CN111509531A - Stress-free clamping method for repetition rate chip amplifier - Google Patents

Abstract

A stress-free clamping method for a repetition frequency chip amplifier is characterized in that the periphery of window glass is fixed on a cover plate through sealant and parting beads, a gain medium is fixed along the surface normal direction through a lamination, then the cover plate is sealed with two end faces of a chip frame, and the lamination is connected with the left inner wall and the right inner wall of the chip frame. The invention can realize the stress-free clamping of the repetition frequency chip amplifier, has the characteristics of ingenious conception, simplicity and feasibility, compact structure and convenient disassembly, and is particularly suitable for the stress-free clamping of the repetition frequency chip amplifier.

Description

Stress-free clamping method for repetition rate chip amplifier

technical field

The invention relates to an amplifier, in particular to a stress-free clamping method for a repetition frequency chip amplifier.

Background technique

With the deepening of ICF research, laser driving devices are developing towards high-energy repetition frequency. As the key link of energy amplification in high-power laser devices, chip amplifiers provide more than 90% of the energy. The core is to realize the repetition frequency of the chip amplifier. The thermal management method based on liquid cooling is one of the effective methods to realize the repetition frequency of the chip amplifier. Chip amplifiers will show different characteristics and phenomena from traditional chip amplifiers, specifically the surge of wavefront distortion (several times) and the lack of sealing performance, which seriously limits the normal use of repetition frequency chip amplifiers. A common problem with repetition frequency chip amplifiers, our previous research shows that this phenomenon is more obvious for large-diameter (diameter φ100mm or more) chip amplifiers, and this phenomenon is directly related to the installation structure, so so It is necessary to realize the stress-free calibration of the repetition rate chip amplifier.

SUMMARY OF THE INVENTION

The purpose of the present invention is to solve the above-mentioned problems of the prior art, and propose a stress-free clamping method for the repetition frequency chip amplifier, which can realize the stress-free clamping of the repetition frequency chip amplifier, and has the advantages of ingenious design, simple and easy operation. , Compact structure and easy disassembly, especially suitable for stress-free clamping of chip amplifiers at repetitive frequencies.

The solution of the present invention is as follows:

A stress-free clamping method for a repetitive frequency chip amplifier is characterized in that the method comprises the following steps:

1) The window glass of the repetition frequency chip amplifier is placed in the cover plate, and a retractable, initial truncated diameter of φM (φM≥d3) is first embedded in the gap between the cover plate and the window glass. ), d3 is the width of the gap, and then pour sealant into the gap around the cover plate and the window glass, and the window glass relies on the spacer and the sealant It is installed and fixed on the cover plate to realize the stress-free installation of the window glass, the window glass includes an upper window glass and a lower window glass, and the cover plate includes an upper cover plate and a lower cover plate;

2) The two ends of the lower cover plate are hermetically connected with the two frames, so as to realize the stress-free sealing and clamping of the lower window glass;

3) Multiple sheets of gain medium are fixed by the laminations at both ends along the normal direction of the surface of the gain medium, the laminations are connected with the two inner walls of the sheet frame, and the thickness of the laminations is d2, so The thickness of the gain medium is d1, 0<d2-d1<0.1mm, which can realize the stress-free installation and calibration of the gain medium;

4) Sealing connection between the two ends of the upper cover plate and the upper surfaces of the two-piece frame, finally realizing stress-free installation and calibration of the repetition frequency chip amplifier.

The thickness of the lamination is d2, which is realized by stacking two laminations, or by one-time machining of the laminations.

The material of the spacer is a metal sealing ring, a rubber sealing ring or a thin cotton wire, and the tensile breaking strength of the spacer is ≥10kgf.

The sealant (3) is silicone rubber.

Technical effect of the present invention:

The invention is ingenious in conception, simple and easy to implement and convenient to disassemble, can realize stress-free clamping of the repetition frequency chip amplifier, and promote the real application of the repetition frequency chip amplifier.

Description of drawings

1 is a schematic diagram of an embodiment of a stress-free clamping structure of a repetition rate chip amplifier of the present invention;

2 is a schematic diagram of an embodiment of the present invention-window glass stress-free clamping structure;

FIG. 3 is a schematic diagram of the stress-free clamping structure of a gain medium according to an embodiment of the present invention;

Fig. 4 is a wavefront test effect diagram of an embodiment of the present invention. (a) Before clamping; (b) After clamping.

Detailed ways

The present invention will be described in detail below through examples, but the protection scope of the present invention should not be limited by this.

Example

Referring to Fig. 1, Fig. 2 and Fig. 3, the stress-free clamping method of the repetition frequency chip amplifier of the present invention includes the following steps:

1) The window glass 4 of the repetition frequency chip amplifier is placed in the cover plate 1, and a retractable, initial truncated diameter of φM is first embedded in the gap around the cover plate 1 and the window glass 4. (φM≥d3) spacer 2, d3 is the width of the gap, and then pour sealant 3 into the gap around the cover plate 1 and the window glass 4, and the window glass 4 Relying on the spacer 2 and the sealant 3 to be installed and fixed on the cover plate 1, the stress-free installation of the window glass 4 is realized. The window glass 4 includes an upper window glass 4 and a lower window glass 4. The cover plate 1 includes an upper cover 1 and a lower cover 1;

2) The two ends of the lower cover plate 1 are hermetically connected with the two frames 7, so as to realize the stress-free sealing and clamping of the lower window glass 4;

3) The multiple sheets of gain medium 6 are fixed by the laminations 5 at both ends along the normal direction of the surface of the gain medium 6, the laminations 5 are connected with the two inner walls of the sheet frame 7, and the laminations 5 The thickness of the gain medium 6 is d2, the thickness of the gain medium 6 is d1, 0<d2-d1<0.1mm, and the stress-free adjustment of the gain medium is realized;

4) Sealing connection between the two ends of the upper cover plate 1 and the upper surfaces of the two-piece frame 7, finally realizing stress-free installation and calibration of the repetition frequency chip amplifier.

The thickness of the laminations 5 is d2, which is realized by stacking two laminations, or by one-time machining of the laminations.

The material of the spacer 2 is a metal sealing ring, a rubber sealing ring or a thin cotton thread, and the tensile breaking strength of the spacer 2 is ≥10kgf.

Example

所述的增益介质6的厚度d1＝10，所述的窗口玻璃4的四周与盖板1保持的间隙d3为3mm，所述的隔条2的初始截径φM为4mm的，防止密封胶3粘结窗口玻璃4的端面而影响拆卸，然后灌注密封胶3，实现窗口玻璃4的无应力安装。The spacing of the laminations 5

The thickness d1 of the gain medium 6 is 10, the gap d3 between the surrounding of the window glass 4 and the cover plate 1 is 3mm, and the initial truncated diameter φM of the spacer 2 is 4mm, preventing the sealant 3 The end face of the window glass 4 is bonded to affect the disassembly, and then the sealant 3 is poured to realize the stress-free installation of the window glass 4 .

The material of the spacer 2 is cotton thin wire, the tensile breaking strength is 10kgf, the sealant is silicone rubber, the material of the window glass 4 is K9 glass, the thickness is 10mm, and the size is 160mm× 280mm, the technical effect of this embodiment before and after installation is shown in Figure 4 (measured by zygo interferometer, measurement accuracy ±0.1λ, λ=632.8nm, normal incidence, measurement aperture φ130mm), the reflected wavefronts before and after installation are 1.714λ and 1.549λ, basically unchanged, to achieve stress-free installation. Experiments show that the invention can realize stress-free clamping of repetitive frequency chip amplifiers, and has the characteristics of ingenious design, simple operation, compact structure and convenient disassembly, and is especially suitable for stress-free clamping of repetitive frequency chip amplifiers.

Claims (4)

1. A stress-free clamping method for a repetition frequency chip amplifier is characterized by comprising the following steps:

1) the window glass (4) of the repetition frequency chip amplifier is arranged in a cover plate (1), a telescopic spacer bar (2) with an initial section diameter phi M (phi M is more than or equal to d3) is embedded in gaps around the cover plate (1) and the window glass (4), d3 is the width of the gap, sealant (3) is poured into the gaps around the cover plate (1) and the window glass (4), the spacer bar (2) and the sealant (3) are installed and fixed on the cover plate (1) to realize stress-free installation of the window glass (4), the window glass (4) comprises an upper window glass (4) and a lower window glass (4), and the cover plate (1) comprises an upper cover plate (1) and a lower cover plate (1);

2) two ends of the lower cover plate (1) are hermetically connected with the two frames (7) to realize the stress-free sealing and clamping of the lower window glass (4);

3) the gain media (6) are fixed along the normal direction of the surface of the gain media (6) by means of the lamination sheets (5) at two ends, the lamination sheets (5) are connected with two inner walls of the sheet frame (7), the thickness of the lamination sheets (5) is d2, the thickness of the gain media (6) is d1, and d2-d1 are more than 0.1mm, so that the stress-free assembly and calibration of the gain media are realized;

4) and (3) hermetically connecting the two ends of the upper cover plate (1) with the upper surfaces of the two frames (7), and finally realizing the stress-free assembly and calibration of the repetition frequency chip amplifier.

2. The stress-free clamping method for a repetition frequency chip amplifier according to claim 1, characterized in that the thickness d2 of the lamination (5) is achieved by stacking two laminations or by machining the laminations once.

3. The stress-free clamping method of the repetition frequency chip amplifier according to claim 1, characterized in that the material of the division bar (2) is a metal seal ring, a rubber seal ring or a cotton fine line, and the tensile breaking strength of the division bar (2) is not less than 10 kgf.

4. The stress-free assembly and calibration method for a repetition frequency chip amplifier according to claim 1, characterized in that said sealant (3) is silicone rubber.

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