CN111538391A - Temperature control method and device, storage medium and terminal - Google Patents
Temperature control method and device, storage medium and terminal Download PDFInfo
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- CN111538391A CN111538391A CN202010330158.0A CN202010330158A CN111538391A CN 111538391 A CN111538391 A CN 111538391A CN 202010330158 A CN202010330158 A CN 202010330158A CN 111538391 A CN111538391 A CN 111538391A
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- temperature
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- temperature value
- heat transfer
- shell
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/72—Mobile telephones; Cordless telephones, i.e. devices for establishing wireless links to base stations without route selection
- H04M1/724—User interfaces specially adapted for cordless or mobile telephones
- H04M1/72448—User interfaces specially adapted for cordless or mobile telephones with means for adapting the functionality of the device according to specific conditions
- H04M1/72454—User interfaces specially adapted for cordless or mobile telephones with means for adapting the functionality of the device according to specific conditions according to context-related or environment-related conditions
Abstract
The embodiment of the application discloses a temperature control method, a temperature control device, a storage medium and a terminal. The temperature control method comprises the following steps: acquiring a first temperature value of the shell at present; comparing the first temperature value with a preset first temperature value; if the first temperature value is smaller than a preset first temperature value, judging whether the heat transfer layer works or not; if not, the heat transfer layer is driven to start working, and the heat generated by the heat dissipation layer is transferred to the heating layer to control the temperature of the shell to rise. This application embodiment transmits the heat that the inside device that generates heat in terminal produced to the inboard zone of heating of shell through the heat dissipation layer, simultaneously for zone of heating ohmic heating, the temperature of quick adjustment shell can effectively improve terminal work efficiency.
Description
Technical Field
The application relates to the field of mobile terminal application, in particular to a temperature control method, a temperature control device, a storage medium and a terminal.
Background
With the rapid development of network technology and the popularization of intelligent terminals, the daily life of people is more and more unable to leave the intelligent terminals.
On one hand, in order to ensure that the intelligent terminal can work normally, related easily-heating components such as a radio frequency power amplification circuit, an audio power amplification circuit and a processor of the intelligent terminal need to be subjected to heat dissipation treatment.
On the other hand, when the ambient temperature is too low, the standby time of the smart terminal is shortened. When the temperature is reduced again, some functions of the intelligent terminal, such as functions of making a call, taking a picture and the like, cannot be normally used, and even the intelligent terminal is automatically turned off.
In the current solution, the heat dissipation component of the intelligent terminal is only responsible for heat dissipation. When the periphery is in a low-temperature environment, the heat-insulating sleeve needs to be additionally arranged, so that the volume is increased, the carrying is inconvenient, and the operation is inconvenient.
Disclosure of Invention
The embodiment of the application provides a temperature control method, a temperature control device, a storage medium and a terminal, and can effectively improve the working efficiency of the terminal.
The embodiment of the application provides a temperature control method, which comprises the following steps:
acquiring a first temperature value of the shell at present;
comparing the first temperature value with a preset first temperature value;
if the first temperature value is smaller than a preset first temperature value, judging whether the heat transfer layer works or not;
if not, the heat transfer layer is driven to start working, and the heat generated by the heat dissipation layer is transferred to the heating layer to control the temperature of the shell to rise.
Correspondingly, the embodiment of the present application further provides a temperature control device, including:
the first acquisition unit is used for acquiring a first temperature value of the shell at present;
the first comparison unit is used for comparing the first temperature value with a preset first temperature value;
the first judging unit is used for judging whether the heat transfer layer is in a working state or not if the first temperature value is smaller than a preset first temperature value;
and the first driving unit is used for driving the heat transfer layer to start working if the temperature of the shell is not increased, and transferring the heat generated by the heat dissipation layer to the heating layer so as to control the temperature of the shell to be increased.
Accordingly, the present application further provides a storage medium, where the storage medium stores a plurality of instructions, and the instructions are suitable for being loaded by a processor to perform the steps in the temperature control method.
Correspondingly, the embodiment of the application also provides a terminal, which comprises a heat dissipation layer, a heat transfer layer, a heating layer, a shell, a processor and a memory, wherein the memory stores a plurality of instructions, and the processor loads the instructions to execute the steps in the temperature control method.
This application embodiment transmits the heat that the inside device that generates heat in terminal produced to the inboard zone of heating of shell through the heat dissipation layer, does simultaneously zone of heating ohmic heating, the temperature of quick adjustment shell can effectively improve terminal work efficiency.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic flow chart of a first temperature control method according to an embodiment of the present disclosure.
Fig. 2 is a schematic cross-sectional diagram of a hardware structure according to an embodiment of the present disclosure.
Fig. 3 is a schematic flowchart of a second temperature control method according to an embodiment of the present disclosure.
Fig. 4 is a block diagram of a temperature control device according to an embodiment of the present disclosure.
Fig. 5 is a schematic structural diagram of a terminal according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Based on the above problems, embodiments of the present application provide a first temperature control method, an apparatus, a storage medium, and a terminal, which can effectively improve the working efficiency of the terminal. The following are detailed below. It should be noted that the following description of the embodiments is not intended to limit the preferred order of the embodiments.
Referring to fig. 1, fig. 1 is a schematic flow chart of a first temperature control method according to an embodiment of the present disclosure. The temperature control method may be applied to mobile terminals such as mobile phones, tablet computers, notebook computers, palmtop computers, Portable Media Players (PMPs), and the like, and fixed terminals such as desktop computers, and the like.
Specifically, the terminal may include a heat dissipation layer, a heat transfer layer, a heating layer, and a housing. Referring to fig. 2, fig. 2 is a schematic cross-sectional view of a hardware structure according to an embodiment of the present disclosure, where the hardware structure may be used to process heat inside a terminal, and as shown in fig. 2, the hardware structure is sequentially arranged according to a heat generating device, a heat dissipation layer, a heat transfer layer, a heat generating layer, and a housing.
Wherein, the heating device can be a processor, a battery, a display screen and the like; the heat dissipation layer can be a heat dissipation device, such as a heat sink; the heat transfer layer can be composed of heat-conducting media and can transfer heat generated by the radiating fins to the heating layer; the heating layer can be composed of an energizable heating material, and the heating material can be pasted on the inner side of the shell so that the shell can quickly adjust the temperature; the shell is a rear shell of the terminal and is connected with the terminal display screen to form a closed space. The user can avoid damage to the housing by fitting a protective sleeve to the housing.
Specifically, the specific flow of the temperature control method may be as follows:
101. and acquiring a first temperature value of the current shell.
Specifically, when the user is using the terminal, the temperature of the terminal housing may be acquired at preset time intervals. The temperature of the terminal housing can be obtained by reading a temperature value detected by a temperature sensor arranged on the housing.
For example, the current temperature detected by the temperature sensor may be 25 degrees celsius, which indicates that the current first temperature value of the housing is 25 degrees celsius.
102. The first temperature value is compared with a preset first temperature value.
Specifically, after the first temperature value of the housing is obtained, the first temperature value may be compared with a preset first temperature value. The preset first temperature value may be represented as a lower limit of an optimum shell temperature range when the user uses the shell, for example, the optimum shell temperature felt by the user may be 25 to 30 degrees celsius, and the 25 degrees celsius may be the preset first temperature value. By comparing the current first temperature of the case with the preset first temperature value, an operation may be performed according to the comparison result.
103. And if the first temperature value is smaller than the preset first temperature value, judging whether the heat transfer layer works.
Specifically, when the first temperature is lower than the preset first temperature, it may be determined that the current casing temperature is lower than the suitable temperature for the user, and the casing temperature needs to be increased to the suitable temperature for the user.
Wherein raising the temperature of the housing may be achieved by the heat transfer layer, first determining whether the heat transfer layer is in operation.
In some embodiments, the step of "determining whether the heat transfer layer is in operation" may include the following process:
acquiring the state of a control switch of the heat transfer layer;
and judging whether the heat transfer layer works according to the state of the control switch.
Specifically, the state of a control switch of the heat transfer layer is obtained, the control switch is used for controlling the heat transfer layer to start/stop working, and the control switch can be enabled to control on/off through a General-purpose input/output (GPIO) of a Central Processing Unit (CPU).
The state of the control switch of the heat transfer layer may be obtained by obtaining a value in a register of the GPIO corresponding to the control switch, for example, if the control switch is on or off, a value 0 may represent a tube, and a value 1 represents off.
After the state of the control switch is acquired, whether the heat transfer layer is in operation can be judged according to the state of the control switch.
In some embodiments, the step of determining whether the heat transfer layer is in operation according to the state of the control switch may include the following steps:
if the control switch is in a connection state, the heat transfer layer is judged to be in work;
and if the control switch is in an off state, judging that the heat transfer layer does not work.
Specifically, the states of the control switch may include an off state and a connected state, where the off state may indicate that the control switch is off and the heat transfer layer is not operating; the connected state may indicate that the control switch is on and the heat transfer layer is in operation.
For example, if the value read into the register is 0, it may indicate that the control switch is off, that is, the heat transfer layer is working, and step 104 may be executed; if the value read into the register is 1, it may indicate that the control switch is on, that is, the heat transfer layer is in operation, and step 105 may be executed.
104. The heat transfer layer is driven to start working, and the heat generated by the heat dissipation layer is transferred to the heating layer to control the temperature rise of the shell.
Specifically, when it is detected that the heat transfer layer is not operating, the heat transfer layer may be driven to start operating. When the heat transfer layer starts to operate, i.e., indicates that the heat dissipation layer and the heating layer are connected by a material that is easily heat-transferred, the heat of the heat dissipation layer can be transferred to the heating layer, so that the temperature of the housing starts to rise.
In some embodiments, the step of "driving the heat transfer layer to operate" may include the following steps:
and switching the control switch from the disconnection state to the connection state, and driving the heat transfer layer to start working.
Specifically, driving the heat transfer layer to operate may switch the control switch of the heat transfer layer from the off state to the on state.
For example, if the value read into the register of the GPIO corresponding to the control switch is 0, which indicates that the control switch is in the off state, the value 0 may be updated to the value 1, and the value 1 is written into the register, the control switch may be switched to the on state, so as to drive the heat transfer layer to start operating.
In some embodiments, after the step of "driving the heat transfer layer to operate", the following steps may be further included:
acquiring a second temperature value of the shell;
comparing the second temperature value with a preset second temperature value;
and if the second temperature value is greater than the preset second temperature value, stopping the heat transfer layer from working.
Specifically, after the driving heat transfer layer starts to work, a second temperature value of the housing after a preset time interval is obtained, and the second temperature value may be a temperature value of the housing after the driving heat transfer layer heats the housing for the preset time interval.
After the second temperature value is obtained, the second temperature value is compared with a preset second temperature value, where the preset second temperature value may be an upper limit of an optimum shell temperature range when the user uses the shell, for example, the optimum shell temperature felt by the user may be 25 to 30 degrees celsius, and then 30 degrees celsius may be the preset second temperature value.
When the second temperature value of the shell is greater than the preset second temperature value, the heat transfer layer can be stopped from working, namely, the shell is stopped from being heated, so that the temperature of the shell can be kept at the proper temperature for a user to use.
For example, the detected second temperature value may be 32 degrees celsius, the preset second temperature value may be 30 degrees celsius, and the second temperature value is compared with the preset second temperature value, so that it can be known that the second temperature value is greater than the preset second temperature value, that is, the temperature of the housing exceeds the suitable temperature range for the user, and the heating of the housing is stopped.
In some embodiments, before the step of "comparing the second temperature value with a preset second temperature value", the following steps may be further included:
if the second temperature value is smaller than the preset second temperature value, acquiring an electrifying switch state of the heating layer, wherein the electrifying switch state comprises a first state and a second state, the first state represents that the electrifying switch is turned on, the heating layer is electrified to start working, the second state represents that the electrifying switch is turned off, and the heating layer is not electrified to work;
and if the state of the power-on switch is the second state, switching the power-on switch from the second state to the first state, and driving the heating layer to start working.
Specifically, if the second temperature value is smaller than the preset second temperature value, it may indicate that the temperature of the housing has not been increased to the appropriate temperature. In order to rapidly raise the temperature of the shell to the proper temperature, the power-on switch state of the heating layer can be acquired, so that whether the heating layer is in operation or not can be judged.
The state of the power-on switch can comprise a first state and a second state, wherein the first state can indicate that the power-on switch is turned on, and the heating layer starts to work after being powered on; the second state may indicate that the power switch is off and the heating layer is not powered.
Specifically, if the second state of the power switch is detected, it may be determined that the heating layer is not in operation, and at this time, the second state of the power switch may be switched to the first state, that is, the power switch is turned on to drive the heating layer to start power heating. In the step, the heating layer starts to work while the heat transfer layer can work through the electrifying heating of the heating layer, so that the temperature of the shell can be quickly increased, the temperature rise time is shortened, and the shell temperature adjusting efficiency is improved.
In some embodiments, the temperature control method may further include the steps of:
when the execution of the starting operation is detected, acquiring the temperature of the shell;
judging whether the temperature of the shell is less than a preset starting temperature or not;
if yes, executing the step to drive the heat transfer layer to start working;
if not, the starting operation is continuously completed.
Specifically, when it is detected that the power-on operation is executed, the detection of the power-on operation may be performed by detecting an operation in which a user triggers a physical key. And if the fact that the physical key detection operation triggered by the user accords with the starting operation is detected, acquiring the shell temperature.
In order to ensure that the terminal can normally execute the booting operation, the shell temperature may be compared with a preset booting temperature to determine whether the shell temperature is less than the preset temperature.
For example, the acquired shell temperature may be 15 degrees celsius, the preset boot temperature may be 20 degrees celsius, and the comparison shows that the shell temperature is lower than the preset boot temperature, the step "driving the heat transfer layer to start working" may be executed, and after the shell temperature is increased to the preset boot temperature, the boot operation is completed, so that the terminal may be protected.
For another example, the acquired shell temperature may be 25 degrees celsius, the preset boot temperature may be 20 degrees celsius, and the comparison shows that the shell temperature is greater than the preset boot temperature, so that the boot operation may be continuously completed.
105. And finishing the operation.
Specifically, when the first temperature value is smaller than the preset first temperature value and the heat transfer layer is working, the working state of the heat transfer layer can be continuously maintained, and other operations are finished.
The embodiment of the application discloses a temperature control method, which comprises the following steps: acquiring a first temperature value of the shell at present; comparing the first temperature value with a preset first temperature value; if the first temperature value is smaller than a preset first temperature value, judging whether the heat transfer layer works or not; if not, the heat transfer layer is driven to start working, and the heat generated by the heat dissipation layer is transferred to the heating layer to control the temperature of the shell to rise. This application embodiment transmits the heat that the inside device that generates heat in terminal produced to the inboard zone of heating of shell through the heat dissipation layer, simultaneously for zone of heating ohmic heating, quick and adjust the temperature of shell, can effectively improve terminal work efficiency.
Referring to fig. 3, fig. 3 is a schematic flow chart of a second temperature control method according to an embodiment of the present disclosure. The specific scene application of the temperature control method can be as follows:
201. and in the terminal operation process, the terminal acquires the current temperature of the shell.
Specifically, in the terminal operation process, the terminal operation may start the terminal for the user to execute the corresponding operation. The terminal may obtain a current temperature of the housing, and specifically, the terminal may obtain the current temperature of the housing through a temperature sensor disposed on the housing.
For example, the temperature that the terminal reads through the temperature sensor to the current housing may be 30 degrees celsius.
202. And the terminal compares the temperature with a preset standard temperature and judges whether the temperature of the shell is less than the preset standard temperature.
Specifically, after acquiring the temperature of the housing, the terminal may compare the temperature of the housing with a preset standard temperature. The preset standard temperature can be set by a user, for example, the user can start temperature setting and input a temperature value, and the terminal shell can adjust the temperature to the temperature input by the user until the user adjusts the temperature to a comfortable use temperature. Through setting up preset standard temperature, the user can adjust best shell service temperature according to external environment to bring good experience for the user.
Specifically, the shell temperature is compared with a preset standard temperature, and whether the shell temperature is smaller than the preset standard temperature is judged.
For example, if the case temperature may be 30 degrees celsius and the preset standard temperature may be 35 degrees celsius, it may be determined that the case temperature is less than the preset standard temperature, and step 203 may be executed; for another example, if the case temperature may be 30 degrees celsius and the preset standard temperature may be 25 degrees celsius, it may be determined that the case temperature is greater than the preset standard temperature, and step 206 may be performed.
203. And the terminal judges whether the heat dissipation isolating switch is in an off state.
Specifically, when the temperature of the housing is lower than the preset standard temperature, the terminal can judge whether the heat dissipation isolating switch is in an off state. The heat dissipation isolating switch can be arranged on the heat dissipation sheet inside the terminal, and the heat dissipation isolating switch can control heat of the heat dissipation sheet to be transferred to the shell.
The radiating isolating switch can be in multiple states, such as an off state and a connection state, and when the radiating isolating switch is in the off state, the radiating isolating switch can be turned off, that is, the heat of the radiating fin is transferred to the outside of the terminal; when the radiating isolating switch is in a connected state, the radiating isolating switch can be turned on, namely, the heat of the radiating fins is transferred to the terminal shell at the moment, so that the temperature of the shell is increased.
Specifically, the terminal may perform a corresponding operation by determining a state of the thermal isolation switch, for example, when the terminal detects that the thermal isolation switch may be in an off state, step 204 may be performed; for another example, the terminal detects that the thermal isolator can be in a connected state, and then step 205 can be executed.
204. The terminal switches the radiating isolating switch into a connection state.
Specifically, when the temperature of the terminal shell is smaller than the preset standard temperature and the state of the heat dissipation isolating switch is the disconnection state, the terminal can be switched to the connection state from the disconnection state through the heat dissipation isolating switch, the heat of the radiating fins is transmitted to the shell, the temperature of the shell begins to rise, the preset standard temperature is reached, the normal operation of the terminal is guaranteed, and the user experiences the appropriate shell temperature.
For example, the case temperature may be 25 degrees celsius, the preset standard temperature may be 30 degrees celsius, and the heat dissipation isolation switch may be turned on to adjust the case temperature to 30 degrees celsius.
205. The terminal starts to start the shell to be heated by electrifying.
Specifically, when the temperature of the terminal shell is lower than the preset standard temperature and the state of the heat dissipation isolating switch is a connection state, the terminal can start the shell to be electrified and heated. Wherein the housing may include a charging heating module that may enable an energized heating function.
The terminal is through opening the heat dissipation switch to and open the ohmic heating function, for the shell intensification simultaneously, the terminal shell that can reach fast and predetermine standard temperature.
206. The terminal judges whether the shell is started to be electrified and heated.
Specifically, when the temperature of the shell is higher than the preset standard temperature, the terminal can detect whether to start the shell power-on heating function. For example, if the terminal detects that the housing is started to be heated, step 207 may be executed; for another example, if the terminal detects that the power-on heating of the housing is not activated, step 208 may be performed.
207. The terminal stops starting the shell to be electrified and heated.
Specifically, when the temperature of the shell is higher than the preset standard temperature and the terminal detects that the shell is in the power-on heating state, the terminal can stop the power-on heating of the shell, so that the power consumption of the terminal can be reduced.
208. And the terminal judges whether the heat dissipation isolating switch is in a connection state.
Specifically, when the temperature of the shell is higher than the preset standard temperature and the terminal detects that the shell is not in the power-on heating state, the terminal can detect the state of the heat dissipation isolating switch and execute corresponding operation according to the state of the heat dissipation isolating switch.
For example, when the terminal detects that the heat dissipation isolation switch is in the connected state, step 209 may be executed; step 210 may be performed when it is detected that the thermal isolation switch is in an open state.
209. The terminal switches the radiating isolating switch to an off state.
Specifically, when the temperature of the shell is greater than the preset standard temperature and the terminal detects that the heat dissipation isolating switch is in the connection state, the terminal can switch the state of the heat dissipation isolating switch into the disconnection state, the heating of the shell is stopped, and the overhigh temperature of the shell can be avoided, so that the use of a user is influenced.
210. And the terminal finishes the operation.
Specifically, when the temperature of the shell is higher than the preset standard temperature, the shell is detected not to be in the power-on heating state, and when the heat dissipation isolating switch is in the off state, the terminal can stop corresponding temperature adjusting operation, so that the power consumption of the terminal can be saved, and the running speed is improved.
The embodiment of the application discloses a temperature control method, which comprises the following steps: acquiring a first temperature value of the shell at present; comparing the first temperature value with a preset first temperature value; if the first temperature value is smaller than a preset first temperature value, judging whether the heat transfer layer works or not; if not, the heat transfer layer is driven to start working, and the heat generated by the heat dissipation layer is transferred to the heating layer to control the temperature of the shell to rise. This application embodiment transmits the heat that the inside device that generates heat in terminal produced to the inboard zone of heating of shell through the heat dissipation layer, simultaneously for zone of heating ohmic heating, the temperature of quick adjustment shell can effectively improve terminal work efficiency.
In order to better implement the temperature control method provided by the embodiments of the present application, the embodiments of the present application further provide a device based on the temperature control method. Wherein the terms are the same as in the above-mentioned temperature control method, and the details of the implementation can be referred to the description in the method embodiment.
Referring to fig. 4, fig. 4 is a block diagram of a temperature control device according to an embodiment of the present disclosure, where the temperature control device can be applied to a mobile terminal such as a mobile phone, a tablet computer, a notebook computer, a palm computer, a Portable Media Player (PMP), and a fixed terminal such as a desktop computer, and the temperature control device includes:
a first obtaining unit 301, configured to obtain a first temperature value of the current enclosure;
a first comparing unit 302, configured to compare the first temperature value with a preset first temperature value;
a first determining unit 303, configured to determine whether the heat transfer layer is in a working state if the first temperature value is smaller than a preset first temperature value;
and the first driving unit 304 is used for driving the heat transfer layer to start working if the temperature of the shell is not increased, and transferring the heat generated by the heat dissipation layer to the heating layer to control the temperature of the shell to be increased.
In some embodiments, the determining unit 303 may include:
the acquisition subunit is used for acquiring the state of a control switch of the heat transfer layer;
and the judging subunit is used for judging whether the heat transfer layer works according to the state of the control switch.
In some embodiments, the determining subunit is specifically configured to: if the control switch is in a connection state, the heat transfer layer is judged to be in work; and if the control switch is in an off state, judging that the heat transfer layer does not work.
In some embodiments, the driving unit 304 may include:
and the driving subunit is used for switching the control switch from the disconnection state to the connection state and driving the heat transfer layer to start working.
In some embodiments, the temperature control device may further include:
the second acquisition unit is used for acquiring a second temperature value of the shell;
the second comparison unit is used for comparing the second temperature value with a preset second temperature value;
and the stopping unit is used for stopping the heat transfer layer from working if the second temperature value is greater than the preset second temperature value.
In some embodiments, the temperature control device may further include:
the second judgment unit is used for judging whether the heating layer is in work or not;
and the second driving unit is used for driving the heating layer to start working if the heating layer does not work.
In some embodiments, the temperature control device may further include:
the third acquisition unit is used for acquiring the temperature of the shell when the execution of the starting operation is detected;
the third judging unit judges whether the temperature of the shell is less than the preset starting temperature or not;
the first execution unit is used for executing the step to drive the heat transfer layer to start working if the first execution unit is in the positive state;
and the second execution unit is used for continuing to finish the starting operation if the second execution unit does not finish the starting operation.
The embodiment of the application discloses temperature control device, this temperature control device includes: acquiring a first temperature value of the shell at present; comparing the first temperature value with a preset first temperature value; if the first temperature value is smaller than a preset first temperature value, judging whether the heat transfer layer works or not; if not, the heat transfer layer is driven to start working, and the heat generated by the heat dissipation layer is transferred to the heating layer to control the temperature of the shell to rise. This application embodiment transmits the heat that the inside device that generates heat in terminal produced to the inboard zone of heating of shell through the heat dissipation layer, simultaneously for zone of heating ohmic heating, the temperature of quick adjustment shell can effectively improve terminal work efficiency.
The embodiment of the application also provides a terminal. As shown in fig. 5, the terminal may include a Radio Frequency (RF) circuit 601, a memory 602 including one or more storage media, an input unit 603, a display unit 604, a sensor 605, an audio circuit 606, a Wireless Fidelity (WiFi) module 607, a processor 608 including one or more processing cores, and a power supply 609. Those skilled in the art will appreciate that the terminal structure shown in fig. 5 is not intended to be limiting and may include more or fewer components than those shown, or some components may be combined, or a different arrangement of components. Wherein:
the RF circuit 601 may be used for receiving and transmitting signals during the process of transmitting and receiving information, and in particular, for processing the received downlink information of the base station by one or more processors 608; in addition, data relating to uplink is transmitted to the base station. In general, the RF circuit 601 includes, but is not limited to, an antenna, at least one Amplifier, a tuner, one or more oscillators, a Subscriber Identity Module (SIM) card, a transceiver, a coupler, a Low Noise Amplifier (LNA), a duplexer, and the like. In addition, the RF circuit 601 may also communicate with networks and other devices via wireless communications.
The memory 602 may be used to store software programs and modules, and the processor 608 executes various functional applications and data processing by operating the software programs and modules stored in the memory 602. The memory 602 may mainly include a storage program area and a storage data area, wherein the storage program area may store an operating system, an application program required for at least one function (such as a sound playing function, an image playing function, etc.), and the like. Further, the memory 602 may include high speed random access memory, and may also include non-volatile memory, such as at least one magnetic disk storage device, flash memory device, or other volatile solid state storage device. Accordingly, the memory 602 may also include a memory controller to provide the processor 608 and the input unit 603 access to the memory 602.
The input unit 603 may be used to receive input numeric or character information and generate keyboard, mouse, joystick, optical or trackball signal inputs related to user settings and function control. In particular, in one particular embodiment, input unit 603 may include a touch-sensitive surface as well as other input devices. The touch-sensitive surface, also referred to as a touch display screen or a touch pad, may collect touch operations by a user (e.g., operations by a user on or near the touch-sensitive surface using a finger, a stylus, or any other suitable object or attachment) thereon or nearby, and drive the corresponding connection device according to a predetermined program. The input unit 603 may include other input devices in addition to the touch-sensitive surface. In particular, other input devices may include, but are not limited to, one or more of a physical keyboard, function keys (such as volume control keys, switch keys, etc.), a trackball, a mouse, a joystick, and the like.
The display unit 604 may be used to display information input by or provided to the user and various graphical user interfaces of the server, which may be made up of graphics, text, icons, video, and any combination thereof. The display unit 604 may include a display panel, and optionally, the display panel may be configured in the form of a Liquid Crystal Display (LCD), an Organic Light-Emitting Diode (OLED), or the like. Further, the touch-sensitive surface may overlay the display panel, and when a touch operation is detected on or near the touch-sensitive surface, the touch operation is transmitted to the processor 608 to determine the type of touch event, and the processor 608 then provides a corresponding visual output on the display panel according to the type of touch event. Although in FIG. 5 the touch-sensitive surface and the display panel are two separate components to implement input and output functions, in some embodiments the touch-sensitive surface may be integrated with the display panel to implement input and output functions.
The terminal may also include at least one sensor 605, such as a light sensor, motion sensor, and other sensors. Specifically, the light sensor may include an ambient light sensor that adjusts the brightness of the display panel according to the brightness of ambient light, and a proximity sensor that turns off the display panel and the backlight when the server moves to the ear.
WiFi belongs to short-distance wireless transmission technology, and the terminal can help a user to receive and send e-mails, browse webpages, access streaming media and the like through the WiFi module 607, and provides wireless broadband internet access for the user. Although fig. 5 shows the WiFi module 607, it is understood that it does not belong to the essential constitution of the terminal, and may be omitted entirely as needed within the scope of not changing the essence of the application.
The processor 608 is a control center of the terminal, connects various parts of the entire handset using various interfaces and lines, and performs various functions of the server and processes data by operating or executing software programs and modules stored in the memory 602 and calling data stored in the memory 602, thereby performing overall monitoring of the handset. Optionally, processor 608 may include one or more processing cores; preferably, the processor 608 may integrate an application processor, which primarily handles operating systems, user interfaces, applications, etc., and a modem processor, which primarily handles wireless communications. It will be appreciated that the modem processor described above may not be integrated into the processor 608.
The terminal also includes a power supply 609 (e.g., a battery) for powering the various components, which may preferably be logically connected to the processor 608 via a power management system that may be used to manage charging, discharging, and power consumption. The power supply 609 may also include any component of one or more dc or ac power sources, recharging systems, power failure detection circuitry, power converters or inverters, power status indicators, and the like.
Specifically, in this embodiment, the processor 608 in the terminal loads the executable file corresponding to the process of one or more application programs into the memory 602 according to the following instructions, and the processor 608 runs the application programs stored in the memory 602, thereby implementing various functions:
acquiring a first temperature value of the shell at present;
comparing the first temperature value with a preset first temperature value;
if the first temperature value is smaller than the preset first temperature value, judging whether the heat transfer layer works or not;
if not, the heat transfer layer is driven to start working, and the heat generated by the heat dissipation layer is transferred to the heating layer to control the temperature of the shell to rise.
The embodiment of the application discloses a temperature control method, a temperature control device, a storage medium and a terminal. The temperature control method comprises the following steps: acquiring a first temperature value of the shell at present; comparing the first temperature value with a preset first temperature value; if the first temperature value is smaller than a preset first temperature value, judging whether the heat transfer layer works or not; if not, the heat transfer layer is driven to start working, and the heat generated by the heat dissipation layer is transferred to the heating layer to control the temperature of the shell to rise. This application embodiment transmits the heat that the inside device that generates heat in terminal produced to the inboard zone of heating of shell through the heat dissipation layer, simultaneously for zone of heating ohmic heating, the temperature of quick adjustment shell can effectively improve terminal work efficiency.
It will be understood by those skilled in the art that all or part of the steps in the methods of the above embodiments may be performed by instructions or by instructions controlling associated hardware, which may be stored in a storage medium and loaded and executed by a processor.
To this end, embodiments of the present application provide a storage medium, in which a plurality of instructions are stored, and the instructions can be loaded by a processor to execute the steps in any one of the temperature control methods provided in the embodiments of the present application. For example, the instructions may perform the steps of:
acquiring a first temperature value of the shell at present; comparing the first temperature value with a preset first temperature value; if the first temperature value is smaller than a preset first temperature value, judging whether the heat transfer layer works or not; if not, the heat transfer layer is driven to start working, and the heat generated by the heat dissipation layer is transferred to the heating layer to control the temperature of the shell to rise.
The above operations can be implemented in the foregoing embodiments, and are not described in detail herein.
Wherein the storage medium may include: read Only Memory (ROM), Random Access Memory (RAM), magnetic or optical disks, and the like.
Since the instructions stored in the storage medium can execute the steps in any temperature control method provided in the embodiments of the present application, the beneficial effects that can be achieved by any temperature control method provided in the embodiments of the present application can be achieved, which are detailed in the foregoing embodiments and will not be described herein again.
The temperature control method, the temperature control device, the storage medium and the terminal provided by the embodiments of the present application are described in detail above, and a specific example is applied in the description to explain the principle and the implementation of the present application, and the description of the embodiments above is only used to help understanding the method and the core idea of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (10)
1. The utility model provides a temperature control method, its characterized in that is applied to the terminal, the terminal includes heat dissipation layer, heat transfer layer, zone of heating and shell, wherein, the heat dissipation layer sets up in the device outside that generates heat, the heat transfer layer sets up between heat dissipation layer and the zone of heating, the zone of heating sets up the shell is inboard, includes:
acquiring a first temperature value of the shell at present;
comparing the first temperature value with a preset first temperature value;
if the first temperature value is smaller than the preset first temperature value, judging whether the heat transfer layer works or not;
if not, the heat transfer layer is driven to start working, and the heat generated by the heat dissipation layer is transferred to the heating layer to control the temperature of the shell to rise.
2. The method of claim 1, wherein said determining whether said heat transfer layer is in operation comprises:
acquiring the state of a control switch of the heat transfer layer;
and judging whether the heat transfer layer works according to the state of the control switch.
3. The method of claim 2, wherein the states of the control switch comprise an open state and a connected state;
the judging whether the heat transfer layer works according to the state of the control switch comprises the following steps:
if the control switch is in a connection state, the heat transfer layer is judged to be in work;
and if the control switch is in an off state, judging that the heat transfer layer does not work.
4. The method of claim 1, wherein said actuating said heat transfer layer to operate comprises:
and switching the control switch from the disconnection state to the connection state, and driving the heat transfer layer to start working.
5. The method of claim 1, further comprising, after driving the heat transfer layer into operation:
acquiring a second temperature value of the shell;
comparing the second temperature value with a preset second temperature value;
and if the second temperature value is greater than the preset second temperature value, stopping the heat transfer layer from working.
6. The method of claim 5, further comprising:
if the second temperature value is smaller than the preset second temperature value, acquiring an electrifying switch state of the heating layer, wherein the electrifying switch state comprises a first state and a second state, the first state represents that the electrifying switch is turned on, the heating layer is electrified to start working, the second state represents that the electrifying switch is turned off, and the heating layer is not electrified to work;
and if the state of the power-on switch is the second state, switching the power-on switch from the second state to the first state, and driving the heating layer to start working.
7. The method of claim 1, further comprising:
when the execution of the starting operation is detected, acquiring the temperature of the shell;
judging whether the temperature of the shell is less than a preset starting temperature or not;
if yes, executing the step to drive the heat transfer layer to start working;
if not, the starting operation is continuously completed.
8. A temperature control apparatus, comprising:
the first acquisition unit is used for acquiring a first temperature value of the shell at present;
the first comparison unit is used for comparing the first temperature value with a preset first temperature value;
the first judging unit is used for judging whether the heat transfer layer is in a working state or not if the first temperature value is smaller than a preset first temperature value;
and the first driving unit is used for driving the heat transfer layer to start working if the temperature of the shell is not increased, and transferring the heat generated by the heat dissipation layer to the heating layer so as to control the temperature of the shell to be increased.
9. A storage medium storing a plurality of instructions adapted to be loaded by a processor to perform the steps of the temperature control method according to any one of claims 1 to 7.
10. A terminal comprising a heat dissipation layer, a heat transfer layer, a heating layer, and a housing, a processor, and a memory, the memory storing a plurality of instructions, the processor loading the instructions to perform the steps in the temperature control method of any of claims 1 to 7.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010330158.0A CN111538391A (en) | 2020-04-24 | 2020-04-24 | Temperature control method and device, storage medium and terminal |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010330158.0A CN111538391A (en) | 2020-04-24 | 2020-04-24 | Temperature control method and device, storage medium and terminal |
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| CN111538391A true CN111538391A (en) | 2020-08-14 |
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| CN202010330158.0A Pending CN111538391A (en) | 2020-04-24 | 2020-04-24 | Temperature control method and device, storage medium and terminal |
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| CN114816005A (en) * | 2021-01-19 | 2022-07-29 | 深圳市万普拉斯科技有限公司 | Terminal control method and device, computer equipment and storage medium |
| CN115996262A (en) * | 2021-10-18 | 2023-04-21 | 北京小米移动软件有限公司 | Terminal, temperature adjustment method, temperature adjustment device and storage medium |
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Application publication date: 20200814 |