CN111559130A - Novel thin foil flexible film and preparation method thereof - Google Patents
Novel thin foil flexible film and preparation method thereof Download PDFInfo
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- CN111559130A CN111559130A CN202010452291.3A CN202010452291A CN111559130A CN 111559130 A CN111559130 A CN 111559130A CN 202010452291 A CN202010452291 A CN 202010452291A CN 111559130 A CN111559130 A CN 111559130A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/20—Inorganic coating
- B32B2255/205—Metallic coating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/26—Polymeric coating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
- B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/54—Yield strength; Tensile strength
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/546—Flexural strength; Flexion stiffness
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
Abstract
The invention discloses a novel thin foil flexible film and a preparation method thereof, wherein the novel thin foil flexible film sequentially comprises a bottom film, an adhesive layer, a sputtering layer, a crystallization layer, an adhesive flame-retardant layer and a surface film; the bottom film and the face film are polyimide films or PET polyester films; the bonding layer is used for bonding the base film and the sputtering layer; the crystallization layer is arranged on the sputtering layer; the bonding flame-retardant layer is used for bonding the crystalline layer and the surface layer. Compared with the common copper foil film, the novel thin foil flexible film is thinner, softer and better in tensile strength. Has antioxidant and flame retardant effects. The sheet resistance is improved by about 5 times. The adhesive force is 10-15 times higher than that of a common copper foil film. The hundred-grid test data is far superior to that of the common copper foil film, so that the bending resistance is better, and the water washing and kneading performance is better. Besides the heating field, the heat-conducting protective film can also be applied to the fields of flexible circuits, heat-conducting protection, electronic devices and the like.
Description
Technical Field
The invention relates to the technical field of heating products, in particular to a novel thin foil flexible film and a preparation method thereof.
Background
The class product that generates heat on the existing market, including can generate heat clothing, the wearing equipment that can generate heat, can generate heat outdoor articles for use, at home official working, personal care etc. its part that generates heat mainly has several kinds: carbon fiber ropes, graphene films, thick film paste printing films, cloth spraying, cloth weaving and the like. And then heating is controlled through a control circuit, a detection sensor, a power supply and the like.
The carbon fiber rope is linear as the name suggests, the shape of the carbon fiber rope causes that a heating area is also linear, a wired place is hot, a wireless place is cold, the heat is not uniform, and the wire can generate strong foreign body feeling. The carbon fiber rope has low overcurrent capacity, needs high-voltage driving when being heated in a large area, cannot be bent, cannot be washed by water, is not flame-retardant, is easy to break, has low safety factor and the like.
The film type heating element is mainly formed by transferring carbon paste or other rare earth conductive materials onto an insulating substrate by printing to form a circuit capable of conducting electricity and heating. The main defects of the method are that the method cannot be washed by water, cannot resist bending, can generate heat unevenly, is easy to burn through by local high-temperature points, is easy to attenuate and the like. Large-area heating cannot be performed and the cost is high. Meanwhile, the conductive material and the base material need to be matched, otherwise, the conductive material is easy to fall off.
The cloth heating parts mainly transfer the conductive material to the cloth by spraying or dip dyeing or directly weave the conductive material into the cloth, and have the main disadvantages of incapability of washing, bending resistance, easy burning-through of local high-temperature points, easy attenuation and the like, and higher cost.
In summary, the following problems exist when the flexible films such as common copper foil, tin foil, and aluminum foil in the prior art are used as the heat generating film:
1. the thickness, flexibility and tensile strength cannot be satisfied simultaneously.
2. The problems of no oxidation resistance and no flame retardant layer protection generally exist.
3. The sheet resistance (resistance per unit area) is low, generally less than 10 milliohms, which makes the application of small heat generating area impossible.
4. The adhesive force is low, and the metal layer is easy to fall off and separate from the base material. Such as copper foil: many manufacturers in the market reflect that the copper layer cannot be directly attached to the substrate (the substrate is generally a PI (polyimide) film or a PET polyester film), and need to plate a nickel layer and then plate the copper layer, but even then, the Baige test of the finished film is not as satisfactory.
Disclosure of Invention
In order to solve the technical problems, the invention aims to disclose a novel thin foil flexible film and a preparation method thereof, aiming at improving the technical problems of the existing heating film products, and the novel thin foil flexible film is produced by changing the process on the basis of the existing flexible film materials such as common copper foil, tin foil, aluminum foil and the like. The purpose of the invention is realized by the following technical scheme:
the invention discloses a novel thin foil flexible film which sequentially comprises a bottom film, an adhesive layer, a sputtering layer, a crystallization layer, an adhesive flame-retardant layer and a surface film; the bottom film and the face film are polyimide films or PET polyester films; the bonding layer is used for bonding the base film and the sputtering layer; the crystallization layer is arranged on the sputtering layer; the bonding flame-retardant layer is used for bonding the crystalline layer and the surface layer.
Furthermore, the thicknesses of the bottom film and the surface film are 10-50 microns.
Furthermore, the material of the bonding layer is epoxy resin.
Furthermore, the material of the sputtering layer is copper or a mixture of copper, tin and indium, and the thickness is 1-10 micrometers.
Furthermore, the material of the crystallization layer is copper or a tin-indium mixture, and the thickness of the crystallization layer is 1-10 micrometers.
Furthermore, the thickness of the bonding flame-retardant layer is 20-100 microns.
In a second aspect, the invention discloses a method for preparing a novel thin foil flexible film, which comprises the following steps:
step S1, uniformly coating epoxy resin on the bottom film to form an adhesive layer;
step S2, uniformly sputtering copper or copper-tin-indium mixture on the bonding layer by adopting a magnetic co-sputtering process to form a sputtering layer;
step S3, plating the copper or indium-tin mixture on the sputtering layer by adopting a water plating process to form a crystallization layer;
step S4, uniformly coating a bonding flame-retardant material on the crystallization layer to form a bonding flame-retardant layer;
and step S5, bonding the mask on the flame-retardant layer.
Furthermore, the bottom film and the face film are made of polyimide film or PET polyester film.
Further, the ratio of copper in the copper-tin-indium mixture: tin: the weight ratio of indium can be adjusted according to the required sheet resistance.
Further, the ratio of tin in the tin-indium mixture is as follows: the weight ratio of indium can be adjusted according to the required sheet resistance.
Further, the bonding flame-retardant material is a mixture of flame-retardant acrylic acid and a nano material, and the weight ratio of the flame-retardant acrylic acid to the nano material is 8: 2.
compared with the common copper foil film, the novel thin foil flexible film has the following advantages:
1. thinner, softer, and better tensile strength.
2. Resisting oxidation and having flame retardant effect.
3. The sheet resistance (unit area resistance) is improved by about 5 times, and the application of large, medium and small heating surfaces can be met.
4. The adhesive force of the copper foil is 10-15 times higher than that of a common copper foil film, and the hundred-grid test data of the copper foil is far better than that of the common copper foil film, so that the copper foil is more resistant to bending and has better water washing and kneading performance.
The novel thin foil flexible film keeps the planar heating of the original common film heating sheet, is flexible in design, more uniform in heat, lower in cost and high in production rate, and has important advantages in the application occasions of low-voltage large-area heating.
The novel thin foil flexible film can be designed to be powered by 3V-36V and other safe low voltages, and the power of the novel thin foil flexible film can be ensured, so that the novel thin foil flexible film is safer compared with a product directly adopting commercial power in the market. The novel thin foil flexible membrane used by the invention has been aged for a long time, is soaked by electrifying (tap water, added with laundry detergent and added with salt), is washed by a machine, and has good effect.
The novel thin foil flexible film can be applied to the heating industry, and can also be applied to the fields of flexible circuits, heat conduction protection, electronic devices and the like.
Drawings
FIG. 1 is a schematic structural diagram of a novel thin foil flexible film of the present invention;
fig. 2 is a flow chart of the production process of the novel thin foil flexible film of the present invention.
DETAILED DESCRIPTION OF EMBODIMENT (S) OF INVENTION
The embodiments of the present disclosure are described in detail below with reference to the accompanying drawings.
The embodiments of the present disclosure are described below with specific examples, and other advantages and effects of the present disclosure will be readily apparent to those skilled in the art from the disclosure in the specification. It is to be understood that the described embodiments are merely illustrative of some, and not restrictive, of the embodiments of the disclosure. The disclosure may be embodied or carried out in various other specific embodiments, and various modifications and changes may be made in the details within the description without departing from the spirit of the disclosure. It is to be noted that the features in the following embodiments and examples may be combined with each other without conflict. All other embodiments, which can be derived by a person skilled in the art from the embodiments disclosed herein without making any creative effort, shall fall within the protection scope of the present disclosure.
The structure schematic diagram of the novel thin foil flexible film is shown in fig. 1, and the novel thin foil flexible film sequentially comprises a bottom film 1, an adhesive layer 2, a sputtering layer 3, a crystallization layer 4, an adhesive flame-retardant layer 5 and a surface film 6. The bottom film 1 and the face film 6 are made of high temperature resistant, bending resistant and high strength insulating flexible films, and the flexibility of the films needs to be ensured, and PI (polyimide) films or PET (polyethylene terephthalate) polyester films are generally adopted. The film thickness is generally between 10 and 50 microns. The base film 1 is a bottom layer, and the face film 6 is a top layer.
The adhesive layer 2 is used to adhere the base film 1 and the sputtering layer 3. The adhesive layer 2 is an epoxy resin coating, and the thickness is generally about 5 micrometers. This layer is the key to bonding the sputtered layer 3 to the base film 1, and its presence greatly improves the adhesion of the sputtered layer 3 to the base film 1.
And sputtering the layer 3, namely uniformly sputtering copper or a copper-tin-indium mixture on the bonding layer 2 by adopting a magnetic co-sputtering process, wherein the thickness is generally 1-10 micrometers. The sputtering material and thickness depend on the desired sheet resistance. The sputtered layer does not have metal particles in close contact with the metal particles, and therefore the layer 4 needs to be crystallized. Copper in copper-tin-indium mixture: tin: the weight ratio of indium can be adjusted according to the required sheet resistance.
And a crystallization layer 4, plating copper or a tin-indium mixture on the sputtering layer 3 by adopting a water plating process, so that the sputtering layer 3 and the crystallization layer 4 form crystallization connection, and finally forming a compact copper foil metal layer. The crystalline layer is typically 1 micron to 10 microns thick, depending on the desired sheet resistance. Tin in the tin-indium mixture: the weight ratio of indium can be adjusted according to the required sheet resistance.
The main material of the bonding flame-retardant layer 5 is flame-retardant acrylic (silica gel) and blended with nano materials (such as metal powder, graphene and the like), and the weight ratio of the flame-retardant acrylic to the nano materials is about 8: 2, typically 20 to 100 microns thick. The layer mainly plays a role in preventing oxidation, increasing flexibility, retarding flame and adhering the face film 6.
The novel thin foil flexible film is the core of a heating system in a heating product, and can be designed into different shapes and sizes. The designed resistance value can be designed to be various in size, and different power requirements are realized. When current flows through the novel thin foil flexible film, electric energy is generated and converted into heat energy, and the control of a heating mode can be realized through an external control circuit, a detection sensor and a power supply.
The preparation method of the novel thin foil flexible film comprises the following steps:
step S1 is to uniformly coat the primary film 1 with epoxy resin to form the adhesive layer 2.
The thickness of the adhesive layer 2 is typically around 5 μm.
Step S2, sputtering copper or copper-tin-indium mixture onto the adhesion layer 2 by using a magnetic co-sputtering process to form the sputtering layer 3.
Copper in copper-tin-indium mixture: tin: the weight ratio of indium can be adjusted according to the required sheet resistance.
Step S3, plating the copper or indium-tin mixture on the sputtering layer 3 by using a water plating process to form the crystallization layer 4.
The crystalline layer is typically 1 to 10 microns thick. Tin in the tin-indium mixture: the weight ratio of indium can be adjusted according to the required sheet resistance.
Step S4, uniformly coating the adhesive flame retardant material on the crystallization layer 4 to form the adhesive flame retardant layer 5.
The bonding flame-retardant material is a mixture of flame-retardant acrylic acid and a nano material, and the weight ratio of the flame-retardant acrylic acid to the nano material is 8: 2. the thickness of the adhesive flame-retardant layer 5 is generally 20 to 100 μm.
And step S5, bonding the facial mask 6 on the flame-retardant layer 5.
The bottom film 1 and the face film 6 are both made of high temperature resistant, bending resistant and high strength insulating flexible films, and the flexibility of the films needs to be ensured, and PI (polyimide) films or PET (polyethylene terephthalate) polyester films are generally adopted. The film thickness is generally between 10 and 50 microns.
The above description is for the purpose of illustrating embodiments of the invention and is not intended to limit the invention, and it will be apparent to those skilled in the art that any modification, equivalent replacement, or improvement made without departing from the spirit and principle of the invention shall fall within the protection scope of the invention.
Claims (10)
1. A novel thin foil flexible film is characterized by sequentially comprising a bottom film, an adhesive layer, a sputtering layer, a crystallization layer, an adhesive flame-retardant layer and a surface film; the bottom film and the face film are polyimide films or PET polyester films; the bonding layer is used for bonding the base film and the sputtering layer; the crystallization layer is arranged on the sputtering layer; the bonding flame-retardant layer is used for bonding the crystalline layer and the surface layer.
2. The novel thin foil flexible film as claimed in claim 1, wherein the thickness of the bottom and top films is 10-50 microns.
3. The novel foil-flex as claimed in claim 1 wherein the adhesive layer is epoxy and has a thickness of 5 microns.
4. The novel thin foil flexible film as claimed in claim 1, wherein the material of the sputtered layer is copper or copper-tin-indium mixture with a thickness of 1-10 μm.
5. The novel thin foil flexible film as claimed in claim 1, wherein the material of the crystalline layer is copper or indium-tin mixture, and the thickness is 1-10 μm.
6. The novel thin foil flexible film as claimed in claim 1, wherein the thickness of the adhesive flame retardant layer is 20-100 microns.
7. A preparation method of a novel thin foil flexible film is characterized by comprising the following steps:
step S1, uniformly coating epoxy resin on the bottom film to form an adhesive layer;
step S2, uniformly sputtering copper or copper-tin-indium mixture on the bonding layer by adopting a magnetic co-sputtering process to form a sputtering layer;
step S3, plating the copper or indium-tin mixture on the sputtering layer by adopting a water plating process to form a crystallization layer;
step S4, uniformly coating a bonding flame-retardant material on the crystallization layer to form a bonding flame-retardant layer;
and step S5, bonding the mask on the flame-retardant layer.
8. The method for preparing the novel thin flexible film as claimed in claim 7, wherein the bottom film and the top film are made of polyimide film or PET polyester film.
9. The method of claim 7, wherein the ratio of copper to indium in the copper-tin-indium mixture is: tin: indium weight ratio, tin in the tin-indium mixture: the weight ratio of indium is adjusted according to the required sheet resistance.
10. The method for preparing a novel thin foil flexible film according to claim 7, wherein the bonding flame retardant material is a mixture of flame retardant acrylic acid and a nano material, and the weight ratio of the flame retardant acrylic acid to the nano material is 8: 2.
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| CN202010452291.3A CN111559130A (en) | 2020-05-26 | 2020-05-26 | Novel thin foil flexible film and preparation method thereof |
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| CN202010452291.3A CN111559130A (en) | 2020-05-26 | 2020-05-26 | Novel thin foil flexible film and preparation method thereof |
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| JP2016164848A (en) * | 2015-03-06 | 2016-09-08 | 日東電工株式会社 | Manufacturing method of transparent conductive film and transparent conductive film |
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| CN109930109A (en) * | 2011-11-28 | 2019-06-25 | 日东电工株式会社 | The manufacturing method of transparent conductive film |
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2020
- 2020-05-26 CN CN202010452291.3A patent/CN111559130A/en active Pending
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| CN101108546A (en) * | 2007-08-30 | 2008-01-23 | 山东天诺光电材料有限公司 | Flexible material and method of manufacturing the same and use thereof |
| CN102168246A (en) * | 2011-03-29 | 2011-08-31 | 核工业西南物理研究院 | Large-area high-uniformity transparent conducting film deposited on flexible substrate and preparation method thereof |
| CN102220614A (en) * | 2011-05-04 | 2011-10-19 | 淮安富扬电子材料有限公司 | Preparation method for coiled omnibearing electroconductive sponge |
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| JP2016164848A (en) * | 2015-03-06 | 2016-09-08 | 日東電工株式会社 | Manufacturing method of transparent conductive film and transparent conductive film |
| CN105039910A (en) * | 2015-08-14 | 2015-11-11 | 陕西煤业化工技术研究院有限责任公司 | Flexible transparent conducting thin film |
| CN109890187A (en) * | 2017-12-06 | 2019-06-14 | 广东中晨电子科技有限公司 | FPC electromagnetic shielding film and preparation method thereof |
| CN109267009A (en) * | 2018-08-31 | 2019-01-25 | 株洲火炬安泰新材料有限公司 | A kind of low-temperature resistance high resistivity ITO conduction membrane preparation method |
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Application publication date: 20200821 |