CN111540604B - Preparation method of multilayer flaky ceramic electronic component - Google Patents
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- 238000002360 preparation method Methods 0.000 title abstract description 19
- 238000005245 sintering Methods 0.000 claims abstract description 49
- 239000002994 raw material Substances 0.000 claims abstract description 32
- 239000000843 powder Substances 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 claims abstract description 12
- 239000002245 particle Substances 0.000 claims abstract description 6
- 238000003754 machining Methods 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 26
- 239000010410 layer Substances 0.000 claims description 18
- 238000005498 polishing Methods 0.000 claims description 18
- 238000003825 pressing Methods 0.000 claims description 17
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
- 239000012744 reinforcing agent Substances 0.000 claims description 15
- 239000011889 copper foil Substances 0.000 claims description 12
- 239000002270 dispersing agent Substances 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 8
- 239000000654 additive Substances 0.000 claims description 6
- 239000012790 adhesive layer Substances 0.000 claims description 6
- 239000004014 plasticizer Substances 0.000 claims description 6
- 238000011282 treatment Methods 0.000 claims description 6
- 238000005303 weighing Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000005728 strengthening Methods 0.000 claims description 5
- 230000000996 additive effect Effects 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910003460 diamond Inorganic materials 0.000 claims description 3
- 239000010432 diamond Substances 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 3
- 238000013532 laser treatment Methods 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 238000007639 printing Methods 0.000 claims description 3
- 238000004080 punching Methods 0.000 claims description 3
- 230000003014 reinforcing effect Effects 0.000 claims description 3
- 150000003377 silicon compounds Chemical class 0.000 claims description 3
- 239000002356 single layer Substances 0.000 claims description 3
- 238000004513 sizing Methods 0.000 claims description 3
- 238000004544 sputter deposition Methods 0.000 claims description 3
- 239000007888 film coating Substances 0.000 claims description 2
- 238000009501 film coating Methods 0.000 claims description 2
- 239000007767 bonding agent Substances 0.000 claims 2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/10—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on aluminium oxide
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- C—CHEMISTRY; METALLURGY
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
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- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
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- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
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- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/85—Coating or impregnation with inorganic materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/60—Aspects relating to the preparation, properties or mechanical treatment of green bodies or pre-forms
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Abstract
The invention discloses a preparation method of a multilayer flaky ceramic electronic component, which comprises the following steps: s01: preparing raw materials; s02: preparing a raw blank; s03: sintering the green part; s04: finish machining of the cooked blank; s05: electrode wiring; s06: and (4) preparing multiple layers. According to the preparation method of the multilayer sheet-shaped ceramic electronic component, the added ceramic reinforcer can be used for increasing the particle strength among powder raw materials and obtaining the powder raw materials with extremely high strength during raw material preparation, so that the powder raw materials cannot deform or even break randomly during the process of sintering, the self stability of the powder raw materials is greatly enhanced, the preparation quality of the electronic component is further improved, and a sintering mode of rotating a sintering disc is adopted, so that each part of a green blank can be completely sintered and molded, the sintering efficiency of the green blank is ensured, and the phenomenon of incomplete sintering is avoided.
Description
Technical Field
The invention relates to the technical field of ceramic electronic component preparation, in particular to a preparation method of a multilayer flaky ceramic electronic component.
Background
The electronic components are components of electronic elements and small machines and instruments, are usually composed of a plurality of parts and can be commonly used in similar products; it is a general name of some parts in the industries of electric appliances, radio, instruments and the like, such as capacitors, transistors, balance springs, springs and other subcomponents, and ceramic electronic components are electronic components prepared by using alumina as a main material, and ceramic powder and metal powder are mixed with a binder in advance to prepare ceramic slurry and electrode slurry necessary for manufacturing ceramic diaphragms and electrodes of the electronic ceramic components.
At present, in the preparation of multilayer flaky ceramic electronic components, because the strength among ceramic powder raw materials is insufficient, a green blank is broken or incompletely sintered during sintering, the green blank cannot meet the follow-up high-quality preparation and processing treatment, and then the high-strength ceramic electronic components cannot be obtained.
Disclosure of Invention
The invention aims to solve the defects in the prior art and provides a preparation method of a multilayer chip ceramic electronic component.
In order to achieve the purpose, the invention adopts the following technical scheme: a preparation method of a multilayer chip ceramic electronic component comprises the following steps:
s01: preparing raw materials, namely weighing sufficient alumina as a main material, weighing sufficient mixed additives as auxiliary materials, and mixing the main material and the auxiliary materials to obtain a powder raw material;
s02: preparing a raw blank, putting a powder raw material into a dry pressing die, and dry pressing the powder raw material into a flaky green blank by using a dry pressing flat plate technology;
s03: sintering the green body, namely placing the green body in a flat layer and a single layer, and transporting the green body to a sintering furnace for sintering through a rotary sintering disc to obtain a cooked blank;
s04: finish machining the cooked blank, fixing the cooked blank on polishing equipment, and performing step-by-step comprehensive polishing on the surface of the cooked blank by using a coarse-to-fine polishing material to obtain a smooth and flat cooked blank;
s05: electrode wiring, namely performing hot press molding on the copper foil, the heat-resistant adhesive layer, the ceramic, the heat-resistant adhesive layer and the copper foil in a laminating mode, sintering to obtain a double-sided copper foil-coated ceramic base plate, and performing electrode printing after a printed circuit board process;
s06: and (3) multilayer preparation, namely repeatedly coating insulating layers on the double-sided copper foil-clad ceramic substrate plate, and sintering, wiring and sintering to obtain a finished product of the multilayer flaky ceramic electronic component.
As a further description of the above technical solution:
in the step S01, the content of alumina is not less than 95%, the mixed additive is composed of an adhesive, a plasticizer, a reinforcing agent and a dispersing agent, wherein the ratio of the adhesive, the plasticizer, the reinforcing agent and the dispersing agent is respectively 30%, 25%, 20% and 25%, and the reinforcing agent is a ceramic reinforcing agent and can be used for reinforcing the strength of the raw materials.
As a further description of the above technical solution:
in step S02, the pressure of the dry-pressing plate is 0.8kpa, the thickness of the dry-pressing plate is less than 0.3mm, and after the sheet-shaped green blank is dry-pressed, the green blank may be subjected to operations such as punching and sizing.
As a further description of the above technical solution:
in step S03, the rotation direction of the sintering disk is clockwise and counterclockwise, the rotation angular velocity is 20rad/min, and the sintering temperature of the sintering furnace is stably controlled between 1200 ℃ and 1600 ℃.
As a further description of the above technical solution:
in step S04, the polishing material is alumina powder or diamond paste, and the particle diameter of the polishing material is smaller than 1 um.
As a further description of the above technical solution:
before the step S05, the method further comprises a strengthening treatment of the cooked blank, wherein the strengthening treatment is to coat a layer of silicon compound film on the surface of the cooked blank in a vacuum sputtering film coating mode and perform heat treatment at the temperature of 1300-1700 ℃.
As a further description of the above technical solution:
in step S05, before hot press forming, the copper foil with one oxidized surface and the alumina ceramic substrate need to be hot press formed, and an activated surface is obtained after laser treatment, which is convenient for subsequent hot press forming.
As a further description of the above technical solution:
in step S06, the insulating layer is made of alumina, and the number of insulating layers to be coated may be selected according to the number of layers of the electronic component.
Advantageous effects
The invention provides a preparation method of a multilayer flaky ceramic electronic component. The method has the following beneficial effects:
(1): according to the preparation method of the multilayer flaky ceramic electronic component, the added ceramic reinforcer can be used for increasing the particle strength among the powder raw materials and obtaining the powder raw materials with extremely high strength during raw material preparation, so that the phenomenon of random deformation or even breakage of green parts of the powder raw materials in subsequent sintering treatment can be avoided, the self stability of the powder raw materials is greatly enhanced, and the quality of electronic component preparation is further improved.
(2): the preparation method of the multilayer chip ceramic electronic component adopts a sintering mode of rotating the sintering disc, so that the green compact can be in comprehensive contact with flames in the sintering furnace, each part of the green compact can be completely sintered and molded, the sintering efficiency of the green compact is ensured, and the phenomenon of incomplete sintering is avoided.
Drawings
Fig. 1 is a schematic flow chart of a method for manufacturing a multilayer chip ceramic electronic component according to the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
As shown in fig. 1, a method for manufacturing a multilayer chip ceramic electronic component includes the steps of:
s01: preparing raw materials, namely weighing sufficient alumina as a main material, weighing sufficient mixed additives as auxiliary materials, and mixing the main material and the auxiliary materials to obtain a powder raw material;
s02: preparing a raw blank, putting a powder raw material into a dry pressing die, and dry pressing the powder raw material into a flaky green blank by using a dry pressing flat plate technology;
s03: sintering the green ware, namely placing the green ware in a flat layer and in a single layer, and transporting the green ware to a sintering furnace through a rotary sintering disc for sintering to obtain a cooked blank;
s04: finish machining the cooked blank, fixing the cooked blank on polishing equipment, and performing step-by-step comprehensive polishing on the surface of the cooked blank by using a coarse-to-fine polishing material to obtain a smooth and flat cooked blank;
s05: electrode wiring, namely performing hot press molding on the copper foil, the heat-resistant adhesive layer, the ceramic, the heat-resistant adhesive layer and the copper foil in a laminating mode, sintering to obtain a double-sided copper foil-coated ceramic substrate plate, and performing electrode printing after a printed circuit board process;
s06: and (3) multilayer preparation, namely repeatedly coating insulating layers on the double-sided copper foil-clad ceramic substrate plate, and sintering, wiring and sintering to obtain a finished product of the multilayer flaky ceramic electronic component.
In the step S01, the content of alumina is not less than 95%, the mixed additive is composed of an adhesive, a plasticizer, a reinforcing agent and a dispersing agent, wherein the ratio of the adhesive, the plasticizer, the reinforcing agent and the dispersing agent is respectively 30%, 25%, 20% and 25%, the reinforcing agent is a ceramic reinforcing agent, and can be used for reinforcing the strength of the raw materials, and when the raw materials are prepared, the particle strength among the powder raw materials can be increased, so that the powder raw materials with extremely high strength can be obtained, and the phenomenon of random deformation and even breakage of the green parts of the powder raw materials can not occur in the subsequent sintering treatment, thereby greatly enhancing the self-stability of the powder raw materials.
In step S02, the pressure of the dry-pressing plate is 0.8kpa, the thickness of the dry-pressing plate is less than 0.3mm, and after the sheet-like green piece is dry-pressed, the green piece may be subjected to operations such as punching, sizing, and the like.
In step S03, the rotation direction of the sintering disk is clockwise and counterclockwise, the rotation angular velocity is 20rad/min, the sintering temperature of the sintering furnace is stably controlled between 1200 ℃ and 1600 ℃, and the sintering mode of the rotation of the sintering disk is adopted, so that the green compact can be in full contact with the flame in the sintering furnace, each part of the green compact can be completely sintered and molded, thereby ensuring the sintering efficiency of the green compact and avoiding incomplete sintering.
In step S04, the polishing material is alumina powder or diamond paste, and the particle diameter of the polishing material is smaller than 1um, so that the polishing material can efficiently polish the blank member, and the abrasion of the polishing material on the surface of the blank member can be reduced, thereby ensuring the polishing safety of the blank member.
Before the step S05, the method further includes a step of strengthening the cooked blank, in which a silicon compound film is coated on the surface of the cooked blank by vacuum sputtering, and heat treatment is performed at 1300-1700 ℃, so as to ensure that a protective film with high strength is formed on the surface of the cooked blank, block possible external interference factors, and ensure that the cooked blank is not scratched and abraded during the processing.
In step S05, before hot press forming, the copper foil with one oxidized surface and the alumina ceramic substrate need to be hot press formed, and an activated surface is obtained after laser treatment, which is convenient for subsequent hot press forming.
In step S06, the insulating layer is made of alumina, and the number of the insulating layers to be coated may be selected according to the number of the layers of the electronic component, and the thickness of the insulating layer may be selected according to the thickness of the chip-shaped ceramic electronic component to be mounted, as long as the ceramic substrates are kept in a relatively insulated state.
In the description herein, references to the description of "one embodiment," "an example," "a specific example," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (2)
1. A method for manufacturing a multilayer chip ceramic electronic component is characterized by comprising the following steps:
s01: preparing raw materials, namely weighing sufficient alumina as a main material, weighing sufficient mixed additives as auxiliary materials, and mixing the main material and the auxiliary materials to obtain a powder raw material;
s02: preparing a raw blank, putting a powder raw material into a dry pressing die, and dry pressing the powder raw material into a flaky green blank by using a dry pressing flat plate technology;
s03: sintering the green body, namely placing the green body in a flat layer and a single layer, and transporting the green body to a sintering furnace for sintering through a rotary sintering disc to obtain a cooked blank;
s04: finish machining the cooked blank, fixing the cooked blank on polishing equipment, and performing step-by-step comprehensive polishing on the surface of the cooked blank by using a coarse-to-fine polishing material to obtain a smooth and flat cooked blank;
s05: electrode wiring, namely performing hot press molding on the copper foil, the heat-resistant adhesive layer, the ceramic, the heat-resistant adhesive layer and the copper foil in a laminating mode, sintering to obtain a double-sided copper foil-coated ceramic base plate, and performing electrode printing after a printed circuit board process;
s06: preparing a multilayer, namely repeatedly coating an insulating layer on a double-sided copper foil-clad ceramic substrate plate, and sintering, wiring and sintering to obtain a finished product of a multilayer flaky ceramic electronic component;
in the step S01, the content of the alumina is not less than 95%, the mixed additive is composed of a bonding agent, a plasticizer, a reinforcing agent and a dispersing agent, wherein the ratio of the bonding agent to the plasticizer to the reinforcing agent to the dispersing agent is 30%, the ratio of the reinforcing agent to the dispersing agent is 25%, the ratio of the reinforcing agent to the dispersing agent to the reinforcing agent is 20%, and the reinforcing agent is a ceramic reinforcing agent and can be used for reinforcing the strength of the raw materials;
in the step S03, the rotation direction of the sintering disk is clockwise and counterclockwise, the rotation angular velocity is 20rad/min, and the sintering temperature of the sintering furnace is stably controlled between 1200 ℃ and 1600 ℃;
before the step S05, the method further comprises the step of strengthening the cooked blank, wherein the strengthening treatment is to coat a layer of silicon compound film on the surface of the cooked blank in a vacuum sputtering film coating mode and carry out heat treatment at the temperature of 1300-1700 ℃;
in step S05, before hot press forming, a copper foil with one oxidized surface and an alumina ceramic substrate need to be subjected to hot press forming, and an activated surface is obtained after laser treatment, which facilitates subsequent hot press forming;
in the step S04, the polishing material is alumina powder or diamond paste, and the particle diameter of the polishing material is less than 1 um;
in step S06, the insulating layer is made of alumina, and the number of insulating layers to be coated may be selected according to the number of layers of the electronic component.
2. The method for manufacturing a multilayer chip ceramic electronic component as claimed in claim 1, wherein in step S02, the pressing force of the dry-pressing plate is 0.8kpa, the thickness of the dry-pressing plate is less than 0.3mm, and after the dry-pressing to form the chip green piece, the green piece can be subjected to punching, sizing, and the like.
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| JP2006093525A (en) * | 2004-09-27 | 2006-04-06 | Matsushita Electric Ind Co Ltd | Method of manufacturing ceramic multilayer substrate and ceramic multilayer substrate and power amplifier module using it |
| CN101448759A (en) * | 2006-05-23 | 2009-06-03 | 埃普科斯股份有限公司 | Ceramic material, sintered ceramics and component made therefrom, production method, and use of the ceramics |
| JP4942862B1 (en) * | 2011-07-29 | 2012-05-30 | 日本碍子株式会社 | Multilayer sintered ceramic wiring board and semiconductor package including the wiring board |
| CN104844158A (en) * | 2015-04-03 | 2015-08-19 | 北京科技大学 | Method for producing ceramic material by using metallurgic intermediate cladding slag |
| CN104844199A (en) * | 2015-04-24 | 2015-08-19 | 河南科技大学 | Technology for preparing zirconia-zirconium boride bilayer composite ceramic heating unit through slip casting method |
| CN105118673A (en) * | 2015-09-09 | 2015-12-02 | 福建火炬电子科技股份有限公司 | Chip ceramic capacitor sintering method |
| CN110372392A (en) * | 2019-07-02 | 2019-10-25 | 无锡元核芯微电子有限责任公司 | A kind of sintering method of ceramic substrate |
| CN211120666U (en) * | 2019-07-03 | 2020-07-28 | 乐山市瑞祯建材有限公司 | Heat flow circulation type sintering device for producing sintered porous bricks |
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