CN111513513A - Method and structure for adjusting hardness and temperature of mattress surface pad - Google Patents
Method and structure for adjusting hardness and temperature of mattress surface pad Download PDFInfo
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- CN111513513A CN111513513A CN202010551693.9A CN202010551693A CN111513513A CN 111513513 A CN111513513 A CN 111513513A CN 202010551693 A CN202010551693 A CN 202010551693A CN 111513513 A CN111513513 A CN 111513513A
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- 238000000034 method Methods 0.000 title claims abstract description 30
- 230000001105 regulatory effect Effects 0.000 claims abstract description 49
- 238000001514 detection method Methods 0.000 claims description 44
- 238000012790 confirmation Methods 0.000 claims description 3
- 230000001276 controlling effect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 4
- 230000006870 function Effects 0.000 description 3
- 239000004816 latex Substances 0.000 description 3
- 229920000126 latex Polymers 0.000 description 3
- 239000000839 emulsion Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 210000000653 nervous system Anatomy 0.000 description 1
- 230000001575 pathological effect Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000003860 sleep quality Effects 0.000 description 1
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- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47C—CHAIRS; SOFAS; BEDS
- A47C27/00—Spring, stuffed or fluid mattresses or cushions specially adapted for chairs, beds or sofas
- A47C27/14—Spring, stuffed or fluid mattresses or cushions specially adapted for chairs, beds or sofas with foamed material inlays
- A47C27/18—Spring, stuffed or fluid mattresses or cushions specially adapted for chairs, beds or sofas with foamed material inlays in combination with inflatable bodies
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- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47C—CHAIRS; SOFAS; BEDS
- A47C21/00—Attachments for beds, e.g. sheet holders, bed-cover holders; Ventilating, cooling or heating means in connection with bedsteads or mattresses
- A47C21/04—Devices for ventilating, cooling or heating
- A47C21/048—Devices for ventilating, cooling or heating for heating
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- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47C—CHAIRS; SOFAS; BEDS
- A47C27/00—Spring, stuffed or fluid mattresses or cushions specially adapted for chairs, beds or sofas
- A47C27/08—Fluid mattresses or cushions
- A47C27/081—Fluid mattresses or cushions of pneumatic type
- A47C27/083—Fluid mattresses or cushions of pneumatic type with pressure control, e.g. with pressure sensors
Abstract
The invention discloses a method and a structure for adjusting the hardness and the temperature of a mattress surface cushion, which comprises the steps that a flexible pressure pipe is arranged in the mattress surface cushion, the pressure pipe is connected with a pressure adjusting pipe through a sensor unit and then connected with a partial pressure bottle, and the partial pressure bottle is connected with a main pressure bottle through a pressurizing electromagnetic valve; the main pressure bottle is connected with a pressure pump; the pressure regulating pipe is also connected with a temperature regulator, the temperature regulator is connected with a circulating pipe through a temperature regulating pump, and the circulating pipe is communicated with the pressure pipe; the pressure dividing bottle is also connected with a pressure relief and limiting electromagnetic valve, the pressure relief and limiting electromagnetic valve is connected with the pressure relief bottle, and a controller controls the system. The invention can change the hardness and temperature of the face pad flexibly and individually, greatly meet the individual requirements of different sleepers on the face pad, and improve the sleeping comfort of the sleepers.
Description
Technical Field
The invention relates to furniture, in particular to a mattress pad, and particularly relates to a method and a structure for adjusting the hardness and the temperature of the mattress pad.
Background
In the prior art, a bed is a necessity of people's life, nearly one third of the life of a person is read on the bed, a mattress is a product for improving the sleep quality of the human body, the comfort level of the people can be improved, simultaneously, the physiological natural form of the human body in sleep can be maintained, the natural physiological bend of the human vertebra generated by evolution is a natural physiological form which needs to be kept by the human body all the time, when the natural physiological bend of the vertebra is changed by external force for a long time, the vertebra can not keep a natural vertical state on the middle section of the human body, the vertebra of the human body generates pathological abnormality, and various problems occur to the human body, therefore, the human body always keeps the natural physiological form in sleep, and the mattress is very significant for protecting the health of the human body. At present, the face pad of various mattresses can meet the requirements of various individuals to a certain extent through the design of materials and structures, but the real preference of each individual cannot be really met, so that a face pad is needed to be designed, and the preference of people is met to the maximum extent by adjusting the specific parameters of hardness and temperature of the face pad according to the specific physiological requirements of the individual body of each individual.
The existing bed mask basically has no temperature and hardness adjusting function, particularly heating products such as an additional electric blanket and the like can only perform unidirectional temperature adjustment, and a certain amount of electromagnetic radiation exists due to the existence of heating current, so that the bioelectric current of a human nervous system can be influenced, the sleeping quality of a person is influenced, and meanwhile, the danger of uncontrolled fire exists.
For example, the application number 201710113395. X discloses a technical scheme of 'an intelligent mattress adjustable according to sleeping posture', which comprises the following steps: the device comprises a latex layer covering a fixing plate, and a plurality of second sensors are fixed on the latex layer.
Analyzing the technical solution of this patent results in: the mattress face pad of this technique does not do the hardness and softness and adjusts, and it "still includes the emulsion layer that covers on the fixed plate, is fixed with a plurality of second inductors" on the emulsion layer, and its second inductor is not for the face pad setting.
Therefore, the hardness of the cushion is controlled, so that the whole mattress is more comfortable. Therefore, there is a need for a bed cover with safety, convenient hardness adjustment, and bi-directional temperature adjustment.
Disclosure of Invention
The invention aims to solve the problem that the hardness of the mattress surface cushion is not adjusted in the prior art, and a plurality of second sensors are fixed on the latex layer covered on the fixing plate and are not arranged for the surface cushion. "to provide a method and structure for adjusting the firmness and temperature of a mattress topper. According to the invention, the flexible pipelines are densely distributed in the face cushion, the hardness of the face cushion is controlled by pressurizing and decompressing the flexible pipelines, and the comfort level of the human body in sleeping is greatly improved.
The invention is realized by the following steps: a method of implementing a method of adjusting mattress topper hardness and temperature, comprising:
firstly, setting: the mattress pad is internally provided with a flexible pressure pipe, the pressure pipe is connected with a pressure regulating pipe through a sensor unit and then is connected with a pressure dividing bottle, and the pressure dividing bottle is connected with a main pressure bottle through a pressurizing electromagnetic valve;
the main pressure bottle is connected with a pressure pump;
the pressure regulating pipe is also connected with a temperature regulator, the temperature regulator is connected with a circulating pipe through a temperature regulating pump, and the circulating pipe is communicated with the pressure pipe;
the pressure-dividing bottle is also connected with a pressure-relief and pressure-limiting electromagnetic valve, and the pressure-relief and pressure-limiting electromagnetic valve is connected with the pressure-relief bottle;
a controller for controlling the system;
secondly, a main control single chip microcomputer U1 is arranged in the controller, and the main control single chip microcomputer U1 is connected with a keyboard circuit, a pressure pump driving circuit, a pressure relief bottle driving circuit, an A-area pressure solenoid valve driving circuit, an A-area pressure relief solenoid valve driving circuit, an A-area temperature regulating pump driving circuit, an A-area temperature regulator driving circuit, an A-area temperature detection input circuit, an A-area pressure detection input circuit, a main bottle pressure detection input circuit and a display;
thirdly, loading an A-area pressure regulating program module, an A-area temperature regulating program module, an A-area pressure detecting program module, an A-area temperature detecting program module, a keyboard management program module, a power failure notification program module, a display driving program module and a main bottle pressure detecting program module in a program memory of a main control singlechip U1, wherein all the program modules can be called and executed by a processor;
fourthly, during the power-on working period of the system, the main control singlechip U1 calls a main bottle pressure detection program module, an area A pressure regulation program module, an area A temperature regulation program module, an area A pressure detection program module and an area A temperature detection program module, and displays a main bottle pressure value and an area A temperature value on a display;
fifthly, when the hardness or the temperature of the mattress pad needs to be changed, corresponding data is input through a keyboard circuit and a display, and after confirmation, the main control singlechip U1 controls any one of a pressure pump, a pressure relief bottle, a temperature regulator, a temperature regulating pump, a pressurization solenoid valve and a pressure relief and limiting solenoid valve which need to be driven, or keeps the original state;
and sixthly, if the power supply is interrupted, the system keeps the state before power failure.
In the method, the output end of the A-area pressure detection input circuit is connected with one pin of a P1 port of a main control singlechip U1, and the pin is internally provided with an A/D interface.
In the method, the output end of the main bottle pressure detection input circuit is connected with one pin of a P1 port of a main control singlechip U1, and the pin is internally provided with an A/D interface.
In the method, the output end of the A-zone temperature detection input circuit is connected with one pin of a P0 port of a main control singlechip U1, the pin is set as a single-bus device interface, and a temperature sensor adopts DS18B 20.
In the method, the pressure relief and limiting solenoid valve and the pressurizing solenoid valve are both in a closed state when the power is off.
Implementing a structure for adjusting mattress topper firmness and temperature, the structure comprising:
the mattress pad is internally provided with a flexible pressure pipe, the pressure pipe is connected with a pressure regulating pipe through a sensor box and then is connected with a pressure dividing bottle, and the pressure dividing bottle is connected with a main pressure bottle through a pressurizing electromagnetic valve;
the main pressure bottle is connected with a pressure pump;
the pressure regulating pipe is also connected with a temperature regulator, the temperature regulator is connected with a circulating pipe through a temperature regulating pump, and the circulating pipe is communicated with the pressure pipe;
the pressure-dividing bottle is also connected with a pressure-relief and pressure-limiting electromagnetic valve, and the pressure-relief and pressure-limiting electromagnetic valve is connected with the pressure-relief bottle;
a controller for controlling the system;
the controller is internally provided with a main control single chip microcomputer U1, and the main control single chip microcomputer U1 is connected with a keyboard circuit, a pressure pump driving circuit, a pressure relief bottle driving circuit, an A area pressure solenoid valve driving circuit, an A area pressure relief solenoid valve driving circuit, an A area temperature regulating pump driving circuit, an A area temperature regulator driving circuit, an A area temperature detection input circuit, an A area pressure detection input circuit, a main bottle pressure detection input circuit and a display.
The output end of the A-area pressure detection input circuit is connected with one pin of a P1 port of a main control singlechip U1, and the inside of the pin is set as an A/D interface; the output end of the A-zone temperature detection input circuit is connected with one pin of a P0 port of a main control singlechip U1, the pin is set as a single bus device interface, and a temperature sensor adopts DS18B 20; the output end of the main bottle pressure detection input circuit is connected with one pin of a P1 port of the main control single chip microcomputer U1, and an A/D interface is arranged inside the pin.
The main control singlechip U1 is connected with a wireless remote control circuit and receives signal data of a wireless remote controller.
The P1.0-P1.3 ports of the main control singlechip U1 are connected with a keyboard circuit, and the ports are arranged as A/D converters in the device.
The pressure relief and limiting solenoid valve and the pressurizing solenoid valve are both in a closed state when the power is off.
The invention embeds the flexible pressure pipeline in the face cushion of the conventional bed, is matched with a set of temperature and pressure control system, can flexibly and individually change the hardness and the temperature of the mask by controlling and adjusting the pressure and the temperature of a medium in the flexible pressure pipeline, greatly meets the individual experience of different sleepers on the face cushion, improves the sleeping comfort of the sleepers, and has very good practical significance for improving the sleeping quality of people and promoting the health.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the method and structure for adjusting the firmness and temperature of a mattress topper of the present invention;
FIG. 2 is a schematic diagram of a control circuit composed of a main control single chip microcomputer U1 in a controller according to the method and the structure for adjusting the hardness and the temperature of the mattress pad of the invention;
FIG. 3 is a block diagram of various program modules loaded in a program memory in a main control single chip microcomputer U1 involved in the method and structure for adjusting the hardness and temperature of a mattress pad according to the present invention;
FIG. 4 is a schematic diagram of a pressure and temperature sensor circuit 22 involved in the method and structure of adjusting mattress topper firmness and temperature of the present invention;
FIG. 5 is a schematic diagram of the structure of the sensor box 2C and the main sensor box 2D arranged on the main pressure bottle and the pressure regulating pipe in the area of the sensor box 2A, B and the sensor box 2B, C, according to the method and the structure for regulating the hardness and the temperature of the mattress pad of the invention;
fig. 6 is a schematic structural diagram of a wireless remote controller 9 related to the method and structure for adjusting the hardness and temperature of the mattress surface pad.
Detailed Description
The present invention will be described in further detail with reference to preferred embodiments.
Referring to fig. 1 to 6, the first embodiment implements a method for adjusting the firmness and temperature of a mattress pad by controlling the entire pad as zone a, and includes the steps of:
firstly, setting: a mattress pad 4, wherein a flexible pressure pipe 3 is arranged in the mattress pad, the pressure pipe 3 is connected with a pressure regulating pipe 54 through a sensor unit 2A and then is connected with a partial pressure bottle 52, and the partial pressure bottle 52 is connected with a main pressure bottle 11 through a pressurizing electromagnetic valve 51;
the main pressure bottle 11 is connected with a pressure pump 10;
the pressure regulating pipe 54 is also connected with a temperature regulator 56, the temperature regulator 56 is connected with a circulating pipe 57 through a temperature regulating pump 55, and the circulating pipe 57 is communicated with the pressure pipe 3;
the partial pressure bottle 52 is also connected with a pressure relief and limiting electromagnetic valve 53, and the pressure relief and limiting electromagnetic valve 53 is connected with the pressure relief bottle 12;
a controller 8 controls the system;
secondly, arranging a main control single chip microcomputer U1 in the controller 8, wherein the main control single chip microcomputer U1 is connected with a keyboard circuit, a booster pump driving circuit, a pressure relief bottle driving circuit and an A-area pressurization electromagnetic valve driving circuit; the temperature control system comprises a driving circuit of a pressure relief solenoid valve in a region A, a driving circuit of a temperature regulating pump in the region A, a driving circuit of a temperature regulator in the region A, a temperature detection input circuit in the region A, a pressure detection input circuit in a main bottle and a display;
thirdly, loading an A-area pressure regulating program module 801, an A-area temperature regulating program module 802, an A-area pressure detection program module 821, an A-area temperature detection program module 822, a keyboard management program module 807, a power failure notification program module 809, a display driving program module 810 and a main bottle pressure detection program module 811 in a program memory 81 of a main control singlechip U1, wherein all the program modules can be called and executed by a processor;
fourthly, during the system power-on working period, the main control singlechip U1 calls a main bottle pressure detection program module 811, an A-area pressure regulation program module 801, an A-area temperature regulation program module 802, an A-area pressure detection program module 821 and an A-area temperature detection program module 822 to display a main bottle pressure value and an A-area pressure value and temperature value on the display;
fifthly, when the hardness or the temperature of the mattress pad needs to be changed, corresponding data is input through a keyboard circuit and a display, and after confirmation, the main control singlechip U1 controls any one of the pressure pump 10, the pressure relief bottle 12, the temperature regulator 56, the temperature regulating pump 55, the pressurization solenoid valve 51 and the pressure relief and limiting solenoid valve 53 which need to be driven, or keeps the original state;
and sixthly, if the power supply is interrupted, the system keeps the state before power failure.
In the method, the output end of the A-area pressure detection input circuit is connected with one pin of a P1 port of a main control singlechip U1, and the pin is internally provided with an A/D interface.
In the method, the output end of the main bottle pressure detection input circuit is connected with one pin of a P1 port of a main control singlechip U1, and the pin is internally provided with an A/D interface.
In the method, the output end of the A-zone temperature detection input circuit is connected with one pin of a P0 port of a main control singlechip U1, the pin is set as a single-bus device interface, and a temperature sensor adopts DS18B 20.
In the method, the pressure relief and limiting solenoid valve and the pressurizing solenoid valve are both in a closed state when the power is off.
A structure for adjusting the firmness and temperature of a mattress topper implementing the above method, said structure comprising:
a mattress pad 4, wherein a flexible pressure pipe 3 is arranged in the mattress pad, the pressure pipe 3 is connected with a pressure regulating pipe 54 through a sensor unit 2A and then is connected with a partial pressure bottle 52, and the partial pressure bottle 52 is connected with a main pressure bottle 11 through a pressurizing electromagnetic valve 51;
the main pressure bottle 11 is connected with a pressure pump 10;
the pressure regulating pipe 54 is also connected with a temperature regulator 56, the temperature regulator 56 is connected with a circulating pipe 57 through a temperature regulating pump 55, and the circulating pipe 57 is communicated with the pressure pipe 3;
the partial pressure bottle 52 is also connected with a pressure relief and limiting electromagnetic valve 53, and the pressure relief and limiting electromagnetic valve 53 is connected with the pressure relief bottle 12;
a controller 8 controls the system;
the controller 8 is internally provided with a main control singlechip U1, and the main control singlechip U1 is connected with a keyboard circuit, a pressure pump driving circuit, a pressure relief bottle driving circuit and an A-area pressure solenoid valve driving circuit; the temperature control system comprises a driving circuit of a pressure relief solenoid valve in a region A, a driving circuit of a temperature regulating pump in the region A, a driving circuit of a temperature regulator in the region A, a temperature detection input circuit in the region A, a pressure detection input circuit in a main bottle and a display.
The output end of the A-area pressure detection input circuit is connected with one pin of a P1 port of a main control singlechip U1, and the inside of the pin is set as an A/D interface; the output end of the A-zone temperature detection input circuit is connected with one pin of a P0 port of a main control singlechip U1, the pin is set as a single bus device interface, and a temperature sensor adopts DS18B 20; the output end of the main bottle pressure detection input circuit is connected with one pin of a P1 port of the main control single chip microcomputer U1, and an A/D interface is arranged inside the pin.
The main control singlechip U1 is connected with a wireless remote control circuit and receives signal data of the wireless remote controller 9.
The P1.0-P1.3 ports of the main control singlechip U1 are connected with a keyboard circuit, and the ports are arranged as A/D converters in the device.
The pressure relief and limiting solenoid valve and the pressurizing solenoid valve are both in a closed state when the power is off.
The second embodiment increases the temperature and pressure adjusting region to more than two: zone B as shown in fig. 1 is in the middle region of the face pad.
The B area pressure pipe 31 is connected with a B area pressure regulating pipe 64 through the sensor unit 2B and then is connected with a B area pressure bottle 62, and the B area pressure bottle 62 is connected with the main pressure bottle 11 through a B area pressurizing electromagnetic valve 61;
the B-area pressure regulating pipe 64 is also connected with a B-area temperature regulator 66, the B-area temperature regulator 66 is connected with a B-area circulating pipe 67 through a B-area temperature regulating pump 65, and the B-area circulating pipe 67 is communicated with the B-area pressure pipe 31;
the B-area pressure relief and limiting solenoid valve 63 is connected with the B-area pressure bottle 62, and the B-area pressure relief and limiting solenoid valve 63 is connected with the pressure relief bottle 12;
the controller 8 simultaneously carries out integrated control on the B area;
as shown in fig. 2, a keyboard circuit connected with a main control singlechip U1 is added with B area control content, a pressurizing pump driving circuit and a pressure relief bottle driving circuit are added as old, a B area pressurizing electromagnetic valve driving circuit, a B area pressure relief electromagnetic valve driving circuit, a B area temperature regulating pump driving circuit, a B area temperature regulator driving circuit, a B area temperature detection input circuit and a B area pressure detection input circuit are added, a main bottle pressure detection input circuit is added as old, and B area control content is added on a display.
The pins with A/D function of the selected single chip microcomputer model are all arranged at the port P1.
The output end of the B-area pressure detection input circuit is connected with one pin of a P1 port of a main control singlechip U1, and the inside of the pin is set to be in an A/D mode; the output end of the B-zone temperature detection input circuit is connected with one pin of a P0 port of a main control singlechip U1, the pin is set as a single-bus device interface, and a temperature sensor also adopts DS18B 20.
The wireless remote control circuit adds control data of the area B, and the signal data of the wireless remote controller 9 adds control data of the area B.
As shown in fig. 3, the main control single chip microcomputer U1 adds program modules for controlling the B area: a B-area pressure regulating program module 803, a B-area temperature regulating program module 804, a B-area pressure detecting program module 831 and a B-area temperature detecting program module 832.
As shown in fig. 4, the pressure-temperature sensor circuit 22 is applied to both the sensor cartridge 2A, the B block sensor cartridge 2B, the C block sensor cartridge 2C and the main sensor cartridge 2D shown in fig. 1;
as shown in fig. 5 and 4, the sensor box has a housing 20, a temperature sensor circuit 22 is arranged in the housing, and the temperature sensor can be DS18B20 which is a single bus device and can be driven by a pull-up resistor; the sealing gasket 25 is used for sealing between the housing 20 and the nozzle 24, the pipe head 26 is connected into the system, and the signal cable 27 transmits pressure and temperature signal data.
The pressure sensor IC6 can be selected from various types, and the measuring range can be about 0.1MPa to 0.2 MPa.
The output V0 of the operational amplifier IC3 is an analog quantity, the P1 port of the main control singlechip U1 needs to be subjected to A/D conversion, and when the main control singlechip U1 selects STC15W4K48S4, the conversion result is 11 bits, and the precision is enough.
As shown in fig. 6, the wireless remote controller 9 has added the control content of the B area.
In the second embodiment, as shown in fig. 1, a region C is also added, which is in the left area of the face pad.
The C area pressure pipe 32 is connected with a C area pressure regulating pipe 74 through the sensor unit 2C and then is connected with a C area pressure distinguishing bottle 72, and the C area pressure distinguishing bottle 72 is connected with the main pressure bottle 11 through a C area pressurizing electromagnetic valve 71;
the C-area pressure regulating pipe 74 is also connected with a C-area temperature regulator 76, the C-area temperature regulator 76 is connected with a C-area circulating pipe 77 through a C-area temperature regulating pump 75, and the C-area circulating pipe 77 is communicated with the C-area pressure pipe 32;
the C-region pressure-relief and pressure-limiting electromagnetic valve 73 is also connected with the C-region pressure-relief and pressure-limiting electromagnetic valve 72, and the C-region pressure-relief and pressure-limiting electromagnetic valve 73 is connected with the pressure-relief bottle 12;
the controller 8 simultaneously carries out integrated control on the area C;
as shown in fig. 2, a C-zone control content is added in a keyboard circuit connected with a main control singlechip U1, a pressurizing pump driving circuit and a pressure relief bottle driving circuit are added as before, a C-zone pressurizing electromagnetic valve driving circuit, a C-zone pressure relief electromagnetic valve driving circuit, a C-zone temperature regulating pump driving circuit, a C-zone thermostat driving circuit, a C-zone temperature detection input circuit and a C-zone pressure detection input circuit are added, and a main bottle pressure detection input circuit is added as before, and a C-zone control content is added on a display.
The pins with A/D function of the selected single chip microcomputer model are all arranged at the port P1.
The output end of the C-area pressure detection input circuit is connected with one pin of a P1 port of the main control singlechip U1, and the inside of the pin is set as an A/D interface; the output end of the C-zone temperature detection input circuit is connected with one pin of a P0 port of a main control singlechip U1, the pin is set as a single-bus device interface, and a temperature sensor also adopts DS18B 20.
The wireless remote control circuit adds control data of the area C, and the signal data of the wireless remote controller 9 adds control data of the area C.
As shown in fig. 3, the main control single chip microcomputer U1 adds program modules for controlling the area C: a zone C pressure regulating program module 805, a zone C temperature regulating program module 806, a zone C pressure detecting program module 841, and a zone C temperature detecting program module 842.
As shown in fig. 4, the pressure-temperature sensor circuit 22 is applied to both the sensor cartridge 2A, the B block sensor cartridge 2B, the C block sensor cartridge 2C and the main sensor cartridge 2D shown in fig. 1;
as shown in fig. 5 and 4, the sensor box has a housing 20, a temperature sensor circuit 22 is arranged in the housing, and the temperature sensor can be DS18B20 which is a single bus device and can be driven by a pull-up resistor;
the pressure sensor IC6 can be selected from various types, and the measuring range can be about 0.1MPa to 0.2 MPa.
The output V0 of the operational amplifier IC3 is an analog quantity, the P1 port of the main control singlechip U1 needs to be subjected to A/D conversion, and when the main control singlechip U1 selects STC15W4K48S4, the conversion result is 11 bits, and the precision is enough.
As shown in fig. 6, the wireless remote controller 9 has added the control content of the zone C.
The above description is only a preferred embodiment of the present invention, and the present invention should not be limited by the above description, which should be interpreted as limiting the scope of the present invention, since the person skilled in the art can change the invention in the details of the embodiment and the range of applications according to the spirit of the present invention.
Claims (10)
1. A method of adjusting mattress topper firmness and temperature, the method comprising:
firstly, setting: the mattress pad (4) is internally provided with a flexible pressure pipe (3), the pressure pipe (3) is connected with a pressure regulating pipe (54) through a sensor unit (2A) and then is connected with a partial pressure bottle (52), and the partial pressure bottle (52) is connected with a main pressure bottle (11) through a pressurizing electromagnetic valve (51);
the main pressure bottle (11) is connected with a pressure pump (10);
the pressure regulating pipe (54) is also connected with a temperature regulator (56), the temperature regulator (56) is connected with a circulating pipe (57) through a temperature regulating pump (55), and the circulating pipe (57) is communicated with the pressure pipe (3);
the pressure dividing bottle (52) is also connected with a pressure relief and limiting electromagnetic valve (53), and the pressure relief and limiting electromagnetic valve (53) is connected with the pressure relief bottle (12);
a controller (8) controls the system;
secondly, a main control single chip microcomputer U1 is arranged in a controller (8), and the main control single chip microcomputer U1 is connected with a keyboard circuit, a booster pump driving circuit, a pressure relief bottle driving circuit, an A-area booster solenoid valve driving circuit, an A-area pressure relief solenoid valve driving circuit, an A-area temperature regulating pump driving circuit, an A-area temperature regulator driving circuit, an A-area temperature detection input circuit, an A-area pressure detection input circuit, a main bottle pressure detection input circuit and a display;
thirdly, loading an A-area pressure regulating program module (801), an A-area temperature regulating program module (802), an A-area pressure detection program module (821), an A-area temperature detection program module (822), a keyboard management program module (807), a power failure notification program module (809), a display driving program module (810) and a main bottle pressure detection program module (811) in a program memory (81) of a main control singlechip U1, wherein all the program modules can be called and executed by a processor;
fourthly, during the system power-on working period, the main control singlechip U1 calls a main bottle pressure detection program module (811), an A-area pressure regulation program module (801), an A-area temperature regulation program module (802), an A-area pressure detection program module (821) and an A-area temperature detection program module (822) to display a main bottle pressure value and an A-area pressure value and a temperature value on a display;
fifthly, when the hardness or the temperature of the mattress pad needs to be changed, corresponding data are input through a keyboard circuit and a display, and after confirmation, the main control singlechip U1 controls any one of the pressure pump (10), the pressure relief bottle (12), the temperature regulator (56), the temperature regulating pump (55), the pressurizing solenoid valve (51) and the pressure relief and limiting solenoid valve (53) which need to be driven, or keeps the original state;
and sixthly, if the power supply is interrupted, the system keeps the state before power failure.
2. The method for adjusting the firmness and temperature of a mattress pad according to claim 1, wherein the output end of the A-zone pressure detection input circuit is connected with one pin of a P1 port of a main control single chip microcomputer U1, and the pin is internally provided with an A/D interface.
3. The method for adjusting the hardness and temperature of a mattress pad according to claim 1, wherein the output end of the main bottle pressure detection input circuit is connected with one pin of a P1 port of a main control single chip microcomputer U1, and the pin is internally provided with an A/D interface.
4. The method for adjusting the hardness and temperature of a mattress pad according to claim 1, wherein the output end of the A-zone temperature detection input circuit is connected with one pin of a P0 port of a main control single chip microcomputer U1, the pin is set to be a single bus device interface, and a DS18B20 is adopted as a temperature sensor.
5. The method of adjusting the firmness and temperature of a mattress topper of claim 1, wherein the pressure relief and limiting solenoid valve and the pressurization solenoid valve are both closed when de-energized.
6. A structure for adjusting the firmness and temperature of a mattress topper, the structure comprising:
the mattress pad (4) is internally provided with a flexible pressure pipe (3), the pressure pipe (3) is connected with a pressure regulating pipe (54) through a sensor unit (2A) and then is connected with a partial pressure bottle (52), and the partial pressure bottle (52) is connected with a main pressure bottle (11) through a pressurizing electromagnetic valve (51);
the main pressure bottle (11) is connected with a pressure pump (10);
the pressure regulating pipe (54) is also connected with a temperature regulator (56), the temperature regulator (56) is connected with a circulating pipe (57) through a temperature regulating pump (55), and the circulating pipe (57) is communicated with the pressure pipe (3);
the pressure dividing bottle (52) is also connected with a pressure relief and limiting electromagnetic valve (53), and the pressure relief and limiting electromagnetic valve (53) is connected with the pressure relief bottle (12);
a controller (8) controls the system;
the controller (8) is internally provided with a main control single chip microcomputer U1, and the main control single chip microcomputer U1 is connected with a keyboard circuit, a pressure pump driving circuit, a pressure relief bottle driving circuit, an A area pressure solenoid valve driving circuit, an A area pressure relief solenoid valve driving circuit, an A area temperature regulating pump driving circuit, an A area temperature regulator driving circuit, an A area temperature detection input circuit, an A area pressure detection input circuit, a main bottle pressure detection input circuit and a display.
7. The structure for adjusting the hardness and temperature of a mattress pad according to claim 6, wherein the output end of the A-zone pressure detection input circuit is connected with one pin of a P1 port of a main control singlechip U1, and the pin is internally provided with an A/D interface; the output end of the A-zone temperature detection input circuit is connected with one pin of a P0 port of a main control singlechip U1, the pin is set as a single bus device interface, and a temperature sensor adopts DS18B 20; the output end of the main bottle pressure detection input circuit is connected with one pin of a P1 port of the main control single chip microcomputer U1, and the inside of the pin is set to be in an A/D mode.
8. The structure for adjusting the hardness and the temperature of the mattress pad according to claim 6, wherein the main control singlechip U1 is connected with a wireless remote control circuit and receives signal data of a wireless remote controller (9).
9. The structure for adjusting the hardness and temperature of a mattress pad according to claim 6, wherein the P1.0-P1.3 ports of the main control single chip microcomputer U1 are connected with a keyboard circuit, and the ports are set to be in an A/D converter mode inside the device.
10. The structure for adjusting the hardness and temperature of a mattress pad according to claim 6, wherein the pressure relief and limiting solenoid valve and the pressurizing solenoid valve are both in a closed state when power is off.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010551693.9A CN111513513A (en) | 2020-06-17 | 2020-06-17 | Method and structure for adjusting hardness and temperature of mattress surface pad |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010551693.9A CN111513513A (en) | 2020-06-17 | 2020-06-17 | Method and structure for adjusting hardness and temperature of mattress surface pad |
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| CN111513513A true CN111513513A (en) | 2020-08-11 |
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| CN202010551693.9A Pending CN111513513A (en) | 2020-06-17 | 2020-06-17 | Method and structure for adjusting hardness and temperature of mattress surface pad |
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Citations (5)
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|---|---|---|---|---|
| CN106923565A (en) * | 2017-04-10 | 2017-07-07 | 冯小大 | One kind monitoring regulating mattress and Sleep-Monitoring bed |
| CN108514281A (en) * | 2018-04-27 | 2018-09-11 | 安徽网润数据科技有限公司 | A kind of modularization intelligent water bed temperature-adjustment pressure-adjustment system and method |
| CN111035183A (en) * | 2019-12-23 | 2020-04-21 | 西南交通大学 | Bed body structure with adjustable bed surface hardness |
| CN111227562A (en) * | 2020-03-20 | 2020-06-05 | 广东工业大学 | Mattress capable of adjusting hardness and control system thereof |
| CN212307378U (en) * | 2020-06-17 | 2021-01-08 | 雷士实业(香港)有限公司 | Structure for adjusting hardness and temperature of mattress pad |
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2020
- 2020-06-17 CN CN202010551693.9A patent/CN111513513A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106923565A (en) * | 2017-04-10 | 2017-07-07 | 冯小大 | One kind monitoring regulating mattress and Sleep-Monitoring bed |
| CN108514281A (en) * | 2018-04-27 | 2018-09-11 | 安徽网润数据科技有限公司 | A kind of modularization intelligent water bed temperature-adjustment pressure-adjustment system and method |
| CN111035183A (en) * | 2019-12-23 | 2020-04-21 | 西南交通大学 | Bed body structure with adjustable bed surface hardness |
| CN111227562A (en) * | 2020-03-20 | 2020-06-05 | 广东工业大学 | Mattress capable of adjusting hardness and control system thereof |
| CN212307378U (en) * | 2020-06-17 | 2021-01-08 | 雷士实业(香港)有限公司 | Structure for adjusting hardness and temperature of mattress pad |
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Application publication date: 20200811 |