CN111538394B - Air-cooled host case with internal environment temperature adjusting function and method - Google Patents
Air-cooled host case with internal environment temperature adjusting function and method Download PDFInfo
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- CN111538394B CN111538394B CN202010344029.7A CN202010344029A CN111538394B CN 111538394 B CN111538394 B CN 111538394B CN 202010344029 A CN202010344029 A CN 202010344029A CN 111538394 B CN111538394 B CN 111538394B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
Abstract
The invention relates to an air-cooled host case with an internal environment temperature regulation function and a method, wherein the host case comprises a host case; the host case comprises a left side plate and a right side plate; the left side plate is fixedly provided with a main control plate; the main control panel is fixedly provided with a CPU; a turntable, a rotating assembly, a lower fan plate, a first heat dissipation assembly and a second heat dissipation assembly are arranged in the host machine case; the first heat dissipation assembly comprises a first iron block, a heat conducting pin group and a first return spring; the second heat dissipation assembly comprises a second iron block, a mounting plate, a first heat dissipation fin group and a second return spring; an upper fan air plate is also arranged in the host machine case; the upper fan air plate is fixed with the transverse plate body of the mounting plate; the lower fan air plate is an iron plate, and the right side surface of the lower fan air plate is fixedly provided with an electromagnet; the right side plate is provided with a first movable through groove; the first movable through groove is used for allowing the heat conducting pin group or the first radiating fin group to penetrate out of the host case; the heat dissipation mode of this quick-witted case is nimble various, and heat absorption, heat dissipation are more high-efficient, and dustproof effectual.
Description
Technical Field
The invention relates to the technical field of host machine cases, in particular to an air-cooled host machine case with an internal environment temperature adjusting function and a method.
Background
The computer case is mainly used for placing and fixing computer accessories and comprises a main control panel. During heat dissipation, or a fan is directly fixed in the case to continuously blow air towards the CPU, and in this way, the fan, the main control board and electronic components on the main control board are easily attached by dust; or directly cover a layer of heat conduction silica gel on the main control board, under this mode, heat conduction silica gel is the rigid, can't directly dispel the heat outside the computer machine case after the heat absorption, and the radiating rate is slow.
Disclosure of Invention
The present invention provides an air-cooled host chassis with an internal environment temperature adjusting function, and a method for using the air-cooled host chassis, aiming at the above-mentioned defects in the prior art.
The technical scheme adopted by the invention for solving the technical problems is as follows:
on one hand, the air-cooled host case with the internal environment temperature regulation function is provided, and comprises a host case; the host case comprises a left side plate and a right side plate; a longitudinal main control plate is fixedly arranged on the inner wall of the left side plate; the main control panel is fixedly provided with a CPU; the host machine case is internally provided with a transverse rotary table, a rotating assembly for driving the rotary table to rotate on a horizontal plane, a lower fan plate fixedly arranged at the middle position of the upper surface of the rotary table, and a first heat dissipation assembly and a second heat dissipation assembly which are distributed at two sides of the lower fan plate;
the first heat dissipation assembly comprises a first iron block, a heat conducting pin group which is fixed on the left side surface of the first iron block and is matched with the CPU, and a first return spring; two ends of the first return spring are respectively fixed with the right side surface of the first iron block and the left side surface of the lower fan air plate;
the second heat dissipation assembly comprises a second iron block, an inverted L-shaped mounting plate fixed with the right side surface of the second iron block, a first heat dissipation fin group fixedly arranged on one side, away from the second iron block, of the mounting plate and matched with the CPU, and a second reset spring; two ends of the second return spring are respectively fixed with the left side surface of the mounting plate and the right side surface of the lower fan air plate;
an upper fan plate matched with the lower fan plate for fan is also arranged in the host case; the upper fan air plate is fixed with the transverse plate body of the mounting plate; the lower fan air plate is an iron plate, and an electromagnet for adsorbing the first iron block and the second iron block is fixedly arranged on the right side surface of the lower fan air plate; the right side plate is provided with a first movable through groove; the first movable through groove is used for allowing the heat conducting pin group or the first radiating fin group to penetrate out of the host machine case.
On the other hand, the use method of the air-cooled host case is provided, based on the air-cooled host case with the internal environment temperature regulation function, and the method comprises the following steps:
starting air cooling and heat dissipation:
the electromagnet is electrified to adsorb the first iron block and the second iron block, the heat conducting pin group and the first radiating fin group return to the turntable, and the upper fan air plate and the lower fan air plate are closed;
the rotating assembly drives the rotating disc to rotate in a reciprocating mode, and the lower fan plate and the upper fan plate are matched to fan the main control panel and the electronic components mounted on the main control panel;
starting the heat conducting needle set for heat dissipation:
after the air cooling is carried out for a certain time, the rotating assembly drives the rotating disc to rotate, so that the heat conducting pin group is opposite to the CPU, and the first radiating fin group is opposite to the first movable through groove;
when the electromagnet is powered off, the first iron block and the second iron block move outwards under the pushing of the first return spring and the second return spring respectively, the heat conducting pin group is directly connected to the CPU to absorb heat, and the first radiating fin group directly moves out of the host case;
starting the first radiating fin group to radiate:
after the heat conducting pin group radiates heat for a certain time, the electromagnet is electrified to adsorb the first iron block and the second iron block, and the heat conducting pin group and the first radiating fin group return to the turntable; the rotating assembly drives the rotating disc to rotate, so that the supercooled first radiating fin group is opposite to the CPU, and the heat conducting pin group which absorbs a large amount of heat is opposite to the first movable through groove;
when the electromagnet is powered off, the first iron block and the second iron block move outwards under the pushing of the first return spring and the second return spring respectively, the first radiating fin group is directly connected to the CPU to absorb heat, and the heat conducting pin group directly goes out of the host case; and after the first radiating fin group radiates heat for a certain time, executing the step of starting air cooling radiation.
The invention has the beneficial effects that:
the heat dissipation mode is nimble various. Specifically, the method comprises the following steps: the air-cooled heat dissipation, the heat conduction pin group heat dissipation and the first heat dissipation fin group heat dissipation are alternately used.
The heat absorption and the heat dissipation are more efficient. Specifically, the method comprises the following steps: the solid heat conduction is faster than the gas heat conduction, so that the heat conduction needle group and the first radiating fin are contacted with the CPU, and the heat absorption speed is higher; after heat absorption, the heat conducting needle group and the first radiating fins can be directly arranged outside the host case for radiating, so that the radiating speed is higher; meanwhile, the heat conducting needle group and the first heat radiating fins work alternately, so that efficient heat radiation and heat absorption can be synchronously performed.
The dustproof effect is good. Specifically, the method comprises the following steps: the swing type air supply is adopted, the surfaces of the left side and the right side of the lower fan air plate are windward surfaces, and dust is difficult to attach to the lower fan air plate, so that a certain dustproof effect is achieved; meanwhile, the heat conducting pin group and the first radiating fin group radiate heat in turn, so that the phenomenon that the air cooling radiating time is too long and dust excessively enters the host case can be avoided; furthermore, when the heat conducting pin group or the first radiating fin group is adopted for radiating, the first movable through groove is correspondingly shielded, so that dust can be effectively prevented from entering the first movable through groove.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the present invention will be further described with reference to the accompanying drawings and embodiments, wherein the drawings in the following description are only part of the embodiments of the present invention, and for those skilled in the art, other drawings can be obtained without inventive efforts according to the accompanying drawings:
fig. 1 is a top view of an air-cooled host chassis with an internal environment temperature adjusting function according to an embodiment of the present invention (an electromagnet is in a power-off state);
fig. 2 is a top view of an air-cooled host chassis with an internal environment temperature adjusting function according to an embodiment of the present invention (an electromagnet is in an energized state);
fig. 3 is a rear view of an air-cooled host chassis with an internal environment temperature adjusting function according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present invention, and it is obvious that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without inventive step, are within the scope of the present invention.
Example one
The embodiment of the invention provides an air-cooled host case with an internal environment temperature regulation function, which comprises a host case as shown in fig. 1-3; the host machine case comprises a left side plate 11 and a right side plate 12; a longitudinal main control panel 13 is fixedly arranged on the inner wall of the left side plate 11; the main control panel 13 is fixedly provided with a CPU 14; a transverse rotary table 15, a rotating assembly 16 for driving the rotary table 15 to rotate on a horizontal plane, a lower fan plate 17 fixedly arranged at the middle position of the upper surface of the rotary table 15, and a first heat dissipation assembly 18 and a second heat dissipation assembly 19 distributed at two sides of the lower fan plate 17 are arranged in the host case;
the first heat sink assembly 18 includes a first iron block 110, a heat conducting pin set 111 fixed to the left side surface of the first iron block 110 and adapted to the CPU14, and a first return spring 112; two ends of the first return spring 112 are respectively fixed with the right side surface of the first iron block 110 and the left side surface of the lower fan plate 17;
the second heat dissipation assembly 19 comprises a second iron block 113, an inverted L-shaped mounting plate 114 fixed with the surface of the right side of the second iron block 113, a first heat dissipation fin set 115 fixed on the side of the mounting plate 114 away from the second iron block 113 and matched with the CPU14, and a second return spring 116; both ends of the second return spring 116 are fixed to the left side surface of the mounting plate 114 and the right side surface of the lower fan plate 17, respectively;
an upper fan plate 117 matched with the lower fan plate 17 for fan is also arranged in the host machine case; the upper fan plate 117 is fixed with the transverse plate body of the mounting plate 114; the lower fan plate 17 is an iron plate, and the right surface is fixedly provided with an electromagnet 118 for adsorbing the first iron block 110 and the second iron block 113; the right side plate 12 is provided with a first movable through groove 180; the first movable through slot 180 allows the heat conducting pin set 111 or the first heat dissipating fin set 115 to pass through the host chassis.
This host computer machine case possesses following advantage:
the heat dissipation mode is nimble various. Three heat dissipation modes of air cooling heat dissipation, heat conduction pin group heat dissipation and first heat dissipation fin group heat dissipation are alternately used, and the method specifically comprises the following steps:
starting air cooling and heat dissipation: the electromagnet 118 is electrified to adsorb the first iron block 110 and the second iron block 113, the heat conducting pin group 111 and the first radiating fin group 18 return to the turntable 15, and the upper fan plate 117 and the lower fan plate 17 are closed; the rotating assembly 16 drives the rotating disc 15 to rotate in a reciprocating manner, and the lower fan plate 17 and the upper fan plate 117 are matched to fan the main control panel 13 and the electronic components mounted on the main control panel 13 so as to cool the electronic components;
starting the heat conducting needle set for heat dissipation: after the air cooling is carried out for a certain time, the rotating assembly 16 drives the rotating disc 15 to rotate, so that the heat conducting pin group 111 is opposite to the CPU14, and the first radiating fin group 115 is opposite to the first movable through groove 180; when the electromagnet 118 is powered off, the first iron block 110 and the second iron block 113 move outwards under the pushing of the first return spring 112 and the second return spring 116 respectively, the heat conducting pin group 111 directly absorbs heat on the CPU14, the first cooling fin group 115 directly goes out of the host case to contact with cooler air, the absorbed heat is released, and meanwhile, the first cooling fin group 115 also shields the first movable through groove 180, thereby effectively preventing external dust from entering the host case;
starting the first radiating fin group to radiate: after the heat conducting pin group 111 dissipates heat for a certain time, the electromagnet 118 is electrified to adsorb the first iron block 110 and the second iron block 113, and the heat conducting pin group 111 and the first heat dissipating fin group 115 return to the turntable 15; the rotating assembly 16 drives the rotating disc 15 to rotate, so that the first cooled radiating fin group 115 is opposite to the CPU14, and the heat conducting pin group 111 which has absorbed a large amount of heat is opposite to the first movable through groove 180; when the electromagnet 118 is de-energized, the first iron block 110 and the second iron block 113 move outwards under the urging of the first return spring 112 and the second return spring 116, respectively, the first heat dissipation fin set 115 directly reaches the CPU14 to absorb heat, and the heat conduction pin set 111 directly reaches the outside of the main machine case to contact with cooler air, so as to release the heat absorbed from the CPU 14.
The heat absorption and the heat dissipation are more efficient. Specifically, the method comprises the following steps: the solid heat conduction is faster than the gas heat conduction, so that the heat conducting pin set 111 and the first heat radiating fin set 115 are in contact with the CPU14, and the heat absorption speed is higher; after heat absorption, the heat conducting pin group 111 and the first heat radiating fin group 115 can be directly arranged outside the host case for heat radiation, so that the heat radiation speed is higher; meanwhile, the heat conducting pin group 111 and the first fin group 115 are alternately operated, and thus, efficient heat dissipation and heat absorption can be simultaneously performed.
The dustproof effect is good. Specifically, the method comprises the following steps: swing type air supply is adopted, the surfaces of the left side and the right side of the lower fan air plate 17 are windward surfaces, dust is difficult to attach to the lower fan air plate 17, and a certain dustproof effect is achieved; meanwhile, the heat conducting pin group 111 and the first radiating fin group 115 radiate heat in turn, so that the phenomenon that the air cooling radiating time is too long and dust excessively enters the host case can be avoided; furthermore, when the heat conducting pin group 111 or the first heat radiating fin group 115 is used for heat radiation, the first movable through groove 180 is correspondingly shielded, so that dust can be effectively prevented from entering.
As shown in fig. 1-3, a second fin group 119 is fixedly arranged on the outer surface of the rotary disk 15; the fins of the second cooling fin group 119 are uniformly distributed on the circumference, the distribution circle where the fins are located is coaxial with the turntable 15, and when the turntable 15 rotates in a reciprocating manner, the fins of the second cooling fin group 119 can fan air to accelerate the air flow in the case of the host machine.
As shown in fig. 1-3, the lower fan plate 17 and the upper fan plate 117 are both provided with a plurality of sets of dust-removing soft bristles 120 which are longitudinally distributed on the rear side surface; the dust removing soft bristles 120 are used for cleaning dust attached to the main control board 13 and the CPU14, and the electromagnet 118 is electrified to adsorb the first iron block 110 and the second iron block 113, and the heat conducting pin group 111 and the first radiating fin group 115 to return to the rotary table 15; the rotating assembly 16 drives the rotating disc 15 to rotate, and the dust removing soft bristles 120 can clean the main control board 13 and the electronic components mounted on the main control board 13, so that the main control board 13 and the electronic components mounted on the main control board 13 can be always in an exposed state, and the heat conducting pin group 111 and the first heat dissipating fin group 115 can absorb heat.
As shown in fig. 2-3, the turntable 15 is a plastic plate; the lower end of the mounting plate 114 is fixedly provided with a first bar magnet 121; the inner walls of the left side plate 11 and the right side plate 12 are fixedly provided with second bar magnets 122 corresponding to the first bar magnets 121; the S-pole of the first bar magnet 121 faces downward; the S-pole of the second bar magnet 122 faces upward; after the mounting plate 114 is extended, when the mounting plate 114 tends to move downward, the S-poles of the first bar magnet 121 and the S-poles of the second bar magnet 122 are opposite to each other, and the like poles repel each other, so that the mounting plate 114 is prevented from moving downward, and the first fin group 115 can be smoothly inserted into the first movable through groove 180.
As shown in fig. 1-3, a supporting platform 123 for supporting the first iron block 110 is fixedly disposed on the turntable 15, so that the heat conducting pin set 111 can extend outwards along the supporting platform 123 and smoothly pass through the first movable through slot 180 or contact with the CPU 14.
As shown in fig. 1-3, a first heat-conducting silica gel layer 124 adapted to the CPU14 is fixedly disposed on a side of the heat-conducting pin set 111 away from the first iron block 110; the second heat-conducting silica gel layer 125 matched with the CPU14 is fixedly arranged on the side of the first heat-radiating fin group 115 away from the mounting plate 114, and the heat-conducting silica gel is additionally arranged, so that the heat of the main control board 13 and the CPU14 can be better absorbed, and the buffer can be performed, and the main control board 13 and the CPU14 are prevented from being damaged.
As shown in fig. 1-3, the second heat dissipating assembly 19 further includes two sets of third fin groups 126 disposed on the upper and lower sides of the first fin group 115; the third fin group 126 is arranged on the side of the mounting plate 114, which faces away from the second iron block 113; a third heat-conducting silica gel layer 127 is fixedly arranged on one side, away from the mounting plate 114, of the third heat-radiating fin group 126, the heat absorption area can be increased by additionally arranging the third heat-radiating fin group 126 and the third heat-conducting silica gel layer 127, and meanwhile, due to the flexibility of the heat-conducting silica gel, electronic components arranged on the main control board 13 can be prevented from being damaged;
the right side plate 12 is provided with a second movable through groove 181 communicated with the first movable through groove 180; the second movable through slot 181 allows the two sets of the third fin groups 126 to pass through the host chassis.
Further, as shown in fig. 1-3, a fourth heat conductive silicone layer 128 in a shape of a square-circle is fixedly disposed on one side of the mounting plate 114 facing the right side plate 12; the fourth heat conductive silicone layer 128 surrounds the first fin group 115 and the two third fin groups 126, so that heat in the host chassis can be directly conducted to the right side plate 12, and can be tightly attached to the right side plate 12, thereby preventing external dust from entering the host chassis.
As shown in fig. 3, the host chassis includes a backplane (not shown); the rotating assembly 16 comprises a motor fixed to a base plate (not shown in the figures); the motor and the turntable 15 are coaxially fixed, and the motor is used as a driving source, so that the installation is convenient.
Example two
The embodiment of the invention provides a use method of an air-cooled host case, and the method comprises the following steps of:
step S101: starting air cooling heat dissipation
The electromagnet is electrified to adsorb the first iron block and the second iron block, the heat conducting pin group and the first radiating fin group return to the turntable, and the upper fan air plate and the lower fan air plate are closed;
the rotating assembly drives the rotating disc to rotate in a reciprocating mode, and the lower fan plate and the upper fan plate are matched to fan the main control panel and the electronic components mounted on the main control panel;
step S102: starting heat conduction needle set for heat dissipation
After the air cooling is carried out for a certain time, the rotating assembly drives the rotating disc to rotate, so that the heat conducting pin group is opposite to the CPU, and the first radiating fin group is opposite to the first movable through groove;
when the electromagnet is powered off, the first iron block and the second iron block move outwards under the pushing of the first return spring and the second return spring respectively, the heat conducting pin group is directly connected to the CPU to absorb heat, and the first radiating fin group directly moves out of the host case;
step S103: radiating by using the first radiating fin group
After the heat conducting pin group radiates heat for a certain time, the electromagnet is electrified to adsorb the first iron block and the second iron block, and the heat conducting pin group and the first radiating fin group return to the turntable; the rotating assembly drives the rotating disc to rotate, so that the supercooled first radiating fin group is opposite to the CPU, and the heat conducting pin group which absorbs a large amount of heat is opposite to the first movable through groove;
when the electromagnet is powered off, the first iron block and the second iron block move outwards under the pushing of the first return spring and the second return spring respectively, the first radiating fin group is directly connected to the CPU to absorb heat, and the heat conducting pin group directly goes out of the host case; and after the first radiating fin group radiates heat for a certain time, executing the step of starting air cooling radiation.
It will be understood that modifications and variations can be made by persons skilled in the art in light of the above teachings and all such modifications and variations are intended to be included within the scope of the invention as defined in the appended claims.
Claims (10)
1. An air-cooled host case with an internal environment temperature regulation function comprises a host case; the host case comprises a left side plate and a right side plate; a longitudinal main control plate is fixedly arranged on the inner wall of the left side plate; the main control panel is fixedly provided with a CPU; the heat dissipation device is characterized in that a transverse rotary table, a rotating assembly driving the rotary table to rotate on a horizontal plane, a lower fan plate fixedly arranged at the middle position of the upper surface of the rotary table, and a first heat dissipation assembly and a second heat dissipation assembly distributed on two sides of the lower fan plate are arranged in the host machine case;
the first heat dissipation assembly comprises a first iron block, a heat conducting pin group which is fixed on the left side surface of the first iron block and is matched with the CPU, and a first return spring; two ends of the first return spring are respectively fixed with the right side surface of the first iron block and the left side surface of the lower fan air plate;
the second heat dissipation assembly comprises a second iron block, an inverted L-shaped mounting plate fixed with the right side surface of the second iron block, a first heat dissipation fin group fixedly arranged on one side, away from the second iron block, of the mounting plate and matched with the CPU, and a second reset spring; two ends of the second return spring are respectively fixed with the left side surface of the mounting plate and the right side surface of the lower fan air plate;
an upper fan plate matched with the lower fan plate for fan is also arranged in the host case; the upper fan air plate is fixed with the transverse plate body of the mounting plate; the lower fan air plate is an iron plate, and an electromagnet for adsorbing the first iron block and the second iron block is fixedly arranged on the right side surface of the lower fan air plate; the right side plate is provided with a first movable through groove; the first movable through groove is used for allowing the heat conducting pin group or the first radiating fin group to penetrate out of the host machine case.
2. The air-cooled mainframe box with the function of adjusting the internal environment temperature as claimed in claim 1, wherein the outer surface of the turntable is fixedly provided with a second cooling fin group; the fins of the second radiating fin group are uniformly distributed on the circumference, and the distribution circle of the fins is coaxial with the turntable.
3. The air-cooled mainframe box with the function of adjusting the internal environment temperature as claimed in claim 1, wherein the lower fan plate and the upper fan plate are both fixedly provided with a plurality of groups of dust-removing soft bristles which are longitudinally distributed on the rear side surface; the dust removal soft brush hair is used for cleaning dust attached to the main control panel and the CPU.
4. The air-cooled mainframe box with internal environment temperature regulation function according to claim 1, characterized in that the turntable is made of plastic plate; the lower end part of the mounting plate is fixedly provided with a first bar-shaped magnet; the inner walls of the left side plate and the right side plate are fixedly provided with second bar magnets corresponding to the first bar magnets; the S pole of the first bar magnet faces downwards; the S pole of the second bar magnet faces upwards.
5. The air-cooled mainframe box with an internal environment temperature adjusting function according to claim 1, wherein a support platform for supporting the first iron block is fixedly arranged on the turntable.
6. The air-cooled host case with the internal environment temperature regulation function according to claim 1, wherein a first heat-conducting silica gel layer adapted to the CPU is fixedly arranged on one side of the heat-conducting needle group away from the first iron block; and a second heat-conducting silica gel layer matched with the CPU is fixedly arranged on one side, deviating from the mounting plate, of the first heat-radiating fin group.
7. The air-cooled host case with the internal environment temperature adjusting function according to claim 1, wherein the second heat dissipation assembly further comprises two groups of third heat dissipation fin groups distributed on the upper and lower sides of the first heat dissipation fin group; the third radiating fin group is arranged on one side, away from the second iron block, of the mounting plate; a third heat-conducting silica gel layer is fixedly arranged on one side, away from the mounting plate, of the third heat-radiating fin group;
the right side plate is provided with a second movable through groove communicated with the first movable through groove; the second movable through groove is used for allowing the two groups of the third radiating fin groups to penetrate out of the host case.
8. The air-cooled host case with the internal environment temperature adjusting function according to claim 7, wherein a fourth heat-conducting silica gel layer in a shape of a circle is fixedly arranged on one side of the mounting plate facing the right side plate; the fourth heat conducting silica gel layer surrounds the first heat radiating fin group and the two groups of third heat radiating fin groups.
9. The air-cooled host computer case with internal environment temperature regulation function of claim 1, wherein the host computer case comprises a bottom plate; the rotating assembly comprises a motor fixed with the bottom plate; the motor is coaxially fixed with the turntable.
10. An application method of an air-cooled host case based on any one of claims 1 to 9, wherein the air-cooled host case with an internal environment temperature regulation function comprises the following steps:
starting air cooling and heat dissipation:
the electromagnet is electrified to adsorb the first iron block and the second iron block, the heat conducting pin group and the first radiating fin group return to the turntable, and the upper fan air plate and the lower fan air plate are closed;
the rotating assembly drives the rotating disc to rotate in a reciprocating mode, and the lower fan plate and the upper fan plate are matched to fan the main control panel and the electronic components mounted on the main control panel;
starting the heat conducting needle set for heat dissipation:
after the air cooling is carried out for a certain time, the rotating assembly drives the rotating disc to rotate, so that the heat conducting pin group is opposite to the CPU, and the first radiating fin group is opposite to the first movable through groove;
when the electromagnet is powered off, the first iron block and the second iron block move outwards under the pushing of the first return spring and the second return spring respectively, the heat conducting pin group is directly connected to the CPU to absorb heat, and the first radiating fin group directly moves out of the host case;
starting the first radiating fin group to radiate:
after the heat conducting pin group radiates heat for a certain time, the electromagnet is electrified to adsorb the first iron block and the second iron block, and the heat conducting pin group and the first radiating fin group return to the turntable; the rotating assembly drives the rotating disc to rotate, so that the supercooled first radiating fin group is opposite to the CPU, and the heat conducting pin group which absorbs a large amount of heat is opposite to the first movable through groove;
when the electromagnet is powered off, the first iron block and the second iron block move outwards under the pushing of the first return spring and the second return spring respectively, the first radiating fin group is directly connected to the CPU to absorb heat, and the heat conducting pin group directly goes out of the host case; and after the first radiating fin group radiates heat for a certain time, executing the step of starting air cooling radiation.
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