CN111503933A

CN111503933A - Novel semiconductor refrigeration piece of built-in wireless charging coil

Info

Publication number: CN111503933A
Application number: CN202010297402.8A
Authority: CN
Inventors: 韦陶
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-04-05
Filing date: 2020-04-15
Publication date: 2020-08-07

Abstract

The invention discloses a novel semiconductor refrigeration piece with a built-in wireless charging coil, which mainly comprises a semiconductor refrigeration piece back substrate, a semiconductor refrigeration piece particle element, a semiconductor refrigeration piece front substrate, a wireless charging coil module and a wireless charging circuit module, wherein after the wireless charging circuit module is electrified, the wireless charging coil module arranged inside the novel semiconductor refrigeration piece starts to emit energy outwards, and after the semiconductor refrigeration piece is electrified, the semiconductor refrigeration piece starts to refrigerate.

Description

Novel semiconductor refrigeration piece of built-in wireless charging coil

Technical Field

The invention relates to a novel semiconductor refrigeration piece and a wireless charging semiconductor refrigeration piece, which can be used for most devices needing cooling and supporting wireless charging in the market.

Background

At present, semiconductor refrigeration pieces on the market often only have an independent refrigeration or heating function and do not have a wireless charging function, most of mobile phone or tablet computer radiators adopt a semiconductor refrigeration mode to cool, but most of areas on the back of the mobile phone are occupied due to the radiator in the cooling process, so that the problem that a wireless charger cannot be used when the mobile phone radiator is used is solved, and the problem that the mobile phone radiator cannot be used when the wireless charger is used is solved.

When the traditional mobile phone wireless charger is used, the wireless charging transmitting terminal coil and the mobile phone built-in wireless charging receiving terminal coil generate current, so that the mobile phone built-in wireless charging receiving terminal coil is seriously scalded, and the risks of explosion and fire of a mobile phone battery are easily caused.

Disclosure of Invention

In order to overcome the defects, the wireless charging coil module is directly arranged in the semiconductor refrigerating sheet, so that the problems can be effectively solved. Because the semiconductor refrigeration and the wireless charging are carried out simultaneously, the semiconductor refrigeration piece can effectively reduce the temperature of the mobile phone and the built-in wireless charging receiving coil of the mobile phone during the wireless charging, thereby effectively avoiding potential safety hazards such as fire, scald and the like caused by scalding during the wireless charging of the mobile phone.

The invention has the beneficial effects that: can use wireless function of charging simultaneously when using the refrigeration of semiconductor refrigeration piece to sustainable reduction wireless charging coil gives the high temperature that the cell-phone brought, can effectively avoid because of a great deal of unknown risk that the high temperature brought.

The technical scheme adopted by the invention for solving the technical problem is that a wireless charging coil is internally integrated in a semiconductor refrigeration sheet, and the wireless charging coil comprises the following components: semiconductor refrigeration piece back base plate (1), semiconductor refrigeration piece particle component (2), semiconductor refrigeration piece front base plate (3), wireless charging coil module (4), wireless charging circuit module (5), semiconductor refrigeration piece back heat conduction module (6), generate heat the face heat dissipation to semiconductor refrigeration piece back base plate (1) and semiconductor refrigeration piece particle component (2) through semiconductor refrigeration piece back heat conduction module (6), carry out wireless charging to equipment such as cell-phones through built-in integrated wireless charging coil module (4) in the middle of the semiconductor refrigeration piece.

The final size dimensions of the various components described above vary depending on the application scenario.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 5 is a schematic structural diagram of the present invention.

Fig. 3 is an overall schematic view of the present invention.

FIG. 1/4 is a schematic diagram illustrating an exploded view of the present invention.

Fig. 2 is a schematic structural view of the semiconductor chilling plate of the present invention without the front substrate.

In the figure, the semiconductor refrigeration piece comprises a semiconductor refrigeration piece back substrate 1, a semiconductor refrigeration piece particle element 2, a semiconductor refrigeration piece front substrate 3, a wireless charging coil module 4, a wireless charging circuit module 5 and a semiconductor refrigeration piece back heat conduction module 6.

Detailed description and modes of assembly

The preferred embodiments of the present invention will be further described with reference to the accompanying drawings.

As shown in fig. 1 and 4, a novel semiconductor refrigeration piece of built-in wireless charging coil, it includes semiconductor refrigeration piece back base plate (1), semiconductor refrigeration piece particle component (2), semiconductor refrigeration piece front base plate (3), wireless charging coil module (4), wireless charging circuit module (5), semiconductor refrigeration piece back heat conduction module (6), semiconductor refrigeration piece particle component (2), wireless charging coil module (4), semiconductor refrigeration piece front base plate (3) arrange in proper order as shown in fig. 4 in semiconductor refrigeration piece back base plate (1) top, carry out weld forming through semiconductor refrigeration piece welding set to semiconductor refrigeration piece back base plate (1), semiconductor refrigeration piece particle component (2), semiconductor refrigeration piece front base plate (3) at last. The semiconductor refrigeration piece and the semiconductor refrigeration piece welding device are both in the prior art and are not described in detail herein.

After wireless charging circuit module (5) circular telegram, set up in inside wireless charging coil module (4) of the novel semiconductor refrigeration piece of an embedded wireless charging coil and begin outside emission energy, set up and utilize semiconductor particle element's Peltier effect after particle element (2) circular telegram in the inside semiconductor refrigeration piece of the novel semiconductor refrigeration piece of an embedded wireless charging coil, when the galvanic couple that the direct current was established ties through two kinds of different semiconductor materials, can absorb the heat respectively and emit the heat at the both ends of galvanic couple, can realize refrigerated purpose, the regional refrigeration that begins of semiconductor refrigeration piece front substrate (3).

It should be understood that the above embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same, and those skilled in the art can modify the technical solutions described in the above embodiments, or make equivalent substitutions for some technical features; and all such modifications and alterations are intended to fall within the scope of the appended claims.

Claims

1. The utility model provides a novel semiconductor refrigeration piece of built-in wireless charging coil which characterized in that:

the semiconductor refrigeration piece back substrate comprises a semiconductor refrigeration piece back substrate (1), a semiconductor refrigeration piece particle element (2), a semiconductor refrigeration piece front substrate (3), a wireless charging coil module (4), a wireless charging circuit module (5) and a semiconductor refrigeration piece back heat conduction module (6); the semiconductor refrigeration piece back base plate (1) is provided with a wireless charging coil module (4) installation position, and the wireless charging coil module (4) is arranged between the semiconductor refrigeration piece back base plate (1) and the semiconductor refrigeration piece front base plate (3).

2. The novel semiconductor refrigeration piece with the built-in wireless charging coil according to claim 1, characterized in that:

the main components comprise a semiconductor refrigeration piece back substrate (1), a semiconductor refrigeration piece particle element (2), a semiconductor refrigeration piece front substrate (3), a wireless charging coil module (4) and a wireless charging circuit module (5).

3. The novel semiconductor refrigeration piece with the built-in wireless charging coil according to claim 1, characterized in that:

the wireless charging coil module (4) is integrally arranged beside the particle element (2) of the semiconductor refrigerating sheet.

4. The novel semiconductor refrigeration piece with the built-in wireless charging coil according to claim 1, characterized in that:

the wireless charging coil module (4) and the semiconductor refrigeration piece particle element (2) are on the same plane.

5. The novel semiconductor refrigeration piece with the built-in wireless charging coil according to claim 1, characterized in that:

after wireless charging circuit module (5) circular telegram, set up in the inside wireless charging coil module (4) of the novel semiconductor refrigeration piece of a built-in wireless charging coil and begin to outside transmitting energy, set up and utilize semiconductor particle element's Peltier effect after semiconductor refrigeration piece particle element (2) circular telegram in the inside semiconductor refrigeration piece of the novel semiconductor refrigeration piece of a built-in wireless charging coil, when the galvanic couple that the direct current is established ties through two kinds of different semiconductor materials, can absorb the heat respectively and emit the heat at the both ends of galvanic couple, can realize cryogenic purpose, the regional refrigeration that begins of semiconductor refrigeration piece front base plate (3).

6. The novel semiconductor refrigeration piece with the built-in wireless charging coil according to claim 1, characterized in that:

after the semiconductor refrigeration piece particle element (2) and the wireless charging circuit module (5) are electrified, the novel semiconductor refrigeration piece wirelessly charges equipment while refrigerating.