CN111524464A - Display device - Google Patents
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- CN111524464A CN111524464A CN202010531366.7A CN202010531366A CN111524464A CN 111524464 A CN111524464 A CN 111524464A CN 202010531366 A CN202010531366 A CN 202010531366A CN 111524464 A CN111524464 A CN 111524464A
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- display device
- metal
- groove
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- metal bump
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
Abstract
The application discloses display device, including the display area with be located the peripheral non-display area of display area, wherein, display device specifically includes: the display device comprises a substrate, wherein at least one groove is formed in the surface of one side, located in a non-display area, of the substrate; at least one first metal bump arranged in the groove, wherein the first metal bump is electrically connected with a circuit exposed out of the groove in the substrate; and the chip is arranged on the surface of one side of the substrate, which is provided with the first metal bump, and the second metal bump on the functional surface of the chip is electrically connected with the first metal bump. When the display device provided by the application is formed, the position of the chip can be limited by the groove in the substrate, the probability of deviation of the chip in the bending process along with the bendable substrate is reduced, the probability of falling of the chip is reduced, and therefore the reliability of electric connection between the chip and the substrate is improved.
Description
Technical Field
The present application relates to the field of display technologies, and in particular, to a display device.
Background
When the display device product is assembled, the surface of the bendable substrate is flat, and the surface of the substrate positioned in the non-display area is provided with an exposed circuit used for being electrically connected with the chip. It is usually necessary to electrically connect the functional surface of the chip to the exposed circuit on the surface of the bendable substrate, and then bend the bendable substrate. However, when the bendable substrate is bent, the bent portion is deformed and stress is accumulated, which may cause the chip electrically connected to the substrate surface to shift or even drop on the substrate, thereby causing the reliability of the electrical connection inside the display device to be reduced or even causing the electrical connection to fail.
Disclosure of Invention
The technical problem that this application mainly solved provides a display device, can reduce the chip and take place the skew on the substrate and the probability that drops, improves the reliability of the inside electricity of display device and connects.
In order to solve the technical problem, the application adopts a technical scheme that:
there is provided a display device including a display area and a non-display area located at a periphery of the display area, wherein the display device includes: the substrate is provided with at least one groove on the surface of one side of the non-display area; at least one first metal bump arranged in the groove, wherein the first metal bump is electrically connected with a circuit exposed out of the groove in the substrate; the chip is arranged on the surface of one side, provided with the first metal bump, of the substrate, and the second metal bump on the functional surface of the chip is electrically connected with the first metal bump.
The display device comprises a substrate, a non-display area and a substrate, wherein one side surface of the substrate, which is positioned in the non-display area, is provided with one groove, a plurality of first metal lugs which are arranged at intervals are arranged in the groove, and the upper surface of each first metal lug is not lower than the surface of the substrate around the groove when the display device is horizontally placed.
Wherein the display device further comprises: a plurality of non-conductive posts, one of the posts corresponding to one of the first metal bumps, the posts being disposed between the first metal bump and the bottom of the recess; and the first metal coating is arranged on the side surface of the columnar body, and the first metal bump, the first metal coating and the circuit exposed from the groove in the substrate are electrically connected.
Wherein the height of the columnar body is smaller than the depth of the groove.
The first metal bump comprises a first metal part and a second metal part which are stacked in the vertical direction, the first metal part is located between the bottom of the groove and the second metal part, and the size of the orthographic projection of the first metal part on the bottom of the groove is larger than or equal to the size of the orthographic projection of the second metal part on the bottom of the groove.
Wherein the display device further comprises: and the non-conductive first filling body is arranged in the unoccupied space of the groove, and the thickness of the first filling body is smaller than or equal to the depth of the groove.
Or, a plurality of grooves are arranged on the surface of one side of the substrate, which is positioned in the non-display area, one first metal bump is arranged in one groove, and the upper surface of the first metal bump is not lower than the upper surface of the groove when the display device is horizontally placed.
Wherein the display device further comprises: and the plurality of non-conductive second filling bodies are arranged between the bottom of each groove and the corresponding first metal bump, and the thickness of each second filling body is smaller than the depth of the groove.
Wherein the display device further comprises: and the conductive adhesive or the solder is positioned between the first metal bump and the second metal bump, and the first metal bump and the second metal bump are electrically connected through the conductive adhesive or the solder.
The material of the first metal bump comprises at least one of gold, copper and nickel.
The beneficial effect of this application is: different from the prior art, the present application provides a display device including a display area and a non-display area located at a periphery of the display area, wherein the display device includes: the display device comprises a substrate, wherein at least one groove is formed in the surface of one side, located in a non-display area, of the substrate; at least one first metal bump arranged in the groove, wherein the first metal bump is electrically connected with a circuit exposed out of the groove in the substrate; and the chip is arranged on the surface of one side of the substrate, which is provided with the first metal bump, and the second metal bump on the functional surface of the chip is electrically connected with the first metal bump. When the display device provided by the application is formed, the position of the chip can be limited by the groove in the substrate, the probability of deviation of the chip in the bending process along with the bendable substrate is reduced, the probability of falling of the chip is reduced, and therefore the reliability of electric connection between the chip and the substrate is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts. Wherein:
FIG. 1 is a schematic diagram of a display device according to an embodiment of the present application;
FIG. 2 is a schematic structural diagram of another embodiment of a display device according to the present application;
FIG. 3 is a schematic structural diagram of another embodiment of a display device according to the present application;
FIG. 4 is a schematic structural diagram of another embodiment of a display device according to the present application;
FIG. 5a is a schematic structural diagram of another embodiment of a display device according to the present application;
FIG. 5b is a schematic structural diagram of another embodiment of a display device according to the present application;
FIG. 5c is a schematic structural diagram of another embodiment of a display device according to the present application;
FIG. 5d is a schematic structural diagram of another embodiment of a display device according to the present application;
FIG. 6 is a schematic structural diagram of another embodiment of a display device according to the present application;
fig. 7 is a schematic structural diagram of another embodiment of a display device according to the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments that can be obtained by a person skilled in the art without making any inventive step based on the embodiments in the present application belong to the protection scope of the present application.
Referring to fig. 1, fig. 1 is a schematic structural diagram of an embodiment of a display device of the present application, the display device having a display area and a non-display area located at a periphery of the display area, and the display device specifically includes: a substrate 11, at least one first metal bump 13 and a chip 100. Wherein, the surface of one side of the substrate 11 positioned in the non-display area is provided with at least one groove 12; the first metal bump 13 is disposed in the groove 12 and electrically connected to a circuit (not shown) exposed from the groove 12 in the substrate 11; the chip 100 is disposed on a side surface of the substrate 11 where the first metal bump 13 is disposed, and the second metal bump 200 on the functional surface of the chip 100 is electrically connected to the first metal bump 13. In fig. 1, the second metal bump 200 is directly electrically connected to the first metal bump 13, and may be implemented by using a thermal compression bonding method, and the temperature, pressure and time of the thermal compression bonding process may be set according to actual requirements of the display device. In this embodiment, the substrate 11 is flexible and bendable, and may be made of a transparent material such as glass.
In this embodiment, a groove 12 is disposed on a side surface of the substrate 11 in the non-display area, a plurality of first metal bumps 13 are disposed in the groove 12 at intervals, and an upper surface a of the first metal bump 13 is not lower than a surface B of the substrate 11 around the groove 12 when the display device is horizontally placed. The upper surface a of the first metal bump 13 is preferably flush with the surface B of the substrate 11 around the recess 12 or higher than the surface B of the substrate 11 around the recess 12. Fig. 1 schematically shows a case where two first metal bumps 13 are provided inside the groove 12, and the upper surface a of the first metal bumps 13 is flush with the surface B of the substrate 11 around the groove 12. Preferably, the material of the first metal bump 13 includes at least one of gold (Au), copper (Cu), and nickel (Ni).
When the display device provided by the present embodiment is formed, after the chip 100 is electrically connected to the substrate 11, and the substrate 11 is bent, the groove 12 on the substrate 11 can limit the position of the chip 100, thereby reducing the probability that the chip 100 is shifted during the bending process of the bendable substrate 11, and reducing the probability that the chip 100 falls off, thereby improving the reliability of the electrical connection between the chip 100 and the substrate 11.
In another embodiment, please refer to fig. 2, wherein fig. 2 is a schematic structural diagram of another embodiment of a display device according to the present application. Similarly to the display device shown in fig. 1, the display device provided in this embodiment mode also includes: a substrate 21, a plurality of first metal bumps 23, and a chip 100. Wherein, a groove 22 is arranged on one side surface of the substrate 21 in the non-display area; the first metal bumps 23 are disposed in the grooves 22 at intervals and electrically connected to circuits (not shown) exposed from the grooves 22 in the substrate 21; the chip 100 is disposed on a side surface of the substrate 21 where the first metal bump 23 is disposed, and the second metal bump 200 on the functional surface of the chip 100 is electrically connected to the first metal bump 23. Unlike the display device shown in fig. 1, the display device provided in this embodiment further includes a conductive adhesive or solder 24 located between the first metal bump 23 and the second metal bump 200, and the first metal bump 23 and the second metal bump 200 are electrically connected through the conductive adhesive or solder 24. The conductive paste or the solder 24 may be selected arbitrarily, the conductive paste may be, for example, an isotropic conductive paste, an anisotropic conductive paste, or, for example, a silver-based conductive paste, a gold-based conductive paste, a copper-based conductive paste, a carbon-based conductive paste, etc., the solder may be, for example, a solder including gold, copper, or nickel, etc., as long as the first metal bump 23 and the second metal bump 200 can be electrically connected, which is not limited in the present application.
When the display device provided by the present embodiment is formed, after the chip 100 is electrically connected to the substrate 21, and the substrate 21 is bent, the groove 22 on the substrate 21 can limit the position of the chip 100, thereby reducing the probability that the chip 100 is shifted during the bending process of the bendable substrate 21, and reducing the probability that the chip 100 falls off, thereby improving the reliability of the electrical connection between the chip 100 and the substrate 21.
In another embodiment, please refer to fig. 3, wherein fig. 3 is a schematic structural diagram of another embodiment of the display device of the present application. Similarly to the display device shown in fig. 2, the display device provided in this embodiment mode also includes: a substrate 31, a plurality of first metal bumps 33, and a chip 100. Wherein, a groove 32 is arranged on one side surface of the substrate 31 in the non-display area; the first metal bumps 33 are spaced in the grooves 32 and electrically connected to a circuit (not shown) exposed from the grooves 32 in the substrate 31; the chip 100 is disposed on a side surface of the substrate 31 where the first metal bump 33 is disposed, and the second metal bump 200 on the functional surface of the chip 100 is electrically connected to the first metal bump 33. Unlike the display device shown in fig. 2, the display device provided in this embodiment mode further includes a plurality of non-conductive columnar bodies 34 and a first metal coating layer 35. Wherein, the height h1 of the column 34 is less than the depth h2 of the groove 32, one column 34 corresponds to one first metal bump 33, and the column 34 is arranged between the first metal bump 33 and the bottom of the groove 32; the first metal coating 35 is disposed on the side surface of the pillar 34, and the first metal bump 33, the first metal coating 35, and the circuit exposed from the recess 32 in the substrate 31 are electrically connected.
Fig. 3 schematically illustrates the formation of two spaced apart polyamide columns 34 within the recess 32. The specific formation process of the polyamide-amine pillar 34 may be: the pre-customized mold is placed in the groove 32, the molten polyamide is placed in the mold, and after the polyamide is molded, the mold is removed, so that polyamide columns 34 arranged in the groove 32 at intervals are obtained. Further, a painting process may be used to form a metal layer on each surface of pillars 34, and to ensure the reliability of the electrical connection, the painting process may be controlled to make the thickness of the metal layer as thick as possible, wherein the metal layer painted on the surface of each pillar 34 away from the recess 32 becomes the first metal bump 33, and the metal layer painted on the side surface of each pillar 34 becomes the first metal coating 35.
In this embodiment and the following embodiments, the first metal bump and the second metal bump may be directly connected by thermocompression bonding, or may be connected by a conductive paste or solder, for the sake of simplicity, and when the direct connection is schematically illustrated in the structural diagrams of this embodiment and the following embodiments, the direct connection is not limited to the thermocompression bonding.
The display device provided by the embodiment further includes a non-conductive column 34 and a first metal coating 35 distributed on the side surface of the column 34 between the first metal bump 33 and the bottom of the groove 32, so that the first metal bump 33 is electrically connected with a circuit exposed from the groove 32 in the substrate 31 through the first metal coating 35, the display device not only includes a plurality of first metal bumps 33 arranged at intervals, but also can reduce the usage amount of metal, and the cost is saved while the offset probability and the falling probability of the chip 100 on the substrate 31 are reduced.
In another embodiment, please refer to fig. 4, wherein fig. 4 is a schematic structural diagram of another embodiment of the display device of the present application. Similarly to the display device shown in fig. 2, the display device provided in this embodiment mode also includes: a substrate 41, a plurality of first metal bumps 43, and a chip 100. Wherein, a groove 42 is arranged on one side surface of the substrate 41 in the non-display area; the first metal bumps 43 are disposed in the grooves 42 at intervals and electrically connected to a circuit (not shown) exposed from the grooves 42 in the substrate 41; the chip 100 is disposed on a surface of the substrate 41 on a side thereof where the first metal bump 43 is disposed, and the second metal bump 200 on the functional surface of the chip 100 is electrically connected to the first metal bump 43. Unlike the display device shown in fig. 2, the first metal bump 43 in the display device provided in this embodiment includes a first metal portion 431 and a second metal portion 432 stacked in the vertical direction, the first metal portion 431 is located between the bottom of the groove 42 and the second metal portion 432, the first metal portion 431 is electrically connected to a circuit (not shown) exposed from the groove 42 in the substrate 41, and the size of the orthographic projection of the first metal portion 431 on the bottom of the groove 42 is greater than or equal to the size of the orthographic projection of the second metal portion 432 on the bottom of the groove 42.
Specifically, a plurality of first metal portions 431 may be formed at intervals in the groove 42 by using a patterned photoresist, and then a second metal portion 432 is formed on a side surface of the first metal portion 431 away from the groove 42, preferably, a height h3 of the first metal portion 431 is lower than a depth h4 of the groove 42, and a sum h5 of the heights of the first metal portion 431 and the second metal portion 432 is greater than or equal to the depth h4 of the groove 42. Fig. 4 schematically shows the case where the size of the orthogonal projection of second metal part 432 on the bottom of groove 42 is smaller than the size of the orthogonal projection of first metal part 431 on the bottom of groove 42, and h3< h4, h5> h 4.
In the display device provided by the embodiment, the plurality of first metal bumps 43 are formed in the groove 42, wherein the first metal bumps 43 include the first metal portions 431 and the second metal portions 432 with smaller sizes, so that the plurality of first metal bumps 43 arranged at intervals can be formed, the usage amount of metal can be reduced, the offset probability and the falling probability of the chip 100 on the substrate 41 are reduced, and meanwhile, the cost is saved.
In another embodiment, please refer to fig. 5a to 5d with reference to fig. 1 to 4, and fig. 5a to 5d are schematic structural diagrams of another embodiment of the display device of the present application. Similar to the display device shown in fig. 1 to 4, the display device provided in this embodiment mode also includes: a substrate, a plurality of first metal bumps, and a chip 100. Wherein, a groove is arranged on the surface of one side of the substrate positioned in the non-display area; the first metal bumps are arranged in the grooves at intervals and are electrically connected with circuits (not shown) exposed from the grooves in the substrate; the chip 100 is disposed on a surface of the substrate on a side thereof where the first metal bump is disposed, and the second metal bump 200 on the functional surface of the chip 100 is electrically connected to the first metal bump. Unlike the display devices of the above embodiments, these embodiments provide a display device further including a non-conductive first filling body disposed in the space where the groove is not occupied, the first filling body having a thickness less than or equal to the depth of the groove. The first filling body may be made of a non-conductive material such as polyimide, polytetrafluoroethylene, or polycarbonate.
Fig. 5 a-5 d correspond to fig. 1-4, respectively, i.e. the display device of fig. 5a comprises the display device of fig. 1 plus the first filling body 16 arranged in the unoccupied space of the cavity 12, the display device of fig. 5b comprises the display device of fig. 2 plus the first filling body 26 arranged in the unoccupied space of the cavity 22, the display device of fig. 5c comprises the display device of fig. 3 plus the first filling body 36 arranged in the unoccupied space of the cavity 32, and the display device of fig. 5d comprises the display device of fig. 4 plus the first filling body 46 arranged in the unoccupied space of the cavity 42. Wherein the thickness division of the first filling body 16, 26, 36, 46 is smaller than or equal to the depth of the corresponding recess 12, 22, 32, 42. Fig. 5a and 5b schematically show the case where the thickness of the first filling bodies 16 and 26 is smaller than the depth of the corresponding recesses 12 and 22, and fig. 5c and 5d schematically show the case where the thickness of the first filling bodies 36 and 46 is equal to the depth of the corresponding recesses 32 and 42 (i.e. the upper surface of the first filling bodies is flush with the substrate surface around the recesses).
In these embodiments, the display device further includes a non-conductive first filling body formed in the space not occupied by the groove, and the first filling body can further stabilize the first metal bump, so that the probability of the first metal bump and the second metal bump on the chip being shifted when the substrate is bent is further reduced, and the reliability of the internal electrical connection of the display device is improved.
In another embodiment, please refer to fig. 6, wherein fig. 6 is a schematic structural diagram of another embodiment of the display device of the present application. Similarly to the display device shown in fig. 1, the display device provided in this embodiment mode also includes: a substrate 61, at least one first metal bump 63 and a chip 100. Wherein, the surface of one side of the substrate 61 positioned in the non-display area is provided with at least one groove 62; the first metal bump 63 is disposed in the groove 62 and electrically connected to a circuit (not shown) exposed from the groove 62 in the substrate 61; the chip 100 is disposed on a side surface of the substrate 61 where the first metal bump 63 is disposed, and the second metal bump 200 on the functional surface of the chip 100 is electrically connected to the first metal bump 63. The first metal bump 63 and the second metal bump 200 are electrically connected through a conductive adhesive or solder 64.
Unlike the display device shown in fig. 1, in the present embodiment, a plurality of grooves 62 are formed on a side surface of the substrate 61 located in the non-display region, one first metal bump 63 is formed in one groove 62, and an upper surface C of the first metal bump 63 is not lower than a surface D of the substrate 61 around the groove when the display device is horizontally placed. Wherein the circuitry inside the substrate 61 is exposed from each recess 62 for electrical connection with the first metal bump 63. Specifically, a first metal bump 63 may be formed in one of the grooves 62 by electroplating or deposition. Fig. 6 schematically shows a substrate 61 with four grooves 62, four first metal bumps 63 respectively disposed in the four grooves 62, and an upper surface C of the first metal bumps 63 is higher than a surface D of the substrate 61 around the grooves 62.
The substrate 61 surface of the display device provided by the embodiment is provided with the plurality of grooves 62, each groove 62 is internally provided with one first metal bump 63, that is, the first metal bumps 63 arranged at intervals can be formed, and the substrate 61 can play a role in stabilizing the first metal bumps 63, so that the probability of the first metal bumps 63 and the second metal bumps 200 on the chip 100 deviating when the substrate 61 is bent can be further reduced, and the reliability of the internal electrical connection of the display device is improved.
In another embodiment, please refer to fig. 7, and fig. 7 is a schematic structural diagram of another embodiment of the display device of the present application. Similarly to the display device shown in fig. 6, the display device provided in this embodiment mode also includes: a substrate 71, at least one first metal bump 73 and a chip 100. Wherein, a plurality of grooves 72 are arranged on one side surface of the substrate 71 in the non-display area; a first metal bump 73 disposed in one of the recesses 72 and electrically connected to a circuit (not shown) exposed from the recess 72 in the substrate 71; the chip 100 is disposed on a side surface of the substrate 71 where the first metal bump 73 is disposed, and the second metal bump 200 on the functional surface of the chip 100 is electrically connected to the first metal bump 73. Unlike the display device shown in fig. 6, the display device in this embodiment further includes a plurality of non-conductive second fillers 74 disposed between the bottom of each of the recesses 72 and the corresponding first metal bumps 73. The thickness h6 of the second filling body 74 is smaller than the depth h7 of the groove 72, and the upper surface E of the first metal bump 73 is not lower than the surface F of the substrate 71 around the groove 72 when the display device is horizontally placed. Fig. 7 schematically shows a case where the substrate 71 is provided with four recesses 72, four first metal bumps 73 are respectively disposed in the four recesses 72, and the upper surfaces E of the first metal bumps 73 are flush with the surface F of the substrate 71 around the recesses 72. The second filling member 74 may be made of a non-conductive material such as polyimide, polytetrafluoroethylene, or polycarbonate.
In this embodiment, the display device may further include a sputtered metal layer 75 disposed on a surface of the second filling body 74 away from the groove 72 and a sidewall of the groove 72. Wherein the sputtered metal layer 75 on the sidewall of the recess 72 is electrically connected to the circuit exposed from the sidewall of the recess 72 in the substrate 71, so that the first metal bump 73 is electrically connected to the circuit exposed from the sidewall of the recess 72 in the substrate 71 through the sputtered metal layer 75. Specifically, the first metal bump 73 may be formed on the sputtered metal layer 75 by electroplating, and the sputtered metal layer 75 may be a seed layer of the electroplating process, which may improve the quality of the first metal bump 73. Of course, in other embodiments, the display device may not include the sputtered metal layer 75, and the first metal bump 73 may be formed directly on the second filling body 74.
The surface of the substrate 71 of the display device provided by the embodiment is provided with the plurality of grooves 72, each groove 72 is sequentially provided with the second filling body 74 and the first metal bump 73, that is, the first metal bumps 73 arranged at intervals can be formed, the substrate 71 can play a role in stabilizing the first metal bumps 73, the second filling bodies 74 can also reduce the use of metal, the probability of the chip 100 on the substrate 71 deviating and the probability of dropping can be reduced, and meanwhile, the cost is also saved.
The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.
Claims (10)
1. A display device including a display area and a non-display area located at a periphery of the display area, comprising:
the substrate is provided with at least one groove on the surface of one side of the non-display area;
at least one first metal bump arranged in the groove, wherein the first metal bump is electrically connected with a circuit exposed out of the groove in the substrate;
the chip is arranged on the surface of one side, provided with the first metal bump, of the substrate, and the second metal bump on the functional surface of the chip is electrically connected with the first metal bump.
2. The display device according to claim 1, wherein one of the grooves is formed in a side surface of the substrate located in the non-display area, a plurality of the first metal bumps are arranged in the groove at intervals, and an upper surface of each of the first metal bumps is not lower than a surface of the substrate around the groove when the display device is horizontally placed.
3. The display device according to claim 2, further comprising:
a plurality of non-conductive posts, one of the posts corresponding to one of the first metal bumps, the posts being disposed between the first metal bump and the bottom of the recess;
and the first metal coating is arranged on the side surface of the columnar body, and the first metal bump, the first metal coating and the circuit exposed from the groove in the substrate are electrically connected.
4. The display device according to claim 3, wherein the height of the pillar is smaller than the depth of the groove.
5. The display device according to claim 2, wherein the first metal bump includes a first metal portion and a second metal portion stacked in a vertical direction, the first metal portion is located between the bottom of the groove and the second metal portion, and an orthogonal projection of the first metal portion on the bottom of the groove has a size greater than or equal to an orthogonal projection of the second metal portion on the bottom of the groove.
6. The display device according to any one of claims 2 to 5, further comprising:
and the non-conductive first filling body is arranged in the unoccupied space of the groove, and the thickness of the first filling body is smaller than or equal to the depth of the groove.
7. The display device according to claim 1, wherein a plurality of the grooves are provided on a side surface of the substrate located in the non-display region, one of the grooves is provided with one of the first metal bumps, and an upper surface of the first metal bump is not lower than an upper surface of the groove when the display device is horizontally placed.
8. The display device according to claim 7, further comprising:
and the plurality of non-conductive second filling bodies are arranged between the bottom of each groove and the corresponding first metal bump, and the thickness of each second filling body is smaller than the depth of the groove.
9. The display device according to claim 1, further comprising:
and the conductive adhesive or the solder is positioned between the first metal bump and the second metal bump, and the first metal bump and the second metal bump are electrically connected through the conductive adhesive or the solder.
10. The display device according to claim 1, wherein a material of the first metal bump comprises at least one of gold, copper, and nickel.
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