting structure 22 and the blind hole 40. The organic light emitting material of the light emitting structure 22 is generally formed by ink jet printing, and the dam structure 70 prevents the ink from overflowing. The retaining wall structure 70 may be located on the interlayer dielectric layer 213.
Further, the retaining wall structure 70 and the pixel defining layer 224 or the planarization layer 214 are formed in one patterning process. Thus, the retaining wall structure 70 and the pixel defining layer 224 and the planarization layer 214 can be formed in one process step, which helps to simplify the manufacturing process.
The embodiment of the application also provides a preparation method of the stretchable display substrate. The process of preparing the stretchable display substrate is described below. The "patterning process" described in the embodiments of the present application includes processes of depositing a film, coating a photoresist, masking exposure, developing, etching, and stripping the photoresist. The deposition may employ any one or more selected from sputtering, evaporation and chemical vapor deposition, and the etching may employ any one or more selected from dry etching and wet etching. "thin film" refers to a layer of a material deposited or coated onto a substrate. The "thin film" may also be referred to as a "layer" if it does not require a patterning process throughout the fabrication process. When the "thin film" is subjected to a patterning process throughout the fabrication process, the "thin film" is referred to as a "thin film" before the patterning process, and the "layer" after the patterning process. The "layer" after the patterning process includes at least one "pattern".
Referring to fig. 3, the preparation method includes the following steps 110 to 130.
In step 110, a flexible substrate is provided.
In one embodiment, the flexible substrate may be one or more of PI, PET, and PC.
In step 120, forming a plurality of display structures and blind holes arranged at intervals on the flexible substrate, wherein the blind holes are located between adjacent display structures; the bottom of the blind hole comprises a first hole part and a second hole part formed by sinking part of the bottom wall of the first hole part downwards, and the thickness of the part, below the blind hole, of the flexible substrate is smaller than or equal to that of the part, below the display structure, of the flexible substrate.
In one embodiment, the display structure comprises a pixel driving circuit structure on the flexible substrate and a light emitting structure on the pixel driving circuit structure; the pixel driving circuit structure comprises a thin film transistor and a capacitor. The thin film transistor comprises a gate electrode, a first electrode and a second electrode, and the capacitor comprises a first polar plate and a second polar plate.
In one embodiment, referring to fig. 4, the step 120 of forming a plurality of display structures and blind holes arranged at intervals on the flexible substrate may include the following steps 121 to 124.
In step 121, a pixel driving circuit film layer is formed on the flexible substrate, the pixel driving circuit film layer covers the flexible substrate, and the pixel driving circuit film layer includes a plurality of pixel driving circuit structures.
By this step a first intermediate structure as shown in fig. 5 is obtained.
In one exemplary embodiment, the step of forming the pixel driving circuit film layer on the flexible substrate may include the processes of:
first, an active layer thin film is deposited on the flexible substrate 10, and the active layer thin film is patterned through a patterning process to form the active layer 51.
Subsequently, the gate insulating layer 211 and the first metal film are sequentially deposited, and the first metal film is patterned through a patterning process to form the gate electrode 52 and the first plate 61.
Subsequently, the capacitor insulating layer 212 and the second metal film are sequentially deposited, and the second metal film is patterned through a patterning process to form the second electrode plate 62, wherein the second electrode plate 62 corresponds to the first electrode plate 61.
Subsequently, an interlayer dielectric layer 213 is sequentially deposited, and the gate insulating layer 211, the capacitor insulating layer 212, and the interlayer dielectric layer 213 are etched, so that a through hole penetrating the gate insulating layer 211, the capacitor insulating layer 212, and the interlayer dielectric layer 213 is formed above the active layer 51.
Subsequently, a third metal film is sequentially deposited and patterned by a patterning process to form a first electrode 53 and a second electrode 54, and the first electrode 53 and the second electrode 54 are electrically connected to the active layer 51 through via holes, respectively.
Subsequently, a planarization film is sequentially deposited, patterned by a patterning process to form the planarization layer 214, and a via hole exposing the second electrode 54 is formed on the planarization layer 214.
The pixel driving circuit film layer on the flexible substrate 10 can be obtained through the above process. The pixel driving circuit film layer includes a plurality of pixel driving circuit structures 21.
In step 122, the pixel driving circuit film layer and the flexible substrate are etched to form the first hole portion penetrating through the pixel driving circuit film layer and a part of the flexible substrate, and the first hole portion is located between adjacent pixel driving circuit structures.
By this step a second intermediate structure as shown in fig. 6 is obtained.
In this step, the first hole portion 41 may be formed by etching using a dry etching process.
In step 123, the light emitting structure is formed on the pixel driving circuit structure.
By this step a third intermediate structure as shown in fig. 7 is obtained.
In this step, the forming of the light emitting structure 22 on the pixel driving circuit structure 21 may include the following processes.
First, a first electrode layer 221 is formed on the pixel driving circuit structure 21; next, an organic light emitting layer 222 is formed on the first electrode layer 221; again, a second electrode layer 223 is formed on the organic light emitting layer 222.
In step 124, a portion of the flexible substrate in the area exposed by the first aperture portion is etched to form the second aperture portion.
In this step, a portion of the flexible substrate in a region exposed by the first hole portion may be etched using a dry etching process or a laser etching process.
By this step a fourth intermediate structure as shown in fig. 8 is obtained.
In one embodiment, before the step of etching the partial region of the flexible substrate exposed by the first hole portion to form the second hole portion, the preparation method further includes: a shielding portion 43 is formed in a partial region of the bottom wall of the first hole portion 41.
The step of etching a part of a region of the flexible substrate exposed by the first aperture portion to form the second aperture portion includes: the second hole portion 42 is formed by etching an area of the flexible substrate exposed by the first hole portion 41 and not blocked by the blocking portion 43.
In an exemplary embodiment, the step of forming the shielding portion 43 and the first electrode layer 221 in a single patterning process, forming the light emitting structure on the pixel driving circuit structure, etching a portion of the film layer exposed by the first hole portion, and forming the second hole portion may include the following processes:
first, a first electrode layer thin film is formed on the second intermediate structure, and the first electrode layer thin film is patterned by a patterning process to form the first electrode layer 221 and the shielding portion 43, wherein the first electrode layer 221 is electrically connected to the second electrode 54 through a through hole in the planarization layer 214.
Subsequently, a pixel defining thin film is formed, and the pixel defining thin film is patterned through a patterning process to form a pixel defining layer 224.
Subsequently, the organic light emitting layer 222 is formed, and the organic light emitting layer 222 does not cover the first opening 41.
Subsequently, a second electrode layer thin film is formed, and the second electrode layer thin film is patterned through a patterning process to form a second electrode layer 223, wherein the second electrode layer 223 does not cover the first opening 41.
Subsequently, the region of the flexible substrate 10 exposed by the first hole portion 41 and not shielded by the shielding portion 43 is etched to form the second hole portion 42.
When the shielding portion 43 and the first electrode layer 221 are formed in one patterning process, the first through hole 41 may be formed by one etching process, which helps to simplify the manufacturing process. In other embodiments, the shielding portion 43 and one of the gate electrode 52, the first electrode 53, the second electrode plate 62 and the active layer 51 may be formed in a single patterning process, and the specific manufacturing process is not described.
In step 130, an encapsulation layer is formed on the display structure, the encapsulation layer including an inorganic film layer that is continuous at an inner surface of the blind via.
By this step, a stretchable display substrate as shown in fig. 2 can be obtained. The encapsulation layer 30 may be a thin film encapsulation structure including inorganic film layers and organic film layers alternately stacked. In the illustrated embodiment, the encapsulation layer 30 includes a first inorganic film 31, an organic film 32 on the first inorganic film 31, and a second inorganic film 33 on the organic film 32. The inorganic layers of the encapsulation layer 30 include a first inorganic layer 31 and a second inorganic layer 33, and the first inorganic layer 31 and the second inorganic layer 33 are continuous on the inner surface of the blind via 40. The organic film layer 32 is only located at a region above the light emitting structure 32. In other embodiments, the encapsulation layer 30 may include two or more organic film layers, and accordingly, the number of inorganic film layers is one more than the number of organic film layers.
In one embodiment, the method of preparing the stretchable display substrate may further include: a retaining wall 70 is formed between the light emitting structure 22 and the blind via 40, and the retaining wall may be located on the interlayer dielectric layer 213.
In one embodiment, the step of forming the retaining wall 70 between the light emitting structure 22 and the blind via 40 is performed simultaneously with the step of forming the pixel defining layer. Alternatively, the step of forming the retaining wall 70 between the light emitting structure 22 and the blind hole 40 is performed simultaneously with the step of forming the planarization layer. In the structures shown in fig. 5 to 8, the step of forming the dam 70 between the light emitting structure 22 and the blind via 40 is performed simultaneously with the step of forming the pixel defining layer. The intermediate structure obtained when the step of forming the retaining wall 70 between the light emitting structure 22 and the blind hole 40 and the step of forming the planarization layer are performed simultaneously is not illustrated.
In one embodiment, the distance a between the two opposite side walls of the second hole portion 42 ranges from 1 μm to 5 μm in a direction perpendicular to the extension direction of the blind hole 40.
In one embodiment, the second hole part 42 has a dimension b in the longitudinal direction ranging from 0.2 μm to 5 μm.
In one embodiment, the blind holes 40 include a first blind hole 401 extending along a first direction and a second blind hole 402 along a second direction, the first direction intersecting the second direction.
According to the preparation method of the stretchable display substrate, the blind holes located between the adjacent display structures are formed, and the blind holes separate the film layers of different display structures, so that when the stretchable display substrate is in a stretching state, stress on the film layers of the display structures can be reduced, and the risk of breakage of the film layers of the display structures is reduced; because the blind hole comprises the first hole part and the second hole part formed by the downward recess of the partial bottom wall of the first hole part, the inorganic film layer of the packaging layer is continuous on the inner surface of the blind hole, when the tensile display substrate is in a tensile state, the stress borne by the inorganic film layer of the packaging layer can be reduced by the second hole part, the risk of breakage of the inorganic film layer is reduced, the packaging performance of the packaging layer can be improved, and the service life of the tensile display substrate is favorably prolonged.
The embodiment of the application also provides a display device, which comprises the display substrate in any one of the embodiments.
In one embodiment, the display device is a display panel including the stretchable display substrate 100 and a glass cover plate.
In one embodiment, the display device may include a display panel and a housing, the display panel being connected to the housing, e.g., the display panel being embedded within the housing. The display device can be any device with a display function, such as a mobile phone, a tablet computer, a television, a notebook computer, a digital photo frame, a navigator and the like.
It is noted that in the drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. Also, it will be understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element or intervening layers may also be present. In addition, it will be understood that when an element or layer is referred to as being "under" another element or layer, it can be directly under the other element or intervening layers or elements may also be present. In addition, it will also be understood that when a layer or element is referred to as being "between" two layers or elements, it can be the only layer between the two layers or elements, or more than one intermediate layer or element may also be present. Like reference numerals refer to like elements throughout.
Other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.
It will be understood that the present application is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the application is limited only by the appended claims.
Claims (11)
1. A stretchable display substrate, comprising:
a flexible substrate;
the display structure comprises a flexible substrate, a plurality of display structures and blind holes, wherein the display structures and the blind holes are arranged on the flexible substrate at intervals; the thickness of the part of the flexible substrate below the blind hole is smaller than that of the part of the flexible substrate below the display structures, the blind hole between the adjacent display structures comprises a first hole part and a second hole part formed by sinking a part of the bottom wall of the first hole part downwards, the distance between two opposite side walls of the second hole part ranges from 1 mu m to 5 mu m, and the size range of the second hole part in the longitudinal direction ranges from 0.2 mu m to 5 mu m;
an encapsulation layer on the display structure, the encapsulation layer including an inorganic film layer that is continuous on an inner surface of the blind via;
the blind holes separate at least partial film layers of different display structures of the stretchable display substrate, and when the stretchable display substrate is in a stretching state, stress borne by the film layers of the display structures is reduced.
2. The stretchable display substrate of claim 1, wherein a thickness of a portion of the flexible substrate below the blind hole is less than a thickness of a portion of the flexible substrate below the display structure.
3. A stretchable display substrate according to claim 1, wherein the bottom wall of the first hole portion is provided with a blocking portion at a side of the second hole portion, the inorganic film layer covering the blocking portion.
4. A stretchable display substrate according to claim 3, wherein the display structures comprise pixel driving circuitry structures on the flexible substrate and light emitting structures on the pixel driving circuitry structures;
the pixel driving circuit structure comprises a thin film transistor and a capacitor, wherein the thin film transistor comprises an active layer, a gate electrode, a first electrode and a second electrode, and the capacitor comprises a first polar plate and a second polar plate positioned on the first polar plate; the light-emitting structure comprises a first electrode layer, an organic light-emitting layer positioned on the first electrode layer and a second electrode layer positioned on the organic light-emitting layer;
one of the gate electrode, the first electrode, the second electrode plate, the active layer and the first electrode layer and the shielding part are completed in one-time composition process.
5. The stretchable display substrate of claim 1, wherein the display structures comprise pixel driving circuit structures on the flexible substrate and light emitting structures on the pixel driving circuit structures; the display substrate further comprises a retaining wall structure arranged between the light-emitting structure and the blind hole;
the display structure comprises a pixel limiting layer and a planarization layer, and the retaining wall structure and the pixel limiting layer or the planarization layer are formed in a one-time composition process;
and/or the presence of a gas in the atmosphere,
the blind holes comprise a first blind hole extending along a first direction and a second blind hole extending along a second direction, and the first direction intersects with the second direction.
6. A display device comprising the stretchable display substrate of any one of claims 1-5.
7. A method for preparing a stretchable display substrate, the method comprising:
providing a flexible substrate;
forming a plurality of display structures and blind holes which are arranged at intervals on the flexible substrate, wherein the blind holes are positioned between the adjacent display structures; the blind holes positioned between the adjacent display structures comprise first hole parts and second hole parts formed by downwards recessing partial bottom walls of the first hole parts, the thickness of the parts, below the blind holes, of the flexible substrate is smaller than that of the parts, below the display structures, of the flexible substrate, the distance between two opposite side walls of the second hole parts ranges from 1 mu m to 5 mu m, and the size of the second hole parts in the longitudinal direction ranges from 0.2 mu m to 5 mu m;
forming an encapsulation layer on the display structure, wherein the encapsulation layer comprises an inorganic film layer which is continuous on the inner surface of the blind hole;
the blind holes separate at least partial film layers of different display structures of the stretchable display substrate, and when the stretchable display substrate is in a stretching state, stress borne by the film layers of the display structures is reduced.
8. The method of claim 7, wherein the display structure comprises a pixel driving circuit structure on the flexible substrate and a light emitting structure on the pixel driving circuit structure; the pixel driving circuit comprises a thin film transistor and a capacitor;
the formation of a plurality of display structures and blind holes arranged at intervals on the flexible substrate includes:
forming a pixel driving circuit film layer on the flexible substrate, wherein the pixel driving circuit film layer covers the flexible substrate and comprises a plurality of pixel driving circuit structures;
etching the pixel driving circuit film layer and the flexible substrate to form a first hole part penetrating through the pixel driving circuit film layer and part of the flexible substrate, wherein the first hole part is positioned between adjacent pixel driving circuit structures;
forming the light emitting structure on the pixel driving circuit structure;
and etching a part of an area of the flexible substrate exposed by the first hole portion to form the second hole portion.
9. The stretchable display substrate of claim 8, wherein before the etching the partial region of the flexible substrate exposed by the first hole portion, the method further comprises:
forming a shielding portion on a partial region of a bottom wall of the first hole portion;
the etching a portion of an area of the flexible substrate exposed by the first aperture portion to form the second aperture portion includes:
and etching the area of the flexible substrate, which is exposed by the first hole part and is not shielded by the shielding part, to form the second hole part.
10. The method of claim 9, wherein the forming the light emitting structure on the pixel driving circuit structure comprises:
forming a first electrode layer on the pixel driving circuit structure;
forming an organic light emitting layer on the first electrode layer;
forming a second electrode layer on the organic light emitting layer;
the step of forming the first electrode layer on the pixel driving circuit structure is performed in synchronization with the step of forming the shielding portion on the partial region of the bottom wall of the first hole portion.
11. The method for manufacturing a stretchable display substrate according to claim 7, wherein the display structure comprises a pixel driving circuit structure on the flexible substrate and a light emitting structure on the pixel driving circuit structure, and the method further comprises: forming a retaining wall between the light-emitting structure and the blind hole;
the pixel driving circuit structure comprises a planarization layer, and the step of forming the retaining wall between the light-emitting structure and the blind hole and the step of forming the planarization layer are carried out synchronously; alternatively, the first and second liquid crystal display panels may be,
the light emitting structure comprises a pixel limiting layer, and the step of forming the retaining wall between the light emitting structure and the blind hole is performed synchronously with the step of forming the pixel limiting layer.
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| CN112510070B (en) * | 2020-11-30 | 2024-03-12 | 京东方科技集团股份有限公司 | Stretchable array substrate, stretchable display panel and manufacturing method |
| CN112669702B (en) * | 2020-12-29 | 2022-07-29 | 武汉华星光电技术有限公司 | Display panel and display device |
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