CN111491243A - Film loudspeaker with outer ring conductor - Google Patents
Film loudspeaker with outer ring conductor Download PDFInfo
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- CN111491243A CN111491243A CN201910088532.8A CN201910088532A CN111491243A CN 111491243 A CN111491243 A CN 111491243A CN 201910088532 A CN201910088532 A CN 201910088532A CN 111491243 A CN111491243 A CN 111491243A
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 6
- 239000011651 chromium Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
- 239000002033 PVDF binder Substances 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 229910003437 indium oxide Inorganic materials 0.000 claims description 3
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 claims description 3
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
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- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 3
- 229910001887 tin oxide Inorganic materials 0.000 claims description 3
- 229920001940 conductive polymer Polymers 0.000 claims description 2
- 239000011787 zinc oxide Substances 0.000 claims 1
- 239000010408 film Substances 0.000 description 134
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- 229920002799 BoPET Polymers 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229920009405 Polyvinylidenefluoride (PVDF) Film Polymers 0.000 description 1
- 229920004933 Terylene® Polymers 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
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- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
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- 239000010409 thin film Substances 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R17/00—Piezoelectric transducers; Electrostrictive transducers
- H04R17/005—Piezoelectric transducers; Electrostrictive transducers using a piezoelectric polymer
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Piezo-Electric Transducers For Audible Bands (AREA)
Abstract
The invention provides a film loudspeaker with an outer ring conductor, which comprises a film sounding component, two conducting rings and two conducting components, wherein the film sounding component is arranged on the outer ring conductor; the film sounding component comprises a piezoelectric film and two conducting layers, the film sounding component is divided into a plurality of block units, and the film sounding component is bent at the joint of every two adjacent block units to form a plurality of bending lines; the two conducting rings are arranged on the upper side surface and the lower side surface of the periphery of the working area in a surrounding mode, contact with the two conducting layers and are electrically connected with the two conducting layers; the two conductive components are electrically connected between the two conductive layers and the sound source signal, so that the two conductive layers are electrically connected with the sound source signal.
Description
Technical Field
The present invention relates to a film speaker with an outer ring conductor, and more particularly, to a film speaker with an outer ring conductor, which is used in audio or electronic products to output sound signals.
Background
With the progress of the times and the demand of consumers for portability, consumer electronic products are gradually becoming lighter, thinner and miniaturized, and thus various components used in electronic products are also becoming more miniaturized and thinner. For electronic products such as mobile phones, wearable devices, and digital assistants, the speaker is one of important components in the electronic products because it is capable of converting an electronic signal into a sound signal.
The use of piezoelectric film speakers has been increasingly widespread for the purpose of miniaturization and thinning. The piezoelectric loudspeaker utilizes the piezoelectric effect of piezoelectric material, and when an electric field is added to the piezoelectric material, the material is deformed, so as to drive the vibration film to produce sound. The piezoelectric type loudspeaker is simple in structure, can be made into a film type plane loudspeaker, does not need an external sound box, can be fixed in a limited space, and is the first choice for developing the application of a micro-electronic product. However, the conventional film type piezoelectric speaker can obtain excellent performance only in a high audio frequency range due to structural characteristics, has poor performance and high distortion rate for a low audio frequency, and has insufficient sound pressure of an output sound field and poor output power due to limited amplitude of the piezoelectric film.
In addition, in the conventional film speaker, the sound source signal is transmitted to the piezoelectric film of the film speaker in a single-point manner through the wire or the circuit contact, however, since the sound source signal is contacted with the piezoelectric film in a single-point manner, the voltage of the sound source signal is concentrated at the contact position of the wire or the circuit contact and the piezoelectric film, so that the electric field intensity at different positions of the piezoelectric film is not uniform, the vibration amplitude at different positions of the piezoelectric film is changed due to different electric field intensities, and the output sound quality of the film speaker is further affected.
Because of the above reasons, the conventional film speaker has disadvantages in use, and how to solve the above problems by structural improvement has become one of the important issues to be solved by the industry.
Disclosure of Invention
The invention mainly aims to solve the defects of poor sound output efficiency, insufficient power and poor output tone quality of the existing film loudspeaker.
The embodiment of the invention provides a film loudspeaker with an outer ring conductor, which comprises a film sounding component, two conductive rings and two conductive components, wherein the film sounding component is arranged on the outer ring conductor; the film sounding component comprises a piezoelectric film and two conducting layers arranged on the upper side surface and the lower side surface of the piezoelectric film, and is provided with a working area for sounding; the two conducting rings surround the upper side and the lower side which are arranged on the periphery of the working area, contact one side of the two conducting layers opposite to the piezoelectric film and are electrically connected with the two conducting layers; the two conductive components are electrically connected between the two conductive layers and the sound source signal, so that the two conductive layers are electrically connected with the sound source signal.
In a preferred embodiment of the present invention, the working area of the film sound-generating assembly is divided into a plurality of block units, the film sound-generating assembly is bent at a joint of every two adjacent block units to form a plurality of bending lines, and an included angle is formed between every two adjacent block units, so that the film sound-generating assembly forms a structure having a concave surface facing a sound output direction of the sound field output by the film sound-generating assembly.
In a preferred embodiment of the present invention, the two conductive rings are respectively flexible circuit boards, and one side of each of the two conductive rings, which is close to the two conductive layers, is attached to the surfaces of the two conductive layers by a conductive adhesive and is electrically connected to the two conductive layers by the conductive adhesive.
In a preferred embodiment of the present invention, the two conductive rings are conductive adhesive rings coated on surfaces of the two conductive layers, respectively.
In a preferred embodiment of the present invention, two supporting frames are further disposed on the periphery of the film sound-generating assembly, the two supporting frames surround the periphery of the film sound-generating assembly and are oppositely clamped between two opposite side surfaces of the edge of the film sound-generating assembly, and the bending strength of the supporting frames is greater than that of the film sound-generating assembly, so as to enhance the bending strength of the area around the film sound-generating assembly.
In a preferred embodiment of the present invention, the piezoelectric film is a polyvinylidene fluoride (PVDF) film.
In a preferred embodiment of the present invention, the two conductive layers are made of a material selected from copper (Cu), silver (Ag), chromium (Cr), nickel (Ni), titanium (Ti), titanium nitride (TiN), and TiN oxide (SnO)2) Indium oxide (In)2O3) One of zinc oxide (ZnO), Indium Tin Oxide (ITO) film or their combination.
The invention has the advantages that the power of the output sound of the film loudspeaker can be increased, and the aim of improving the sound quality can be fulfilled.
For a better understanding of the features and technical content of the present invention, reference should be made to the following detailed description of the invention and accompanying drawings, which are provided for purposes of illustration and description only and are not intended to limit the invention.
Drawings
Fig. 1 is a perspective view of the present invention.
Fig. 2 is a perspective exploded view of the present invention.
FIG. 3 is a schematic cross-sectional view of the present invention.
Fig. 4 is an enlarged partial cross-sectional view of a film sound generating module for use with the present invention.
Fig. 5-7 are perspective assembly views of alternative embodiments of the film sound emitting assembly of the present invention employing different geometries.
Fig. 8 is an exploded perspective view of an alternate embodiment of the invention employing an alternate conductive assembly configuration.
Fig. 9 is a perspective assembly view of the embodiment shown in fig. 8.
Fig. 10 is an exploded perspective view of an alternative embodiment of the present invention using a conductive adhesive ring as the outer ring conductor.
Fig. 11 is an exploded perspective view of another alternative embodiment of the present invention using a conductive adhesive ring as an outer ring conductor.
Fig. 12 and 13 are exploded and assembled perspective views of the sound generating module using planar films according to the embodiment of the present invention.
Detailed Description
[ first embodiment ]
As shown in fig. 1 to 4, the stereo film speaker 1 of the present invention mainly includes: a film sounding component 10, two conductive rings 20, two supporting frames 30 and two conductive components 50.
Wherein, film sound production subassembly 10 is a sound production subassembly that adopts polymer piezoelectric film to make, as shown in fig. 4, film sound production subassembly 10 has a piezoelectric film 101, piezoelectric film 101 has relative top surface and downside, and the laminating is provided with a conducting layer 102 respectively on piezoelectric film 101's top surface and downside.
The piezoelectric film 101 is a film or a sheet made of a polymer material with piezoelectric properties, and the material of the piezoelectric film 101 is preferably polyvinylidene fluoride (PVDF) or other polymer materials capable of generating piezoelectric effect, such as: nylon, terylene, polyvinyl chloride and other materials. The thickness of the piezoelectric film 101 is preferably less than 0.3 mm. The two conductive layers 102 are disposed on the upper and lower sides of the piezoelectric film 101 by evaporation, sputtering, deposition, electroplating, chemical plating or coating, and the conductive layers 102 substantially cover most of the upper and lower sides of the piezoelectric film 101. Two of the conductive layers 102 may be conductive metallic material layers, such as: one or a combination of metal materials such as copper (Cu), silver (Ag), chromium (Cr), nickel (Ni), titanium (Ti), etc., or a conductive metal oxide thin film such as: titanium nitride (TiN) and TiN oxide (SnO)2) Indium oxide (In)2O3) One of zinc oxide (ZnO), Indium Tin Oxide (ITO) film or their combination.
As shown in fig. 1 and 2, the range of the film sound-generating assembly 10 of the present invention that can generate sound is defined as a working area, and the working area of the film sound-generating assembly 10 can be divided into two or more block units 11. The film sound generating assembly 10 is bent at the intersection of every two adjacent block units 11 in the plurality of block units 11 to form a plurality of bending lines 12 at the intersection of every two adjacent block units 11, and an included angle θ is formed between every two adjacent block units 11.
The film sounding assembly 10 of the present invention is manufactured by forming the conductive layers 102 on the two sides of the diaphragm-shaped piezoelectric film 101 by evaporation, sputtering, deposition, electroplating, chemical plating, coating, etc. to form a film substrate, and then forming the bending lines 12 on the film substrate by bending, rolling, etc. the film sounding assembly 10 of the present invention is formed. Depending on the processing method, the formed film sound emitting component 10 can be a non-extensible film or an extensible film. The non-extensible film type film sound generating unit 10 means that the material of the film sound generating unit 10 at the position other than the position of the bending line 12 is not subjected to the deformation of stretching or extension in the process of forming the bending line 12, and therefore, the bending line 12 is formed on the film sound generating unit 10 simply by bending, indentation or the like. The film sound generating assembly 10 in the form of an extended film is processed by forming the bending line 12 on the film sound generating assembly 10 by stretching or stretching the film sound generating assembly 10 in a uniaxial direction or a biaxial direction during the forming process of the bending line 12.
Specifically, the included angle θ between every two adjacent block units 11 of the film sound-generating assembly 10 of the present invention is preferably between 179 degrees and 90 degrees, and in a preferred embodiment, the included angle θ is between 160 degrees and 120 degrees. And the bending line 12 at the connection position of every two adjacent block units 11 forms an arc bend r, and the curvature radius of the arc bend r is preferably larger than one half of the thickness of the film sound-generating component 10. Through experiments, the film sounding assembly 10 of the present invention has better sound effect and sound quality under the condition that the included angle θ and the radius of the arc bend r meet the above conditions.
As shown in fig. 3 and 4, the two conductive layers 102 of the film sound generating assembly 10 are electrically connected to the positive and negative electrodes of the sound source signal 40, respectively, the voltage of the sound source signal 40 can be conducted to the two conductive layers 102, so that the two conductive layers 102 can carry charges with different polarities, respectively, and the upper and lower sides of the piezoelectric film 101 are covered by the conductive layers 102, so that when the two conductive layers 102 carry voltages, the piezoelectric film 101 can vibrate due to the reverse piezoelectric effect, and the input voltage signal of the sound source signal 40 is converted into an air-vibrating sound signal to be output.
In the film sound-generating assembly 10 of the present invention, an included angle is formed between every two adjacent block units 11, so that the film sound-generating assembly 10 forms a three-dimensional structure having a concave surface, and the concave surface of the film sound-generating assembly 10 is designed to face the sound-emitting direction of the sound field output by the film sound-generating assembly 10. Since the film sound-generating assembly 10 is divided into a plurality of adjacent block units 11, and an included angle is formed between every two adjacent block units 11, so that every two adjacent block units 11 are mutually inclined, when the film sound-generating assembly 10 is driven by the voltage of the sound source signal 40 to generate vibration, the directions of the sound fields generated by each block unit 11 are also mutually staggered, thereby improving the sound pressure of the sound field output by the film sound-generating assembly 10 and improving the sound-generating efficiency.
In addition, the film sound-generating assembly 10 forms a plurality of bending lines 12 at the boundary of every two adjacent block units 11, so that the film sound-generating assembly 10 forms a truss structure capable of enhancing the bending strength at the positions of the bending lines 12, and therefore the film sound-generating assembly 10 can bear a more severe vibration amplitude, so that the output power of the film sound-generating assembly 10 can be improved, the frequency range of the output sound field of the film loudspeaker 1 can be expanded, and the purpose of improving the sound quality can be achieved.
As shown in fig. 3 and 4, the two conductive rings 20 are disposed on the upper side and the lower side of the periphery of the working area of the film sounding assembly 10, and the two conductive rings 20 and the two conductive layers 102 are in contact with and electrically connected to one side of the piezoelectric film 101. In this embodiment, the two conductive rings 20 are ring-shaped bodies made of flexible circuit boards, and one side surfaces of the two conductive rings 20 close to the two conductive layers 102 are adhered to the surfaces of the two conductive layers 102 by conductive adhesives 103, and are electrically connected to the two conductive layers 102 by the conductive adhesives 103.
In this embodiment, the two conductive elements 50 are in a long strip shape, one end of each of the two conductive elements 50 close to the film sounding element 10 is respectively connected to the two conductive rings 20, and one end of each of the two conductive elements 50 away from the film sounding element 10 is respectively provided with a circuit contact 51, as shown in fig. 4, the two conductive elements 50 are electrically connected to the two conductive rings 20, and the circuit contacts 51 of the two conductive elements 50 are respectively electrically connected to the positive electrode and the negative electrode of the sound source signal 40, so that the voltages of the positive electrode and the negative electrode of the sound source signal 40 can be transmitted to the two conductive rings 20, and then the voltage of the sound source signal 40 is transmitted to the two conductive layers 102 through the two conductive rings 20.
In this embodiment, the two conductive rings 20 form an annular conductor surrounding the periphery of the working area of the film sound generating assembly 10, and the voltage of the sound source signal 40 is transmitted to the two conductive layers 102 through the two conductive rings 20, so that the voltage of the sound source signal 40 can be uniformly input to the two conductive layers 102 from the periphery of the working area of the film sound generating assembly 10, and the electric field strength borne by the piezoelectric film 101 in the working area range is also uniform, so as to generate uniform amplitude, thereby achieving the purpose of improving the sound quality of the film sound generating assembly 10.
In addition, the two conductive rings 20 are attached to the surfaces of the peripheral regions of the two conductive layers 102 and electrically connected to the two conductive layers 102, so that when a voltage signal is input to the two conductive layers 102, the two conductive rings 20 can generate an inducing effect to guide charges on the two conductive layers 102 to converge in a direction toward the two conductive rings, thereby achieving the purpose of making the charge intensity of each position of the two conductive layers 102 uniform, and effectively improving the sound quality of the film sound generating assembly 10.
In particular, in the present embodiment, the conductive ring 20 may be made of any type of flexible conductor, such as: the two conductive rings 20 may be made of conductive rubber, or a conductive polymer material (e.g., polyacetylene film), or a flexible metal sheet (e.g., copper, stainless steel sheet), or a polymer sheet material with a metal layer plated on the surface (e.g., plated PET film).
In addition, the present invention can further provide two supporting frames 30 on the upper side and the lower side of the edge of the film sound generating module 10, in this embodiment, the two supporting frames 30 are annular and are clamped between the two opposite sides of the edge of the film sound generating module 10. The supporting frame 30 is made of plastic, metal, cardboard or other composite materials, and the bending strength of the supporting frame 30 is greater than that of the film sounding component 10, so that the bending strength of the edge of the film sounding component 10 can be enhanced, and the sound output power and the sound quality of the film speaker 1 can be further improved.
Specifically, in the present embodiment, the outline of the edge of the film sound-generating assembly 10 is circular, the film sound-generating assembly 10 is divided into four block units 11, and the bending lines 12 are crisscross disposed on the film sound-generating assembly 10, however, in other embodiments of the present invention, the outline of the film sound-generating assembly, the number of the block units 11, and the arrangement of the bending lines 12 are not limited to those disclosed in the present embodiment.
For example, in the embodiment shown in fig. 5, the outline of the film sounding assembly 10 is rectangular, and the supporting frame 30 is also designed to be rectangular ring-shaped. For example, in the embodiment shown in fig. 6, the outline shapes of the film sound-generating module 10 and the supporting frame 30 are polygonal geometric shapes, and the bending lines 12 are arranged on the film sound-generating module 10 in a manner of being distributed along the diagonal direction of the geometric outline shape of the film sound-generating module 10. In the embodiment shown in fig. 7, the film sound-generating component 10 and the supporting frame 30 are also polygonal in geometric outline, and the sound-generating region of the film sound-generating component 10 is divided into a plurality of block units 11 surrounding the periphery of the film sound-generating component 10 and a block unit 11a located at the middle of the film sound-generating component 10, and a plurality of bending lines 12 are formed at the intersection of each block unit 11, and a bending line 12a is formed at the intersection of the block unit 11a located at the center and the block unit 11 located at the periphery.
As shown in fig. 8 and 9, in another variation of the present invention, in the present embodiment, the conductive elements 50 are strip-shaped conductive strips, and two ends of the conductive elements 50 respectively have a circuit contact 51, after the film speaker is assembled, and one end of the two conductive elements 50 close to the film sound generating element 10 crosses the outer side of the supporting frame 30, and the circuit contact 51 close to one end of the film sound generating element 10 is bonded to the outer sides of the two conductive layers 102 by means of adhering or welding, so that the two conductive elements 50 are directly electrically connected to the two conductive layers 102, but not electrically connected to the two conductive rings 20.
In this embodiment, since the conductive member 50 is not connected to the conductive ring 20, the voltage signals of the positive and negative poles of the audio source signal 40 are directly conducted to the two conductive layers 102 without passing through the conductive ring 20. For the above reason, the sound source signal 40 of the present embodiment can be input to only the two conductive layers 102 from the circuit contacts 51 of the conductive member 50. However, since the two conductive rings 20 are disposed outside the working area of the film sounding assembly 10, the electric charges generated by the voltage input from the sound source signal 40 can be uniformly distributed at different positions of the film sounding assembly 10 by the inducing action of the conductive rings 20, and the technical effect of improving the output sound quality of the film sounding assembly 10 can also be achieved.
Fig. 10 shows another embodiment of the present invention. In the embodiment of fig. 10 and 11, two conductive adhesive rings 60 are formed by coating conductive adhesive on the upper and lower sides of the periphery of the working area of the film sound generating assembly 10. The two conductive adhesive rings 60 are respectively attached to the peripheral areas of the two conductive layers 102 of the film sounding component 10. The embodiment shown in fig. 11 is a structure according to a further variation of the embodiment shown in fig. 10. In this embodiment, the conductive adhesive ring 60 is disposed around the periphery of the working area of the film sounding component 10 in a discontinuous manner, so that the conductive adhesive ring 60 forms a shape formed by combining a plurality of arc-shaped segments.
In the embodiments shown in fig. 10 and 11, the conductive adhesive ring 60 is used as an annular conductor formed at the periphery of the working area of the film sound generating assembly 10, so that technical effects similar to those of the conductive rings of the previous embodiments can be generated, which is helpful to improve the uniformity of the electric field intensity of the two conductive layers 102 in the working area of the film sound generating assembly 10 and improve the output sound quality.
As shown in fig. 12 and 13, this embodiment is different from the previous embodiments in that the working area of the film sound-generating component 10 is not provided with a bending line and is in a complete plane state.
[ possible technical effects of the embodiment ]
In summary, the present invention has the advantages of increasing the sound pressure and output power of the sound field output by the film speaker 1, and making the electric field intensity within the working area of the film sounding component 10 uniform, thereby achieving the purpose of increasing the sound output power of the film speaker and improving the output sound quality.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, so that the present invention includes all equivalent technical changes made by using the contents of the present specification and the accompanying drawings.
Claims (11)
1. A film loudspeaker having an outer ring conductor, comprising:
the film sounding assembly comprises a piezoelectric film and two conducting layers attached to the upper side face and the lower side face of the piezoelectric film, and is provided with a working area for sounding;
the two conducting rings surround the upper side and the lower side which are arranged at the periphery of the working area, are in contact with the two conducting layers and are electrically connected with the two conducting layers; and
and the two conductive components are electrically connected between the two conductive layers and the sound source signal, so that the two conductive layers are electrically connected with the sound source signal.
2. The film loudspeaker with an outer ring conductor according to claim 1, wherein the active area of the film sound-generating component is divided into a plurality of block units, the film sound-generating component is bent at the junction of every two adjacent block units to form a plurality of bending lines, and an included angle is formed between every two adjacent block units, so that the film sound-generating component is formed into a structure with a concave surface facing the sound emitting direction of the output sound field of the film sound-generating component.
3. The film loudspeaker having an outer ring conductor as claimed in claim 2, wherein the two conductive rings are each a flexible circuit board.
4. The film loudspeaker having an outer ring conductor as claimed in claim 3, wherein two of said conductive rings are adhered to surfaces of two of said conductive layers at a side thereof adjacent to said two conductive layers by a conductive adhesive, and are electrically connected by said conductive adhesive and said two conductive layers.
5. The film loudspeaker of claim 2, wherein the two conductive rings are conductive adhesive rings coated on the surfaces of the two conductive rings.
6. The film loudspeaker of claim 5, wherein the conductive adhesive ring surrounds the two conductive layers in a discontinuous manner in a region outside the working region.
7. The film loudspeaker having an outer ring conductor of claim 2, wherein the two conductive rings are made from a material selected from the group consisting of: metal sheet, conductive polymer sheet, and polymer sheet with metal plated on the surface.
8. The film loudspeaker of claim 2, wherein the ends of said two conductive elements near said film sounding element are connected to said two conductive rings, respectively, and the ends of said two conductive elements far from said film sounding element are provided with a circuit contact, respectively, and said two circuit contacts are connected to said sound source signal, respectively.
9. The film loudspeaker with the outer ring conductor according to claim 2, wherein two supporting frames are further disposed on the periphery of the film sound-generating component, the two supporting frames surround the periphery of the film sound-generating component and are clamped between two opposite side surfaces of the edge of the film sound-generating component, and the bending strength of the supporting frames is greater than that of the film sound-generating component, so as to enhance the bending strength of the area around the film sound-generating component.
10. The film speaker having an outer ring conductor as claimed in claim 2, wherein said piezoelectric film is a polyvinylidene fluoride film.
11. The film loudspeaker having an outer ring conductor of claim 10 wherein the two conductive layers are made of a material selected from the group consisting of copper, silver, chromium, nickel, titanium nitride, tin oxide, indium oxide, zinc oxide, indium tin oxide, and combinations thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910088532.8A CN111491243A (en) | 2019-01-28 | 2019-01-28 | Film loudspeaker with outer ring conductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910088532.8A CN111491243A (en) | 2019-01-28 | 2019-01-28 | Film loudspeaker with outer ring conductor |
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| Publication Number | Publication Date |
|---|---|
| CN111491243A true CN111491243A (en) | 2020-08-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910088532.8A Pending CN111491243A (en) | 2019-01-28 | 2019-01-28 | Film loudspeaker with outer ring conductor |
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| CN (1) | CN111491243A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001169391A (en) * | 1999-12-07 | 2001-06-22 | Erumekku Denshi Kogyo Kk | Thin microphone employing piezoelectric element |
| CN1812661A (en) * | 2005-12-29 | 2006-08-02 | 电子科技大学 | Acoustic frequency directional ultrasonic wave Loudspeaker |
| CN2930176Y (en) * | 2005-08-24 | 2007-08-01 | 梦想音速技术有限公司 | Connection point structure of thin film speaker |
| CN101102621A (en) * | 2006-07-05 | 2008-01-09 | 太阳诱电株式会社 | Piezoelectric type electroacoustical transformer |
| CN101626537A (en) * | 2008-01-18 | 2010-01-13 | 财团法人工业技术研究院 | Flexible piezoelectric sound-generating devices |
| CN208046868U (en) * | 2017-11-17 | 2018-11-02 | 华一声学股份有限公司 | Audio device |
-
2019
- 2019-01-28 CN CN201910088532.8A patent/CN111491243A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001169391A (en) * | 1999-12-07 | 2001-06-22 | Erumekku Denshi Kogyo Kk | Thin microphone employing piezoelectric element |
| CN2930176Y (en) * | 2005-08-24 | 2007-08-01 | 梦想音速技术有限公司 | Connection point structure of thin film speaker |
| CN1812661A (en) * | 2005-12-29 | 2006-08-02 | 电子科技大学 | Acoustic frequency directional ultrasonic wave Loudspeaker |
| CN101102621A (en) * | 2006-07-05 | 2008-01-09 | 太阳诱电株式会社 | Piezoelectric type electroacoustical transformer |
| CN101626537A (en) * | 2008-01-18 | 2010-01-13 | 财团法人工业技术研究院 | Flexible piezoelectric sound-generating devices |
| CN208046868U (en) * | 2017-11-17 | 2018-11-02 | 华一声学股份有限公司 | Audio device |
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Application publication date: 20200804 |