CN111530698B - Automatic quantitative dispensing device for fast clamping computer motherboard - Google Patents

Automatic quantitative dispensing device for fast clamping computer motherboard Download PDF

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Publication number
CN111530698B
CN111530698B CN202010378632.7A CN202010378632A CN111530698B CN 111530698 B CN111530698 B CN 111530698B CN 202010378632 A CN202010378632 A CN 202010378632A CN 111530698 B CN111530698 B CN 111530698B
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CN
China
Prior art keywords
track
movably connected
clamping
computer motherboard
feeding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN202010378632.7A
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Chinese (zh)
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CN111530698A (en
Inventor
姜晓刚
郭瑗
李艳霞
茹宇龙
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Binzhou Polytechnic
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Binzhou Polytechnic
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Application filed by Binzhou Polytechnic filed Critical Binzhou Polytechnic
Priority to CN202010378632.7A priority Critical patent/CN111530698B/en
Publication of CN111530698A publication Critical patent/CN111530698A/en
Application granted granted Critical
Publication of CN111530698B publication Critical patent/CN111530698B/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0208Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00Means for manipulating or holding work, e.g. for separate articles
    • B05C13/02Means for manipulating or holding work, e.g. for separate articles for particular articles

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  • Coating Apparatus (AREA)

Abstract

The invention relates to the technical field of computer mainboard processing, and discloses an automatic quantitative dispensing device capable of rapidly clamping a computer mainboard. Swing joint has the slider that resets between pressure slider and the service track, compresses reset spring downwards simultaneously, utilizes the hot pressure to glue the inside gluey point of track to the computer motherboard of gluing to reach the effect of quick ration electricity glue, guaranteed the efficiency of processing, increased market competition.

Description

Automatic quantitative dispensing device for fast clamping computer motherboard
Technical Field
The invention relates to the technical field of computer mainboard processing, in particular to an automatic quantitative dispensing device capable of rapidly clamping a computer mainboard.
Background
The computer is commonly called as computer, is a modern electronic computing machine for high-speed computation, can perform numerical computation and logic computation, has a memory function, and is modern intelligent electronic equipment capable of automatically processing mass data at high speed according to program operation.
Computer motherboard usually need carry out some glue in processing, but the volume needs artificial control in some glue of current adhesive deposite device, and this has restricted the efficiency of processing to a certain extent, has increased the waste of resource simultaneously, to above-mentioned problem, so we provide a press from both sides tight computer motherboard automatic ration adhesive deposite device fast and solve above-mentioned problem.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides the automatic quantitative dispensing device capable of rapidly clamping the computer motherboard, which has the advantages of improving dispensing efficiency and the like, and solves the problem of low dispensing efficiency.
(II) technical scheme
In order to achieve the purposes of improving the dispensing efficiency and the like, the invention provides the following technical scheme: an automatic quantitative dispensing device for a fast clamping computer motherboard comprises a processing machine, wherein the bottom inside the processing machine is movably connected with a power wheel, the top inside the processing machine is movably connected with a fixed track, the outside of the fixed track is movably connected with a clamping track, a working plate is movably connected between the two fixed tracks, the left side of the working plate is movably connected with a material reducing plate, the upper part of the material reducing plate is movably connected with a feeding track, the upper part of the feeding track is movably connected with a power track, a feeding slide block is movably connected between the power track and the feeding track, the right side of the working plate is movably connected with a material discharging plate, the top inside the processing machine is movably connected with a dispensing track, the right side of the dispensing track is movably connected with a reset spring, the upper right side inside the processing machine is movably connected with a heating box, the lower part of the dispensing track is movably connected with a molding track, and the inner part of the clamping track is movably connected with a clamping spring.
Preferably, the center of rotation of the power wheel is above the center of mass, ensuring rotation.
Preferably, a fixed sliding block is movably connected between the fixed track and the working plate.
Preferably, the clamping slide block is movably connected inside the clamping track to ensure clamping.
Preferably, a vent pipe is movably connected between the fixed track and the power track.
Preferably, the power track is movably connected with a power spring inside.
Preferably, a heating pipe is movably connected between the dispensing track and the heating box, and a pressurizing slider is movably connected inside the dispensing track.
(III) advantageous effects
Compared with the prior art, the invention provides an automatic quantitative dispensing device for rapidly clamping a computer motherboard, which has the following beneficial effects:
1. this quick clamp is tight from moving quantitive adhesive deposite device of computer motherboard, swing joint has the heating pipe between track and the heating cabinet through gluing, utilize the heating effect of heating cabinet, the inside gas of heating pipe, further promote the inside pressure slider downstream of track is glued in the point, swing joint has the slider that resets between pressure slider and the service track, compress reset spring downwards simultaneously, utilize hot pressure to glue the inside gluey point of track to the computer motherboard of gluing, thereby the effect of quick ration electricity glue has been reached, the efficiency of processing has been guaranteed, market competition has been increased.
2. The automatic quantitative dispensing device for the fast clamping computer motherboard starts to rotate through the power wheel in the machine tool, the working plate is further pushed to move upwards along with the rotation of the power wheel, the fixed slide block is movably connected between the working plate and the fixed track, the fixed slide block is further driven to move upwards in the process of moving upwards by the working plate, the vent pipe is movably connected between the fixed track and the power track, the air pressure in the fixed track is extruded to enter the power track by the vent pipe, the feeding slide block is further pushed to move towards the left side and simultaneously compress the feeding spring, in the process that the working plate moves upwards, when the computer main board contacts the clamping slide block movably connected inside the clamping track, the working plate moves upwards to further clamp the computer main board, so that the effect of automatic clamping is achieved, and the dispensing effect is guaranteed.
3. This quick clamp is tight from moving ration adhesive deposite device of computer motherboard, through utilizing hot pressure to glue the inside glue point of track to the computer motherboard on, along with the rotation of power wheel, the inside mechanism of processing machine resets, and the computer motherboard on the material reducing plate is promoted to lead to the working plate by the feeding slider on, and the computer motherboard of accomplishing is glued to the point is promoted to the play flitch on to the effect of the automatic feed ejection of compact has been reached, has improved the efficiency of processing.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of an enlarged dispensing structure according to the present invention;
FIG. 3 is an enlarged schematic view of the feed material of the present invention;
fig. 4 is a schematic view of a partially enlarged dispensing structure according to the present invention.
In the figure: 1-processing machine, 2-power wheel, 3-fixed rail, 4-clamping rail, 5-working plate, 6-material reducing plate, 7-feeding rail, 8-power rail, 9-feeding slide block, 10-discharging plate, 11-dispensing rail, 12-service rail, 13-heating box, 14- '7' type rail and 15-clamping spring.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-4, an automatic quantitative dispensing device for a fast clamping computer motherboard comprises a processing machine 1, wherein a power wheel 2 is movably connected to the bottom inside the processing machine 1, the rotation center of the power wheel 2 is above the center of mass to ensure rotation, a fixed rail 3 is movably connected to the top inside the processing machine 1, a vent pipe is movably connected between the fixed rail 3 and a power rail 8, a fixed slider is movably connected between the fixed rail 3 and a working plate 5, and a clamping rail 4 is movably connected to the outside of the fixed rail 3.
A clamping slide block is movably connected inside the clamping track 4 to ensure clamping, a working plate 5 is movably connected between the two fixed tracks 3, a fixed slide block is movably connected between the working plate 5 and the fixed tracks 3, the fixed slide block is further driven to move upwards in the upward movement process of the working plate 5, a vent pipe is movably connected between the fixed tracks 3 and the power track 8, the air pressure inside the fixed tracks 3 is extruded and enters the inside of the power track 8 by the vent pipe to further push the feeding slide block 9 to move towards the left side and compress the feeding spring, when a computer mainboard contacts the clamping slide block movably connected inside the clamping track 4 in the upward movement process of the working plate 5, the working plate 5 is utilized to move upwards, a material reducing plate 6 is movably connected on the left side of the working plate 5, a feeding track 7 is movably connected above the material reducing plate 6, and a power track 8 is movably connected above the feeding track 7, the inside swing joint of power track 8 has power spring, swing joint has feeding slider 9 between power track 8 and the feeding track 7, the right side swing joint of working plate 5 has ejection of compact board 10, the inside top swing joint of processing machine 1 has a point track 11, swing joint has the heating pipe between point track 11 and the heating cabinet 13, the inside swing joint of point track 11 has the pressurization slider, the right side swing joint of point track 11 has reset spring, the inside upper right side swing joint of processing machine 1 has heating cabinet 13, the below swing joint of point track 11 has "7" type track 14, the inside swing joint of clamping track 4 has clamping spring 15.
The working principle is that a computer main board needing glue dispensing is placed above a material reducing plate 6, a processing machine 1 is started, a power wheel 2 in the processing machine 1 starts to rotate, the working board 5 is further pushed to move upwards along with the rotation of the power wheel 2, a fixed sliding block is movably connected between the working board 5 and a fixed rail 3, the fixed sliding block is further driven to move upwards in the upward movement process of the working board 5, an air pipe is movably connected between the fixed rail 3 and a power rail 8, air pressure in the fixed rail 3 is extruded into the power rail 8 by the air pipe, the feeding sliding block 9 is further pushed to move leftwards and compress a feeding spring, when the computer main board contacts a clamping sliding block movably connected in a clamping rail 4 in the upward movement process of the working board 5, the working board 5 moves upwards to further clamp the computer main board, meanwhile, the clamping slide block is used for moving upwards to compress the clamping spring 15, when the working plate 5 contacts with the pushing slide block movably connected inside the 7-shaped track 14, the pushing slide block is further pushed to move upwards, the dispensing slide block movably connected inside the 7-shaped track 17 is further pushed to move leftwards and simultaneously compress the dispensing spring, so that the position of a through hole of the dispensing slide block is coincided with the position of a pipe opening of the dispensing needle tube, meanwhile, a heating pipe is movably connected between the dispensing track 11 and the heating box 13, the gas inside the heating pipe is heated by the heating action of the heating box 13, the pressure slide block inside the dispensing track 11 is further pushed to move downwards, a reset slide block is movably connected between the pressure slide block and the service track 12, the reset spring is compressed downwards, the glue inside the dispensing track 11 is dispensed onto a computer mainboard by the thermal pressure, along with the rotation of the power wheel 2, the mechanism inside the processing machine 1 resets, the computer main board on the material reducing plate 6 is pushed to the working plate 5 by the feeding slide block 9, and the computer main board after glue dispensing is pushed to the material discharging plate 10 to complete processing.
To sum up, this quick clamp is tight from moving quantitatively adhesive deposite device of computer motherboard, swing joint has the heating pipe through gluing between track 11 and the heating cabinet 13, utilize the heating action of heating cabinet 13, the inside gas of heating pipe further promotes the inside pressure slider of gluing track 11 and moves down, swing joint has the slider that resets between pressure slider and the service track 12, compress reset spring downwards simultaneously, utilize hot pressure to glue the inside glue point of track 11 and to the computer motherboard, thereby the effect of quick ration electricity glue has been reached, the efficiency of processing has been guaranteed, market competition has been increased.
The automatic quantitative dispensing device for the fast clamping computer mainboard comprises a power wheel 2, a working plate 5, a fixed slide block, a vent pipe, a feeding slide block 9, a feeding spring, a clamping track 4, a clamping slide block, a feeding spring, a power wheel 2, a working plate 5, a vent pipe, a feeding spring, a power wheel 2, a working plate 5, a feeding spring, a clamping track 9, a feeding spring, a power rail 8, a power rail, a feeding spring, a clamping spring, a power wheel, a fixed slide block, a power rail, a feeding spring, a power wheel, a working plate, a feeding spring and a computer mainboard, wherein the power wheel 2, the power wheel, the working machine 1, the working plate, the feeding spring, the clamping track, the feeding spring, the feeding track, the feeding spring, the feeding track, the feeding spring, the feeding track and the feeding track, the feeding spring, the feeding track and the feeding track, the feeding track and the feeding track, the feeding spring, the feeding track and the feeding spring, the feeding track and the feeding track, the effect of some glue has been guaranteed.
This quick clamp is tight from moving ration adhesive deposite device of computer motherboard, through utilizing hot pressure to glue 11 inside glue points to the computer motherboard on, along with the rotation of power wheel 2, the inside mechanism of processing machine 1 resets, and the computer motherboard on the material reducing plate 6 is promoted to lead to on the working plate 5 by feeding slider 9, and the computer motherboard of accomplishing is glued to the point is promoted out flitch 10 on to the effect of the automatic feed ejection of compact has been reached, has improved the efficiency of processing.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (7)

1. The utility model provides an automatic quantitative adhesive deposite device of quick clamp computer motherboard, includes processing machine (1), its characterized in that: the bottom inside the processing machine (1) is movably connected with a power wheel (2), the top inside the processing machine (1) is movably connected with a fixed track (3), the outside of the fixed track (3) is movably connected with a clamping track (4), a working plate (5) is movably connected between the two fixed tracks (3), the left side of the working plate (5) is movably connected with a material reducing plate (6), the upper part of the material reducing plate (6) is movably connected with a feeding track (7), the upper part of the feeding track (7) is movably connected with a power track (8), a feeding sliding block (9) is movably connected between the power track (8) and the feeding track (7), the right side of the working plate (5) is movably connected with a material discharging plate (10), the top inside the processing machine (1) is movably connected with a glue dispensing track (11), and the right side of the glue dispensing track (11) is movably connected with a reset spring (12), the upper right side of the interior of the processing machine (1) is movably connected with a heating box (13), the lower side of the dispensing track (11) is movably connected with a 7-shaped track (14), and the interior of the clamping track (4) is movably connected with a clamping spring (15).
2. The automatic quantitative dispensing device for the fast clamping computer motherboard according to claim 1, characterized in that: the rotation center of the power wheel (2) is above the mass center.
3. The automatic quantitative dispensing device for the fast clamping computer motherboard according to claim 1, characterized in that: and a fixed sliding block is movably connected between the fixed track (3) and the working plate (5).
4. The automatic quantitative dispensing device for the fast clamping computer motherboard according to claim 1, characterized in that: the clamping slide block is movably connected inside the clamping track (4).
5. The automatic quantitative dispensing device for the fast clamping computer motherboard according to claim 1, characterized in that: an air pipe is movably connected between the fixed track (3) and the power track (8).
6. The automatic quantitative dispensing device for the fast clamping computer motherboard according to claim 1, characterized in that: the power track (8) is movably connected with a power spring inside.
7. The automatic quantitative dispensing device for the fast clamping computer motherboard according to claim 1, characterized in that: the heating pipe is movably connected between the dispensing track (11) and the heating box (13), and the pressurizing slide block is movably connected inside the dispensing track (11).
CN202010378632.7A 2020-05-07 2020-05-07 Automatic quantitative dispensing device for fast clamping computer motherboard Expired - Fee Related CN111530698B (en)

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Application Number Priority Date Filing Date Title
CN202010378632.7A CN111530698B (en) 2020-05-07 2020-05-07 Automatic quantitative dispensing device for fast clamping computer motherboard

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Application Number Priority Date Filing Date Title
CN202010378632.7A CN111530698B (en) 2020-05-07 2020-05-07 Automatic quantitative dispensing device for fast clamping computer motherboard

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CN111530698B true CN111530698B (en) 2021-08-20

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112007822A (en) * 2020-08-17 2020-12-01 海宁市天翼龙电器有限公司 LED lamp processingequipment of eccentric wheel control automatic positioning ration injecting glue
CN111941181B (en) * 2020-08-19 2021-11-30 盐城市盐富环保设备有限公司 Automatic press from both sides and remove dust grinding device according to temperature control of polishing
CN112934602A (en) * 2021-01-27 2021-06-11 肖曼来 Automatic carry out environment-friendly device that drips and glue processing to different model computer mainboards

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Publication number Priority date Publication date Assignee Title
US3902406A (en) * 1973-08-21 1975-09-02 Abc Packaging Machine Corp Method and apparatus for applying glue to cartons
JP4467946B2 (en) * 2003-10-30 2010-05-26 ヤヨイ化学工業株式会社 Wallpaper gluing machine
CN201940334U (en) * 2011-01-07 2011-08-24 深圳市顺尚自动化科技有限公司 Dispenser
CN106076738B (en) * 2016-08-06 2018-09-28 湖北匡通电子股份有限公司 A kind of LED light swing-arm type glue pouring machine
CN110064568B (en) * 2019-03-27 2020-03-27 诸暨市和冬水晶有限公司 Crystal glue dispensing device
CN210442016U (en) * 2019-09-20 2020-05-01 广东合科泰实业有限公司 Eutectic chip mounter thrust detects with having orbital automatic check platform of location
CN111002177B (en) * 2019-12-06 2021-07-09 朱香芽 Device for automatically controlling painting and quickly polishing by utilizing atmospheric pressure

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Inventor after: Jiang Xiaogang

Inventor after: Guo Huan

Inventor after: Li Yanxia

Inventor after: Ru Yulong

Inventor before: Ru Yulong

TA01 Transfer of patent application right
TA01 Transfer of patent application right

Effective date of registration: 20210729

Address after: No. 919, Huanghe 12th Road, Bincheng District, Binzhou City, Shandong Province

Applicant after: BINZHOU POLYTECHNIC

Address before: 311600 room 203-95, unit 1, building 2, 89-105 Zhijiang Road, xiaya Town, Jiande City, Hangzhou City, Zhejiang Province

Applicant before: Hangzhou Fuwa Technology Co.,Ltd.

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CF01 Termination of patent right due to non-payment of annual fee
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Granted publication date: 20210820