CN111496389A - Method, equipment and product for forming specific contour separation on transparent planar substrate - Google Patents
Method, equipment and product for forming specific contour separation on transparent planar substrate Download PDFInfo
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- CN111496389A CN111496389A CN201910100295.2A CN201910100295A CN111496389A CN 111496389 A CN111496389 A CN 111496389A CN 201910100295 A CN201910100295 A CN 201910100295A CN 111496389 A CN111496389 A CN 111496389A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D79/00—Methods, machines, or devices not covered elsewhere, for working metal by removal of material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
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Abstract
The invention discloses a method, equipment and a product for separating a specific contour formed by a transparent plane substrate, wherein the method comprises the following steps: a contour cutting step, cutting the transparent plane substrate along the specific contour direction by using a first laser beam, and directionally damaging the transparent plane substrate along the inner transparent plane substrate surrounded by the specific contour; a heat influence step of generating a heat influence area on the inner transparent planar substrate surrounded by the specific contour by using a second laser beam to deform the transparent planar substrate inside the contour; and a profile separation step, namely blowing and spraying the deformed transparent planar substrate inside the profile by using compressed air or heated liquid flow so as to realize integral separation with the planar substrate outside the profile. The thickness range of the transparent substrate applicable to the method is larger, the size of the separated specific contour is also larger, and the obtained broken edge of the inner wall of the specific contour hole is smaller, so that more application requirements are met.
Description
Technical Field
The invention relates to the field of laser cutting, in particular to a method, equipment and a product for forming specific contour separation on a transparent planar substrate.
Background
As the 5G technology is mature day by day and industrial application scenes of transparent materials are more and more abundant, the technology for processing transparent materials by laser is more and more concerned, and at present, there are 3 main mainstream methods for processing transparent materials by laser in the market, namely, CO2Laser heating splinting, nanosecond and picosecond laser material removal processing, and ultrafast laser filamentation cutting. And with the continuous upgrading and development of products, the demand for glass panels is also increasing, and due to the structural requirements of the products, such as components like speakers, sensors, signal antennas and the like, if the components are covered by the panels, the performance of the components can be greatly affected, so that the shape profiles corresponding to the components need to be separated from the corresponding positions on the panels.
The prior art discloses a method for separating a specific contour on a transparent substrate by an ultrafast laser filament cutting method, wherein two different laser beams and two different sets of beam guiding lens systems are generated, but the focal points of the two sets of systems are different, and the focal length of the lens of one set of beams is significantly larger than that of the other set, for example, 120mm is compared with 40mm, so as to separate the specific contour on a planar substrate by respectively generating two sets of cutting lines, but the method has a certain limitation, and is biased to a circular hole or a long hole with a contour diameter smaller than 2.5mm, if a circular hole or other specific contour with a diameter larger than 4mm is to be separated on a transparent substrate with a thickness of 0.5mm to 2.5mm or even thicker, the inner wall of the method can generate micro cracks, and the effect is not ideal.
Disclosure of Invention
The present invention provides a method, an apparatus and a product for forming a specific profile separation on a transparent planar substrate, which are directed to overcome the above-mentioned drawbacks of the prior art. The thickness range of the transparent substrate applicable to the method is larger, the size of the separated specific contour is also larger, and the obtained broken edge of the inner wall of the specific contour hole is smaller, so that more application requirements are met.
The technical scheme adopted by the invention for solving the technical problem is as follows:
a method of forming contoured separations on a transparent planar substrate with a laser, said method comprising the steps of:
a contour cutting step, cutting the transparent plane substrate along the specific contour direction by using a first laser beam, and directionally damaging the transparent plane substrate along the inner transparent plane substrate surrounded by the specific contour;
a heat influence step, wherein a heat influence area is generated on the inner transparent plane substrate surrounded by the specific contour by using a second laser beam, so that the transparent plane substrate inside the contour is deformed, wherein the energy density of the second laser beam is less than that of the first laser beam;
and a profile separation step, namely blowing and spraying the deformed transparent planar substrate inside the profile by using compressed air or heated liquid flow so as to realize integral separation with the planar substrate outside the profile.
Further, the second laser beam is a gaussian laser beam, and the thermal influence step specifically includes: scanning by Gaussian laser beams with the beam waist radius of 0.5mm to 4mm along the specific contour direction at a distance of 0.5mm to 3mm, so that a heat affected zone is generated on the transparent plane substrate, and the transparent plane substrate in the contour is deformed. By controlling the distance between the second laser beam and the specific contour, the influence on the generation of the directional damage crack in the specific contour direction in the contour cutting step during the scanning of the second laser beam is avoided, so that the cutting effect of the inner hole of the directional damage crack is influenced.
Further, the scanning is performed once for the whole to generate a continuous heat affected zone on the transparent planar substrate in the outline, or the whole is scanned several times in sequence to generate several independent heat affected zones on the transparent planar substrate in the outline. When the specific contour shape is a simple shape, such as a circle, laser scanning can be performed inside the contour by adopting a one-time scanning mode, and when the specific contour shape is relatively complex, such as the shape has a plurality of folding angles or the contour size is large, a plurality of times of scanning is performed, a plurality of heat affected zones are generated along the inside of the contour, and the contour is deformed.
Still further, the wavelength of the second laser beam is 5000nm to 11000nm, the power is 10W to 400W, and the repetition frequency is 1kHz to 20 kHz. In the parameter range, the transparent plane substrate is scanned, so that the effects of energy consumption and specific contour separation can be considered, and the cutting effect of the produced product is better.
Further, the contour cutting step adopts laser filamentation cutting; the laser parameters adopted by the laser filamentation cutting are as follows: wavelength is 300nm to 1100nm, power is 1W to 50W, repetition frequency is 10kHZ to 200KH, single pulse energy is 100 muJ to 400 muJ, or 100uJ to 1000uJ, and laser pulse width is 300fs to 50 ps. In the parameter range, the transparent plane substrate is scanned, so that the effects of energy consumption and specific contour separation can be considered, and the cutting effect of the produced product is better.
Still further, the contour separation step specifically comprises:
blowing compressed air with pressure of 20-100 kPa onto the deformed transparent planar substrate inside the contour to separate the substrate from the planar substrate outside the contour integrally, or
And blowing the deformed transparent planar substrate inside the outline by using the heating liquid flow with the pressure of 1atm to 10atm, so that the transparent planar substrate can be integrally separated from the planar substrate outside the outline.
Still further, the thickness of the transparent plane substrate is more than 0.1 mm.
An apparatus applying the method for forming the specific contour separation on the transparent plane substrate by using the laser comprises a first laser, a second laser, a laser cutting head, a laser scanner, a pneumatic pump or a hydraulic pump and a matched pipeline, wherein the first laser is used for generating a first laser beam, and the first laser beam is emitted into the laser cutting head and is cut along the specific contour direction; the second laser is used for generating a second laser beam, and the second laser beam is emitted into the transparent plane substrate inside the outline of the laser scanner and deforms the transparent plane substrate; the pneumatic pump or the hydraulic pump generates compressed air or heating liquid flow, and the deformed transparent plane substrate in the outline is blown and sprayed through the pipeline.
The product is prepared by applying the method for forming the special profile separation on the transparent planar substrate by using the laser, and the taper of the inner wall of the inner hole of the special profile of the product is less than 1 degree, and the edge breakage is less than 10 mu m.
According to the method, the equipment and the product for separating the specific contour of the transparent plane substrate, compared with the traditional method for separating the specific contour, the method is provided with a heat influence step between the contour cutting step and the contour separating step, and a second laser beam different from the cutting laser of the first laser beam used in the contour cutting step is arranged, so that a heat influence area is generated on the internal transparent plane substrate surrounded by the specific contour by the second laser beam, the transparent plane substrate inside the contour is deformed, and is separated through the contour separating step, so that a round hole with a larger diameter or other residual materials with the specific contour can be separated, meanwhile, fewer microcracks are generated on the inner wall of the inner hole with the specific contour, and a product with better effect and ideal effect can be manufactured; after scanning, the transparent plane substrate inside the specific contour is deformed, and then the specific contour can be separated, but in order to facilitate the complete separation of the specific contour, an auxiliary means is adopted to facilitate the complete separation of the specific contour, for example, compressed gas is adopted to also heat a liquid flow to impact the liquid flow, so that the liquid flow is completely separated.
Drawings
In order to illustrate the solution of the present application more clearly, the drawings that are needed in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and that other drawings can be obtained by those skilled in the art without inventive effort.
FIG. 1 is a schematic diagram of the directional damage to a transparent substrate caused by a first laser beam of a method of forming a contoured separation on a transparent planar substrate using a laser according to the present invention.
FIG. 2 is a schematic diagram of a second laser beam used in a method of laser forming a contoured separation on a transparent planar substrate of the present invention to achieve an integral separation of material within the contour from the planar substrate.
Fig. 3 is a schematic structural view of an apparatus to which a method of forming a specific profile separation on a transparent planar substrate using a laser according to the present invention is applied.
FIG. 4 is a microscopic scan of the isolated contour holes of example 4 under certain parameters of a method of forming a specific contour isolation on a transparent planar substrate with a laser according to the present invention.
FIG. 5 is a microscopic scan of the isolated contour holes of example 5 under certain parameters of a method of forming a specific contour isolation on a transparent planar substrate with a laser according to the present invention.
FIG. 6 is a microscopic scan of the isolated contour holes of example 6 under certain parameters of a method of forming a specific contour isolation on a transparent planar substrate with a laser according to the present invention.
FIG. 7 is a method step of forming a contoured separation on a transparent planar substrate using a laser in accordance with the present invention.
Reference numerals:
1-incident laser light path, a first light path lens group 2, a laser cutting head 3, a second laser 4, a second light path lens group 5, a laser scanner 6 and a transparent plane substrate 7.
Detailed Description
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "including" and "having," and any variations thereof, in the description and claims of this application and the description of the above figures are intended to cover non-exclusive inclusions. The terms "first," "second," and the like in the description and claims of this application or in the above-described drawings are used for distinguishing between different objects and not for describing a particular order.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
Example 1
As shown in fig. 7, an embodiment of the present invention provides a method for forming a specific profile separation on a transparent planar substrate using a laser, the method comprising the steps of:
a contour cutting step, cutting the transparent plane substrate along the specific contour direction by using a first laser beam, so that the transparent plane substrate generates internal directional damage along the contour direction;
a heat influence step, wherein a plurality of independent heat influence areas are generated on the inner transparent plane substrate surrounded by the specific contour by using a second laser beam, wherein the energy density of the second laser beam is smaller than that of the first laser beam, so that the transparent plane substrate inside the contour is deformed;
and a profile separation step, namely blowing and spraying the deformed transparent planar substrate inside the profile by using compressed air or heated liquid flow so as to realize integral separation with the planar substrate outside the profile.
The outline cutting step adopts laser filamentation cutting, when ultrafast laser intensity pulses are focused in a transparent glass material, the ultrafast pulses generate a self-focusing phenomenon in the glass material to form a high-energy-density self-transmission channel, which is called as filamentation, and the laser filamentation cutting realization mode has various schemes, such as the laser filamentation cutting can be realized by various modes, such as burst (burst) pulse trains, non-diffraction Bessel beams or diffraction optics to realize multi-focus facula.
And the laser parameters adopted by the laser filamentation cutting are as follows: wavelength is 300nm to 1100nm, power is 1W to 50W, repetition frequency is 10kHZ to 200KH, single pulse energy is 100 muJ to 400 muJ, or 100uJ to 1000uJ, and laser pulse width is 300fs to 50 ps.
The second laser beam adopted in the thermal influence step is a gaussian laser beam, preferably a gaussian laser beam with a beam waist radius of 0.5mm to 4mm, so the thermal influence step of the embodiment specifically comprises: scanning a Gaussian laser beam with the beam waist radius of 0.5mm to 4mm along the specific contour direction in a mode of scanning in sequence on the whole on a path keeping a distance of 0.5mm to 3mm from the contour, and scanning for a plurality of times in total to generate a plurality of independent heat affected zones on the transparent plane substrate so as to deform the transparent plane substrate in the contour.
Therefore, the present embodiment is suitable for use in the case where the specific profile is a circular hole having a diameter of more than 10mm and a polygonal hole such as a triangle.
The contour separation step specifically comprises:
blowing compressed air with pressure of 20-100 kPa onto the deformed transparent planar substrate inside the contour to separate the substrate from the planar substrate outside the contour integrally, or
And blowing the deformed transparent planar substrate inside the outline by using the heating liquid flow with the pressure of 1atm to 10atm, so that the transparent planar substrate can be integrally separated from the planar substrate outside the outline.
With the increase of the size of the specific contour, the pressure of the compressed air or the heated liquid flow can be properly increased, and the success rate of blowing and separating the specific contour is improved, wherein the blowing is that the compressed air or the heated liquid flow which generates high pressure instantly through an air pressure pump or a hydraulic pump like a pneumatic nail gun is blown to the transparent plane substrate inside the specific contour, so that the transparent plane substrate inside the specific contour is separated from the transparent plane substrate outside the contour.
The thickness of the transparent plane substrate is more than 0.1 mm.
An apparatus for applying the method for forming the specific contour separation on the transparent planar substrate by using the laser according to the embodiment comprises a first laser, a second laser, a laser cutting head and a laser scanner, wherein the first laser is used for generating a first laser beam, and the first laser beam is emitted into the laser cutting head and is cut along the specific contour direction; the second laser is used for generating a second laser beam, and the second laser beam is emitted into the laser scanner to scan the transparent planar substrate inside the outline and deform the transparent planar substrate inside the outline; the device also comprises a pneumatic pump or a hydraulic pump and a matched pipeline, wherein the pneumatic pump or the hydraulic pump generates compressed air or heated liquid flow, and the deformed transparent plane substrate in the outline is blown and sprayed through the pipeline.
Wherein the movement path of the laser scanner is set up for a plurality of independent heat affected zones matching the heat affected step.
Of course, an optical path formed by the optical lens is also included for reflecting the laser beam generated in the laser into the laser cutting head.
Example 2
The embodiment of the invention provides a method for forming specific contour separation on a transparent plane substrate by using laser, which comprises the following steps:
a contour cutting step, cutting the transparent plane substrate along the specific contour direction by using a first laser beam, so that the transparent plane substrate generates internal directional damage along the contour direction;
a heat influence step, wherein a second laser beam is used for generating a continuous heat influence area on the inner transparent plane substrate surrounded by the specific contour, and the energy density of the second laser beam is smaller than that of the first laser beam, so that the transparent plane substrate inside the contour is deformed;
and a profile separation step, namely blowing and spraying the deformed transparent planar substrate inside the profile by using compressed air or heated liquid flow so as to realize integral separation with the planar substrate outside the profile.
The contour cutting step adopts laser filamentation cutting, and the laser filamentation cutting can be realized by various schemes, such as burst (burst) pulse train, non-diffraction Bessel beam or diffraction optics multifocal facula.
And the laser parameters adopted by the laser filamentation cutting are as follows: wavelength is 300nm to 1100nm, power is 1W to 50W, repetition frequency is 10kHZ to 200KH, single pulse energy is 100 muJ to 400 muJ, or 100uJ to 1000uJ, and laser pulse width is 300fs to 50 ps.
The second laser beam adopted in the thermal influence step is a gaussian laser beam, preferably a gaussian laser beam with a beam waist radius of 0.5mm to 4mm, so the thermal influence step of the embodiment specifically comprises: scanning a Gaussian laser beam with the beam waist radius of 0.5mm to 4mm along the direction of the specific contour in a mode of scanning the whole in sequence on a path keeping a distance of 0.5mm to 3mm from the contour, and scanning once in all to generate a continuous heat affected zone on the transparent plane substrate so as to deform the transparent plane substrate in the contour.
Therefore, the embodiment is suitable for the specific contour of a round hole with the diameter more than 5mm and less than 10 mm.
The contour separation step specifically comprises:
blowing compressed air with pressure of 20-100 kPa onto the deformed transparent planar substrate inside the contour to separate the substrate from the planar substrate outside the contour integrally, or
And blowing the deformed transparent planar substrate inside the outline by using the heating liquid flow with the pressure of 1atm to 10atm, so that the transparent planar substrate can be integrally separated from the planar substrate outside the outline.
The thickness of the transparent plane substrate is more than 0.1 mm. Preferably, the thickness of the transparent planar substrate is 0.1mm to 3 mm.
An apparatus for applying the method for forming the specific contour separation on the transparent planar substrate by using the laser according to the embodiment comprises a first laser, a second laser, a laser cutting head and a laser scanner, wherein the first laser is used for generating a first laser beam, and the first laser beam is emitted into the laser cutting head and is cut along the specific contour direction; the second laser is used for generating a second laser beam, and the second laser beam is emitted into the laser scanner to scan the transparent planar substrate inside the outline and deform the transparent planar substrate inside the outline; the device also comprises a pneumatic pump or a hydraulic pump and a matched pipeline, wherein the pneumatic pump or the hydraulic pump generates compressed air or heated liquid flow, and the deformed transparent plane substrate in the outline is blown and sprayed through the pipeline.
Wherein the movement path of the laser scanner is set to a continuous heat-affected zone in cooperation with the heat-affected step.
Of course, an optical path formed by the optical lens is also included for reflecting the laser beam generated in the laser into the laser cutting head.
The products manufactured by processing the transparent plane substrate with the thickness of more than 0.1mm by the method in the embodiment 1 and the embodiment 2 have the specific contour, the inner bore inner wall taper of the specific contour of the products is less than 1 degree, the edge breakage is less than 10 mu m, and the specific contour separation effect is better than that of the processing method in the prior art. And the contour separation effect is best when the thickness of the transparent planar substrate is 0.1mm to 3 mm.
Example 3
The cutting apparatus shown in fig. 3 comprises a first laser 1, a laser cutting head 3 and a first optical path lens group 2 for cooperating with the first laser 1 and the laser cutting head 3, and a laser beam generated by the first laser 1 is incident into the laser cutting head 3 by reflection of the first optical path lens group 2. As shown in fig. 1, when a laser beam is injected into the laser cutting head 3, a directional damage crack is formed on the transparent planar substrate 7 through the lens of the laser cutting head 3, and a directional damage crack having a specific shape and contour can be formed on the transparent planar substrate 7 along with the movement of the laser cutting head 3.
The cutting device further comprises a second laser 4, a laser scanner 6 and a second optical path lens group 5 for cooperating with the second laser 4 and the laser scanner 6, and a laser beam generated by the second laser 4 is incident into the laser scanner 6 by being reflected by the second optical path lens group 5. As shown in fig. 2, when a laser beam is incident into the laser scanner 6, the laser beam finally passes through a galvanometer of the laser scanner 6 and acts on the cull surrounded by the cut profile of a specific shape on the transparent planar substrate 7, thereby deforming the cull. Preferably, the laser scanner 6 scans inside the contour of the specific shape and at a distance of 0.5mm to 3mm from the contour in a similar path to the contour, so that a heat affected zone is generated on the transparent planar substrate 7, and the transparent planar substrate inside the contour is deformed. And blowing and spraying the deformed transparent planar substrate inside the outline by using compressed air or heated liquid flow so as to realize integral separation with the transparent planar substrate outside the outline.
As for the moving mode of laser cutting head 3 and laser scanner 6, can adopt portal frame and two sets of mutually perpendicular's lead screw drive mechanism, through the portal frame with laser cutting head 3 and/or laser scanner 6 hypothesis in the work platform top, place transparent plane base plate 7 at work platform, through the cooperation of two sets of mutually perpendicular's lead screw drive mechanism, can be so that laser cutting head 3 and laser scanner 6 can be on work platform's one side, move with arbitrary route, thereby can carry out laser filamentation cutting and laser scanning according to arbitrary route.
Of course, still include programmable control module, control module controls the removal route of above-mentioned laser cutting head 3 and laser scanner 6 at least, controls rotation and the positive and negative rotation of two sets of mutually perpendicular's lead screw drive mechanism promptly, controls the removal of laser cutting head 3 and laser scanner 6, and control module can be single facer, P L C or industry control host computer, including control chip and memory, the memory is used for storing control program, control chip is used for output control signal, control the rotation and the positive and negative rotation of the motor in the lead screw drive mechanism.
The specific contour may be a closed contour formed on the transparent planar substrate or a contour formed at an edge of the transparent planar substrate.
Examples 4 to 6 are 3 sets of examples of cutting a transparent planar substrate with a thickness of 1mm under different setting parameters and show the effect of scanning with a microscope.
Example 4
Firstly, scanning a laser beam with the wavelength of 300nm, the power of 20W and the repetition flatness of 35kHZ along the contour direction on a transparent planar substrate with the thickness of 1mm to enable the substrate to generate internal directional damage along the contour direction;
secondly, scanning a Gaussian laser beam with the power of 30W, the wavelength of 5000nm, the repetition frequency of 15kHZ and the beam waist radius of 0.5mm on the material inside the circular contour along the contour line direction at a distance of 1mm from the center of the circle to generate 1 independent heat affected zone with the deformation distance of 0.8mm in the vertical direction;
and thirdly, blowing and spraying the deformed material in the profile by using compressed air with the pressure of 60kPa to separate the material in the profile from the substrate, preparing the circular profile inner hole shown in the figure 4, and displaying that the taper of the inner wall of the inner hole is less than 1 degree and the edge breakage is less than 10 microns according to a microscope scanning test result.
Example 5
Firstly, scanning a laser beam with the wavelength of 1100nm, the power of 20W and the repetition flatness of 35kHZ along the contour direction on a transparent planar substrate with the thickness of 1mm to enable the substrate to generate internal directional damage along the contour direction;
secondly, scanning a Gaussian laser beam with the power of 30W, the wavelength of 11000nm, the repetition frequency of 15kHZ and the beam waist radius of 0.5mm on the material inside the circular contour along the contour line direction at a distance of 1mm from the center of the circle to generate 1 independent heat affected zone with the deformation distance of 0.8mm in the vertical direction;
and thirdly, blowing and spraying the deformed material in the profile by using compressed air with the pressure of 60kPa to separate the material in the profile from the substrate, preparing the obtained circular profile inner hole shown in the figure 5, and displaying that the taper of the inner wall of the inner hole is less than 1 degree and the edge breakage is less than 10 microns according to a microscope scanning test result.
Example 6
Firstly, scanning a laser beam with the wavelength of 1030nm, the power of 20W and the repetition flatness of 35kHZ along the contour direction on a transparent planar substrate with the thickness of 1mm to enable the substrate to generate internal directional damage along the contour direction;
secondly, scanning a Gaussian laser beam with the power of 30W, the wavelength of 10600nm, the repetition frequency of 15kHZ and the beam waist radius of 0.5mm on the material inside the circular contour along the contour line direction at a distance of 1mm from the center of the circle to generate 1 independent heat affected zone with the deformation distance of 0.8mm in the vertical direction;
and thirdly, blowing and spraying the deformed material in the profile by using compressed air with the pressure of 60kPa to separate the material in the profile from the substrate, preparing the obtained circular profile inner hole shown in the figure 6, and displaying that the taper of the inner wall of the inner hole is less than 1 degree and the edge breakage is less than 10 microns according to a microscope scanning test result.
The inventor finds a more preferable embodiment through long-term research and development, that is, in step 1, the laser beam with the wavelength of 1030nm is used for laser filamentation cutting, and in step 2, the gaussian laser beam with the wavelength of 10600nm is used for scanning, so that the inner wall separation effect of the separated inner hole with the specific contour is better, and the microscope scanning test results of the inner holes of the embodiments 4 to 6 can also show that the scanning result of the embodiment 6 is also better.
According to the method, the equipment and the product for separating the specific contour of the transparent plane substrate, compared with the traditional method for separating the specific contour, the method is provided with a heat influence step between the contour cutting step and the contour separating step, and a second laser beam different from the cutting laser of the first laser beam used in the contour cutting step is arranged, so that a heat influence area is generated on the internal transparent plane substrate surrounded by the specific contour by the second laser beam, the transparent plane substrate inside the contour is deformed, and is separated through the contour separating step, so that a round hole with a larger diameter or other residual materials with the specific contour can be separated, meanwhile, fewer microcracks are generated on the inner wall of the inner hole with the specific contour, and a product with better effect and ideal effect can be manufactured; after scanning, the transparent plane substrate inside the specific contour is deformed, and then the specific contour can be separated, but in order to facilitate the complete separation of the specific contour, an auxiliary means is adopted to facilitate the complete separation of the specific contour, for example, compressed gas is adopted to also heat a liquid flow to impact the liquid flow, so that the liquid flow is completely separated.
It is to be understood that the above-described embodiments are merely illustrative of some, but not restrictive, of the broad invention, and that the appended drawings illustrate preferred embodiments of the invention and do not limit the scope of the invention. This application is capable of embodiments in many different forms and is provided for the purpose of enabling a thorough understanding of the disclosure of the application. Although the present application has been described in detail with reference to the foregoing embodiments, it will be apparent to one skilled in the art that the present application may be practiced without modification or with equivalents of some of the features described in the foregoing embodiments. All equivalent structures made by using the contents of the specification and the drawings of the present application are directly or indirectly applied to other related technical fields and are within the protection scope of the present application.
Claims (10)
1. A method of forming a contoured separation on a transparent planar substrate using a laser, the method comprising the steps of:
a contour cutting step, cutting the transparent plane substrate along the specific contour direction by using a first laser beam, and directionally damaging the transparent plane substrate along the inner transparent plane substrate surrounded by the specific contour;
a heat influence step, wherein a heat influence area is generated on the inner transparent plane substrate surrounded by the specific contour by using a second laser beam, so that the transparent plane substrate inside the contour is deformed, wherein the energy density of the second laser beam is less than that of the first laser beam;
and a profile separation step, namely blowing and spraying the deformed transparent planar substrate inside the profile by using compressed air or heated liquid flow so as to realize integral separation with the planar substrate outside the profile.
2. The method of claim 1, wherein the second laser beam is a gaussian laser beam, and the thermal influencing step comprises: scanning by Gaussian laser beams with the beam waist radius of 0.5mm to 4mm along the specific contour direction at a distance of 0.5mm to 3mm, so that a heat affected zone is generated on the transparent plane substrate, and the transparent plane substrate in the contour is deformed.
3. The method of claim 2, wherein the scanning is performed once for the whole to generate the continuous heat-affected zone on the transparent planar substrate within the contour, or several times for the whole to generate several independent heat-affected zones on the transparent planar substrate within the contour.
4. The method of claim 3, wherein the second laser beam has a wavelength of 5000nm to 11000nm, a power of 10W to 400W, and a repetition rate of 1kHz to 20 kHz.
5. The method for forming contoured separations on transparent planar substrates using lasers as claimed in claim 1 wherein said contour cutting step uses laser filamentation cutting.
6. The method for forming contoured separations on transparent planar substrates with lasers according to claim 5, wherein said laser filamentation cuts employ laser parameters of: wavelength is 300nm to 1100nm, power is 1W to 50W, repetition frequency is 10kHZ to 200KH, single pulse energy is 100 muJ to 400 muJ, or 100uJ to 1000uJ, and laser pulse width is 300fs to 50 ps.
7. The method for forming a specific profile separation on a transparent planar substrate by using a laser according to claim 1, wherein the profile separation step is specifically:
blowing compressed air with pressure of 20-100 kPa onto the deformed transparent planar substrate inside the contour to separate the substrate from the planar substrate outside the contour integrally, or
And blowing the deformed transparent planar substrate inside the outline by using the heating liquid flow with the pressure of 1atm to 10atm, so that the transparent planar substrate can be integrally separated from the planar substrate outside the outline.
8. The method for forming profile-specific separations on transparent planar substrates using lasers according to any of claims 1 to 7, characterized in that said transparent planar substrate has a thickness greater than 0.1 mm.
9. An apparatus for applying the method of forming a specific profile separation on a transparent planar substrate with a laser according to any one of claims 1 to 8, comprising a first laser for generating a first laser beam which is incident into the laser cutting head and cuts along the specific profile direction, a second laser, a laser cutting head, a laser scanner, a pneumatic or hydraulic pump, and a pipeline in cooperation; the second laser is used for generating a second laser beam, and the second laser beam is emitted into the transparent plane substrate inside the outline of the laser scanner and deforms the transparent plane substrate; the pneumatic pump or the hydraulic pump generates compressed air or heating liquid flow, and the deformed transparent plane substrate in the outline is blown and sprayed through the pipeline.
10. A product prepared by the method for forming the special profile separation on the transparent plane substrate by using the laser according to any one of claims 1 to 8, wherein the special profile of the product has the inner bore taper of less than 1 degree and the edge breakage of less than 10 μm.
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| CN114131213A (en) * | 2021-11-10 | 2022-03-04 | 江苏大学 | Laser modification cutting and automatic separation method for transparent material closed graph hollow structure |
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