CN111525042A - Organic light emitting diode display panel and manufacturing method thereof - Google Patents
Organic light emitting diode display panel and manufacturing method thereof Download PDFInfo
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- CN111525042A CN111525042A CN202010337710.9A CN202010337710A CN111525042A CN 111525042 A CN111525042 A CN 111525042A CN 202010337710 A CN202010337710 A CN 202010337710A CN 111525042 A CN111525042 A CN 111525042A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/81—Anodes
- H10K50/814—Anodes combined with auxiliary electrodes, e.g. ITO layer combined with metal lines
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- H—ELECTRICITY
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- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
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- H—ELECTRICITY
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Abstract
The application provides an organic light emitting diode display panel and a manufacturing method thereof. The organic light emitting diode display panel includes: a substrate; an anode layer and at least one auxiliary electrode disposed on the substrate; a light emitting layer disposed on the anode layer; an electrical connection layer disposed on the light emitting layer and the auxiliary electrode, the electrical connection layer including an electrical connection portion corresponding to the auxiliary electrode; and a cathode layer disposed on the electrical connection layer; the electrical connection portion electrically connects the cathode layer and the auxiliary electrode, the electrical connection portion including conductive particles.
Description
Technical Field
The present disclosure relates to display technologies, and particularly to an organic light emitting diode display panel and a method for manufacturing the same.
Background
Large-sized organic light emitting diode display devices use a large number of thin film transistors in order to achieve high resolution. The aperture ratio is decreased due to the increase in the number of thin film transistors. In a top-emitting organic electroluminescent device, the surface resistance of the transparent cathode layer is high, and the voltage drop change is significant, resulting in poor brightness uniformity.
One known solution is to provide an auxiliary electrode. For example, an auxiliary electrode is added to a substrate, after an organic light-emitting material layer is formed, an organic material on the auxiliary electrode is removed by laser etching or the like, or an inverted trapezoidal resist is used to block deposition of an organic material on the auxiliary electrode, so that the cathode layer can be brought into direct contact with an auxiliary electrode line when a cathode layer is deposited. The above method for the auxiliary electrode is theoretically feasible, but the practical process difficulty is very large, for example, the method for laser etching the organic material is easy to over-etch, so that the auxiliary electrode line is etched away or partially etched away. The uniformity of the pattern in the manufacture of the reverse trapezoidal photoresist is difficult to control, so that the cathode layer and the auxiliary electrode in partial areas cannot be contacted.
Disclosure of Invention
In view of the above, the present disclosure provides an organic light emitting diode display panel and a method for manufacturing the same.
An organic light emitting diode display panel, comprising:
a substrate;
an anode layer and an auxiliary electrode disposed on the substrate;
a light emitting layer disposed on the anode layer;
an electrical connection layer disposed on the light emitting layer and the auxiliary electrode, the electrical connection layer including an electrical connection portion corresponding to the auxiliary electrode; and
a cathode layer disposed on the electrical connection layer;
the electrical connection portion electrically connects the cathode layer and the auxiliary electrode, the electrical connection portion including conductive particles.
In the organic light emitting diode display panel according to an embodiment of the present application, the electrical connection layer includes one or both of an electron transport layer and an electron injection layer.
In the organic light emitting diode display panel according to an embodiment of the present application, the organic light emitting diode display panel includes a pixel definition layer disposed on the anode layer, the pixel definition layer is located above the auxiliary electrode, a first opening and at least one second opening are disposed in the pixel definition layer, the anode layer is exposed to the first opening, the light emitting layer is formed in the first opening, the auxiliary electrode is exposed to the second opening, an electrical connection portion is formed in the second opening and electrically connected to the auxiliary electrode, the electrical connection layer and the cathode layer extend to the second opening through the electrical connection portion and electrically connected to the auxiliary electrode.
In the organic light emitting diode display panel according to an embodiment of the present application, the electrical connection portion includes the electrical connection layer in contact with the auxiliary electrode.
In the organic light emitting diode display panel according to an embodiment of the present application, the electrical connection portion includes the electrical connection layer in the second opening.
A manufacturing method of an organic light emitting diode display panel comprises the following steps:
providing a substrate, and forming an anode layer and an auxiliary electrode on the substrate;
forming a light emitting layer on the anode layer;
forming an electrical connection layer on the light emitting layer and the auxiliary electrode;
adding conductive particles into the electric connection layer corresponding to the auxiliary electrode to form an electric connection part; and
and forming a cathode layer on the electrical connection layer, wherein the electrical connection part electrically connects the cathode layer and the auxiliary electrode.
In the method of manufacturing an organic light emitting diode display panel according to an embodiment of the present application, the step of adding conductive particles to the electrical connection layer corresponding to the auxiliary electrode to form an electrical connection portion includes: dissolving the electrical connection layer corresponding to the auxiliary electrode using an organic solvent.
In the method of manufacturing an organic light emitting diode display panel according to an embodiment of the present application, the step of adding conductive particles to the electrical connection layer corresponding to the auxiliary electrode to form an electrical connection portion includes printing the organic solvent on the electrical connection layer corresponding to the auxiliary electrode to dissolve the electrical connection layer, and printing the conductive particle solution and drying.
In the method of manufacturing an organic light emitting diode display panel according to an embodiment of the present application, the step of adding conductive particles to the electrical connection layer corresponding to the auxiliary electrode to form an electrical connection portion is printing a conductive particle solution including the organic solvent on the electrical connection layer corresponding to the auxiliary electrode and drying the conductive particle solution.
In the method for manufacturing an organic light emitting diode display panel according to an embodiment of the present disclosure, the organic solvent is selected from one or more of aromatic hydrocarbons and alkanes.
In the method of manufacturing an organic light emitting diode display panel according to an embodiment of the present application, the step of forming an electrical connection layer on the light emitting layer and the auxiliary electrode includes: one or both of the electron transport layer and the electron injection layer are formed.
In the method for manufacturing an organic light emitting diode display panel according to an embodiment of the present application, the method further includes:
forming a pixel defining layer on the anode layer, the pixel defining layer being positioned over the auxiliary electrode;
forming a first opening and at least one second opening on the pixel defining layer;
the anode layer is exposed to a first opening, the light emitting layer is formed in the first opening, the auxiliary electrode is exposed to a second opening, the electrical connection portion is formed in the second opening and electrically connected with the auxiliary electrode, and the electrical connection layer and the cathode layer extend into the second opening and are electrically connected with the auxiliary electrode through the electrical connection portion.
According to the organic light emitting diode display panel, the conductive particles are added in the electric connection part electrically connected with the cathode layer and the auxiliary electrode, so that the voltage drop condition in a large-size panel can be relieved, and the brightness uniformity is improved. In addition, the manufacturing method of the organic light emitting diode display panel is simple and high in yield.
Drawings
In order to more clearly illustrate the technical solutions in the present application, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic cross-sectional view of an oled display panel according to an embodiment of the present disclosure.
Fig. 2 is a schematic top view of an oled display panel according to an embodiment of the present disclosure.
Fig. 3 is a schematic cross-sectional view of an oled display panel according to another embodiment of the present disclosure.
Fig. 4(a) to 4(f) are flowcharts of a method for manufacturing an organic light emitting diode display panel according to an embodiment of the present application.
Detailed Description
The technical solution in the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. It should be apparent that the described embodiments are only some embodiments of the present application, and not all embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any inventive step based on the embodiments in the present application, are within the scope of protection of the present application.
Referring to fig. 1, an oled display panel 100 according to an embodiment of the present disclosure includes a substrate 10, a thin film transistor 20 disposed on the substrate 10, a pixel defining layer 30 disposed on the thin film transistor 20, an organic light emitting device 40, and an auxiliary electrode 50.
The substrate 10 is a transparent substrate, and may be made of hard materials such as glass and quartz, or flexible materials such as plastic films and paper fibers. A buffer layer may be further disposed between the substrate 10 and the thin film transistor 20.
The thin film transistor 20 includes an active layer, a gate insulating layer, a gate electrode, an interlayer insulating layer, a source electrode, and a drain electrode, which are sequentially stacked. It is understood that the organic light emitting diode display panel 100 further includes a plurality of gate lines and a plurality of source/drain lines for driving the thin film transistors 20. A planarization layer is further disposed between the thin film transistor 20 and the pixel defining layer 30 and the organic light emitting device 40. It should be noted that the above contents are only used to illustrate the embodiments of the present invention, and the thin film transistor structure and the positional relationship between the film layers included in the thin film transistor structure in the present embodiment are not limited thereto, and the present embodiment is not limited thereto.
A first opening 30a and a second opening 30b are opened in the pixel defining layer 30. The first opening 30a is used to dispose the organic light emitting device 40, and the second opening 30b is used to expose the auxiliary electrode 50. The first opening 30a penetrates the pixel defining layer 30. The second opening 30b penetrates the pixel defining layer 30 and the passivation layer between the pixel defining layer 30 and the auxiliary electrode 50. The number of the first and second openings 30a and 30b is not limited in the present application, and in an embodiment, the number of the first and second openings 30a and 30b may be one. In one embodiment, the number of the first openings 30a and the second openings 30b may be plural.
The organic light emitting device 40 of the present application is a top emission type light emitting device. The organic light-emitting device 40 includes an anode layer 41, a hole injection layer 42, a hole transport layer 43, a light-emitting layer 44, an electrical connection layer 45, and a cathode layer 46, which are sequentially stacked.
The anode layer 41 is a transparent electrode layer, and may be a metal or metal oxide layer, and the specific composition includes metal aluminum, gold, silver, or metal oxide, or indium tin oxide, tin oxide. The anode layer 41 is exposed to the first opening 30 a.
The cathode layer 46 is a metal cathode layer, and the material thereof may be lithium, boron, sodium, calcium, magnesium, beryllium, barium, potassium, aluminum, gold, silver, or a metal oxide, or an alloy of two or more of them.
The hole injection layer 42 is a thin film made of a conjugated or non-conjugated high-conductivity system having carbon or silicon as a main chain; for example, polyaniline, polythiophene, polypyrrole, or polyparaphenylene vinylene film may be used.
The hole transport layer 43 may be an aromatic triamine compound or a carbazole compound having low ionization energy and an organic metal complex film, and may be a polyvinylcarbazole film, for example.
The light-emitting layer 44 is mainly made of an organic electroluminescent material including a high-molecular or low-molecular organic photoluminescent or electroluminescent material, and a fluorescent and phosphorescent compound.
The hole injection layer 42, the hole transport layer 43, and the light emitting layer 44 are disposed in the first opening 30 a. An electrical connection layer 45 and a cathode layer 46 are disposed on the light emitting layer 44 and extend into the second opening 30a, on the auxiliary electrode 50 and electrically connected to the auxiliary electrode 50. In this embodiment, the electrical connection layer 45 is an electron transport layer. The electron transport layer may be Bphen, TPBi, Bebq2 or Bepp 2. The electrical connection portion 451 includes at least a portion of the electrical connection layer 45 in contact with the auxiliary electrode 50. In one embodiment, the electrical connection portion 451 can include an electrical connection layer 45 located in the second opening 30 a. The electrical connection portion 451 electrically connects the cathode layer 46 and the auxiliary electrode 50. The electrical connection portion 451 includes conductive particles 451 a. The conductive particles 451a may be graphene, nano-metal particles, carbon nanotubes, or the like. The nano metal particles comprise one or more of nano gold particles, nano silver particles, nano copper particles, nano iron particles, nano nickel particles or nano platinum particles.
The auxiliary electrode 50 is exposed to the second opening 30 b. The auxiliary electrode 50 is disposed at the same layer as the gate electrode or the source/drain electrode of the thin film transistor 20. In this embodiment, the auxiliary electrode 50 is disposed at the same layer as the source/drain electrodes. The auxiliary electrode 50 is disposed around the organic light emitting device 40, i.e., a non-light emitting region of the organic light emitting diode display panel 100. The auxiliary electrode 50 may be a block electrode, a strip electrode, or an auxiliary electrode line. The display unit in fig. 1 shows that the organic light emitting device within one sub-pixel is electrically connected to one auxiliary electrode 50, however, the number of the auxiliary electrodes 50 is not limited in this application. In order to prevent the auxiliary electrodes 50 from being fused in a large-sized panel, and the current flowing through the cathode layer 46 is large, referring to fig. 2, in other embodiments of the present disclosure, one display unit 100 may include a plurality of auxiliary electrodes 50, and the plurality of auxiliary electrodes 50 are criss-cross disposed around the organic light emitting device 40 to form a grid shape. These auxiliary electrodes 50 may be formed on the same layer or different layers. It is understood that in other embodiments of the present application, the organic light emitting device in one pixel (including three sub-pixels) may be electrically connected to one auxiliary electrode 50.
Referring to fig. 3, an organic light emitting diode display panel 200 according to another embodiment of the present invention has substantially the same structure as the organic light emitting diode display panel 100, except that: the electrical connection layer 245 includes an electron transport layer 245a and an electron injection layer 245b, and the auxiliary electrode 250 is disposed at the same layer as the gate. It is understood that in other embodiments of the present application, the electrical connection layer 245 may include only an electron injection layer. The material of the electron injection layer 245b may be selected from LiF, Li2O, Liq.
It is to be understood that the organic light emitting diode display panel of the present application may include only a cathode layer, a light emitting layer, and an anode layer, and may further include an electron blocking layer, a hole blocking layer, and a charge generation layer.
According to the organic light emitting diode display panel, the conductive particles are added in the electric connection part electrically connected with the cathode layer and the auxiliary electrode, so that the voltage drop condition in a large-size panel can be relieved, and the brightness uniformity is improved.
Referring to fig. 4(a) to 4(f), another embodiment of the present application provides a method for manufacturing an organic light emitting diode display panel, which includes the following steps:
s1: referring to fig. 4(a), a substrate 10 is prepared, and a thin film transistor 20 and an auxiliary electrode 50 are formed on the substrate 10 to obtain a base plate. An anode layer 41 is formed on the thin film transistor 20 of the substrate.
The thin film transistor 20 includes an active layer, a gate insulating layer, a gate electrode, an interlayer insulating layer, and source and drain electrodes, which are sequentially stacked. The auxiliary electrode 50 may be manufactured at the time of manufacturing the gate or source/drain metal layer of the thin film transistor 20. The anode layer 41 may be formed by depositing a metal film and patterning. It is understood that in the present embodiment, the oled display panel 100 includes a plurality of display units arranged in an array, and only one display unit is illustrated in fig. 4(a) to 4(f) and the description thereof as an example.
S2: referring to fig. 4(b), a pixel defining layer 30 is formed on the thin film transistor 20 and the anode layer, and a first opening 30a and at least one second opening 30b are formed on the pixel defining layer 30. The first opening 30a is used to form an organic light emitting device, and the second opening 30b is used to expose the auxiliary electrode 50. The first opening 30a penetrates the pixel defining layer 30. The second opening 30b penetrates the pixel defining layer 30 and the passivation layer between the pixel defining layer 30 and the auxiliary electrode 50.
The pixel defining layer 30 may be formed by coating an organic material solution on the substrate and performing a drying process. The first opening 30a and the second opening 30b may be formed by photolithography.
S3: referring to fig. 4(c), a hole injection layer 42, a hole transport layer 43, and a light emitting layer 44 are sequentially formed on the anode layer 41.
The hole injection layer 42, the hole transport layer 43, and the light emitting layer 44 may be formed in the first opening 30a using an inkjet printing method.
S4: referring to fig. 4(d), an electrical connection layer 45 is formed on the light-emitting layer 44 and the auxiliary electrode 50.
The electrical connection layer 45 is formed over the light emitting layer 44 of the first opening 30a, and extends from the first opening 30a into the second opening 30b to be electrically connected to the auxiliary electrode 50. The step of forming the electrical connection layer 45 includes forming one or both of an electron transport layer and an electron injection layer. In this embodiment, the electrical connection layer 45 is an electron transport layer. The electrical connection layer 45 is formed by depositing a semiconductor material.
S5: referring to fig. 4(e), conductive particles 451a are added to the electrical connection layer 45 corresponding to the auxiliary electrode 50 to form an electrical connection portion 451. In one embodiment, the electrical connection layer 45 corresponding to the auxiliary electrode may include a portion of the electrical connection layer 45 contacting the auxiliary electrode 50. As shown in fig. 4(e), in one embodiment, the electrical connection layer 45 corresponding to the auxiliary electrode may include the electrical connection layer 45 in the second opening 30a, that is, the electrical connection layer 45 in the second opening 30a, which is in contact with and not in contact with the auxiliary electrode 50.
The step of adding the conductive particles 451a includes: the electrical connection layer 45 corresponding to the auxiliary electrode 50 is dissolved using an organic solvent. In one embodiment, the portion of the electrical connection layer 45 in contact with the auxiliary electrode 50 is dissolved. In one embodiment, the electrical connection layer 45 located in the second opening 30b may be dissolved. The organic solvent is selected from one or more of aromatic hydrocarbon and alkane. The alkane may be exemplified by one or more of alkanes of 9 to 16 carbon atoms. Examples of the aromatic hydrocarbons include: benzene, methylbenzene, methoxybenzene, and one or more of 1,2, 3-trimethylbenzene, 1,2, 4-trimethylbenzene, 1,3, 5-trimethylbenzene, naphthalene, tetrahydronaphthalene, decahydronaphthalene, 1-methylnaphthalene, and the like. The aromatic hydrocarbon may also be exemplified by halogenated aromatic hydrocarbons such as one or more of bromobenzene, iodobenzene, 1, 2-dichlorobenzene, 1, 3-dichlorobenzene, 1, 2-dibromobenzene, 1, 3-dibromobenzene, o-chlorotoluene, p-chlorotoluene, o-bromotoluene, and p-bromotoluene.
In the present embodiment, the step of adding the conductive particles 451a to the electrical connection layer 45 corresponding to the auxiliary electrode 50 to form the electrical connection portion 451 includes printing a conductive particle solution on the position of the electrical connection portion 451, that is, the electrical connection layer 45 corresponding to the auxiliary electrode 50, and drying. The solvent of the conductive particle solution includes the above-mentioned organic solvent, which may be selected from one or more of aromatic hydrocarbon, alkane, alcohol, and water. The alcohol can be methanol, ethanol, n-propanol, isopropanol, n-butanol, 2-butanol, tert-butanol or 2-methyl-1-propanol. The aromatic hydrocarbon and the alkane may be selected from one or more of the organic solvents listed above.
In another embodiment of the present application, the step of adding the conductive particles 451a to the electrical connection layer 45 corresponding to the auxiliary electrode 50 to form the electrical connection portion 451 includes: the organic solvent is printed on the position of the electrical connection portion 451, i.e., the electrical connection layer 45 corresponding to the auxiliary electrode 50 to dissolve the electrical connection layer 45, the conductive particle solution is printed and dried. The solvent of the conductive particle solution may contain alcohol and water, and may further contain the above-mentioned organic solvent.
The electric connection layer is dissolved by the organic solvent, the conductive particles are printed, and the conductive particles are mixed in the electric connection layer made of the semiconductor material, so that the conductivity of the semiconductor material is enhanced, and the electric connection between the auxiliary electrode and the cathode layer is facilitated.
S6: referring to fig. 4(f), a cathode layer 46 is formed on the electrical connection layer 45, and the electrical connection portion 451 electrically connects the cathode layer 46 and the auxiliary electrode 50.
The cathode layer 46 may be formed by depositing a transparent or semi-transparent conductive material. The cathode layer 46 is formed over the electrical connection layer 45 in the first opening 30a, and extends from the first opening 30a into the second opening 30b to be electrically connected to the electrical connection portion 451.
The manufacturing method of the organic light-emitting diode display panel is simple and high in yield.
The foregoing provides a detailed description of embodiments of the present application, and the principles and embodiments of the present application have been described herein using specific examples, which are presented solely to aid in the understanding of the present application. Meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (12)
1. An organic light emitting diode display panel, comprising:
a substrate;
an anode layer and an auxiliary electrode disposed on the substrate;
a light emitting layer disposed on the anode layer;
an electrical connection layer disposed on the light emitting layer and the auxiliary electrode, the electrical connection layer including an electrical connection portion corresponding to the auxiliary electrode; and
a cathode layer disposed on the electrical connection layer;
the electrical connection portion electrically connects the cathode layer and the auxiliary electrode, the electrical connection portion including conductive particles.
2. The organic light emitting diode display panel of claim 1, wherein the electrical connection layer comprises one or both of an electron transport layer and an electron injection layer.
3. The oled display panel of claim 1, wherein the oled display panel includes a pixel defining layer disposed on the anode layer, the pixel defining layer is disposed over the auxiliary electrode, the pixel defining layer has a first opening and at least one second opening therein, the anode layer is exposed to the first opening, the light emitting layer is formed in the first opening, the auxiliary electrode is exposed to the second opening, the electrical connection portion is formed in the second opening and electrically connected to the auxiliary electrode, and the electrical connection layer and the cathode layer extend into the second opening and are electrically connected to the auxiliary electrode through the electrical connection portion.
4. The organic light emitting diode display panel according to claim 1 or 3, wherein the electrical connection portion includes the electrical connection layer in contact with the auxiliary electrode.
5. The organic light emitting diode display panel of claim 3, wherein the electrical connection comprises the electrical connection layer in the second opening.
6. A manufacturing method of an organic light emitting diode display panel comprises the following steps:
providing a substrate, and forming an anode layer and an auxiliary electrode on the substrate;
forming a light emitting layer on the anode layer;
forming an electrical connection layer on the light emitting layer and the auxiliary electrode;
adding conductive particles into the electric connection layer corresponding to the auxiliary electrode to form an electric connection part; and
and forming a cathode layer on the electrical connection layer, wherein the electrical connection part electrically connects the cathode layer and the auxiliary electrode.
7. The manufacturing method according to claim 6, wherein: the step of adding conductive particles to the electrical connection layer corresponding to the auxiliary electrode to form an electrical connection portion includes: and dissolving the electrical connection layer corresponding to the auxiliary electrode using an organic solvent.
8. The manufacturing method according to claim 7, wherein: the step of adding conductive particles to the electrical connection layer corresponding to the auxiliary electrode to form an electrical connection portion includes:
printing the organic solvent on the electric connection layer corresponding to the auxiliary electrode to dissolve the electric connection layer, and printing the conductive particle solution and drying.
9. The manufacturing method according to claim 7, wherein: the step of adding conductive particles to the electrical connection layer corresponding to the auxiliary electrode to form an electrical connection portion includes:
printing a conductive particle solution on an electrical connection layer corresponding to the auxiliary electrode and drying, the conductive particle solution including the organic solvent.
10. The method according to any one of claims 7 to 9, wherein the organic solvent is one or more selected from aromatic hydrocarbons and alkanes.
11. The manufacturing method according to claim 6, wherein the step of forming an electrical connection layer over the light-emitting layer and the auxiliary electrode comprises:
one or both of the electron transport layer and the electron injection layer are formed.
12. The method of manufacturing of claim 6, further comprising the steps of:
forming a pixel defining layer on the anode layer, the pixel defining layer being positioned over the auxiliary electrode;
forming a first opening and at least one second opening on the pixel defining layer;
the anode layer is exposed to a first opening, the light emitting layer is formed in the first opening, the auxiliary electrode is exposed to a second opening, the electrical connection portion is formed in the second opening and electrically connected with the auxiliary electrode, and the electrical connection layer and the cathode layer extend into the second opening and are electrically connected with the auxiliary electrode through the electrical connection portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202010337710.9A CN111525042A (en) | 2020-04-26 | 2020-04-26 | Organic light emitting diode display panel and manufacturing method thereof |
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| CN202010337710.9A CN111525042A (en) | 2020-04-26 | 2020-04-26 | Organic light emitting diode display panel and manufacturing method thereof |
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Application publication date: 20200811 |