CN111556405B - Power amplifier chip and electronic equipment - Google Patents
Power amplifier chip and electronic equipment Download PDFInfo
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- CN111556405B CN111556405B CN202010276014.1A CN202010276014A CN111556405B CN 111556405 B CN111556405 B CN 111556405B CN 202010276014 A CN202010276014 A CN 202010276014A CN 111556405 B CN111556405 B CN 111556405B
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R3/00—Circuits for transducers, loudspeakers or microphones
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R3/00—Circuits for transducers, loudspeakers or microphones
- H04R3/12—Circuits for transducers, loudspeakers or microphones for distributing signals to two or more loudspeakers
Abstract
The embodiment of the invention provides a power amplifier chip and electronic equipment. The power amplifier chip is applied to the electronic equipment, and the electronic equipment includes a plurality of audio output subassemblies, and the power amplifier chip includes: the device comprises an input interface, a frequency division module, an amplification module, a processing module and an output interface; the input interface is electrically connected with the frequency division module, the frequency division module is electrically connected with the amplification module, the amplification module is electrically connected with the processing module, and the processing module is electrically connected with the output interface; the input interface is used for inputting audio information; the frequency division information is used for dividing the frequency of the audio information into a plurality of sub-audio information; the amplifying module is used for amplifying the power of the sub-audio information; the processing module is used for optimizing the sub-audio information after power amplification; the output interface is used for outputting the sub-audio information after optimization. In the embodiment of the invention, when the audio information amplified by the power amplifier chip is played, the playing effect of the audio output assembly is better, and the listening experience of a user is improved.
Description
Technical Field
The invention relates to the technical field of communication, in particular to a power amplifier chip and electronic equipment.
Background
At present, electronic equipment is more and more popular and becomes a necessity in daily life of people. The electronic device usually sets a power amplifier to amplify the audio power to be played.
In the related art, audio information is often power-amplified by a power amplifier chip in an electronic device, and then audio is played by an audio output component in the electronic device.
Because the audio frequency may include different frequencies, after the power amplification of the audio frequency is performed through the power amplification chip, when the audio frequency output component is used for playing the sound information, the playing effect is poor, and further the listening experience of a user is poor.
Disclosure of Invention
The embodiment of the invention provides a power amplifier chip and electronic equipment, which can improve the listening experience of a user.
In a first aspect, an embodiment of the present invention provides a power amplifier chip, which is applied to an electronic device, where the electronic device includes a plurality of audio output components, and the power amplifier chip includes: the device comprises an input interface, a frequency division module, an amplification module, a processing module and an output interface;
the input interface is electrically connected with the frequency dividing module, the frequency dividing module is electrically connected with the amplifying module, the amplifying module is electrically connected with the processing module, and the processing module is electrically connected with the output interface;
the input interface is used for inputting audio information;
the frequency division information is used for dividing the frequency of the audio information and dividing the audio information into a plurality of sub-audio information;
the amplifying module is used for amplifying the power of the sub-audio information;
the processing module is used for optimizing the sub-audio information after power amplification;
the output interface is used for outputting the optimized sub-audio information.
Optionally, the processing module includes: the device comprises a determining unit, an obtaining unit and an optimizing unit;
the determining unit is electrically connected with the acquiring unit, and the acquiring unit is electrically connected with the optimizing unit;
the determining unit is used for determining whether the sub-audio information after the power amplification is complete;
the acquisition unit is used for acquiring optimization information aiming at incomplete sub-audio information;
the optimization unit is configured to store optimization information, where the optimization information is used to optimize the incomplete sub-audio information.
Optionally, the power amplifier chip further comprises a matching module;
the matching module is electrically connected with the processing module and the output interface;
the matching module is used for matching the optimized sub-audio information with the audio output component.
Optionally, the frequency dividing module is further configured to:
taking audio information with a frequency within a first frequency range in the audio information as first sub-audio information;
taking the audio information with the frequency within a second frequency range in the audio information as second sub-audio information;
and taking the audio information with the frequency in the third frequency range in the audio information as third sub-audio information.
Optionally, the power amplifier chip further includes a storage module;
the storage module is electrically connected with the input interface and the frequency dividing module;
the storage module is used for storing the audio information output from the input interface.
Optionally, the power amplifier chip further includes an interrupt control module;
the interrupt control module is electrically connected with the input interface and the memory module;
the interrupt control module is used for controlling the input interface to stop inputting the audio information when the amount of the audio information stored in the storage module exceeds a storage amount threshold value.
Optionally, the power amplifier chip further comprises a register module;
the register module is electrically connected with the frequency division module, and the register module is electrically connected with the amplification module;
the register module is used for registering the audio information after the frequency division of the frequency division module.
Optionally, the register module includes: a first register unit, a second register unit and a third register unit;
the first register unit is used for registering sub-audio information in a fourth frequency range, the second register unit is used for registering sub-audio information in a fifth frequency range, and the third register unit is used for registering sub-audio information in a sixth frequency range.
Optionally, the power amplifier chip further comprises a power module;
the power module is electrically connected with the processing module.
In a second aspect, an embodiment of the present invention provides an electronic device, where the electronic device includes a plurality of audio output components and the power amplifier chip in any one of the first aspect.
The power amplifier chip provided by the embodiment of the invention at least has the following beneficial effects:
in the embodiment of the invention, the input interface is electrically connected with the frequency dividing module, the frequency dividing module is electrically connected with the amplifying module, the amplifying module is electrically connected with the processing module, the processing module is electrically connected with the output interface, and the input interface is used for inputting the audio information, so that the audio information can be transmitted to the frequency dividing module after the audio information is input to the power amplifier chip through the input interface. The frequency division module divides the frequency of the audio information and divides the audio information into a plurality of sub-audio information according to the frequency of the audio information. And the amplifying module amplifies the power of the sub-audio information. And the processing module performs optimization processing on each piece of sub-audio information in the plurality of pieces of sub-audio information after power amplification. And outputting the sub-audio information after each optimization processing from the power amplifier chip through an output interface. That is, in the embodiment of the present invention, the power amplifier chip divides the frequency of the audio information to obtain the sub-audio information with different frequencies, then performs power amplification on the sub-audio information with different frequencies, and performs optimization processing on the sub-audio information after power amplification, so that when the audio information after power amplification by the power amplifier chip is played by the audio output component, the playing effect of the audio output component is better, the playing effect of the audio output component is improved, and the listening experience of the user can be further improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments of the present invention will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive labor.
Fig. 1 is a schematic diagram of a power amplifier chip according to an embodiment of the present invention;
fig. 2 is a schematic diagram of an electronic device according to an embodiment of the invention;
fig. 3 is a schematic diagram of another power amplifier chip according to an embodiment of the present invention.
Reference numerals:
10: an input interface; 20: a frequency division module; 30: an amplifying module; 40: a processing module; 50: a matching module; 60: a storage module; 70: an interrupt control module; 80: a registering module; 90: a power supply module; 11: an output interface; 41: a determination unit; 42: an acquisition unit; 43: an optimization unit; 71: clock module, 81: a first register unit; 82: a second register unit; 83: and a third register unit.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be appreciated that reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
In various embodiments of the present invention, it should be understood that the sequence numbers of the following processes do not mean the execution sequence, and the execution sequence of each process should be determined by its function and inherent logic, and should not constitute any limitation to the implementation process of the embodiments of the present invention.
Before explaining the power amplifier chip provided by the embodiment of the present invention, an application scenario of the power amplifier chip provided by the embodiment of the present invention is specifically explained: in the related art, the power amplifier chip comprises a power amplifier module, and after audio information is input to the power amplifier chip, the power amplifier chip cannot divide the frequency of the audio information, so that power amplification is performed on the audio information which is not divided. However, since the audio information usually includes different frequencies, in the related art, when the audio information amplified by the power amplifier chip is played by the audio output component, the audio output component has a poor playing effect, and thus the listening experience of the user is poor.
Referring to fig. 1, a schematic diagram of a power amplifier chip according to an embodiment of the present invention is shown. The power amplifier chip is applied to electronic equipment, and the electronic equipment comprises a plurality of audio output components. As shown in fig. 1, the power amplifier chip includes: input interface 10, frequency dividing module 20, amplifying module 30, processing module 40 and output interface 11.
The input interface 10 is electrically connected with the frequency dividing module 20, the frequency dividing module 20 is electrically connected with the amplifying module 30, the amplifying module 30 is electrically connected with the processing module 40, and the processing module 40 is electrically connected with the output interface 11. The input interface 10 is used for inputting audio information. The frequency division information is used for dividing the frequency of the audio information into a plurality of sub-audio information. The amplifying module 30 is used for amplifying the power of the plurality of sub-audio information. The processing module 40 is configured to perform optimization processing on the sub-audio information after power amplification. The output interface 11 is used for outputting the sub audio information after optimization.
In the embodiment of the present invention, the input interface 10 is electrically connected to the frequency dividing module 20, the frequency dividing and amplifying module 30 is electrically connected to the processing module 40, the processing module 40 is electrically connected to the output interface 11, and the input interface 10 is used for inputting audio information, so that the audio information can be transmitted to the frequency dividing module 20 after the audio information is input to the power amplifier chip through the input interface 10. The frequency dividing module 20 divides the frequency of the audio information into a plurality of sub-audio information according to the frequency of the audio information. The sub audio information is transmitted to the amplifying module 30, and the amplifying module 30 amplifies the power of the sub audio information. The plurality of power-amplified sub audio information are transmitted to the processing module 40, and the processing module 40 performs optimization processing on each of the plurality of power-amplified sub audio information. And outputting the sub-audio information after each optimization processing from the power amplifier chip through an output interface 11. That is, in the embodiment of the present invention, the power amplifier chip divides the frequency of the audio information to obtain the sub-audio information with different frequencies, then performs power amplification on the sub-audio information with different frequencies, and performs optimization processing on the sub-audio information after power amplification, so that when the audio information after power amplification by the power amplifier chip is played by the audio output component, the playing effect of the audio output component is better, the playing effect of the audio output component is improved, and the listening experience of the user can be further improved.
In the embodiment of the present invention, the frequency dividing module 20 is configured to divide the frequency of the audio information, and an implementation manner of dividing the audio information into a plurality of sub-audio information may be as follows: audio information having a frequency within a first frequency range among the audio information is taken as first sub-audio information. And using the audio information with the frequency in the second frequency range in the audio information as the second sub audio information. And taking the audio information with the frequency in the third frequency range in the audio information as third sub audio information.
For example, the first frequency range may be a frequency range smaller than 200 hz, the second frequency range may be a frequency range from 200 hz to 800 hz, and the third frequency range may be a frequency range larger than 800 hz, at this time, the audio information in the first frequency range may be called low frequency, the audio information in the second frequency range may be called medium frequency, and the audio information in the third frequency range may be called high frequency.
Of course, the first frequency range, the second frequency range, and the third frequency range may be other frequency ranges, for example, the first frequency range is 30 hz to 150 hz, the second frequency range is 150 hz to 500 hz, and the third frequency range is greater than 500 hz, which is not limited herein.
Additionally, in some embodiments, as shown in fig. 1, the processing module 40 may include: a determination unit 41, an acquisition unit 42 and an optimization unit 43. The determination unit 41 is electrically connected to the acquisition unit 42, and the acquisition unit 42 is electrically connected to the optimization unit 43. The determining unit 41 is configured to determine whether the sub-audio information after power amplification is complete, and the obtaining unit 42 is configured to obtain the optimization information for the incomplete sub-audio information. The optimization unit 43 is configured to store optimization information for optimizing the incomplete sub-audio information.
Since the determination unit 41 is electrically connected to the acquisition unit 42 and the acquisition unit 42 is electrically connected to the optimization unit 43, after the sub audio information after power amplification is transmitted to the determination unit 41, the determination unit 41 may determine whether the sub audio information after power amplification is complete. When the sub audio information after power amplification is incomplete, the obtaining unit 42 may obtain optimization information for the incomplete sub audio information, and optimize the incomplete sub audio information by the optimization information. The obtaining unit 42 may directly obtain the optimization information from the optimizing unit 43. Therefore, when the optimized sub-audio information is played by the audio output assembly, the broadcasting effect of the audio output assembly is better, namely the sub-audio information is optimized, the broadcasting effect of the audio output assembly can be improved, and the listening experience of a user is further improved.
The optimization information may be at least one of phase processing information, delay processing information, equalization processing information, and signal-to-noise ratio processing information. The phase processing information may be referred to as a phase processing algorithm, the delay processing information may be referred to as a delay processing algorithm, the equalization processing information may be referred to as an EQ algorithm, and the signal-to-noise processing information may be referred to as a signal-to-noise processing algorithm.
It should be noted that the type of incomplete sub-audio information may be at least one of the following four cases: (1) the sub-audio information has a delay problem. (2) The sub-audio information has a phase difference problem. (3) The signal-to-noise ratio of the sub-audio information becomes problematic. (4) Sub-audio information may present equalization problems.
In addition, the determining unit 41 may determine the type of the incomplete sub-audio information after power amplification, and further may send an instruction to the obtaining unit 42, and the obtaining unit 42 obtains the optimization information corresponding to the type of the incomplete sub-audio information from the optimizing unit 43.
For example, when the determining unit 41 determines that the sub-audio information after power amplification has a delay problem, at this time, the determining unit 41 sends an instruction to the obtaining unit 42, the obtaining unit 42 obtains delay processing information from the optimizing unit 43, and the delay processing information can process the delay problem of the sub-audio information, so that the processed sub-audio information is complete.
In addition, in some embodiments, as shown in fig. 1, the power amplifier chip may further include a matching module 50. The matching module 50 is electrically connected to the processing module 40, and the matching module 50 is electrically connected to the output interface 11. The matching module 50 is used to match the audio output components to the optimized sub-audio information.
Because the electronic device includes a plurality of audio components, and after the audio information is input into the power amplifier chip through the input interface 10, the frequency division module 20 divides the frequency of the audio information, and divides the audio information into a plurality of sub audio information according to the frequency, it indicates that the frequencies of different sub audio information are different, and further indicates that the frequencies of different optimized sub audio information are different. When the power amplifier chip includes the matching module 50, the matching module 50 may match the audio output component according to the optimized frequency of the sub audio, so that different audio output components play sub audio information with different frequencies, thereby improving the playing effect of the audio output component.
It should be noted that, in the embodiment of the present invention, the electronic device includes a plurality of audio output components, and the broadcast frequency of each audio output component is different from the broadcast frequencies of other audio output components, that is, different broadcast components are used for playing audio information with different frequencies.
For example, referring to fig. 2, a schematic diagram of an electronic device provided by an embodiment of the invention is shown. As shown in fig. 2, the electronic device includes a plurality of audio output components, the plurality of audio output components may be divided into a first portion of audio output components and a second portion of audio output components, and the first portion of audio output components may include a first audio output unit, a second audio output unit, a third audio output unit, and a fourth audio output unit. The second partial audio output assembly may include a fifth audio output unit, a sixth audio output unit, a seventh audio output unit, and an eighth audio output unit. The first audio output unit and the fifth audio output unit are used for playing medium-high frequency musical instrument dubbing audio, the second audio output unit and the sixth sub audio output unit are used for playing human voice audio in the audio information, the third audio output unit and the seventh audio output unit are used for playing atmosphere rendering dubbing audio in the audio information, and the fourth audio output unit and the eighth audio output unit are used for playing medium-low frequency musical instrument dubbing audio in the audio information.
In addition, in some embodiments, as shown in fig. 1, the power amplifier chip may further include a storage module 60. The memory module 60 is electrically connected to the input interface 10, and the memory module 60 is electrically connected to the frequency dividing module 20. The storage module 60 is used for storing the audio information output from the input interface 10.
When the power amplifier chip includes the storage module 60, the audio information input to the power amplifier chip through the input interface 10 may be all stored in the storage module 60, so that the power amplifier chip has a certain storage property. And the frequency dividing module 20 can directly obtain the audio information from the storage module 60, thereby improving the processing efficiency of the power amplifier chip on the audio information.
In addition, in some embodiments, as shown in fig. 1, the power amplifier chip may further include an interrupt control module 70. The interrupt control module 70 is electrically connected to the input interface 10, and the interrupt control module 70 is electrically connected to the memory module 60. The interrupt control module 70 is configured to control the input interface 10 to stop inputting the audio information when the amount of the audio information stored in the storage module 60 exceeds the storage amount threshold.
When the power amplifier chip includes the interrupt control module 70, the terminal control module may control the input interface 10 to stop inputting the audio information when the amount of the audio information stored in the storage module 60 exceeds the storage amount threshold, so as to ensure that the amount of the audio information stored in the storage module 60 is not excessive, thereby ensuring that the power amplifier chip is always in a high processing efficiency when processing the audio information. Namely, by setting the interrupt control module 70, the processing efficiency of the power amplifier chip for processing the audio information can be ensured.
It should be noted that the storage threshold may be set according to the amount of audio information that can be divided by the frequency dividing module 20 in the power amplifier chip at one time, and of course, the device may also be configured according to actual needs.
In addition, in some embodiments, as shown in fig. 3, the power amplifier chip may further include a clock module 71, where the clock module 71 is electrically connected to the input interface 10, and the clock module 71 is configured to control the input interface 10 to input the audio information according to a preset time interval. The preset time interval can be set according to actual requirements.
In addition, in some embodiments, as shown in fig. 1, the power amplifier chip may further include a register module 80. The register module 80 is electrically connected to the frequency dividing module 20, the register module 80 is electrically connected to the amplifying module 30, and the register module 80 is configured to register the audio information after frequency division by the frequency dividing module 20.
When the power amplifier chip includes the register module 80, after the frequency division module 20 divides the frequency of the audio information, the sub-audio information with different frequencies can be registered in the register module 80, so that when the amplification module 30 is required to amplify the power of the sub-audio information with different frequencies, the information of the sub-audio with different frequencies can be directly acquired from the register module 80, and the processing efficiency of the power amplifier chip on the audio information is further improved.
It should be noted that the register module 80 may be a register.
Additionally, in some embodiments, as shown in fig. 1, the register module 80 includes: a first register unit 81, a second register unit 82, and a third register unit 83. The first register unit 81 is used for registering sub-audio information in the fourth frequency range, the second register unit 82 is used for registering sub-audio information in the fifth frequency range, and the third register unit 83 is used for registering sub-audio information in the sixth frequency range.
It should be noted that the fourth frequency range may be the same as the first frequency range, the fifth frequency range may be the same as the second frequency range, and the sixth frequency range may be the same as the third frequency range.
When the register module 80 includes the first register unit 81, the second register unit 82, and the third register unit 83, after the frequency division module 20 divides the frequency of the audio information, the sub-audio information with different frequencies can be registered in different register units, so that when the sub-audio information with different frequencies needs to be amplified by power amplification, the sub-audio information with different frequencies can be directly acquired from different register units, and the efficiency of processing the sub-audio information is further improved.
In addition, the first register unit 81 may be a register for registering a high frequency, the second register unit 82 may be a register for registering an intermediate frequency, and the third register unit 83 may be a register for registering a low frequency. Wherein the high frequency, the medium frequency and the low frequency can be set according to the listening effect of the user.
In addition, in some embodiments, as shown in fig. 1, the power amplifier chip may further include a power module 90. The power module 90 is electrically connected to the processing module 40.
When the power amplifier chip includes the power module 90, the power module 90 is electrically connected to the processing module 40, and the power module 90 can provide electric power for the processing module 40, so that the processing module 40 can continuously work, and further the working duration of the power amplifier chip is prolonged.
In the embodiment of the invention, the input interface is electrically connected with the frequency dividing module, the frequency dividing module is electrically connected with the amplifying module, the amplifying module is electrically connected with the processing module, the processing module is electrically connected with the output interface, and the input interface is used for inputting the audio information, so that the audio information can be transmitted to the frequency dividing module after the audio information is input to the power amplifier chip through the input interface. The frequency division module divides the frequency of the audio information and divides the audio information into a plurality of sub-audio information according to the frequency of the audio information. And the amplifying module amplifies the power of the sub-audio information. And the processing module performs optimization processing on each piece of sub-audio information in the plurality of pieces of sub-audio information after power amplification. And outputting the sub-audio information after each optimization processing from the power amplifier chip through an output interface. That is, in the embodiment of the present invention, the power amplifier chip divides the frequency of the audio information to obtain the sub-audio information with different frequencies, then performs power amplification on the sub-audio information with different frequencies, and performs optimization processing on the sub-audio information after power amplification, so that when the audio information after power amplification by the power amplifier chip is played by the audio output component, the playing effect of the audio output component is better, the playing effect of the audio output component is improved, and the listening experience of the user can be further improved.
The embodiment of the invention provides electronic equipment, which comprises a plurality of audio output components and a power amplifier chip in any embodiment of the electronic equipment.
It should be noted that, in the embodiment of the present invention, the electronic device includes, but is not limited to, a mobile phone, a tablet computer, a notebook computer, and the like. In addition, in the embodiment of the present invention, the audio output component may be a speaker.
In the embodiment of the invention, the input interface is electrically connected with the frequency dividing module, the frequency dividing module is electrically connected with the amplifying module, the amplifying module is electrically connected with the processing module, the processing module is electrically connected with the output interface, and the input interface is used for inputting the audio information, so that the audio information can be transmitted to the frequency dividing module after the audio information is input to the power amplifier chip through the input interface. The frequency division module divides the frequency of the audio information and divides the audio information into a plurality of sub-audio information according to the frequency of the audio information. And the amplifying module amplifies the power of the sub-audio information. And the processing module performs optimization processing on each piece of sub-audio information in the plurality of pieces of sub-audio information after power amplification. And outputting the sub-audio information after each optimization processing from the power amplifier chip through an output interface. That is, in the embodiment of the present invention, the power amplifier chip divides the frequency of the audio information to obtain the sub-audio information with different frequencies, then performs power amplification on the sub-audio information with different frequencies, and performs optimization processing on the sub-audio information after power amplification, so that when the audio information after power amplification by the power amplifier chip is played by the audio output component, the playing effect of the audio output component is better, the playing effect of the audio output component is improved, and the listening experience of the user can be further improved.
It should be noted that, in the present specification, the embodiments are all described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments may be referred to each other.
While alternative embodiments of the present invention have been described, additional variations and modifications of these embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including alternative embodiments and all such alterations and modifications as fall within the true scope of the embodiments of the invention.
While the technical solutions provided by the present invention have been described in detail, the principles and embodiments of the present invention are described herein by using specific examples, and meanwhile, for a person of ordinary skill in the art, according to the principles and embodiments of the present invention, the specific embodiments and application scope may be changed, and in summary, the content of the present description should not be construed as limiting the present invention.
Claims (9)
1. The utility model provides a power amplifier chip, is applied to among the electronic equipment, its characterized in that, electronic equipment includes a plurality of audio output subassemblies, power amplifier chip includes: the device comprises an input interface, a frequency division module, an amplification module, a processing module and an output interface;
the input interface is electrically connected with the frequency dividing module, the frequency dividing module is electrically connected with the amplifying module, the amplifying module is electrically connected with the processing module, and the processing module is electrically connected with the output interface;
the input interface is used for inputting audio information;
the frequency dividing module is used for dividing the frequency of the audio information and dividing the audio information into a plurality of sub-audio information;
the amplifying module is used for amplifying the power of the sub-audio information;
the processing module is used for optimizing the sub-audio information after power amplification;
the output interface is used for outputting the optimized sub-audio information;
wherein the processing module comprises: the device comprises a determining unit, an obtaining unit and an optimizing unit;
the determining unit is electrically connected with the acquiring unit, and the acquiring unit is electrically connected with the optimizing unit;
the determining unit is used for determining whether the sub-audio information after the power amplification is complete;
the acquisition unit is used for acquiring optimization information aiming at incomplete sub-audio information;
the optimization unit is configured to store optimization information, where the optimization information is used to optimize the incomplete sub-audio information.
2. The power amplifier chip of claim 1, wherein the power amplifier chip further comprises a matching module;
the matching module is electrically connected with the processing module and the output interface;
the matching module is used for matching the optimized sub-audio information with the audio output component.
3. The power amplifier chip of claim 1, wherein the frequency division module is further configured to:
taking audio information with a frequency within a first frequency range in the audio information as first sub-audio information;
taking the audio information with the frequency within a second frequency range in the audio information as second sub-audio information;
and taking the audio information with the frequency in the third frequency range in the audio information as third sub-audio information.
4. The power amplifier chip of claim 1, wherein the power amplifier chip further comprises a storage module;
the storage module is electrically connected with the input interface and the frequency dividing module;
the storage module is used for storing the audio information output from the input interface.
5. The power amplifier chip according to claim 4, wherein the power amplifier chip further comprises an interrupt control module;
the interrupt control module is electrically connected with the input interface and the memory module;
the interrupt control module is used for controlling the input interface to stop inputting the audio information when the amount of the audio information stored in the storage module exceeds a storage amount threshold value.
6. The power amplifier chip of claim 1, wherein the power amplifier chip further comprises a register module;
the register module is electrically connected with the frequency division module, and the register module is electrically connected with the amplification module;
the register module is used for registering the audio information after the frequency division of the frequency division module.
7. The power amplifier chip of claim 6, wherein the register module comprises: a first register unit, a second register unit and a third register unit;
the first register unit is used for registering sub-audio information in a fourth frequency range, the second register unit is used for registering sub-audio information in a fifth frequency range, and the third register unit is used for registering sub-audio information in a sixth frequency range.
8. The power amplifier chip according to any of claims 1 to 7, wherein the power amplifier chip further comprises a power module;
the power module is electrically connected with the processing module.
9. An electronic device, comprising a plurality of audio output components and the power amplifier chip of any one of claims 1 to 8.
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