CN111509531A - Stress-free clamping method for repetition frequency chip amplifier - Google Patents
Stress-free clamping method for repetition frequency chip amplifier Download PDFInfo
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- CN111509531A CN111509531A CN202010267888.0A CN202010267888A CN111509531A CN 111509531 A CN111509531 A CN 111509531A CN 202010267888 A CN202010267888 A CN 202010267888A CN 111509531 A CN111509531 A CN 111509531A
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- stress
- cover plate
- repetition frequency
- window glass
- frequency chip
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
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- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Optics & Photonics (AREA)
- Joining Of Glass To Other Materials (AREA)
Abstract
A stress-free clamping method for a repetition frequency chip amplifier is characterized in that the periphery of window glass is fixed on a cover plate through sealant and parting beads, a gain medium is fixed along the surface normal direction through a lamination, then the cover plate is sealed with two end faces of a chip frame, and the lamination is connected with the left inner wall and the right inner wall of the chip frame. The invention can realize the stress-free clamping of the repetition frequency chip amplifier, has the characteristics of ingenious conception, simplicity and feasibility, compact structure and convenient disassembly, and is particularly suitable for the stress-free clamping of the repetition frequency chip amplifier.
Description
Technical Field
The invention relates to an amplifier, in particular to a stress-free clamping method for a repetition frequency chip amplifier.
Background
With the intensive research of the ICF, the laser driving device is developing towards the direction of high energy repetition frequency, the chip amplifier is used as a key link for amplifying the energy of the high power laser device and provides more than 90% of energy, so the core of realizing the repetition frequency of the laser driving device is to realize the repetition frequency of the chip amplifier, the thermal management method based on liquid cooling is one of effective methods for realizing the repetition frequency of the chip amplifier, and due to the introduction of the cooling liquid, the traditional installation and calibration mode and structure are adopted, the repetition frequency chip amplifier presents different characteristics and phenomena from the traditional chip amplifier, specifically, the wavefront distortion is increased (several times) and the sealing performance does not meet the requirements, the normal use of the repetition frequency chip amplifier is severely limited, the problem commonly existing in the repetition frequency chip amplifier is a problem, and the research in the early stage shows that the phenomenon of the chip amplifier with large caliber (the caliber is more than 100 mm), and this phenomenon has a direct relationship with the mounting structure, so it is necessary to realize stress-free mounting and calibration of the repetition frequency chip amplifier.
Disclosure of Invention
The invention aims to solve the problems in the prior art, and provides a stress-free clamping method for a repetition frequency chip amplifier, which can realize the stress-free clamping of the repetition frequency chip amplifier, has the characteristics of ingenious design, simplicity and easiness, compact structure and convenience in disassembly, and is particularly suitable for the stress-free clamping of the repetition frequency chip amplifier.
The solution of the invention is as follows:
a stress-free clamping method for a repetition frequency chip amplifier is characterized by comprising the following steps:
1) the window glass of the repetition frequency chip amplifier is arranged in a cover plate, telescopic spacer bars with the initial section diameter of phi M (phi M is more than or equal to d3) are embedded into gaps at the periphery of the cover plate and the window glass, d3 is the width of the gap, then sealant is poured into the gaps at the periphery of the cover plate and the window glass, the window glass is installed and fixed on the cover plate by the spacer bars and the sealant, the stress-free installation of the window glass is realized, the window glass comprises upper window glass and lower window glass, and the cover plate comprises an upper cover plate and a lower cover plate;
2) the two ends of the lower cover plate are hermetically connected with the two frames, so that the stress-free sealing clamping of the lower window glass is realized;
3) the gain media are fixed along the normal direction of the surface of the gain media by means of the lamination sheets at two ends, the lamination sheets are connected with two inner walls of the sheet frame, the thickness of the lamination sheets is d2, the thickness of the gain media is d1, and d2-d1 are more than 0mm and less than 0.1mm, so that stress-free assembly and calibration of the gain media are realized;
4) and connecting the two ends of the upper cover plate with the upper surfaces of the two frames in a sealing manner, and finally realizing stress-free assembly and calibration of the repetition frequency chip amplifier.
The thickness of the lamination is d2, and the lamination is realized by overlapping two laminations or by machining the laminations once.
The parting strip is made of metal sealing rings, rubber sealing rings or cotton thin lines, and the tensile breaking strength of the parting strip is more than or equal to 10 kgf.
The sealant (3) is silicon rubber.
The invention has the technical effects that:
the invention has the advantages of ingenious design, simplicity, practicability and convenient disassembly, can realize the stress-free clamping of the repetition frequency chip amplifier, and promotes the real application of the repetition frequency chip amplifier.
Drawings
FIG. 1 is a schematic diagram of an embodiment of a stress-free clamping structure of a repetition frequency chip amplifier according to the present invention;
FIG. 2 is a schematic view of a non-stress clamping structure of window glass according to an embodiment of the present invention;
FIG. 3 is a schematic view of an embodiment of the present invention, illustrating a stress-free clamping structure of a gain medium;
fig. 4 is a diagram of the wavefront test effect of the embodiment of the present invention, (a) before clamping; (b) and (5) clamping.
Detailed Description
The present invention is illustrated by the following examples, which should not be construed as limiting the scope of the invention.
Examples
Referring to fig. 1, 2 and 3, the stress-free clamping method of the repetition frequency chip amplifier of the invention comprises the following steps:
1) the window glass 4 of the repetition frequency chip amplifier is arranged in a cover plate 1, a telescopic spacer 2 with an initial section diameter phi M (phi M is more than or equal to d3) is embedded in gaps around the cover plate 1 and the window glass 4, d3 is the width of the gap, then sealant 3 is poured into the gaps around the cover plate 1 and the window glass 4, the window glass 4 is installed and fixed on the cover plate 1 by the spacer 2 and the sealant 3, the stress-free installation of the window glass 4 is realized, the window glass 4 comprises an upper window glass 4 and a lower window glass 4, and the cover plate 1 comprises an upper cover plate 1 and a lower cover plate 1;
2) the two ends of the lower cover plate 1 are hermetically connected with the two frames 7, so that the stress-free sealing and clamping of the lower window glass 4 are realized;
3) the gain media 6 are fixed along the normal direction of the surface of the gain media 6 by means of the lamination sheets 5 at two ends, the lamination sheets 5 are connected with two inner walls of the sheet frame 7, the thickness of the lamination sheets 5 is d2, the thickness of the gain media 6 is d1, and d2-d1 are more than 0.1mm, so that the stress-free assembly and calibration of the gain media are realized;
4) and (3) hermetically connecting the two ends of the upper cover plate 1 with the upper surfaces of the two frames 7, and finally realizing stress-free assembly and calibration of the repetition frequency chip amplifier.
The thickness d2 of the lamination 5 is realized by overlapping two laminations or by machining the laminations at one time.
The division bar 2 is made of metal sealing rings, rubber sealing rings or cotton thin lines, and the tensile breaking strength of the division bar 2 is more than or equal to 10 kgf.
Examples
The distance between the laminations 5
The gain medium 6The thickness d1 of (1) is 10, the clearance d3 that keeps with apron 1 all around the window glass 4 is 3mm, the initial section diameter phi M of parting bead 2 be 4mm, prevent that sealed glue 3 from gluing the terminal surface of window glass 4 and influencing the dismantlement, then pour into sealed glue 3, realize the non-stress installation of window glass 4.
The material of the division bar 2 is a cotton fine line, the tensile breaking strength is 10kgf, the sealant is silicon rubber, the material of the window glass 4 is K9 glass, the thickness is 10mm, the size is 160mm × 280mm, the technical effects of the embodiment before and after installation are as shown in figure 4 (measured by a zygo interferometer, the measurement precision is +/-0.1 lambda, lambda is 632.8nm, the normal incidence is achieved, the measurement caliber phi is 130mm), the reflection wave fronts before and after installation are respectively 1.714 lambda and 1.549 lambda and are basically unchanged, and the stress-free installation is achieved.
Claims (4)
1. A stress-free clamping method for a repetition frequency chip amplifier is characterized by comprising the following steps:
1) the window glass (4) of the repetition frequency chip amplifier is arranged in a cover plate (1), a telescopic spacer bar (2) with an initial section diameter phi M (phi M is more than or equal to d3) is embedded in gaps around the cover plate (1) and the window glass (4), d3 is the width of the gap, sealant (3) is poured into the gaps around the cover plate (1) and the window glass (4), the spacer bar (2) and the sealant (3) are installed and fixed on the cover plate (1) to realize stress-free installation of the window glass (4), the window glass (4) comprises an upper window glass (4) and a lower window glass (4), and the cover plate (1) comprises an upper cover plate (1) and a lower cover plate (1);
2) two ends of the lower cover plate (1) are hermetically connected with the two frames (7) to realize the stress-free sealing and clamping of the lower window glass (4);
3) the gain media (6) are fixed along the normal direction of the surface of the gain media (6) by means of the lamination sheets (5) at two ends, the lamination sheets (5) are connected with two inner walls of the sheet frame (7), the thickness of the lamination sheets (5) is d2, the thickness of the gain media (6) is d1, and d2-d1 are more than 0.1mm, so that the stress-free assembly and calibration of the gain media are realized;
4) and (3) hermetically connecting the two ends of the upper cover plate (1) with the upper surfaces of the two frames (7), and finally realizing the stress-free assembly and calibration of the repetition frequency chip amplifier.
2. The stress-free clamping method for a repetition frequency chip amplifier according to claim 1, characterized in that the thickness d2 of the lamination (5) is achieved by stacking two laminations or by machining the laminations once.
3. The stress-free clamping method of the repetition frequency chip amplifier according to claim 1, characterized in that the material of the division bar (2) is a metal seal ring, a rubber seal ring or a cotton fine line, and the tensile breaking strength of the division bar (2) is not less than 10 kgf.
4. The stress-free assembly and calibration method for a repetition frequency chip amplifier according to claim 1, characterized in that said sealant (3) is silicone rubber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010267888.0A CN111509531B (en) | 2020-04-08 | 2020-04-08 | Stress-free clamping method for repetition frequency chip amplifier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010267888.0A CN111509531B (en) | 2020-04-08 | 2020-04-08 | Stress-free clamping method for repetition frequency chip amplifier |
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| Publication Number | Publication Date |
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| CN111509531A true CN111509531A (en) | 2020-08-07 |
| CN111509531B CN111509531B (en) | 2021-06-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010267888.0A Active CN111509531B (en) | 2020-04-08 | 2020-04-08 | Stress-free clamping method for repetition frequency chip amplifier |
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Citations (6)
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|---|---|---|---|---|
| US20070238219A1 (en) * | 2006-03-29 | 2007-10-11 | Glen Bennett | Low stress optics mount using thermally conductive liquid metal or gel |
| CN104218436A (en) * | 2014-09-26 | 2014-12-17 | 中国科学院上海光学精密机械研究所 | Cooling device of sheet neodymium glass laser amplifier based on sapphire cladding layer |
| CN105207045A (en) * | 2015-10-19 | 2015-12-30 | 中国科学院上海光学精密机械研究所 | Thermal distortion compensation device of disk laser amplifier |
| CN107404060A (en) * | 2017-07-26 | 2017-11-28 | 中国工程物理研究院激光聚变研究中心 | A kind of sheet laser amplifier and piece case |
| CN109411997A (en) * | 2018-11-08 | 2019-03-01 | 中国科学院上海光学精密机械研究所 | The cooling stacked repetition rate disk amplifier of xenon flash lamp pumping liquid |
| CN110943357A (en) * | 2019-11-27 | 2020-03-31 | 中国工程物理研究院激光聚变研究中心 | Combined sheet laser amplifier window assembly |
-
2020
- 2020-04-08 CN CN202010267888.0A patent/CN111509531B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070238219A1 (en) * | 2006-03-29 | 2007-10-11 | Glen Bennett | Low stress optics mount using thermally conductive liquid metal or gel |
| CN104218436A (en) * | 2014-09-26 | 2014-12-17 | 中国科学院上海光学精密机械研究所 | Cooling device of sheet neodymium glass laser amplifier based on sapphire cladding layer |
| CN105207045A (en) * | 2015-10-19 | 2015-12-30 | 中国科学院上海光学精密机械研究所 | Thermal distortion compensation device of disk laser amplifier |
| CN107404060A (en) * | 2017-07-26 | 2017-11-28 | 中国工程物理研究院激光聚变研究中心 | A kind of sheet laser amplifier and piece case |
| CN109411997A (en) * | 2018-11-08 | 2019-03-01 | 中国科学院上海光学精密机械研究所 | The cooling stacked repetition rate disk amplifier of xenon flash lamp pumping liquid |
| CN110943357A (en) * | 2019-11-27 | 2020-03-31 | 中国工程物理研究院激光聚变研究中心 | Combined sheet laser amplifier window assembly |
Non-Patent Citations (1)
| Title |
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| 王冰艳 等: "氙灯抽运液冷叠片式重复频率钕玻璃放大器研制", 《中国激光》 * |
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