CN111526698A - Shell manufacturing method, shell and electronic equipment - Google Patents

Shell manufacturing method, shell and electronic equipment Download PDF

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Publication number
CN111526698A
CN111526698A CN202010331533.3A CN202010331533A CN111526698A CN 111526698 A CN111526698 A CN 111526698A CN 202010331533 A CN202010331533 A CN 202010331533A CN 111526698 A CN111526698 A CN 111526698A
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China
Prior art keywords
hole
die
conductive particles
housing
shell
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CN202010331533.3A
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Chinese (zh)
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CN111526698B (en
Inventor
周凯吉
何淑琴
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Shanghai Chuanggong Telecom Technology Co Ltd
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Shanghai Chuanggong Telecom Technology Co Ltd
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Priority to CN202010331533.3A priority Critical patent/CN111526698B/en
Publication of CN111526698A publication Critical patent/CN111526698A/en
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Publication of CN111526698B publication Critical patent/CN111526698B/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D17/00—Pressure die casting or injection die casting, i.e. casting in which the metal is forced into a mould under high pressure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure

Abstract

The embodiment of the invention relates to the field of shell manufacturing, and discloses a shell manufacturing method, a shell and electronic equipment. In the invention, before forming the conductive particle forming plate body, the linear conductor is placed among the conductive particles, and then the conductive particles are subjected to die-casting treatment; if the electric conductor is provided with a channel for communicating the first end with the second end, the channel directly forms a through hole of the plate body after die-casting treatment to obtain the plate body with the through hole, or the electric conductor is taken out after the die-casting treatment to form the plate body with the through hole no matter whether the electric conductor is provided with the channel for communicating the first end with the second end or not; and filling and sealing the channel to obtain the shell with good heat dissipation capacity. This application compares among the prior art through the three-dimensional casing that forms and have the cavity of printing, has improved the tolerance of casing, has improved anti ability of falling promptly, and production efficiency is higher, and the cost is lower.

Description

Shell manufacturing method, shell and electronic equipment
Technical Field
The embodiment of the invention relates to the field of shell manufacturing, in particular to a shell manufacturing method, a shell and electronic equipment.
Background
At present, as electronic devices are gradually popularized in life, heat dissipation capability of electronic devices is more and more concerned by consumers, and housings of electronic devices are required to have not only an effect of protecting internal electronic devices but also a good heat dissipation function, and therefore, manufacturing of housings having a good heat dissipation function has become a main direction of research. In the prior art, a shell structure with a relatively good heat dissipation function is characterized in that a plurality of cavities are formed inside a shell, liquid absorbing cores and liquid are placed in the cavities, the liquid flows in the cavities under the action of the liquid absorbing cores, and the liquid flows to help heat dissipation of heating devices in electronic equipment.
The inventor finds that at least the following problems exist in the prior art: the shell structure with a plurality of cavities in the prior art is manufactured in a three-dimensional printing mode, so that the shell is poor in tolerance and easy to damage; and the efficiency of producing the shell by the three-dimensional printing mode is lower, and the cost is higher.
Disclosure of Invention
An object of an embodiment of the present invention is to provide a method for manufacturing a housing, and an electronic device, which can improve the durability of the housing, improve the efficiency of housing production, and reduce the production cost while ensuring good heat dissipation of the housing.
In order to solve the above technical problem, an embodiment of the present invention provides a method for manufacturing a casing, including the following steps: providing a plurality of electric conductors, wherein the electric conductors are in a linear structure; filling conductive particles among the plurality of electric conductors, and carrying out die-casting treatment on the conductive particles; obtaining a plate body with a through hole; wherein the conductor has a channel communicating a first end of the conductor with a second end of the conductor, the channel forming the through hole; or after the conductive particles are subjected to the die casting treatment, taking out the plurality of conductors from the die-cast conductive particles to obtain a plate body with through holes; and placing a radiator in the through hole, and sealing the through hole to obtain the shell.
The embodiment of the invention also provides a shell which is manufactured by the shell manufacturing method.
The embodiment of the invention also provides electronic equipment which comprises the shell.
Compared with the prior art, the embodiment of the invention has the advantages that before the conductive particle forming plate body is formed, the linear conductor is placed among the conductive particles, and then the conductive particles are subjected to die-casting treatment; if the electric conductor is provided with a channel for communicating the first end with the second end, the channel directly forms a through hole of the plate body after die-casting treatment to obtain the plate body with the through hole, or the electric conductor is taken out after the die-casting treatment to form the plate body with the through hole no matter whether the electric conductor is provided with the channel for communicating the first end with the second end or not; and filling and sealing the channel to obtain the shell with good heat dissipation capacity. This application compares among the prior art through the three-dimensional casing that forms and have the cavity of printing, has improved the tolerance of casing, has improved anti ability of falling promptly, and production efficiency is higher, and the cost is lower.
Further, before the step of removing the plurality of conductive bodies from the die-cast conductive particles, the method includes: and placing the die-cast conductive particles and the conductive body in an acid environment, and electrifying the first end of the conductive body and the second end of the conductive body. Before the electric conductor is taken out, the electric conductor is placed in an acid environment and electrified, so that the contact part between the electric conductor and the die-cast conductive particles is corroded, a larger gap is formed between the electric conductor and the die-cast conductive particles, and the process that the electric conductor is taken out from the die-cast conductive particles is more convenient.
In addition, the extending direction of the through hole is perpendicular to the thickness direction of the shell. By setting the extending direction of the through-hole to be perpendicular to the thickness direction of the housing, the thickness of the housing is reduced.
In addition, the central lines of the through holes are positioned in the same plane in the shell, and the plane is parallel to the outer surface of the shell. Through setting up a plurality of through-holes on lieing in the coplanar parallel with the casing surface for arranging of through-hole is only located a plane, has reduced the thickness of casing.
In addition, a plurality of through holes are uniformly distributed in the shell. Through setting up evenly distributed's structure with the through-hole for the mode of arranging of through-hole structure is comparatively clear, simultaneously, can make the inside heat of electronic equipment distribute uniformly through even arranging.
In addition, the conductive particles are made of aluminum alloy.
In addition, the material of the conductor is copper.
In addition, the through hole is sealed by adopting a welding mode or a flattening mode.
Drawings
One or more embodiments are illustrated by way of example in the accompanying drawings, which correspond to the figures in which like reference numerals refer to similar elements and which are not to scale unless otherwise specified.
Fig. 1 is a flowchart of a method of manufacturing a housing according to a first embodiment of the present invention;
fig. 2 is a schematic cross-sectional view of a plate body according to a first embodiment of the present invention, taken along a direction perpendicular to a center line of a through hole;
FIG. 3 is a schematic cross-sectional view of a through-hole in a centerline direction according to a first embodiment of the present invention;
fig. 4 is a flowchart of a method of manufacturing a housing according to a second embodiment of the present invention;
FIG. 5 is a schematic diagram of a structure for electrochemically etching an electrical conductor according to a second embodiment of the present invention.
DETAILED DESCRIPTION OF EMBODIMENT (S) OF INVENTION
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, it will be appreciated by those of ordinary skill in the art that in various embodiments of the invention, numerous technical details are set forth in order to provide a better understanding of the present application. However, the technical solution claimed in the present application can be implemented without these technical details and various changes and modifications based on the following embodiments. The following embodiments are divided for convenience of description, and should not constitute any limitation to the specific implementation manner of the present invention, and the embodiments may be mutually incorporated and referred to without contradiction.
A first embodiment of the present invention is directed to a housing manufacturing method. As shown in fig. 1, a flowchart of a method for manufacturing a housing according to this embodiment specifically includes the following steps:
step 101, providing a plurality of conductors.
Specifically, the conductor is in a linear structure, and the conductor is provided with a channel for communicating a first end and a second end of the conductor, namely the conductor is in a hollow structure; in this embodiment, the cross-sectional structure of the conductor is circular, that is, the conductor is a hollow cylinder, wherein the top of the cylinder is the first end of the conductor, and the bottom of the cylinder is the second end of the conductor.
In one example, the material of the conductor 101 is copper.
Step 102, filling conductive particles among the plurality of conductors, and performing die-casting treatment on the conductive particles.
Specifically, the conductive particles are dispersed granular substances before the die casting treatment, and the conductive particles can form a fixed structure after the die casting treatment; therefore, after the conductive particles are subjected to die casting, the conductive particles can form a relatively fixed structure, wherein the conductive particles can form solid structures with various shapes through the die casting according to actual production needs.
In one example, the conductive particles 102 are made of an aluminum alloy.
And 103, obtaining a plate body with a through hole.
Specifically, since the conductive bodies have the channels connecting the first ends and the second ends of the conductive bodies, in order to directly obtain a plate body with through holes, the conductive particles are filled among the plurality of conductive bodies and subjected to die casting treatment, so that the conductive particles can form a relatively fixed structure, and the through holes of the plate body can be directly formed after the die casting treatment of the channels of the conductive bodies, so that the plate body with the through holes is obtained.
As shown in fig. 2, fig. 2 is a schematic cross-sectional view of a plate body along a direction perpendicular to a center line of a through hole, it can be seen that the conductor 1001 has a hollow structure, and a through hole 1002 of the plate body is directly formed in a channel of the conductor 1001 after the die casting process, in this case, the conductor 1001 can be used as a hole wall of the through hole 1002, and the conductor 1001 can form a plate body structure having the through hole 1002 without being taken out.
In one example, the through-hole extends in a direction perpendicular to the thickness direction of the case. By setting the extending direction of the through-hole to be perpendicular to the thickness direction of the housing, the thickness of the housing is reduced.
In one example, the center lines of the plurality of through holes are located in the same plane inside the housing, which is parallel to the outer surface of the housing. Through setting up a plurality of through-holes on the coplanar parallel with the casing surface for arranging of through-hole is only located a plane, has reduced the thickness of casing.
In one example, the plurality of through holes are evenly distributed in the interior of the housing. Through setting up evenly distributed's structure with the through-hole for the mode of arranging of through-hole structure is comparatively clear, simultaneously, can make the inside heat of electronic equipment distribute uniformly through even arranging.
And 104, placing a radiator in the through hole, and sealing the through hole to obtain the shell.
Specifically, the heat sink includes a capillary structure and a liquid, referring to fig. 3, fig. 3 is a schematic cross-sectional structure diagram of the through hole along the center line direction, the capillary structure 1003 is disposed inside the through hole 1002, and the liquid is filled in other areas of the through hole 1002, because the capillary structure 1003 has a capillary force, the liquid can continuously flow under the action of the capillary force, and this embodiment utilizes this principle to enable the liquid to continuously flow and take away heat of the element in the flowing process, thereby helping the element to dissipate heat. Wherein, the capillary structure 1003 is a pure copper wire mesh, and the liquid is pure water, so that the process cost can be saved.
Specifically, since the through hole is non-sealed, in order to keep the heat sink in the through hole and avoid liquid leakage and influence on product performance, the through hole is sealed after the heat sink is placed in the through hole, and the shell is obtained.
In one example, the through-holes are sealed by welding or flattening.
In this embodiment, before the conductive particle forming plate body is formed, the linear conductor is placed between the conductive particles, and then the conductive particles are subjected to die casting; the conductor is provided with a channel for communicating the first end with the second end, and after die-casting treatment, the channel directly forms a through hole of the plate body to obtain the plate body with the through hole; and filling and sealing the channel to obtain the shell with good heat dissipation capacity.
This application compares among the prior art through the three-dimensional casing that forms and have the cavity of printing, has improved the tolerance of casing, has improved anti ability of falling promptly, and production efficiency is higher, and the cost is lower.
A second embodiment of the invention is directed to a housing fabrication method. The second embodiment is substantially the same as the first embodiment, with the main differences being: in the second embodiment of the present invention, after the conductive particles are subjected to the die casting process, the plurality of conductive bodies are taken out from the die-cast conductive particles. The same or corresponding parts of this embodiment as those of the first embodiment are still valid in this embodiment, and are not described herein again to avoid redundancy.
As shown in fig. 4, a flowchart of the method for manufacturing the housing of this embodiment specifically includes the following steps:
step 201, a plurality of conductors are provided.
Specifically, the conductor of the present embodiment may have a solid structure, and therefore, after the die-casting process, the conductor needs to be taken out to form a plate body having a through hole. In this embodiment, the conductor may have a channel having a first end of the conductor and a second end of the conductor, and after the die casting process, the conductor having the channel may be taken out to form a plate having a through hole.
Step 202, filling conductive particles among the plurality of conductors, and performing die-casting treatment on the conductive particles.
Step 203, obtaining a plate body with a through hole;
in the embodiment, since the plurality of conductors are surrounded by the conductive particles before the die-casting process, the conductors are located inside the die-cast conductive particles after the die-casting process, and the first and second ends of the conductors are exposed outside the die-cast conductive particles, which provides a basis for further forming the through holes.
In one example, before removing the plurality of electrical conductors from the diecast conductive pellets, the method comprises: and placing the die-cast conductive particles and the conductive body in an acid environment, and electrifying the first end of the conductive body and the second end of the conductive body. Before the electric conductor is taken out, the electric conductor is placed in an acid environment and electrified, so that the contact part between the electric conductor and the die-cast conductive particles is corroded, a larger gap is formed between the electric conductor and the die-cast conductive particles, and the process that the electric conductor is taken out from the die-cast conductive particles is more convenient.
As shown in fig. 5, fig. 5 is a schematic structural diagram of electrochemically corroding the electrical conductor, the die-cast conductive particle 1004 and the electrical conductor 1001 are in an acidic environment, and a first end of the electrical conductor 1001 is electrified with a second end of the electrical conductor, and since the electrical conductor 1001 is made of a conductive material, after the electrical conductor 1001 is electrified, the electrical conductor 1001 is electrochemically corroded, so that a large gap is formed between the electrical conductor 1001 and the die-cast conductive particle 1004, and the electrical conductor 1001 is conveniently taken out of the die-cast conductive particle 1004.
And step 204, placing a radiator in the through hole, and sealing the through hole to obtain the shell.
In this embodiment, before the conductive particle forming plate body is formed, the linear conductor is placed between the conductive particles, and then the conductive particles are subjected to die casting; the conductor is taken out after die-casting treatment no matter whether the conductor has a channel for communicating the first end with the second end, so that a plate body with a through hole is formed; and then, filling and sealing the channel to obtain the shell with good heat dissipation capacity, and compared with the shell with a cavity formed by three-dimensional printing in the prior art, the shell has the advantages that the tolerance of the shell is improved, namely, the anti-falling capacity is improved, the production efficiency is higher, and the cost is lower.
The third embodiment of the present invention relates to a housing, which is manufactured by the housing manufacturing method in the first and second embodiments, so that the durability of the housing, that is, the anti-falling capability is improved, and the housing has high production efficiency and low cost.
A fourth embodiment of the present invention relates to an electronic device including the housing according to the third embodiment, so that the durability of the whole electronic device, i.e., the falling resistance, is improved, and the electronic device has high production efficiency and low cost.
The steps of the above methods are divided for clarity, and the implementation may be combined into one step or split some steps, and the steps are divided into multiple steps, so long as the same logical relationship is included, which are all within the protection scope of the present patent; it is within the scope of the patent to add insignificant modifications to the algorithms or processes or to introduce insignificant design changes to the core design without changing the algorithms or processes.
It will be understood by those of ordinary skill in the art that the foregoing embodiments are specific embodiments for practicing the invention, and that various changes in form and details may be made therein without departing from the spirit and scope of the invention in practice.

Claims (10)

1. A method of manufacturing a housing, comprising:
providing a plurality of electric conductors, wherein the electric conductors are in a linear structure;
filling conductive particles among the plurality of conductors, and carrying out die-casting treatment on the conductive particles to obtain a plate body with through holes; wherein the conductor has a channel communicating a first end of the conductor with a second end of the conductor, the channel forming the through hole; or after the conductive particles are subjected to the die casting treatment, taking out the plurality of conductors from the die-cast conductive particles to obtain a plate body with through holes;
and placing a radiator in the through hole, and sealing the through hole to obtain the shell.
2. The method of manufacturing a housing according to claim 1, wherein before removing the plurality of conductive bodies from the die-cast conductive particles, the method comprises:
and placing the die-cast conductive particles and the conductive body in an acid environment, and electrifying the first end of the conductive body and the second end of the conductive body.
3. The method of manufacturing a case according to claim 1 or 2, wherein the extending direction of the through hole is perpendicular to the thickness direction of the case.
4. The method of manufacturing a housing according to claim 3, wherein the center lines of the plurality of through holes are located in the same plane inside the housing, and the plane is parallel to the outer surface of the housing.
5. The method of manufacturing a housing according to claim 4, wherein the plurality of through holes are uniformly distributed in the interior of the housing.
6. The method of claim 1, wherein the conductive particles are made of aluminum alloy.
7. The method of claim 1, wherein the conductive material is copper.
8. The method of manufacturing a housing according to claim 1, wherein the through hole is sealed by welding or flattening.
9. A housing produced by the housing production method according to any one of claims 1 to 8.
10. An electronic device characterized by comprising the housing of claim 9.
CN202010331533.3A 2020-04-24 2020-04-24 Shell manufacturing method, shell and electronic equipment Active CN111526698B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010331533.3A CN111526698B (en) 2020-04-24 2020-04-24 Shell manufacturing method, shell and electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010331533.3A CN111526698B (en) 2020-04-24 2020-04-24 Shell manufacturing method, shell and electronic equipment

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CN111526698A true CN111526698A (en) 2020-08-11
CN111526698B CN111526698B (en) 2022-09-30

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100081272A1 (en) * 2008-09-30 2010-04-01 Samsung Electronics Co., Ltd. Methods of Forming Electrical Interconnects Using Electroless Plating Techniques that Inhibit Void Formation
CN106197104A (en) * 2015-12-16 2016-12-07 广州共铸科技股份有限公司 3 D stereo hot superconductive temperature equalizing radiator and preparation method thereof
CN106659016A (en) * 2016-11-29 2017-05-10 广东欧珀移动通信有限公司 Shell and manufacturing method therefor, and mobile terminal

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100081272A1 (en) * 2008-09-30 2010-04-01 Samsung Electronics Co., Ltd. Methods of Forming Electrical Interconnects Using Electroless Plating Techniques that Inhibit Void Formation
CN106197104A (en) * 2015-12-16 2016-12-07 广州共铸科技股份有限公司 3 D stereo hot superconductive temperature equalizing radiator and preparation method thereof
CN106659016A (en) * 2016-11-29 2017-05-10 广东欧珀移动通信有限公司 Shell and manufacturing method therefor, and mobile terminal

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