CN111491443A - Can splice circuit board and circuit board - Google Patents

Abstract

The invention provides a circuit board capable of being spliced and a circuit board, and relates to the technical field of electronic circuits. The circuit board capable of being spliced provided by the invention comprises a substrate, wherein the substrate is divided into a circuit area and a connection area surrounding the circuit area, the circuit area is used for placing a circuit, and the connection area is used for realizing the electric connection between different circuit boards capable of being spliced; at least one pore canal, wherein the first opening of the pore canal is positioned on the upper surface of the connecting area, and the second opening of the pore canal is positioned on the side surface of the substrate; the connecting part is filled in the pore channel; the combination electrodes are positioned on the side surface of the substrate and are connected with the connecting parts in a one-to-one correspondence manner; when the circuit is arranged in the circuit area, at least one end of the circuit extends into the connection area and is connected with at least one connection part. The technical scheme of the invention can be used for manufacturing the large-scale circuit board more simply.

Description

Can splice circuit board and circuit board

Technical Field

The invention relates to the technical field of electronic circuits, in particular to a circuit board capable of being spliced and a circuit board.

Background

The circuit board is the main structure of electronic circuit, when developing electronic products, generally design the circuit schematic diagram first, make electronic circuit board by hand again, debug again, make formal printed circuit board after debugging is passed again, the circuit board preparation cycle that this kind of mode was made is long. At present, liquid metal is used for manufacturing the circuit board quickly, conveniently and at low cost in a printing mode, a printing mode and the like. However, the above method is limited by the size of the circuit board, and a large circuit board cannot be manufactured.

Disclosure of Invention

The invention provides a circuit board capable of being spliced and a circuit board, which can be used for manufacturing a large-scale circuit board relatively simply.

In a first aspect, the present invention provides a circuit board capable of being spliced, which adopts the following technical scheme:

the spliceable circuit board includes:

the circuit board comprises a substrate and a plurality of splicing circuit boards, wherein the substrate is divided into a circuit area and a connecting area surrounding the circuit area, the circuit area is used for placing circuits, and the connecting area is used for realizing the electric connection among different circuit boards which can be spliced;

at least one duct, a first opening of the duct being located at an upper surface of the connection region, a second opening of the duct being located at a side of the substrate;

at least one connecting part filled in the pore channel;

the combination electrode is positioned on the side surface of the substrate and is connected with the connecting parts in a one-to-one correspondence manner;

when the circuit is arranged in the circuit area, at least one end of the circuit extends into the connecting area and is connected with at least one connecting part.

Optionally, the spliceable circuit board includes a plurality of the holes, and the holes are distributed in the connection region at equal intervals.

Furthermore, the pore canals are L type, the arm length of the pore canals is larger than or equal to the pore diameter, and the distance between the pore canals is not less than the arm length of the pore canals.

Furthermore, the aperture of the pore canal is 1 mm-1 cm.

Optionally, the circuit board capable of being spliced further comprises a strip-shaped guide portion, and the guide portion is arranged on the side face of the substrate.

Furthermore, the guiding part is positioned below the combined electrode, and the guiding part is a trapezoid strip-shaped bulge with a self-locking structure or a trapezoid strip-shaped groove with a self-locking structure.

Further, the surface material of the guide portion is one of polytetrafluoroethylene, polyacetal, polyoxymethylene, polycarbonate, polysulfone, polyimide, polyether chloride, polyphenylene sulfide, and polyester terephthalate.

In a second aspect, the present invention provides a circuit board, which adopts the following technical solutions:

the circuit board comprises at least two or more than two spliced circuit boards which are spliced with each other, and the combined electrodes of the adjacent spliced circuit boards are in contact with each other.

Optionally, in adjacent circuit boards, the bonding electrode of one circuit board is a male terminal, and the bonding electrode of the other circuit board is a female terminal.

Further, the top of the male head is provided with a conductive elastic buckle.

The invention provides a circuit board capable of being spliced and a circuit board, wherein the circuit board capable of being spliced comprises a substrate, at least one pore channel, at least one connecting part and at least one combined electrode, wherein the substrate is divided into a circuit area and a connecting area surrounding the circuit area, the circuit area is used for placing circuits, the connecting area is used for realizing the electric connection between different circuit boards capable of being spliced, a first opening of the pore channel is positioned on the upper surface of the connecting area, a second opening of the pore channel is positioned on the side surface of the substrate, the connecting parts are filled in the pore channel, and the combined electrode is positioned on the side surface of the substrate and is connected with the connecting parts in. When a large circuit board is manufactured, the circuit board is only required to be split into a plurality of circuit boards which can be spliced and have the structure, the circuit boards which can be spliced are manufactured respectively, the circuit area of each manufactured spliced circuit board is internally provided with a circuit, at least one end of the circuit extends into the connecting area and is connected with at least one connecting part, then the circuit boards which can be spliced are spliced, and the combined electrodes of the adjacent circuit boards which can be spliced are contacted with each other in the splicing process, so that the circuit in the adjacent spliced circuit boards can be electrically connected.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a top view of a spliceable circuit board provided by an embodiment of the invention;

fig. 2 is a front view of a spliceable circuit board provided by an embodiment of the invention;

FIG. 3 is a first cross-sectional view along AA' of FIG. 1 according to an embodiment of the present invention;

FIG. 4 is a schematic cross-sectional view along AA' of FIG. 1 according to an embodiment of the present invention;

FIG. 5 is a first schematic structural diagram of a via and a bonding electrode according to an embodiment of the present invention;

fig. 6 is a second structural schematic diagram of a via and a bonding electrode according to an embodiment of the present invention;

FIG. 7 is a schematic structural diagram of a bonding electrode according to an embodiment of the present invention;

fig. 8 is a schematic structural diagram of a circuit board according to an embodiment of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that the technical features in the embodiments of the present invention may be combined with each other without conflict.

An embodiment of the present invention provides a circuit board and a circuit board capable of being spliced, and specifically, as shown in fig. 1, fig. 2, fig. 3, and fig. 4, fig. 1 is a top view of the circuit board capable of being spliced provided by the embodiment of the present invention, fig. 2 is a front view of the circuit board capable of being spliced provided by the embodiment of the present invention, fig. 3 is a first schematic cross-sectional view along an AA 'direction of fig. 1 provided by the embodiment of the present invention, fig. 4 is a second schematic cross-sectional view along the AA' direction of fig. 1 provided by the embodiment of the present invention, and the circuit board capable of being spliced includes:

the circuit board comprises a substrate 1, wherein the substrate 1 is divided into a circuit area 1a and a connection area 1b surrounding the circuit area 1a, the circuit area 1a is used for placing a circuit 5, and the connection area 1b is used for realizing the electric connection among different circuit boards which can be spliced;

at least one duct 2, a first opening of the duct 2 being located at an upper surface of the connection region 1b, a second opening of the duct 2 being located at a side surface of the substrate 1;

at least one connecting part 3, wherein the connecting part 3 is filled in the pore canal 2;

and the at least one combined electrode 4 is positioned on the side surface of the substrate 1, and is connected with the connecting parts 3 in a one-to-one correspondence manner.

When the circuit 5 is disposed in the circuit region 1a, at least one end of the circuit 5 extends into the connection region 1b and is connected to at least one connection portion 3.

It should be noted that the spliceable circuit board in the embodiment of the present invention protects not only the structure in which the wiring 5 is provided in the circuit region 1a but also the structure in which the wiring 5 is not provided in the circuit region 1a, because in the latter structure, although the wiring 5 is not provided, the provided wiring 5 inevitably satisfies the above-described positional relationship and connection relationship as long as the wiring 5 is provided.

In addition, the line 5 disposed in the circuit region 1a may be an integral structure, or may include a plurality of structures separated from each other, which is not limited in the embodiment of the present invention.

In the embodiment of the present invention, at least one duct 2 may be disposed only in the area where the circuit 5 extending into the connection area 1b is located, so that the structure of the circuit board capable of being spliced is relatively simple, and a plurality of ducts 2 may be uniformly distributed in the entire connection area 1b at equal intervals, so that the application range of the circuit board capable of being spliced is wider, and a person skilled in the art may select the duct according to actual needs.

The connection portions 3 may be in one-to-one correspondence with the ducts 2, that is, each duct 2 is filled with the connection portion 3, or the connection portions 3 may be in one-to-one correspondence with only the ducts 2 corresponding to the area where the circuit 5 extends into the connection area 1b, that is, only the duct 2 corresponding to the area where the circuit 5 extends into the connection area 1b is filled with the connection portions 3.

At least one end of the line 5 extends into the connection region 1b and is connected to at least one connection portion 3, which includes various situations, for example, one end of the line 5 extends into the connection region 1b and is connected to one connection portion 3, or one end of the line 5 extends into the connection region 1b and is connected to a plurality of connection portions 3, or a plurality of ends of the line 5 extends into the connection region 1b and each end is connected to one connection portion 3, or a plurality of ends of the line 5 extends into the connection region 1b and each end is connected to a plurality of connection portions 3.

When a large circuit board is manufactured, the circuit board is only required to be split into a plurality of circuit boards which can be spliced and have the structure, the circuit boards which can be spliced are manufactured respectively, the circuit 5 is arranged in the circuit area 1b of each manufactured circuit board which can be spliced, at least one end of each circuit 5 extends into the connecting area 1b and is connected with at least one connecting part 3, then the circuit boards which can be spliced are spliced, and the combined electrodes 4 of the adjacent circuit boards which can be spliced are contacted with each other in the splicing process, so that the circuit 5 in the adjacent circuit boards which can be spliced can be electrically connected.

In a specific example, taking the material of the connecting portion 3 as a liquid metal as an example, the manufacturing process of the spliceable circuit board includes:

step S1, providing a substrate;

step S2 of dividing a circuit region and a connection region on a substrate;

step S3, forming at least one pore canal in the connecting area;

step S4, installing a combination electrode at the second opening of the pore channel;

and step S5, filling liquid metal in the pore canal, and obtaining the connecting part after the liquid metal is solidified.

The manufacturing process of the spliced circuit board can further comprise the steps of manufacturing a circuit and connecting the circuit with the connecting part. In one example, after the step S5, the spliceable circuit board is manufactured according to the above 5 steps, and when the large circuit board needs to be spliced by using the spliceable circuit board, the circuit 5 is manufactured on the spliceable circuit board, and the circuit 5 is connected to the connection part 3; in yet another example, this step is between step S4 and step S5, i.e., when a large circuit board needs to be fabricated, the individual structures in the spliceable circuit board are fabricated from scratch.

The following embodiment of the present invention illustrates specific contents of the substrate 1, the via 2, the connecting portion 3, the bonding electrode 4, and the line 5 included in the spliceable circuit board.

Alternatively, the substrate 1 in the embodiment of the present invention may be a liquid metal-impregnated substrate, such as a resin plate, a rubber plate, a cloth, and paper. The substrate 1 may also be a substrate that is not itself infiltrated with liquid metal, but can be infiltrated with liquid metal after surface modification, such as wood, metal, cement, ceramic, etc. with resin and other materials attached to the surface. The arrangement enables the circuit 5 made of liquid metal to be manufactured on the substrate 1, so that the circuit 5 is simple to manufacture.

The inventors have found that it is difficult to form the cell channels 2 if the thickness of the substrate 1 is too small, and optionally the thickness of the substrate 1 is not less than 3 cm. Further, if the thickness of the base material 1 is too large, the base material is not easily attached or fixed to a wall surface or the like, and the use scene is limited, and the thickness of the base material 1 is preferably 3cm to 5 cm.

Optionally, as shown in fig. 1 and fig. 2, the circuit board capable of being spliced includes a plurality of holes 2, and the plurality of holes 2 are distributed in the connection region 1b at equal intervals, so that no matter whether the line 5 has one end or a plurality of ends extending into the connection region 1b, no matter what the line width of the line 5 is, the line 5 can be well connected with the connection portion 3 filled in the hole 2, so that the arrangement of the hole 2 in the circuit board capable of being spliced can be adapted to various different lines 5, and the application range of the circuit board capable of being spliced is wide.

Optionally, in the embodiment of the present invention, as shown in fig. 3 and 4, the duct 2 is L type, so that the shape rule of the duct 2 is easier to manufacture, and the connection portion 3 is easier to manufacture in the duct 2. optionally, in the embodiment of the present invention, the arm length of the duct 2 (which is collectively referred to as W1 and W2 in fig. 3 and 4) is selected to be greater than or equal to the aperture, the arm length of the duct 2 is mainly limited by the width of the connection region 1b, and the arm length of the duct 2 is greater than the aperture, so that it is avoided that the aperture of the duct 2 is too large, so that more ducts 2 can be disposed on the spliceable circuit board, and the application range of the spliceable circuit board is wide.

Optionally, the aperture of the pore channel 2 is 1mm to 1cm, so that the pore channel 2 is easy to manufacture, the number of the pore channels 2 which can be arranged on the circuit board can be spliced is large, the aperture of the pore channel 2 can be well matched with the printing line width of a conventional liquid metal printer, and the printed line corresponds to one pore channel 2.

Optionally, the material of connecting portion 3 is the liquid metal of melting point more than 50 degrees centigrade to make connecting portion 3 make easily, and in the use of can splicing the circuit board, connecting portion 3 can not melt, and structural stability is good.

Alternatively, as shown in fig. 3 and 4, one end of the bonding electrode 4 in the embodiment of the present invention is inserted into the second opening of the duct 2 and connected to the connecting portion 3, and the other end is a free end for contacting with the bonding electrode 4 of another circuit board that can be spliced to achieve electrical connection therebetween. Preferably, the bonding electrode 4 is free from gaps between the inner wall of the porthole 2 to prevent liquid metal from flowing out during the process of making the connection 3.

The combined electrode 4 may be a solid structure or a hollow structure surrounded by conductive foils, and when the combined electrode 4 is a hollow structure, the liquid metal is filled into the hollow structure in the process of filling the liquid metal to manufacture the connecting portion 3.

According to actual needs, the contact surface of the bonding electrode 4 (i.e., the surface of the free end of the bonding electrode 4) in the circuit board capable of being spliced in the embodiment of the present invention may be a plane or a curved surface (e.g., a convex surface or a concave surface), which is preferred in the embodiment of the present invention, as shown in fig. 5 and 6, fig. 5 is a first schematic structural diagram of the duct and the bonding electrode provided in the embodiment of the present invention, fig. 6 is a second schematic structural diagram of the duct and the bonding electrode provided in the embodiment of the present invention, and the contact surface of the bonding electrode 4 is a concave surface or a convex surface, i.e., the bonding electrode 4 is a female head (corresponding to the concave surface) or a male head (corresponding to the convex surface), so that after a plurality of circuit boards capable of being spliced are spliced, the contact area between the. In the example shown in fig. 5, the bonding electrode 4 is a male terminal, and in the example shown in fig. 6, the bonding electrode 4 is a female terminal. As will be understood by those skilled in the art, in a large circuit board formed by splicing a plurality of spliceable circuit boards, the bonding electrode 4 of one spliceable circuit board is a male terminal, and the bonding electrode 4 of the other spliceable circuit board is a female terminal.

Optionally, as shown in fig. 7, fig. 7 is a schematic structural diagram of the bonding electrode according to the embodiment of the present invention, when the bonding electrode 4 is a male head, a conductive elastic buckle 41 is disposed on a top portion of the bonding electrode 4 (i.e., a top portion of the male head), so that when the male head contacts with a corresponding female head, the elastic buckle 41 is compressed, and the fit between the male head and the female head is an interference fit, so that the electrical connection between the male head and the female head is good. Illustratively, as shown in fig. 7, the elastic buckle 41 includes an elastic member 41a, and an elastic piece 41b connected to a top of the elastic member 41a, and when compressed, the elastic piece 41b is pressed inward to compressively deform the elastic member 41 a. Optionally, the elastic member is a spring, and the elastic sheet is a copper foil.

Optionally, the material of the bonding electrode 4 is copper, so that the resistance of the bonding electrode 4 is small, and the self-lubricating property is good, and if silver is used, the silver is too expensive, and if aluminum is used, the gallium is corroded.

Optionally, the bonding electrodes 4 have a dimensional tolerance of less than 1mm to ensure good electrical contact when adjacent spliceable circuit boards are spliced together.

Alternatively, the line 5 may be a copper line, an aluminum line, or the like, or may be a liquid metal line. Preferably, the line 5 is a liquid metal line, so that the line can be manufactured and formed in various ways such as printing, spraying, hand-drawing and the like, and the manufacturing process is simple and has strong operability. The liquid metal is a simple metal with a melting point below 300 ℃, an alloy with a melting point below 300 ℃, or a conductive mixture with the simple metal or the alloy as a main component. Preferably, the liquid metal includes one or more of a gallium simple substance, an indium simple substance, a bismuth simple substance, a gallium-based alloy, an indium-based alloy, a bismuth-based alloy, and the like.

Alternatively, as shown in fig. 3 and 4, the spliceable circuit board further includes a strip-shaped guide portion 6, and the guide portion 6 is disposed on a side surface of the substrate 1. When splicing adjacent circuit boards which can be spliced, the guide parts 6 of the adjacent circuit boards which can be spliced are matched with each other, so that the two circuit boards which can be spliced in a proper direction, and the good connection effect between the combined electrodes of the two circuit boards which can be spliced is ensured.

Further, as shown in fig. 3 and 4, the guide portion 6 is located below the bonding electrode 4 so that the placement of the guide portion 6 does not adversely affect the pore canals 2 and the connection portion 3. Optionally, as shown in fig. 3 and 4, the guiding portion 6 is a trapezoidal strip-shaped protrusion with a self-locking structure, or a trapezoidal strip-shaped groove with a self-locking structure, so that when the circuit boards to be spliced are spliced together, the relative positions of adjacent circuit boards to be spliced are not easy to change, and the structure and performance of the spliced large circuit board are stable. In the example shown in fig. 3, the guide portion 6 is a trapezoidal strip-shaped groove having a self-locking structure, and in the example shown in fig. 4, the guide portion 6 is a trapezoidal strip-shaped protrusion having a self-locking structure.

Optionally, the surface material of the guide portion 6 is a self-lubricating material, such as one of polytetrafluoroethylene, polyacetal, polyoxymethylene, polycarbonate, polysulfone, polyimide, polyether chloride, polyphenylene sulfide, or polyester terephthalate, so that when the circuit boards to be spliced are spliced together, the friction between the guide portions 6 is small, the splicing is convenient, and the damage to the guide portion 6 is small.

It should be noted that, when the guiding portion 6 is a trapezoid strip-shaped protrusion with a self-locking structure, the trapezoid strip-shaped protrusion may be a homogeneous structure, and the material of the trapezoid strip-shaped protrusion is any one of the self-lubricating materials described above, or only the surface material of the trapezoid strip-shaped protrusion may be any one of the self-lubricating materials described above; when the guiding part 6 is a trapezoid strip-shaped groove with a self-locking structure, a layer of self-lubricating material is attached to the inner wall of the trapezoid strip-shaped groove, or a profile made of the self-lubricating material is adhered to the inner wall of the trapezoid strip-shaped groove.

Of course, the spliceable circuit board in the embodiment of the invention may further include a component connected to the line, a power supply, and other structures according to actual needs, which is not limited herein.

In addition, an embodiment of the present invention provides a circuit board, specifically, as shown in fig. 8, fig. 8 is a schematic structural diagram of the circuit board provided in the embodiment of the present invention, where the circuit board includes at least two or more than two joinable circuit boards that are spliced with each other, and the bonding electrodes 4 of the adjacent joinable circuit boards are in contact with each other. The circuit board can have functions of interaction, artificial intelligence and the like.

Optionally, in the adjacent spliceable circuit boards, the bonding electrode 4 of one spliceable circuit board is a male terminal, and the bonding electrode 4 of the other spliceable circuit board is a female terminal. Furthermore, the top of the male head is provided with a conductive elastic buckle.

It should be noted that all the contents of the above-mentioned spliceable circuit board are applicable to the circuit board including the same, and the details are not repeated herein.

Optionally, the process of manufacturing the circuit board includes:

step S11, disassembling the circuit board into a plurality of circuits with fixed size;

step S12, providing a plurality of substrates, wherein at least one pore canal is arranged in the connection area of the substrates, and a combination electrode is arranged at the second opening of the pore canal;

step S13, manufacturing a circuit on each spliceable circuit board by adopting printing, hand-drawing, spraying and other modes, and extending at least one end of the circuit to the vicinity of a pore channel in a connection area according to actual needs;

step S14, pouring liquid metal with the melting point higher than 50 ℃ into the pore channel until the liquid metal in the pore channel is flush with the surface of the substrate, standing until the liquid metal is solidified to form a connecting part;

step S15, connecting the connecting part in the pore canal with a circuit;

and step S16, splicing the plurality of circuit boards which can be spliced to enable the bonding electrodes of the adjacent circuit boards which can be spliced to contact with each other to obtain the circuit board.

In the above process, the bonding electrode is firstly placed at the second opening of the pore channel on the substrate, and then the connecting part is manufactured, so that better electric connection between the bonding electrode and the connecting part can be ensured, and the situation that the bonding electrode and the connecting part cannot be electrically connected is avoided.

In addition, in the above steps, those skilled in the art can check the conduction condition in time according to actual needs.

The process of manufacturing the circuit board may further include: one or more of the steps of attaching the components on the wires, and encapsulating the wires and components can be selected by those skilled in the art according to actual needs.

In a specific example, as shown in fig. 8, a 120cm by 90cm large-scale interactive circuit is split into four 60cm by 45cm small and medium-sized spliceable circuit boards, and in the process of splitting the circuit, the circuits at the splicing points are required to be in one-to-one parallel correspondence to ensure the conduction of each line. The manufacturing process of the circuit board comprises the following steps:

s21, splitting a circuit diagram into four parts of A/B/C/D, and enabling each connecting point to correspond in parallel one by one;

s22, respectively drawing or printing lines corresponding to all parts on the four spliceable circuit boards, pasting elements and carrying out packaging treatment;

s23, splicing the circuit boards which can be spliced in the same direction in the X-axis direction or the Y-axis direction according to the actual circuit condition;

s24, verifying the reliability of the circuit on one coordinate axis;

s25, splicing the circuit boards which can be spliced in the other coordinate axis direction;

and S26, verifying the reliability of the whole circuit.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.

Claims (10)

1. A spliceable circuit board, comprising:

the circuit board comprises a substrate and a plurality of splicing circuit boards, wherein the substrate is divided into a circuit area and a connecting area surrounding the circuit area, the circuit area is used for placing circuits, and the connecting area is used for realizing the electric connection among different circuit boards which can be spliced;

at least one duct, a first opening of the duct being located at an upper surface of the connection region, a second opening of the duct being located at a side of the substrate;

at least one connecting part filled in the pore channel;

the combination electrode is positioned on the side surface of the substrate and is connected with the connecting parts in a one-to-one correspondence manner;

when the circuit is arranged in the circuit area, at least one end of the circuit extends into the connecting area and is connected with at least one connecting part.

2. The spliceable circuit board of claim 1, wherein the spliceable circuit board comprises a plurality of said vias, said plurality of vias being equally spaced apart in said connection area.

3. The spliceable circuit board of claim 2, wherein the openings are L type, the openings have an arm length greater than or equal to an aperture diameter, and the openings are spaced apart from each other by a distance not less than the arm length of the openings.

4. The spliceable circuit board of claim 3, wherein the pore diameter of the pore is 1mm to 1 cm.

5. The spliceable circuit board of claim 1, further comprising strip-shaped guides disposed on the sides of the base plate.

6. The spliceable circuit board of claim 5, wherein the guiding portion is located below the bonding electrode, and the guiding portion is a trapezoid strip-shaped protrusion with a self-locking structure or a trapezoid strip-shaped groove with a self-locking structure.

7. The circuit board of claim 5 or 6, wherein the surface material of the guiding portion is one of polytetrafluoroethylene, polyacetal, polyoxymethylene, polycarbonate, polysulfone, polyimide, chlorinated polyether, polyphenylene sulfide or polyester terephthalate.

8. A circuit board comprising at least two spliceable circuit boards according to any one of claims 1 to 7 spliced with each other, wherein bonding electrodes of adjacent spliceable circuit boards are in contact with each other.

9. The circuit board of claim 8, wherein the bonding electrode of one of the adjacent spliceable circuit boards is a male terminal, and the bonding electrode of the other spliceable circuit board is a female terminal.

10. The circuit board of claim 9, wherein the male top portion is provided with an electrically conductive resilient snap.

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