CN111501112A - Device and method for preparing logic channel microfluidic chip - Google Patents
Device and method for preparing logic channel microfluidic chip Download PDFInfo
- Publication number
- CN111501112A CN111501112A CN202010356865.7A CN202010356865A CN111501112A CN 111501112 A CN111501112 A CN 111501112A CN 202010356865 A CN202010356865 A CN 202010356865A CN 111501112 A CN111501112 A CN 111501112A
- Authority
- CN
- China
- Prior art keywords
- metal ring
- contact switch
- liquid storage
- logic channel
- microfluidic chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- D—TEXTILES; PAPER
- D01—NATURAL OR MAN-MADE THREADS OR FIBRES; SPINNING
- D01D—MECHANICAL METHODS OR APPARATUS IN THE MANUFACTURE OF ARTIFICIAL FILAMENTS, THREADS, FIBRES, BRISTLES OR RIBBONS
- D01D5/00—Formation of filaments, threads, or the like
- D01D5/0007—Electro-spinning
- D01D5/0061—Electro-spinning characterised by the electro-spinning apparatus
-
- D—TEXTILES; PAPER
- D01—NATURAL OR MAN-MADE THREADS OR FIBRES; SPINNING
- D01D—MECHANICAL METHODS OR APPARATUS IN THE MANUFACTURE OF ARTIFICIAL FILAMENTS, THREADS, FIBRES, BRISTLES OR RIBBONS
- D01D5/00—Formation of filaments, threads, or the like
- D01D5/0007—Electro-spinning
- D01D5/0061—Electro-spinning characterised by the electro-spinning apparatus
- D01D5/0069—Electro-spinning characterised by the electro-spinning apparatus characterised by the spinning section, e.g. capillary tube, protrusion or pin
-
- D—TEXTILES; PAPER
- D01—NATURAL OR MAN-MADE THREADS OR FIBRES; SPINNING
- D01D—MECHANICAL METHODS OR APPARATUS IN THE MANUFACTURE OF ARTIFICIAL FILAMENTS, THREADS, FIBRES, BRISTLES OR RIBBONS
- D01D5/00—Formation of filaments, threads, or the like
- D01D5/0007—Electro-spinning
- D01D5/0061—Electro-spinning characterised by the electro-spinning apparatus
- D01D5/0076—Electro-spinning characterised by the electro-spinning apparatus characterised by the collecting device, e.g. drum, wheel, endless belt, plate or grid
- D01D5/0084—Coating by electro-spinning, i.e. the electro-spun fibres are not removed from the collecting device but remain integral with it, e.g. coating of prostheses
-
- D—TEXTILES; PAPER
- D01—NATURAL OR MAN-MADE THREADS OR FIBRES; SPINNING
- D01D—MECHANICAL METHODS OR APPARATUS IN THE MANUFACTURE OF ARTIFICIAL FILAMENTS, THREADS, FIBRES, BRISTLES OR RIBBONS
- D01D5/00—Formation of filaments, threads, or the like
- D01D5/0007—Electro-spinning
- D01D5/0061—Electro-spinning characterised by the electro-spinning apparatus
- D01D5/0092—Electro-spinning characterised by the electro-spinning apparatus characterised by the electrical field, e.g. combined with a magnetic fields, using biased or alternating fields
Abstract
The invention discloses a device for preparing a logic channel microfluidic chip, which comprises a high-voltage power supply, a low-voltage power supply, an upper sliding contact, an upper contact switch, a lower sliding contact, a lower contact switch, an air pump, a liquid storage cylinder, a spray head, a rack, a mobile console, an insulating support and a mobile platform. The metal ring group moves upwards around the liquid storage cylinder, the spinning solution in the liquid storage cylinder is heated by the low-voltage power supply, the spinning solution jet flow sprayed by the spray head generates a stronger whip effect under the action of a high-voltage electrostatic field, a spiral pattern is finally formed, after the metal ring group moves downwards, the metal ring group is grounded, the spinning solution jet flow is made to form a straight line shape, and the logic channel microfluidic chip is finally prepared. Also discloses a method for preparing the logic channel microfluidic chip, which has the characteristics of simple and rapid preparation process and high surface quality of the prepared logic channel microfluidic chip.
Description
Technical Field
The invention relates to the technical field of electrostatic spinning, in particular to a device and a method for preparing a logic channel microfluidic chip.
Background
The electrostatic spinning technology is a technology for preparing fiber yarns by utilizing a high-voltage electrostatic effect, and the principle of the technology is that high-voltage static electricity is added to a solution spray head during spinning, a high-voltage electrostatic field is formed between the solution spray head and a collecting device, a Taylor cone is formed at the spray head by a charged solution under the action of the high-voltage electrostatic field, then a spinning jet flow is formed by spraying from the cone tip, and finally spinning fibers in a certain shape are deposited on the collecting device. In electrostatic spinning, the magnitude and acting time of electric field force have certain influence on the formed spinning fiber structure. The method specifically comprises the following steps: when the solution nozzle and the collecting device are close to each other, the spinning jet flow is shot to the collecting device in a straight line, and straight-line fibers are formed on the collecting device, and the mode is called near-field electrospinning direct writing; when the solution nozzle and the collecting device are far away, the spinning jet whips when moving towards the collecting device, and fibers intertwined and crossed are formed on the collecting device, and the mode is called far-field electrostatic spinning.
The micro-fluidic chip laboratory is a biochemical experimental analysis platform which is miniaturized, integrated and automated and is constructed on a structure body with the size of several square centimeters or even smaller, and can control fluid to carry out a series of material interactions under the scales of microliter and nanoliter, so the device is called as the micro-fluidic chip laboratory because the device has smaller size, is shaped like an integrated circuit chip and can carry out biochemical experimental reaction. The logic channel micro-fluidic chip belongs to one of micro-fluidic chips, comprises a spiral channel and a linear channel, is a micro-fluidic chip for selecting liquid to circulate in the spiral channel or the linear channel, and has the function of logic selection channel.
Common materials for preparing logic channel microfluidic chips are: the silicon and glass are milled, etched and photoetched, such as the high molecular polymer of the Chinese patent CN201310203736.4, and molded and stamped. However, the methods mainly have the problems of high-end used instruments and equipment, complex operation, complex preparation process and poor surface quality of products.
Disclosure of Invention
In view of the above technical problems, an object of the present invention is to provide an apparatus for manufacturing a logic channel microfluidic chip, in which a metal ring set moves up around a liquid storage cylinder to generate a whip effect on a jet flow, and the metal ring set moves down to generate a concentrated restriction effect on a high-voltage electrostatic field, thereby manufacturing the logic channel microfluidic chip.
The technical scheme of the invention is realized by the following modes:
the device for preparing the logic channel microfluidic chip comprises a high-voltage power supply, a low-voltage power supply, an upper sliding contact, an upper contact switch, a lower sliding contact, a lower contact switch, an air pump, a liquid storage cylinder, a spray head, a rack, a mobile control platform, an insulating support and a mobile platform. The spinning solution is filled in the liquid storage cylinder, the top of the liquid storage cylinder is provided with an end cover, a connecting hole is formed in the center of the end cover, an outlet pipeline of the air pump is connected with the connecting hole, and the air pump is used for sending compressed air into the liquid storage cylinder. The bottom and the shower nozzle of liquid storage cylinder are connected, and the outer wall cover of liquid storage cylinder is equipped with the becket group, and becket group encircles and has the clearance with the outer wall of liquid storage cylinder, and becket group surrounds around the liquid storage cylinder. The metal ring group is welded with the insulating support, the right end of the insulating support is fixedly connected with the rack, and the fixed rack is connected with the mobile control platform; the spray head is connected with a high-voltage power supply which is used for generating a high-voltage electrostatic field. The top of the upper contact switch is connected with a low-voltage power supply, and the low-voltage power supply is used for electrifying the metal ring set. The metal ring group is used for heating the spinning solution in the liquid storage cylinder.
The metal ring group comprises an upper metal ring, an intermediate metal ring and a lower metal ring. The upper metal ring, the middle metal ring and the lower metal ring are coaxially and vertically welded on the insulating support at equal intervals. The upper metal ring is connected with one end of the upper sliding contact, the other end of the upper sliding contact is connected with the upper contact switch, the upper sliding contact is matched with the upper contact switch, and the upper sliding contact moves up and down in the upper contact switch.
The lower metal ring is connected with one end of the lower sliding moving contact, the other end of the lower sliding moving contact is connected with the lower contact switch, the lower sliding moving contact is matched with the lower contact switch, the lower sliding moving contact moves up and down in the lower contact switch, the lower contact switch is grounded, and the metal ring group is used for concentrating a high-voltage electrostatic field.
The mobile platform is located under the spray head, moves left and right under the spray head, is provided with a bottom PDMS (polydimethylsiloxane, hereinafter referred to as PDMS) substrate, and is grounded.
Compared with the prior art, the invention has the advantages that: the metal ring group moves upwards around the liquid storage cylinder, and a low-voltage power supply is connected to heat the spinning solution in the liquid storage cylinder. The high-voltage power supply is started, a high-voltage electrostatic field is generated between the spray head and the bottom PDMS substrate, the spray head sprays spinning solution to form jet flow, the heated spinning solution forms jet flow after coming out of the spray head, the jet flow generates a stronger whip effect under the action of the high-voltage electrostatic field and is deposited on the bottom PDMS substrate and moves left and right through the moving platform to form a spiral pattern. And after the metal ring group moves downwards, the metal ring group is grounded through a thin metal switch to generate a constraint effect on jet flow, so that the jet flow forms a straight line, and the logic channel microfluidic chip is finally prepared after solidification and cleaning. The device has the advantages of simple structure, easy installation, simple operation, simple process for preparing the logic channel microfluidic chip and higher quality of the prepared logic channel microfluidic chip.
The method is further optimized as follows: the shapes of the upper sliding contact and the lower sliding contact are cuboids.
The method is further optimized as follows: the sections of the upper contact switch and the lower contact switch are concave.
By adopting the technical scheme, the upper sliding contact moves up and down in the upper contact switch, and the section of the lower contact switch is concave.
The method is further optimized as follows: the low-voltage power supply is a low-voltage alternating current power supply, is AIWEITAIKE APS-4000A, and has a frequency of 45-250 HZ.
By adopting the technical scheme, the low-voltage power supply is used for supplying power to the upper metal ring.
The method is further optimized as follows: the voltage regulation range of the high-voltage power supply of the embodiment is-60 kV-60 kV.
By adopting the technical scheme, the high-voltage power supply is used for forming a high-voltage electrostatic field.
The method is further optimized as follows: the flow range of the air pump is 1ml/min-100 ml/min.
By adopting the technical scheme, the air pump can convey compressed air into the liquid storage cylinder.
The method is further optimized as follows: the upper contact switch and the lower contact switch are both royal V-shaped micro switches.
By adopting the technical scheme, the upper metal ring is electrified by the upper contact switch, and the lower metal ring is grounded by the lower contact switch.
The method is further optimized as follows: the maximum travel of the mobile console is 500 mm.
By adopting the technical scheme, the rack is driven to move by the mobile control platform.
The method is further optimized as follows: the nozzle is made of stainless steel and has a diameter of 20-1000 μm.
The technical scheme is adopted for spraying the jet spinning solution.
The invention also discloses a method for preparing the logic channel microfluidic chip by using the electrostatic spinning technology based on the device for preparing the logic channel microfluidic chip, which comprises the following steps:
(1) connecting and installing the device according to the requirement, and filling the prepared spinning solution into a liquid storage cylinder;
(2) placing the prepared bottom PDMS substrate on a horizontal moving platform and grounding, wherein the left end of the bottom PDMS substrate is positioned right below a spray head;
(3) adjusting a mobile console to drive a rack to move upwards, wherein the rack moves to drive a metal ring group to move upwards outside a liquid storage barrel, an upper metal ring moves upwards along with the metal ring group, an upper sliding contact moves upwards in a sliding mode of the upper metal ring and is connected with an upper contact switch, and a lower metal ring is aligned with the tip of a spray head;
(4) turning on a low-voltage alternating current power supply, enabling the upper contact switch to work to enable the metal ring to be electrified, and heating the spinning solution in the liquid storage cylinder;
(5) starting the air pump to enable the solution to flow out along the spray head, starting the high-voltage power supply, stretching the spinning solution at the spray head, forming jet flow and emitting the jet flow to the bottom PDMS substrate;
(6) starting the horizontal moving platform to move leftwards, enabling the jet flow to continuously swing in the moving process, and finally depositing a pattern with a certain form on the bottom PDMS substrate by the spinning solution;
(7) when the right end of the bottom PDMS substrate is moved out of the lower part of the spray head, stopping liquid supply, disconnecting all power supplies, taking out the substrate and curing;
(8) after the spinning solution is cured, covering a layer of PDMS solution on the bottom layer PDMS substrate and forming a middle layer PDMS substrate after the PDMS solution is cured;
(9) placing the middle-layer PDMS substrate on a mobile platform and grounding, wherein the left end of the middle-layer PDMS substrate is positioned under a spray head, adjusting a mobile console to enable a metal ring group to descend, and enabling a lower metal ring to be connected with a lower contact switch, the upper metal ring is flush with the bottom of the spray head, a lower sliding contact enters the lower contact switch, and the lower metal ring is grounded with the lower contact switch through the lower sliding contact;
(10) starting the air pump, delivering compressed air into the liquid storage cylinder by the air pump to enable the solution to flow out along the spray head, and starting the high-voltage power supply; a high-voltage electrostatic field is formed between the spinning solution and the middle-layer PDMS substrate; because the lower metal ring is grounded, an annular electric field can be formed between the lower metal ring and the solution jet, the jet is bound to prevent the lower metal ring from whip, and the spinning solution finally deposits a linear pattern on the middle-layer PDMS substrate;
(11) after the spinning solution is cured, covering a layer of PDMS solution on the middle layer of PDMS substrate and forming an upper layer of PDMS substrate after the PDMS solution is cured;
(12) and washing off the intermediate spinning solution to obtain the logic channel microfluidic chip.
By adopting the technical scheme, the upper metal ring and the lower metal ring are respectively electrified by moving the metal ring group up and down, a high-voltage electrostatic field is formed between the spinning solution and the bottom PDMS substrate, the spinning solution at the nozzle is stretched and forms jet flow to be jetted to the bottom PDMS substrate to form a certain pattern, the pattern is solidified, a layer of PDMS solution is covered, a middle PDMS substrate is formed after the PDMS solution is solidified, a linear pattern is deposited on the middle PDMS substrate after the lower metal ring is grounded, and the logic channel microfluidic chip is finally prepared. The preparation method has the characteristics of simple and rapid preparation process and high surface quality of the prepared logic channel microfluidic chip.
Drawings
FIG. 1 is a schematic view of the overall structure of the embodiment;
FIG. 2 is a schematic diagram of a pattern formed on an underlying PDMS substrate;
FIG. 3 is a schematic view of forming an intermediate layer PDMS substrate;
FIG. 4 is a schematic view of forming a line pattern on an intermediate PDMS substrate;
FIG. 5 is a schematic diagram of forming an upper PDMS substrate;
in the figure: 1-a high voltage power supply; 2-metal ring group; 21-upper metal ring; 22-metal ring; 23-lower metal ring; 3-upper sliding contact; 4-upper contact switch; 5-a low voltage power supply; 6, an air pump; 7-a rack; 8-a liquid storage cylinder; 81-end cap; 9-a mobile console; 10-an insulating support; 11-lower sliding contact; 12-lower contact switch; 13-spinning solution; 14-a spray head; 15-bottom layer PDMS substrate; 16-middle layer PDMS substrate; 17-upper PDMS substrate; 18-moving the platform.
Detailed Description
The technical solution of the present invention is further described below with reference to fig. 1, fig. 2, fig. 3, fig. 4 and fig. 5, and it should be noted in advance that the words upper, middle, lower, left and right indicating the directions in the present application are consistent with the directions indicated by the upper, middle, lower, left and right in the drawings of the specification.
A device for preparing a logic channel microfluidic chip is used for preparing the logic channel microfluidic chip and comprises a high-voltage power supply 1, a low-voltage power supply 5, an upper sliding contact 3, an upper contact switch 4, a lower sliding contact 11, a lower contact switch 12, an air pump 6, a liquid storage cylinder 8, a spray head 14, a rack 7, a mobile control platform 9, an insulating support 10 and a mobile platform 18, wherein the upper sliding contact 3, the lower sliding contact 12, the air pump and the liquid storage cylinder are sequentially connected.
The spinning solution 13 is filled in the liquid storage cylinder 8, and the liquid storage cylinder 8 is made of metal, so that the spinning solution 13 is heated. The top of the liquid storage cylinder 8 is provided with an end cover 81, the end cover 81 can be detached from the liquid storage cylinder 8, and the spinning solution 13 can be added into the liquid storage cylinder 8 by opening the end cover 81. The center of the end cover 81 is provided with a connecting hole, an outlet pipeline of the air pump 6 is connected with the connecting hole, and the air pump 6 is used for sending compressed air into the liquid storage cylinder 8. The bottom of the liquid storage cylinder 8 is connected with a spray head 14, and the spray head 14 is used for spraying the spinning solution 13. The outer wall cover of liquid storage cylinder 8 is equipped with metal ring group 2, and there is the clearance metal ring group 2 and liquid storage cylinder 8's outer wall, and metal ring group 2 centers on around liquid storage cylinder 8. The metal ring group 2 is welded with an insulating support 10, the right end of the insulating support 10 is fixedly connected with a rack 7, and the fixed rack 7 is connected with a mobile control platform 9. The mobile control platform 9 is used for driving the rack 7 to move up and down, so that the insulating bracket 10 moves up and down.
The metal ring set 2 includes an upper metal ring 21, an intermediate metal ring 22, and a lower metal ring 23. The upper metal ring 21, the middle metal ring 22 and the lower metal ring 23 are coaxially and equidistantly vertically welded on the insulating support 10, specifically, the upper metal ring 21 is welded on the top of the insulating support 10, the middle metal ring 22 is welded on the middle of the insulating support 10, and the lower metal ring 23 is welded on the bottom of the insulating support 10. The metal ring set 2 moves up and down with the insulating support 10.
The upper metal ring 21 is connected with one end of the upper sliding contact 3, the other end of the upper sliding contact 3 is connected with the upper contact switch 4, the upper sliding contact 3 is matched with the upper contact switch 4, the upper sliding contact 3 is cuboid, the section of the upper contact switch 4 is concave, and the upper sliding contact 3 moves up and down in the upper contact switch 4. The top of the upper contact switch 4 is connected with the low-voltage power supply 5, the low-voltage power supply 5 is used for supplying power to the upper metal ring 21, the metal ring group 2 is electrified, the spinning solution 13 in the liquid storage cylinder 8 is heated, the temperature of the heated spinning solution 13 is increased, and the fluidity is enhanced, so that the whipping property is enhanced under the action of a high-voltage electrostatic field, and the spinning solution 13 forms jet whipping after coming out of a spray head, so that spiral spinning fibers are generated, as shown in fig. 2. Specifically, the low-voltage power supply 5 is a low-voltage alternating-current power supply with the model of Avetaceae APS-4000A and the frequency of 45-250 HZ.
The moving platform 18 is located under the spray head 14, the moving platform 18 can move left and right under the spray head 14, the bottom layer PDMS substrate 15 is placed on the moving platform 18, and the bottom layer PDMS substrate 15 is grounded. Specifically, the bottom layer PDMS substrate 15 is prepared in advance, and the bottom layer PDMS substrate 15 is used to sequentially form the middle layer PDMS substrate 16 and the upper layer PDMS substrate 17, and is finally prepared into the logic channel microfluidic chip.
Specifically, the flow range of the air pump 6 in this embodiment is 1ml/min to 100ml/min, so as to achieve the purpose of delivering compressed air into the liquid storage cylinder.
Specifically, the nozzle 14 of the present embodiment is a medical injector nozzle 14 made of stainless steel, and has a diameter range of 20 μm to 1000 μm, and is selected according to actual use requirements, and is used for spraying the fluid-like spinning solution 13. Specifically, the voltage regulation range of the high-voltage power supply 1 of the embodiment is-60 kV, and the high-voltage power supply is available for purchase and use as an existing product.
Specifically, the mobile control console 9 of this embodiment chooses the mobile control console 9 that the producer was the production of the Dongjin smart machine for use, and the biggest stroke is 500mm, drives rack 7 through adjusting mobile control console 9 and reciprocates.
Specifically, the upper contact switch 4 and the lower contact switch 12 are both royal V-shaped microswitches, so that the upper metal ring is electrified for the upper contact switch, and the lower metal ring is grounded for the lower contact switch.
The working principle is as follows: the application takes whip effect generated by spinning solution 13 sprayed from a spray head 14 under the action of a high-voltage electrostatic field as a basic principle, and specifically comprises the following steps:
as shown in fig. 1, a spinning solution 13 is filled in a liquid storage cylinder 8, a moving platform 18 is located right below a spray head 14, a moving control platform 9 is adjusted to drive a rack 7 to move upwards, the rack 7 moves to drive a metal ring set 2 to move upwards outside the liquid storage cylinder 8, an upper metal ring 21 moves upwards along with the metal ring set 2, the upper metal ring 21 drives an upper sliding contact 3 to move upwards, and a lower metal ring 23 is flush with a tip of the spray head 14 and is connected with an upper contact switch 4. And meanwhile, the low-voltage power supply 5 is turned on to electrify the metal ring group 2, and the metal ring group 2 surrounds the liquid storage cylinder 8, so that an electric field is generated around and inside the liquid storage cylinder 8, and the electric field forms a vortex in the liquid storage cylinder 8 to heat the spinning solution 13 in the liquid storage cylinder 8. And starting the air pump 6, making the outside air into compressed air by the operation of the air pump 6, conveying the compressed air to the liquid storage cylinder 8, pressing the spinning solution 13 in the liquid storage cylinder 8 to the bottom of the liquid storage cylinder 8 and the spray head 14 by the compressed air, and spraying the fluid spinning solution 13 from the spray head 14. Starting the high-voltage power supply 1, because the bottom layer PDMS substrate 15 is grounded, a high-voltage electrostatic field is formed between the spinning solution 13 and the bottom layer PDMS substrate 15, the temperature of the heated spinning solution 13 is increased, the fluidity is enhanced, the whip effect is enhanced under the action of the high-voltage electrostatic field, the jet flow sprayed from the spray head 14 forms a spiral shape and is emitted to the bottom layer PDMS substrate 15, the moving platform 18 is moved left and right, and a spiral pattern is formed on the bottom layer PDMS substrate 15, as shown in FIG. 2.
The adjusting mobile console 9 drives the rack 7 to move downwards, the rack 7 moves to drive the metal ring group 2 to move downwards outside the liquid storage cylinder 8, the lower metal ring 23 moves downwards along with the metal ring group 2, the lower metal ring 23 drives the lower moving contact 11 to move downwards, the upper metal ring 21 is flush with the bottom of the spray head 14, the lower moving contact 11 enters the lower contact switch 12 to enable the lower metal ring 23 to be grounded, at the moment, the metal ring group 2 plays a role in concentrating a high-voltage electrostatic field, jet flow coming out of the spray head 14 is restrained to become a straight line, the mobile platform 18 is moved left and right, and a straight line pattern is formed on the middle-layer PDMS substrate, as shown in fig. 4 and 5. And finally preparing the logic channel microfluidic chip after curing and cleaning.
In summary, the metal ring set 2 moves upward around the liquid storage cylinder 8, and the low-voltage power supply 5 is connected to heat the spinning solution 13 in the liquid storage cylinder 8. The high-voltage power supply 1 is started, a high-voltage electrostatic field is generated between the spray head 14 and the bottom PDMS substrate 15, the spray head 14 sprays the spinning solution 13 to form jet flow, the heated spinning solution 13 forms jet flow after coming out of the spray head 14, the jet flow generates a stronger whip effect under the action of the high-voltage electrostatic field and is deposited on the bottom PDMS substrate 15, and the pattern in a spiral state is formed by moving the moving platform 18 left and right. And after the metal ring group 2 moves downwards, the restraint effect is generated on jet flow, so that the jet flow forms a straight line, and the logic channel microfluidic chip is finally prepared after solidification and cleaning. The device has the advantages of simple structure, easy installation, simple operation, simple process for preparing the logic channel microfluidic chip and higher quality of the prepared logic channel microfluidic chip.
A method for preparing a logic channel microfluidic chip by using an electrostatic spinning technology based on a device for preparing the logic channel microfluidic chip, please refer to fig. 1, fig. 2, fig. 3, fig. 4 and fig. 5, comprising the following steps:
(1) connecting and installing the device according to the requirement, and filling the prepared spinning solution into a liquid storage cylinder.
(2) And placing the prepared bottom layer PDMS substrate on a horizontal moving platform and grounding, wherein the left end of the bottom layer PDMS substrate is positioned under the spray head.
(3) Adjusting the mobile control console to drive the rack to move upwards, wherein the rack moves to drive the metal ring group to move upwards outside the liquid storage barrel, the upper metal ring moves upwards along with the metal ring group, the upper sliding contact moves upwards in the sliding process of the upper metal ring group and is connected with the upper contact switch, and the lower metal ring is parallel and level with the tip of the spray head.
(4) And turning on a low-voltage alternating current power supply, enabling the metal ring to be electrified by the operation of the upper contact switch, and forming eddy current in the liquid storage cylinder by an electric field generated by the alternating current power supply due to the fact that the metal ring surrounds the metal liquid storage cylinder to heat spinning solution in the liquid storage cylinder.
(5) Starting the air pump to make the solution flow out along the spray head, and starting the high-voltage power supply. As the bottom layer PDMS substrate is grounded, a high-voltage electrostatic field is formed between the spinning solution and the bottom layer PDMS substrate, and the spinning solution at the nozzle is stretched and forms jet flow to be emitted to the bottom layer PDMS substrate.
(6) Starting the horizontal moving platform to move leftwards, and due to the jet whip effect, the jet can continuously swing in the moving process, and finally the spinning solution deposits a pattern with a certain form on the bottom layer PDMS substrate, as shown in FIG. 2.
(7) When the right end of the bottom PDMS substrate is moved out of the lower part of the spray head, the liquid supply is stopped, all power supplies are disconnected, and the substrate is taken out and cured.
(8) After the spinning solution is cured, a layer of PDMS solution is coated on the bottom layer PDMS substrate and cured to form a middle layer PDMS substrate, as shown in fig. 3.
(9) The middle-layer PDMS substrate is placed on the mobile platform and grounded, the left end of the middle-layer PDMS substrate is located under the spray head, the mobile console is adjusted to enable the metal ring group to descend, the lower metal ring 23 is connected with the lower contact switch 12, the upper metal ring 21 is flush with the bottom of the spray head 14, the lower moving contact 11 enters the lower contact switch 12, and the lower metal ring 23 is grounded with the lower contact switch 12 through the lower moving contact 11.
(10) And starting the air pump, delivering compressed air into the liquid storage cylinder by the air pump to enable the solution to flow out along the spray head, and starting the high-voltage power supply. The middle layer PDMS substrate is grounded, a high-voltage electrostatic field is formed between the spinning solution and the middle layer PDMS substrate, the spinning solution at the nozzle is stretched and forms jet flow to be emitted to the middle layer PDMS substrate, and the horizontal moving platform is started to move leftwards. Since the lower metal ring is grounded, an annular electric field is formed between the lower metal ring and the solution jet, the jet is bound to prevent whip, and the spinning solution finally deposits a linear pattern on the middle-layer PDMS substrate, as shown in FIG. 4.
(11) After the spinning solution is cured, covering a layer of PDMS solution on the middle layer PDMS substrate and forming an upper layer PDMS substrate after the curing, as shown in fig. 5.
(12) And washing off the intermediate spinning solution to obtain a three-layer logic channel microfluidic chip with a specific channel, namely a logic channel microfluidic chip, as shown in fig. 5.
The upper metal ring and the lower metal ring are respectively electrified by moving the metal ring group up and down, a high-voltage electrostatic field is formed between the spinning solution and the bottom PDMS substrate, the spinning solution at the nozzle is stretched and forms jet flow to be jetted to the bottom PDMS substrate to form a certain pattern, the pattern is solidified, a layer of PDMS solution is covered and a middle PDMS substrate is formed after the PDMS solution is solidified, a linear pattern is deposited on the middle PDMS substrate after the lower metal ring is grounded, and finally the logic channel microfluidic chip is prepared. The preparation method has the characteristics of simple and rapid preparation process and high surface quality of the prepared logic channel microfluidic chip.
The present embodiment is only for explaining the invention, and it is not limited to the invention, and those skilled in the art can make modifications to the embodiment as necessary without inventive contribution after reading the present specification, but all of them are protected by the patent law within the scope of the present invention.
Claims (10)
1. An apparatus for preparing a logic channel microfluidic chip, comprising: the device comprises a high-voltage power supply, a low-voltage power supply, an upper sliding contact, an upper contact switch, a lower sliding contact, a lower contact switch, an air pump, a liquid storage cylinder, a spray head, a rack, a mobile console, an insulating support and a mobile platform; the spinning solution is filled in the liquid storage cylinder, an end cover is arranged at the top of the liquid storage cylinder, a connecting hole is formed in the center of the end cover, an outlet pipeline of the air pump is connected with the connecting hole, and the air pump is used for feeding compressed air into the liquid storage cylinder; the bottom of the liquid storage cylinder is connected with the spray head, the outer wall of the liquid storage cylinder is sleeved with the metal ring group, a gap exists between the metal ring group ring and the outer wall of the liquid storage cylinder, and the metal ring group surrounds the liquid storage cylinder; the metal ring group is welded with the insulating support, the right end of the insulating support is fixedly connected with the rack, and the fixed rack is connected with the mobile console; the spray head is connected with the high-voltage power supply, and the high-voltage power supply is used for generating a high-voltage electrostatic field; the top of the upper contact switch is connected with the low-voltage power supply, and the low-voltage power supply is used for electrifying the metal ring set; the metal ring group is used for heating the spinning solution in the liquid storage cylinder;
the metal ring group comprises an upper metal ring, an intermediate metal ring and a lower metal ring; the upper metal ring, the middle metal ring and the lower metal ring are coaxially and vertically welded on the insulating bracket at equal intervals; the upper metal ring is connected with one end of the upper sliding contact, the other end of the upper sliding contact is connected with the upper contact switch, the upper sliding contact is matched with the upper contact switch, and the upper sliding contact moves up and down in the upper contact switch;
the lower metal ring is connected with one end of the lower sliding contact, the other end of the lower sliding contact is connected with the lower contact switch, the lower sliding contact is matched with the lower contact switch, the lower sliding contact moves up and down in the lower contact switch, the lower contact switch is grounded, and the metal ring group is used for concentrating the high-voltage electrostatic field;
the mobile platform is located under the spray head, moves left and right under the spray head, and is provided with a bottom PDMS substrate which is grounded.
2. The apparatus for preparing a logic channel microfluidic chip according to claim 1, wherein: the shapes of the upper sliding contact and the lower sliding contact are cuboids.
3. The apparatus for preparing a logic channel microfluidic chip according to claim 1, wherein: the cross section of the upper contact switch and the cross section of the lower contact switch are concave.
4. The apparatus for preparing a logic channel microfluidic chip according to claim 1, wherein: the low-voltage power supply is a low-voltage alternating-current power supply, the model is AIWEITAIKE APS-4000A, and the frequency is 45-250 HZ.
5. The apparatus for preparing a logic channel microfluidic chip according to claim 1, wherein: the voltage regulation range of the high-voltage power supply is-60 kV-60 kV.
6. The apparatus for preparing a logic channel microfluidic chip according to claim 1, wherein: the flow rate of the air pump is 1ml/min-100 ml/min.
7. The apparatus for preparing a logic channel microfluidic chip according to claim 1, wherein: the upper contact switch and the lower contact switch are both royal V-shaped micro switches.
8. The apparatus for preparing a logic channel microfluidic chip according to claim 1, wherein: the maximum stroke of the mobile control platform is 500 mm.
9. The apparatus for preparing a logic channel microfluidic chip according to claim 1, wherein: the nozzle is made of stainless steel and has a diameter range of 20-1000 μm.
10. A method for preparing a logic channel microfluidic chip is characterized by comprising the following steps: the logic channel microfluidic chip is prepared by utilizing an electrostatic spinning technology based on a device for preparing the logic channel microfluidic chip, and the method specifically comprises the following steps:
(1) connecting and installing the device according to the requirement, and filling the prepared spinning solution into a liquid storage cylinder;
(2) placing the prepared bottom PDMS substrate on a horizontal moving platform and grounding, wherein the left end of the bottom PDMS substrate is positioned under a spray head;
(3) adjusting a mobile console to drive a rack to move upwards, wherein the rack moves to drive a metal ring group to move upwards outside a liquid storage barrel, an upper metal ring moves upwards along with the metal ring group, an upper sliding contact moves upwards in a sliding mode of the upper metal ring and is connected with an upper contact switch, and a lower metal ring is aligned with the tip of a spray head;
(4) turning on a low-voltage alternating current power supply, enabling the upper contact switch to work to enable the metal ring to be electrified, and heating the spinning solution in the liquid storage cylinder;
(5) starting an air pump to enable the solution to flow out along a spray head, starting a high-voltage power supply, stretching the spinning solution at the spray head, forming jet flow and emitting the jet flow to the bottom PDMS substrate;
(6) starting the horizontal moving platform to move leftwards, enabling the jet flow to continuously swing in the moving process, and finally depositing a pattern with a certain form on the bottom PDMS substrate by the spinning solution;
(7) when the right end of the bottom PDMS substrate is moved out of the lower part of the spray head, stopping liquid supply, disconnecting all power supplies, taking out the substrate and curing;
(8) after the spinning solution is cured, covering a layer of PDMS solution on the bottom layer PDMS substrate and forming a middle layer PDMS substrate after the PDMS solution is cured;
(9) placing the middle-layer PDMS substrate on a mobile platform and grounding, wherein the left end of the middle-layer PDMS substrate is positioned under a spray head, adjusting a mobile console to enable a metal ring group to descend, and enabling a lower metal ring to be connected with a lower contact switch, the upper metal ring is flush with the bottom of the spray head, a lower sliding contact enters the lower contact switch, and the lower metal ring is grounded with the lower contact switch through the lower sliding contact;
(10) starting the air pump, delivering compressed air into the liquid storage cylinder by the air pump to enable the solution to flow out along the spray head, and starting the high-voltage power supply; a high-voltage electrostatic field is formed between the spinning solution and the middle layer PDMS substrate; because the lower metal ring is grounded, an annular electric field can be formed between the lower metal ring and the solution jet, the jet is bound to prevent the lower metal ring from whip, and the spinning solution finally deposits a linear pattern on the middle-layer PDMS substrate;
(11) after the spinning solution is cured, covering a layer of PDMS solution on the middle layer of PDMS substrate and forming an upper layer of PDMS substrate after the PDMS solution is cured;
(12) and washing off the intermediate spinning solution to obtain the logic channel microfluidic chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010356865.7A CN111501112B (en) | 2020-04-29 | 2020-04-29 | Device and method for preparing logic channel microfluidic chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010356865.7A CN111501112B (en) | 2020-04-29 | 2020-04-29 | Device and method for preparing logic channel microfluidic chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111501112A true CN111501112A (en) | 2020-08-07 |
| CN111501112B CN111501112B (en) | 2021-12-24 |
Family
ID=71869551
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010356865.7A Active CN111501112B (en) | 2020-04-29 | 2020-04-29 | Device and method for preparing logic channel microfluidic chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111501112B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102162176A (en) * | 2011-03-16 | 2011-08-24 | 华中科技大学 | Micro-nano corrugated structure and preparation method thereof, and device and application of preparation method |
| KR20120056055A (en) * | 2010-11-24 | 2012-06-01 | 고려대학교 산학협력단 | Micro Valve Using Surface Tension, Micro Fluidic Chip Comprising the same, and the Preparation Method thereof |
| CN104358029A (en) * | 2014-10-17 | 2015-02-18 | 华中科技大学 | Method and device for preparing micro-nano corrugated structure by electrostatic spinning |
| CN104562231A (en) * | 2015-01-09 | 2015-04-29 | 苏州大学 | Jet flow-controllable bubble electrospinning apparatus |
| CN106732840A (en) * | 2017-01-24 | 2017-05-31 | 厦门大学 | The 3D printing method and device of nanofiber paper substrate layered manufacturing micro-fluidic chip |
| CN109468701A (en) * | 2018-10-19 | 2019-03-15 | 南通纺织丝绸产业技术研究院 | Electrostatic spinning apparatus, orientation Fe3O4/ Gr/PAN composite conducting nanofiber and preparation method thereof |
| CN109629015A (en) * | 2018-12-28 | 2019-04-16 | 李瑞锋 | A kind of separation control electric field Round Porous cylindricality electrostatic spinning apparatus and its spinning process |
| CN110735191A (en) * | 2019-10-30 | 2020-01-31 | 大连理工大学 | method and device for preparing super-large-area suspended nano-fiber net |
-
2020
- 2020-04-29 CN CN202010356865.7A patent/CN111501112B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20120056055A (en) * | 2010-11-24 | 2012-06-01 | 고려대학교 산학협력단 | Micro Valve Using Surface Tension, Micro Fluidic Chip Comprising the same, and the Preparation Method thereof |
| CN102162176A (en) * | 2011-03-16 | 2011-08-24 | 华中科技大学 | Micro-nano corrugated structure and preparation method thereof, and device and application of preparation method |
| CN104358029A (en) * | 2014-10-17 | 2015-02-18 | 华中科技大学 | Method and device for preparing micro-nano corrugated structure by electrostatic spinning |
| CN104562231A (en) * | 2015-01-09 | 2015-04-29 | 苏州大学 | Jet flow-controllable bubble electrospinning apparatus |
| CN106732840A (en) * | 2017-01-24 | 2017-05-31 | 厦门大学 | The 3D printing method and device of nanofiber paper substrate layered manufacturing micro-fluidic chip |
| CN109468701A (en) * | 2018-10-19 | 2019-03-15 | 南通纺织丝绸产业技术研究院 | Electrostatic spinning apparatus, orientation Fe3O4/ Gr/PAN composite conducting nanofiber and preparation method thereof |
| CN109629015A (en) * | 2018-12-28 | 2019-04-16 | 李瑞锋 | A kind of separation control electric field Round Porous cylindricality electrostatic spinning apparatus and its spinning process |
| CN110735191A (en) * | 2019-10-30 | 2020-01-31 | 大连理工大学 | method and device for preparing super-large-area suspended nano-fiber net |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111501112B (en) | 2021-12-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105772722B (en) | A kind of control device and apparatus and method for of control electric current body dynamics print resolution | |
| CN106273497B (en) | A kind of more Material cladding 3D printers and its working method and application | |
| CN103895345B (en) | A kind of multifunction electric fluid ink-jet print system and method | |
| CN103612394B (en) | High-voltage static drive and variable-diameter 3D (three dimensional) printer | |
| CN106553137B (en) | A kind of preparation method of diamond-resin grinding wheel | |
| CN103407163B (en) | A kind of micro-nano 3 D-printing ejecting device | |
| CN105369367B (en) | A kind of needleless nozzle electrospinning device of accurate feed flow | |
| CN102199795A (en) | Electrostatic spinning device | |
| CN107541798B (en) | Device for eliminating electrostatic influence in electrospinning direct writing | |
| CN103147138A (en) | Electrospinning direct-writing jet-printing device enhancing focusing function by virtue of double layers of air | |
| CN111501112B (en) | Device and method for preparing logic channel microfluidic chip | |
| CN106142571B (en) | The ultrasonic droplet ejection increasing material manufacturing device and method of many materials of variable speed | |
| CN103993371A (en) | Opening-closing induction type batch electro-spinning device | |
| US20160199869A1 (en) | Sprayer for a liquid coating product and spraying facility comprising such a sprayer | |
| CN103506720B (en) | Wire electric discharge apparatus, wire edm method, machining object | |
| CN109732902B (en) | Multi-mode printing method and device | |
| CN106391347A (en) | Electromagnetic field atomization diamond abrasive particle uniform jetting device and method | |
| CN111330754B (en) | Electrostatic spraying magnetic field assisted photocuring method and device | |
| CN104014884A (en) | Micro-fine wire electrical discharge machining device generating electrode wire based on electrostatic spinning | |
| CN113580565A (en) | Electric jet printing method for pre-printed functional layer induced jet flow | |
| CN205836254U (en) | A kind of electrohydrodynamics spray printing device of flexible electronic micro nano structure | |
| CN205395180U (en) | 3D printing pen | |
| CN102191574A (en) | Nano fiber batch manufacturing device | |
| CN104688383B (en) | A kind of rotation nozzle apparatus of 3D printer | |
| CN103203294B (en) | Electromagnetic micro jet device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |