CN111554720B - Display substrate, preparation method thereof and display device - Google Patents
Display substrate, preparation method thereof and display device Download PDFInfo
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- CN111554720B CN111554720B CN202010414503.9A CN202010414503A CN111554720B CN 111554720 B CN111554720 B CN 111554720B CN 202010414503 A CN202010414503 A CN 202010414503A CN 111554720 B CN111554720 B CN 111554720B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
- H10K59/1315—Interconnections, e.g. wiring lines or terminals comprising structures specially adapted for lowering the resistance
Abstract
The application provides a display substrate, a preparation method thereof and a display device. The preparation method comprises the following steps: providing a substrate; forming a first electrode layer and an auxiliary electrode on the substrate; forming a pixel defining layer on the first electrode layer, the pixel defining layer having a pixel opening and a through hole, the through hole exposing at least a portion of the auxiliary electrode; forming an auxiliary material in the via hole; forming an organic functional layer covering the pixel defining layer and the auxiliary material; pressing the heated imprinting part into the through hole, enabling the part of the organic functional layer corresponding to the through hole to enter the through hole along with the imprinting part, and melting the auxiliary material, so that the organic functional layer in the through hole flows out of the through hole along with the auxiliary material, and at least part of the auxiliary electrode is exposed; and forming a second electrode layer on the organic functional layer, wherein the second electrode layer is electrically connected with the auxiliary electrode.
Description
Technical Field
The present disclosure relates to the field of display technologies, and in particular, to a display substrate, a manufacturing method thereof, and a display device.
Background
For a top-emission display panel, the thickness of the cathode of the sub-pixel is generally set to be small in order to increase the transmittance of light emitted from the sub-pixel. However, the cathode thickness is small, which results in a large resistance of the cathode and a large voltage drop, and thus causes a large current difference between the sub-pixels in the central area and the edge area of the display panel, which causes a problem of uneven display brightness of the display panel, and the user experience is poor.
Disclosure of Invention
According to a first aspect of embodiments of the present application, a method of manufacturing a display substrate is provided. The preparation method of the display substrate comprises the following steps:
providing a substrate;
forming a first electrode layer and an auxiliary electrode on the substrate;
forming a pixel defining layer on the first electrode layer, the pixel defining layer having a pixel opening and a through hole, the through hole exposing at least a portion of the auxiliary electrode;
forming an auxiliary material in the via hole;
forming an organic functional layer covering the pixel defining layer and the auxiliary material;
pressing the heated imprinting part into the through hole, enabling the part, corresponding to the through hole, of the organic functional layer to enter the through hole along with the imprinting part, and enabling the auxiliary material to be molten, so that the organic functional layer in the through hole flows out of the through hole along with the auxiliary material, and at least part of the auxiliary electrode is exposed;
and forming a second electrode layer on the organic functional layer, wherein the second electrode layer is electrically connected with the auxiliary electrode.
In one embodiment, a melting point of the auxiliary material is lower than a melting point of the auxiliary electrode, and/or a melting point of the auxiliary material is lower than a melting point of the pixel defining layer.
In one embodiment, the auxiliary material is a conductive material.
In one embodiment, the auxiliary electrode includes a plurality of electrode blocks, the pixel defining layer is provided with a plurality of through holes, each of the electrode blocks corresponds to at least one of the through holes, and the pressing the heated embossed portion into the through hole includes:
providing an imprinting piece, wherein the imprinting piece comprises a carrier plate and a plurality of imprinting parts which are arranged on the carrier plate at intervals;
heating the nip;
and pressing the heated plurality of stamping parts into the corresponding through holes simultaneously.
In one embodiment, the carrier plate is provided with a containing part, and the containing part and the stamping part are arranged on the same side of the carrier plate.
In one embodiment, the auxiliary material is doped with metal particles that can be magnetized in a magnetic field; the stamping piece is provided with a magnetic piece, and the magnetic piece can generate a magnetic field.
In one embodiment, in a lamination direction of the display substrate, a size of the embossed portion is larger than a size of the through hole; and/or the presence of a gas in the atmosphere,
the size of the through-hole ranges from 5 μm to 20 μm in a direction perpendicular to the lamination direction of the display substrate.
In one embodiment, the first electrode layer and the auxiliary electrode are formed in a single patterning process.
In one embodiment, the step of pressing the heated nip into the through hole is performed in a closed container, and the manufacturing method further includes: and pumping the gas in the closed container while pressing the heated imprinting part into the through hole.
According to a second aspect of embodiments of the present application, there is provided a display substrate including:
a substrate;
a first electrode layer and an auxiliary electrode on the substrate;
a pixel defining layer on the first electrode layer, the pixel defining layer having a pixel opening and a via hole, the via hole exposing at least a portion of the auxiliary electrode;
the organic functional layer is positioned on the pixel limiting layer, and an opening is formed in the area, corresponding to the through hole, of the organic functional layer;
and the second electrode layer is positioned on the organic functional layer, and part of the second electrode layer enters the through hole through the opening and is electrically connected with the auxiliary electrode.
In one embodiment, an auxiliary material is arranged in the through hole, and the auxiliary material covers part of the surface of the through hole;
the auxiliary material has a melting point lower than that of the auxiliary electrode, and/or the auxiliary material has a melting point lower than that of the pixel defining layer, and/or the auxiliary electrode is made of a conductive material.
According to a third aspect of embodiments of the present application, there is provided a display device including the display substrate described above.
The embodiment of the application achieves the main technical effects that:
according to the display substrate and the preparation method thereof and the display device provided by the embodiment of the application, the second electrode layer of the display substrate is electrically connected with the auxiliary electrode, so that the resistance of the second electrode layer can be reduced, and the voltage drop of the second electrode layer is reduced, so that the difference of the current magnitude of the central area and the edge area of the display substrate can be reduced, the uniformity of the display brightness of different areas of the display substrate is improved, and the use experience of a user is facilitated to be improved; through forming auxiliary material in the through-hole, when the impression portion after adopting the heating impresses the through-hole, the part that organic functional layer and through-hole correspond gets into the through-hole along with the impression portion, and the impression portion after the heating makes auxiliary material melting, and then organic functional layer flows out the through-hole along with the auxiliary material of melting, thereby expose auxiliary electrode, for the scheme that adopts laser sintering's mode to get rid of organic functional layer, can avoid the impurity that produces to get into in the pixel opening and influence the display effect of display substrates, also can make organic functional layer and the part that the through-hole corresponds get rid of more thoroughly, avoid organic functional layer to influence the electricity connection of second electrode layer and auxiliary electrode.
Drawings
Fig. 1 is a flowchart of a method for manufacturing a display substrate according to an exemplary embodiment of the present disclosure;
FIG. 2 is a partial cross-sectional view of a first intermediate structure of a display substrate provided in an exemplary embodiment of the present application;
FIG. 3 is a partial cross-sectional view of a second intermediate structure of a display substrate provided in an exemplary embodiment of the present application;
FIG. 4 is a partial cross-sectional view of a second intermediate structure of a display substrate provided in accordance with another exemplary embodiment of the present application;
FIG. 5 is a partial cross-sectional view of a third intermediate structure of a display substrate provided in an exemplary embodiment of the present application;
FIG. 6 is a partial cross-sectional view of a fourth intermediate structure of a display substrate provided in an exemplary embodiment of the present application;
FIG. 7 is a partial cross-sectional view of a fifth intermediate structure of a display substrate provided in an exemplary embodiment of the present application;
FIG. 8 is a schematic view of a fourth intermediate structure of a display substrate as provided by an exemplary embodiment of the present application positioned over a stamp;
FIG. 9 is a schematic view of a stamp entering a through hole of a fourth intermediate structure of a display substrate according to an exemplary embodiment of the present application;
fig. 10 is a partial cross-sectional view of a display substrate provided in an exemplary embodiment of the present application.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. The following description refers to the accompanying drawings in which the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the exemplary embodiments below do not represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.
It is to be understood that although the terms first, second, third, etc. may be used herein to describe various information, such information should not be limited to these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the present application. The word "if," as used herein, may be interpreted as "at … …" or "at … …" or "in response to a determination," depending on the context.
The following describes in detail a display substrate, a method for manufacturing the same, and a display device in embodiments of the present application with reference to the drawings. The features of the embodiments described below may complement or be combined with each other without conflict.
In the embodiments of the present application, for convenience of description, the up-down direction is defined by defining the direction from the substrate to the first electrode layer as up and the direction from the first electrode layer to the substrate as down. It is easy to understand that the different direction definitions do not affect the actual operation of the process and the actual shape of the product.
The embodiment of the application provides a preparation method of a display substrate. The following describes a method for manufacturing a display substrate. The "patterning process" described in the embodiments of the present application includes processes of depositing a film, coating a photoresist, mask exposure, developing, etching, and stripping a photoresist. The deposition may employ any one or more selected from sputtering, evaporation, chemical vapor deposition, and spin coating, and the etching may employ any one or more selected from dry etching and wet etching. "thin film" refers to a layer of a material deposited or coated onto a substrate. The "thin film" may also be referred to as a "layer" if it does not require a patterning process throughout the fabrication process. When the "thin film" is subjected to a patterning process throughout the fabrication process, the "thin film" is referred to as a "thin film" before the patterning process, and the "layer" after the patterning process. The "layer" after the patterning process includes at least one "pattern".
Referring to fig. 1, the method for manufacturing a display substrate includes the following steps 110 to 170. The steps will be described separately below.
In step 110, a substrate is provided.
In one embodiment, the substrate may be a flexible substrate, the material of which may include one or more of PI (polyimide), PET (polyethylene terephthalate), and PC (polycarbonate). In other embodiments, the substrate may be a rigid substrate, which may be made of, for example, glass, metal, plastic, etc.
In one embodiment, after step 110 and before step 120, the method of making further comprises: a pixel circuit layer is formed on the substrate.
In one embodiment, referring to fig. 2, the pixel circuit layer includes a thin film transistor 20. The thin film transistor 20 includes a source electrode 21, an active layer 22, a gate electrode 23, and a drain electrode 24.
In one exemplary embodiment, the step of forming the pixel circuit layer on the substrate includes the processes of:
first, an active layer thin film is deposited on the substrate 10, and the active layer thin film is patterned through a patterning process to form the active layer 22.
Subsequently, a gate insulating layer 31 and a first metal film are sequentially deposited and the first metal film is patterned through a patterning process to form a gate electrode 23 over the active layer 22.
Subsequently, an interlayer dielectric layer 32 is deposited, and the gate insulating layer 31 and the interlayer dielectric layer 32 are etched to form a through hole penetrating through the gate insulating layer 31 and the interlayer dielectric layer 32. Two through holes are correspondingly formed above the active layer 22 of each thin film transistor 20.
Subsequently, a second metal film, a third metal film and a fourth metal film are sequentially deposited, the second metal film, the third metal film and the fourth metal film are patterned through a patterning process to form a source electrode 21 and a drain electrode 24, and the source electrode 21 and the drain electrode 24 are electrically connected with the active layer 22 through holes respectively. The second metal film and the fourth metal film may be made of titanium, and the third metal film may be made of aluminum.
Subsequently, a planarization layer 33 is deposited and the planarization layer 33 is etched to form a contact hole exposing a portion of the drain electrode 24.
In one embodiment, the material of the planarization layer 33 includes at least one of a phenol-based resin, a polypropylene-based resin, a polyimide-based resin, an acryl-based resin, and the like. The planarization layer 33 may be formed by spin coating.
In step 120, a first electrode layer and an auxiliary electrode are formed on the substrate.
By this step a first intermediate structure as shown in fig. 2 is obtained.
In one embodiment, the first electrode layer includes a plurality of electrode blocks 41 arranged at intervals, and each electrode block 41 is electrically connected to the drain electrode 24 through a corresponding contact hole. The first electrode layer and the auxiliary electrode are formed on the planarization layer 33.
In one embodiment, the number of the auxiliary electrodes 42 is multiple, the auxiliary electrodes 42 are arranged at intervals, and the auxiliary electrodes 42 are located between the adjacent electrode blocks 41.
In one embodiment, the first electrode layer and the auxiliary electrode are formed in a single patterning process. With this configuration, the first electrode layer and the auxiliary electrode 42 can be formed in the same process step, which helps to simplify the manufacturing process.
In one exemplary embodiment, the step 120 of forming the first electrode layer and the auxiliary electrode on the substrate may include the processes of:
a conductive film is deposited on the planarization layer 33 and patterned through a patterning process to form an electrode block 41 and an auxiliary electrode 42.
In other embodiments, the first electrode layer and the auxiliary electrode may not be formed in a single patterning process.
In one embodiment, the material of the first electrode layer and the auxiliary electrode includes at least one of aluminum, magnesium, silver, indium tin oxide, and indium zinc oxide. The thickness of the first electrode layer and the auxiliary electrode can be in the range of 10nm to 150nm. The thicknesses of the first electrode layer and the auxiliary electrode are, for example, 10nm, 30nm, 70nm, 100nm, 130nm, 150nm, and the like.
In step 130, a pixel defining layer is formed on the first electrode layer, the pixel defining layer having a pixel opening and a via hole, the via hole exposing at least a portion of the auxiliary electrode.
By this step a second intermediate structure as shown in fig. 3 or fig. 4 is obtained.
In this step, the pixel defining layer 50 has a plurality of pixel openings 51, the plurality of pixel openings 51 may correspond to the plurality of electrode blocks 41 one by one, and each pixel opening 51 exposes a portion of the corresponding electrode block 41. The number of the through holes 52 is plural, and one through hole 52 or more than two through holes 52 are correspondingly arranged on each auxiliary electrode 42. In the embodiment shown in fig. 3, one auxiliary electrode 42 is correspondingly provided with one through hole 52. In the embodiment shown in fig. 4, two through holes 52 are correspondingly formed in one auxiliary electrode 42. In other embodiments, the number of the through holes 52 correspondingly disposed on one auxiliary electrode 42 may be greater than two.
In one embodiment, the material of the pixel defining layer 50 may be a photoresist material. The pixel defining layer 50 may be formed by exposure, development, lift-off, baking, and the like. The thickness of the pixel defining layer 50 may range from 1 μm to 5 μm. The thickness of the pixel defining layer 50 is, for example, 1 μm, 2 μm, 3 μm, 4 μm, 5 μm, or the like.
In step 140, an assist material is formed in the via.
After step 140, a third intermediate structure as shown in fig. 5 is obtained. Fig. 5 illustrates an example in which one auxiliary electrode 42 is provided with one through hole 52, and other cases are not illustrated.
In one embodiment, the auxiliary material may be formed in the through-hole 52 by transfer printing, or by heating the material prior to printing.
In one embodiment, the distance between the surface of the auxiliary material 60 facing away from the substrate 10 and the surface of the pixel defining layer 50 facing away from the substrate 10 has a height ratio to the pixel defining layer in the range of-5%, 5%. With such an arrangement, the auxiliary material 60 is prevented from being easily broken due to too large height of the part of the auxiliary material 60 exceeding the pixel defining layer 50, and the organic functional layer is also prevented from being easily and completely removed in the subsequent steps due to too low height of the auxiliary material 60 and formation of the organic functional layer on the sidewall of the through hole 52. The ratio of the level difference of the auxiliary material 60 to the pixel defining layer 50 to the height of the pixel defining layer 50 may be, for example, -5%, -3%, 0, 2%, 5%, etc.
In step 150, an organic functional layer is formed covering the pixel defining layer and the auxiliary material.
A fourth intermediate structure as shown in fig. 6 may be obtained, via step 150. Fig. 6 illustrates an example in which one auxiliary electrode 42 is provided with one through hole 52, and other cases are not illustrated.
In this step, the organic functional layer 70 includes an organic light emitting material and at least one of an electron injection layer, an electron transport layer, a hole injection layer, and a hole transport layer. The substrate is covered by the orthographic projection of the electron injection layer, the electron transport layer, the hole injection layer and the hole transport layer on the substrate 10, the organic light-emitting material comprises a plurality of organic light-emitting blocks, the organic light-emitting blocks and the pixel openings 51 can be in one-to-one correspondence, and the organic light-emitting blocks are partially positioned in the corresponding pixel openings 51.
In step 160, the heated stamp is pressed into the through hole, so that the portion of the organic functional layer corresponding to the through hole enters the through hole along with the stamp, and the auxiliary material is melted, so that the organic functional layer in the through hole flows out of the through hole along with the auxiliary material, and the auxiliary electrode is at least partially exposed.
In this step, during the heated stamp enters the through-hole 52, the stamp first comes into contact with the organic functional layer 70. When the stamp moves into the through-hole 52, the stamp applies a force to the organic functional layer to break the organic functional layer 70, and the portion of the organic functional layer 70 corresponding to the through-hole 52 enters the through-hole 52 together with the stamp. After the nip enters the through-hole, the nip transfers heat to the auxiliary material 60 due to the high temperature of the nip, so that the temperature of the auxiliary material 60 is increased, and the auxiliary material 60 is melted. The embossed portion occupies a part of the space of the through-hole after entering the through-hole, the melted auxiliary material 60 is extruded out of the through-hole 52, and the organic functional layer 70 entered into the through-hole 52 flows out of the through-hole 52 together with the auxiliary material 60. Then, the embossed portion is removed from the through hole 52, at least a part of the surface of the auxiliary electrode 42 is exposed, and an opening is formed in the region of the organic functional layer 70 corresponding to the through hole 52.
A fifth intermediate structure as shown in fig. 7 may be obtained by step 160. The auxiliary material 60 in the through holes 52 may not be removed completely in step 160, and as shown in fig. 7, a small amount of the auxiliary material 60 remains in the through holes 52 of the fifth intermediate structure.
In one embodiment, the melting point of the auxiliary material 60 provided in the through-hole 52 is low, for example, may be below 60 ℃. With this arrangement, the auxiliary material 60 can be melted at a lower temperature, so that the imprint is heated to a lower temperature, thereby preventing the imprint from entering the through hole due to a higher temperature of the imprint, which may affect the shape and properties of the pixel defining layer 50.
In one embodiment, the auxiliary material 60 disposed in the through-hole 52 has a melting point lower than that of the auxiliary electrode 42. With this arrangement, when the stamp portion is heated, the stamp portion can be heated to a temperature higher than the melting point temperature of the auxiliary material 60 and lower than the melting point temperature of the auxiliary electrode 42, and the auxiliary electrode 42 can be melted after the stamp portion is pressed into the through hole 52, but the form of the auxiliary electrode 42 does not change, and the auxiliary electrode 42 is prevented from being melted and flowing out of the through hole 52.
In one embodiment, the auxiliary material 60 has a melting point lower than that of the pixel defining layer 50. With this arrangement, when the stamp is heated, the stamp can be heated to a temperature higher than the melting point of the auxiliary material 60 and lower than the melting point of the pixel defining layer 50, and the auxiliary electrode 42 can be melted after the stamp enters the press-fit through hole 52, but the form of the pixel defining layer 50 is not changed, and the influence of the change of the form of the pixel defining layer 50 on the performance of the display substrate is avoided.
In one embodiment, the auxiliary material 60 is a conductive material. With this arrangement, even if the embossed portion does not allow the auxiliary material 60 to completely flow out of the through-hole 52 after entering the through-hole 52, the remaining auxiliary material does not affect the electrical connection of the auxiliary electrode 42 with the second electrode layer to be formed later. In other embodiments, the auxiliary material 60 may also be a non-conductive material, such as paraffin or the like.
In one embodiment, the auxiliary material 60 includes a gallium-based alloy, i.e., an alloy obtained by adding other metals, such as tungsten, cobalt, titanium, iron, etc., to metal gallium. Alternatively, the auxiliary material 60 may be made of one or more metals such as zinc, indium, tin, and bismuth. Thus, the melting point of the auxiliary material 60 is low, and the auxiliary material 60 can be melted by heating the stamp portion to 60 ℃ to 100 ℃.
In one embodiment, the pressing the heated nip into the through hole includes:
firstly, a stamping part is provided, wherein the stamping part comprises a carrier plate and a plurality of stamping parts arranged on the carrier plate at intervals. Referring to fig. 8, the stamp 200 includes a carrier 201 and a plurality of stamps 202 disposed on the carrier. The embossed portions 202 may correspond one-to-one to the through holes 52. The material of the carrier plate 201 may be plastic, glass, quartz, metal, etc. The material of the stamping portion 202 may be acrylic, metal, etc.
Subsequently, the nip is heated.
And then pressing the heated plurality of stamping parts into the corresponding through holes simultaneously.
With such an arrangement, the portions of the organic functional layer 70 corresponding to the through holes 52 and the auxiliary material 60 in the through holes 52 can be removed at the same time, so as to improve the efficiency of manufacturing the display substrate.
In one embodiment, referring again to fig. 8, prior to pressing the heated stamp into the through-hole, the fourth intermediate structure may be inverted with the auxiliary material 60 facing downward and placed over the stamp 200. Thereafter, the fourth intermediate structure is moved downward to cause the embossed portions 202 to enter the corresponding through holes 52, as shown in fig. 9. By inverting the fourth intermediate structure, the melted auxiliary material 60 flows out of the through hole 52 more easily under the action of gravity, which helps to remove the auxiliary material 60 in the through hole 52 and the organic functional layer 70 entering the through hole 52 more completely.
In one embodiment, the size of the embossed portion 202 is larger than the size of the through hole 52 in the stacking direction of the display substrates. With this arrangement, the end of the embossed portion 202 can enter the bottom of the through hole 52, and the auxiliary material at the bottom of the through hole 52 can be squeezed out, which helps the auxiliary material and the organic functional layer in the through hole 52 to flow out from the through hole 52 more.
In one embodiment, the size of the embossed portion 202 is smaller than the size of the through hole 52 in a direction perpendicular to the stacking direction of the display substrates. Thus, the embossed portion 202 can smoothly enter the through-hole 52.
In one embodiment, the auxiliary material 60 is doped with metal particles that can be magnetized in a magnetic field; the imprinting member 200 is provided with a magnetic member, which generates a magnetic field. So set up, the magnetic part produces magnetic attraction to the metal particle in the auxiliary material 60, and metal particle removes to the direction that is close to the imprinting member 200 under the effect of magnetic attraction, and the metal particle removes and drives auxiliary material 60 and the organic functional layer 70 that enters into in the through-hole 52 and remove together, more helps auxiliary material 60 and organic functional layer 70 to flow out from the through-hole 52.
In one embodiment, the material of the metal particles comprises at least one of iron, cobalt, nickel and alloys thereof. So set up, the magnetic attraction that metal particle received in the magnetic field is great. The material of the metal particles is, for example, an iron-nickel alloy, an iron-cobalt alloy, or the like.
In one embodiment, the metal particles have a particle size in the range of 10nm to 100nm. With the arrangement, the situation that the metal particles are not easy to prepare due to small size can be avoided, the situation that the metal particles enter the pixel opening 51 when flowing out of the through hole 52 due to large size of the metal particles and are not easy to purge out of the pixel opening 51 when impurities are purged can be avoided, and therefore a display dark spot of the display panel is caused. The particle diameter of the metal particles may be, for example, 10nm, 20nm, 40nm, 60nm, 80nm, 100nm, or the like.
In one embodiment, the volume fraction of metal particles in the mixture of metal particles and auxiliary material 60 is in the range of 20% to 40%. By such arrangement, the situation that the volume fraction of the metal particles is small, the magnetic attraction force is small, and the resistance force applied when the auxiliary material 60 and the organic functional layer 70 flow out of the through hole 52 cannot be effectively reduced can be avoided; meanwhile, the situation that the molten auxiliary material 60 has low fluidity and cannot smoothly flow out of the through hole 52 due to the large volume fraction of the metal particles can be avoided. The volume fraction of metal particles in the mixture of metal particles and auxiliary material 60 may be 20%, 25%, 30%, 35%, 40%, etc.
In one embodiment, the magnetic member may be a permanent magnet capable of maintaining magnetism for a long period of time.
In one embodiment, the magnetic member and the stamp 202 are disposed on the same side of the carrier 201. Therefore, the magnetic part is closer to the metal particles, and the magnetic attraction force applied to the metal particles is larger.
In one embodiment, the carrier 201 has a receiving portion disposed on the same side of the carrier as the stamping portion. The accommodating portion may be a groove formed on the surface of the carrier 201, the auxiliary material, the metal particles and the organic functional layer flowing out of the through hole 52 may be accommodated in the groove, and the organic functional layer may be removed by heating, so that the auxiliary material and the metal particles may be recycled.
In one embodiment, the size of the through-hole 52 ranges from 5 μm to 20 μm in a direction perpendicular to the lamination direction of the display substrates. With such an arrangement, it is avoided that the size of the through hole 52 is too small, the amount of the auxiliary material contained is small, and the auxiliary material cannot be taken out or the amount of the auxiliary material taken out from the organic functional layer in the through hole 52 is small when flowing out from the through hole 52; and the problem that the effective display area of the display substrate is reduced due to the fact that the through holes 52 occupy a large area due to too large size can be avoided. The size of the through hole 52 in the direction perpendicular to the lamination direction of the display substrate may be, for example, 5 μm, 10 μm, 15 μm, 20 μm, or the like. In an exemplary embodiment, when two through holes are correspondingly disposed on the auxiliary electrode, the size of the through hole may be, for example, 5 μm, and the distance between two adjacent through holes may be, for example, 10 μm.
In one embodiment, the step 160 of pressing the heated nip into the through hole is performed in a closed container, and the method further includes: and pumping the gas in the sealed container while pressing the heated embossing part into the through hole. With this arrangement, impurities such as organic functional layers flowing out of the through holes 52 can be pumped out of the sealed container along with the gas, and the impurities are prevented from entering the pixel openings 51 to affect the display effect of the display substrate.
In one embodiment, the sealed container may be connected with a vacuum-pumping device, and the gas in the sealed container may be pumped by the vacuum-pumping device. The evacuation device may be a vacuum pump.
In step 170, a second electrode layer is formed on the organic functional layer, the second electrode layer being electrically connected to the auxiliary electrode.
The display substrate shown in fig. 10 can be obtained through step 170. A portion of the second electrode layer 80 is electrically connected to the auxiliary electrode 42 through the opening in the organic functional layer 70 into the via hole 52. The projection of the second electrode layer 80 on the substrate 10 covers the substrate 10.
In one embodiment, the material of the second electrode layer 80 may be a magnesium silver alloy. In other embodiments, other conductive materials may be used for the second electrode layer 80.
In one embodiment, the first electrode layer is an anode and the second electrode layer is a cathode.
In one embodiment, the resistivity of the auxiliary electrode 42 is less than the resistivity of the second electrode layer 80. Thus, the auxiliary electrode 42 can effectively reduce the resistance of the second electrode layer 80, and thus the problem of non-uniform display brightness of the display substrate caused by voltage drop can be effectively improved. The material of the auxiliary electrode 42 may include at least one of copper, silver, gold, and aluminum.
In one embodiment, after step 170, the preparation method may further include: and forming an encapsulation layer on the second electrode layer. The encapsulation layer may be a thin film encapsulation layer.
In one embodiment, the light emitted from the organic functional layer 70 is white light, and after the forming of the encapsulation layer on the second electrode layer, the preparation method further includes: and forming a color filter on the packaging layer. The color filter can be arranged to realize that the display substrate displays color images, and the use experience of users is improved.
According to the preparation method of the display substrate, the second electrode layer in the prepared display substrate is electrically connected with the auxiliary electrode, so that the resistance of the second electrode layer can be reduced, the voltage drop of the second electrode layer is reduced, the difference of the current magnitude of the central area and the edge area of the display substrate can be reduced, the uniformity of the display brightness of different areas of the display substrate is improved, and the use experience of a user is improved; through forming auxiliary material in the through-hole, when the impression portion after adopting the heating impresses the through-hole, the part that organic functional layer and through-hole correspond gets into the through-hole along with the impression portion, and the impression portion after the heating makes auxiliary material melting, and then organic functional layer flows out the through-hole along with the auxiliary material of melting, thereby expose auxiliary electrode, for the scheme that adopts laser sintering's mode to get rid of organic functional layer, can avoid the impurity that produces to get into in the pixel opening and influence the display effect of display substrates, also can make organic functional layer and the part that the through-hole corresponds get rid of more thoroughly, avoid organic functional layer to influence the electricity connection of second electrode layer and auxiliary electrode.
The embodiment of the application also provides a display substrate. The display substrate described with reference to fig. 10 includes a substrate 10, a first electrode layer, an auxiliary electrode 42, a pixel defining layer 50, an organic functional layer 70, and a second electrode layer 80. The first electrode layer and the auxiliary electrode 42 are located on the substrate 10, and the first electrode layer may include a plurality of electrode blocks 41 arranged at intervals; the pixel defining layer 50 is located on the first electrode layer and the auxiliary electrode 42, a pixel opening 51 and a through hole 52 are formed on the pixel defining layer 50, and at least a portion of the auxiliary electrode 42 is exposed by the through hole 52; the organic functional layer 70 is positioned on the pixel defining layer 50, and the organic functional layer 70 forms an opening at a position corresponding to the through hole 52; a portion of the second electrode layer 80 enters the via hole 52 through the opening in the organic functional layer 70 and is electrically connected to the auxiliary electrode 42.
The display substrate provided by the embodiment of the application, the second electrode layer is electrically connected with the auxiliary electrode, the resistance of the second electrode layer can be reduced, the voltage drop of the second electrode layer is reduced, the difference of the current magnitude of the central area and the edge area of the display substrate can be reduced, the uniformity of the display brightness of different areas of the display substrate can be improved, and the use experience of a user can be improved
In one embodiment, an auxiliary material 60 is disposed in the through hole 52, and the auxiliary material 60 covers a part of the surface of the through hole 52. As described in the above embodiments of the method for manufacturing a display substrate, removing the auxiliary material 60 may leave a part of the auxiliary material 60, and the remaining auxiliary material 60 covers at most a part of the surface of the auxiliary electrode 42 or does not cover the auxiliary electrode 42, so that the electrical connection between the auxiliary electrode 42 and the second electrode layer 80 is not affected.
In one embodiment, a melting point of the auxiliary material is lower than a melting point of the auxiliary electrode, and/or a melting point of the auxiliary material is lower than a melting point of the pixel defining layer.
In one embodiment, the material of the auxiliary electrode is a conductive material.
In one embodiment, the resistivity of the auxiliary electrode 42 is less than the resistivity of the second electrode layer 80. Thus, the auxiliary electrode 42 can effectively reduce the resistance of the second electrode layer 80, and thus the problem of non-uniform display brightness of the display substrate caused by voltage drop can be effectively improved. The material of the auxiliary electrode 42 may include at least one of copper, silver, gold, and aluminum.
In one embodiment, the display substrate may further include a pixel circuit layer between the substrate 10 and the first electrode layer 41, and the pixel circuit layer includes a thin film transistor.
In one embodiment, the display substrate may further include an encapsulation layer on the second electrode layer 80 and a color filter on the encapsulation layer.
For the product embodiment, since it basically corresponds to the method embodiment, the description of the relevant details and beneficial effects may refer to the partial description of the method embodiment, and will not be repeated.
The embodiment of the application further provides a display device. The display device comprises the display substrate of any one of the embodiments.
In some embodiments, the display device may be a display panel, and the display panel includes the display substrate and a cover plate disposed on a side of the display substrate facing away from the substrate.
In some embodiments, the display device includes a housing and a display panel connected to the housing, for example, the display panel is embedded in the housing. The display device can be any device with a display function, such as a mobile phone, a tablet computer, a television, a notebook computer, a digital photo frame, a navigator and the like.
It is noted that in the drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. Also, it will be understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element or layer or intervening layers may also be present. In addition, it will be understood that when an element or layer is referred to as being "under" another element or layer, it can be directly under the other element or intervening layers or elements may also be present. In addition, it will also be understood that when a layer or element is referred to as being "between" two layers or elements, it can be the only layer between the two layers or elements, or more than one intermediate layer or element can also be present. Like reference numerals refer to like elements throughout.
Other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.
It will be understood that the present application is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the application is limited only by the appended claims.
Claims (15)
1. A method for preparing a display substrate is characterized by comprising the following steps:
providing a substrate;
forming a first electrode layer and an auxiliary electrode on the substrate;
forming a pixel defining layer on the first electrode layer, the pixel defining layer having a pixel opening and a through hole exposing at least a portion of the auxiliary electrode;
forming an auxiliary material in the via hole;
forming an organic functional layer covering the pixel defining layer and the auxiliary material;
pressing the heated imprinting part into the through hole, enabling the part of the organic functional layer corresponding to the through hole to enter the through hole along with the imprinting part, and melting the auxiliary material, so that the organic functional layer in the through hole flows out of the through hole along with the auxiliary material, and at least part of the auxiliary electrode is exposed;
and forming a second electrode layer on the organic functional layer, wherein the second electrode layer is electrically connected with the auxiliary electrode.
2. The method of manufacturing a display substrate according to claim 1, wherein a melting point of the auxiliary material is lower than a melting point of the auxiliary electrode.
3. The method of manufacturing a display substrate according to claim 1, wherein a melting point of the auxiliary material is lower than a melting point of the pixel defining layer.
4. The method of manufacturing a display substrate according to claim 1, wherein the auxiliary material is a conductive material.
5. The method for manufacturing a display substrate according to claim 1, wherein the auxiliary electrode includes a plurality of electrode blocks, the pixel defining layer is provided with a plurality of through holes, each electrode block corresponds to at least one through hole, and the pressing the heated embossed portion into the through hole includes:
providing an imprinting piece, wherein the imprinting piece comprises a carrier plate and a plurality of imprinting parts which are arranged on the carrier plate at intervals;
heating the nip;
and pressing the heated plurality of stamping parts into the corresponding through holes simultaneously.
6. The method for manufacturing a display substrate according to claim 5, wherein the carrier has a receiving portion disposed thereon, and the receiving portion and the stamping portion are disposed on the same side of the carrier.
7. The method of manufacturing a display substrate according to claim 5, wherein the auxiliary material is doped with metal particles, the metal particles being magnetized in a magnetic field; the stamping piece is provided with a magnetic piece, and the magnetic piece can generate a magnetic field.
8. The method for manufacturing a display substrate according to claim 1, wherein a size of the embossed portion is larger than a size of the through hole in a lamination direction of the display substrate; and/or the presence of a gas in the gas,
the size of the through-hole ranges from 5 μm to 20 μm in a direction perpendicular to the lamination direction of the display substrate.
9. The method of claim 1, wherein the first electrode layer and the auxiliary electrode are formed in a single patterning process.
10. The method of manufacturing a display substrate according to claim 1, wherein the step of pressing the heated imprint portion into the through hole is performed in a closed container, the method further comprising: and pumping the gas in the closed container while pressing the heated imprinting part into the through hole.
11. A display substrate prepared by the method according to any one of claims 1 to 10, the display substrate comprising:
a substrate;
a first electrode layer and an auxiliary electrode on the substrate;
a pixel defining layer on the first electrode layer, the pixel defining layer having a pixel opening and a via hole, the via hole exposing at least a portion of the auxiliary electrode;
the organic functional layer is positioned on the pixel limiting layer, and an opening is formed in the area, corresponding to the through hole, of the organic functional layer;
and the second electrode layer is positioned on the organic functional layer, and part of the second electrode layer enters the through hole through the opening and is electrically connected with the auxiliary electrode.
12. The display substrate according to claim 11, wherein an auxiliary material is disposed in the through hole, and the auxiliary material covers a part of the surface of the through hole;
the melting point of the auxiliary material is lower than the melting point of the auxiliary electrode.
13. The display substrate according to claim 11, wherein an auxiliary material is provided in the through hole, and the auxiliary material covers a part of a surface of the through hole; the auxiliary material has a melting point lower than that of the pixel defining layer.
14. The display substrate according to claim 11, wherein an auxiliary material is provided in the through hole, and the auxiliary material covers a part of a surface of the through hole; the auxiliary electrode is made of a conductive material.
15. A display device comprising the display substrate according to any one of claims 11 to 14.
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| KR101640803B1 (en) * | 2014-09-26 | 2016-07-20 | 엘지디스플레이 주식회사 | Organic Light Emitting Diode Display Device and Method of Fabricating the Same |
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