CN111490065A

CN111490065A - Display device

Info

Publication number: CN111490065A
Application number: CN201910075399.2A
Authority: CN
Inventors: 林芳禾; 林柏彣; 张简志强; 丁景隆
Original assignee: Innolux Corp
Current assignee: Innolux Corp
Priority date: 2019-01-25
Filing date: 2019-01-25
Publication date: 2020-08-04

Abstract

The invention provides a display device which comprises a first substrate, a conductive layer and a filling layer. The first substrate has a substrate upper surface having at least one recess. The conductive layer is disposed on the upper surface of the first substrate, and at least a portion of the conductive layer corresponds to the recess. At least a portion of the fill layer is located within the recess.

Description

Display device

Technical Field

The present invention relates to a display device, and more particularly, to a display device having a substrate with a recess filled therein.

Background

In a conventional electronic device, a display device is composed of a substrate, a plurality of layers and various electronic components disposed on the substrate, so as to display a picture. Because the display device has the characteristics of being light and thin, low in power consumption, and free from radiation pollution, the display device has been widely applied to various portable or wearable electronic products, such as a notebook computer (notebook), a smart phone (smart phone), a watch, a display for a vehicle, and the like, to provide more convenient information transmission and display.

However, the substrate used in the display device may have an uneven structure, for example, depressions may be generated on the surface of the substrate during the physical or chemical thinning process. If the pits are not processed correspondingly, the pits will affect the traveling path of the light, so that the display device will generate abnormal bright spots when displaying the image, and further affect the display quality. To reduce the dishing, the substrate surface is conventionally polished to remove the dishing, but this method has the disadvantages of long process time and high process cost, which affects the yield and manufacturing cost of the display device.

Disclosure of Invention

Drawings

Fig. 1 is a schematic cross-sectional view illustrating a first substrate structure of a display device according to a first embodiment of the invention during a manufacturing process.

Fig. 2 is a schematic cross-sectional view illustrating a first substrate structure of a display device according to a first embodiment of the invention.

Fig. 3 is a schematic cross-sectional view illustrating a first substrate structure of a display device according to a second embodiment of the invention.

Fig. 4 is a schematic cross-sectional view illustrating a first substrate structure of a display device according to a third embodiment of the invention during a manufacturing process.

Fig. 5 is a schematic cross-sectional view illustrating a first substrate structure of a display device according to a third embodiment of the invention.

Fig. 6 is a schematic cross-sectional view illustrating a first substrate structure of a display device according to a fourth embodiment of the invention.

Fig. 7 is a schematic cross-sectional view illustrating a first substrate structure of a display device according to a fifth embodiment of the invention during a manufacturing process.

Fig. 8 is a schematic cross-sectional view illustrating a first substrate structure of a display device according to a fifth embodiment of the invention.

Fig. 9 is a schematic cross-sectional view of a display device according to an embodiment of the invention.

Reference numerals indicate 100, 200, 300, 400, 500, SB 1-first substrate structure, 110-first substrate, 110 a-substrate upper surface, 110D-recess, 120-conductive layer, 122-first conductive part, 124-second conductive part, 130-adhesive layer, 132, 312-filling part, 134, 314-planar part, 140-polarizing layer, 310-filling material, D1-depth, DV-display device, M L-dielectric layer, P1, P2-highest point, SB 2-second substrate structure, T1-first thickness, T2-second thickness.

Detailed Description

The present invention may be understood by reference to the following detailed description taken in conjunction with the accompanying drawings, in which it is noted that, for the purposes of facilitating understanding and simplifying the drawing, the various drawings in the present invention depict only some of the illustrated devices and are not necessarily drawn to scale. In addition, the number and size of the elements in the drawings are merely illustrative and are not intended to limit the scope of the present invention.

Certain terms are used throughout the description and following claims to refer to particular elements. Those skilled in the art will appreciate that electronic device manufacturers may refer to the same components by different names. This document does not intend to distinguish between components that differ in function but not name. In the following description and claims, the terms "including" and "comprising" are used in an open-ended fashion, and thus should be interpreted to mean "including, but not limited to …".

When a corresponding element, such as a film or region, is referred to as being "on," "connected to" or "extending to" another element (or variations thereof), it can be directly on, connected to, or extending directly to the other element or intervening elements may be present. On the other hand, when an element is referred to as being "directly on" or "directly extending" to another element (or variations thereof), there are no elements present therebetween. In addition, when a component is referred to as being "coupled" to another component (or a variation thereof), it may be directly connected to the other component or indirectly connected (e.g., electrically connected) to the other component through one or more members.

When the terms "comprising", "including" and/or "having" are used in the description of the present invention, they specify the presence of corresponding features, regions, steps, operations, and/or components, but do not preclude the presence or addition of one or more corresponding features, regions, steps, operations, and/or components.

When used in the description of the present invention, the terms "about", "approximately", "substantial" and "approximately" are generally intended to mean within 20%, or within 10%, or within 5%, or within 3%, or within 2%, or within 1%, or within 0.5% of a given value or range. The quantities given herein are approximate quantities, i.e., the meanings of "about", "about" and "about" are implied unless otherwise indicated.

It is to be understood that the embodiments described below may be implemented in various other forms of implementation, which may be substituted, recombined, or mixed with other features of various embodiments without departing from the spirit of the present invention.

The display device will be explained below. It should be noted that the method and structure described in the present invention can also be applied to any suitable electronic device, such as a light emitting structure, a backlight module, a display device, a splicing type electronic device, a sensing device or an antenna, but not limited thereto.

Referring to fig. 1 and fig. 2, fig. 1 is a schematic cross-sectional view illustrating a first substrate structure of a display device according to a first embodiment of the invention in a manufacturing process, and fig. 2 is a schematic cross-sectional view illustrating the first substrate structure of the display device according to the first embodiment of the invention. As shown in fig. 1 and fig. 2, the display device of the present embodiment includes a first substrate structure 100, wherein the first substrate structure 100 includes a first substrate 110, a conductive layer 120, and an adhesive layer 130, and optionally includes a polarizing layer 140. The first substrate 110 is used to support a film layer, a structure and/or an electronic device disposed on the first substrate 110, such as an active device (e.g., a transistor) or a passive device (e.g., a capacitor, a resistor, etc.). In the present invention, the first substrate 110 may be a hard substrate, such as glass, quartz, sapphire or other suitable hard materials, or the first substrate 110 may be a flexible substrate, such as Polyimide (PI), polyethylene terephthalate (PET) and/or other suitable soft materials, but not limited thereto. In the present invention, the first substrate 110 has a substrate upper surface 110a having at least one recess 110d, and the recess 110d can be generated in the forming process of the first substrate 110 or in the physical/chemical thinning process of the first substrate 110, for example, but the invention is not limited thereto. In the embodiment, the depth D1 of the recess 110D can be greater than or equal to 0 micrometer (μm) and less than or equal to 10 micrometers (0 micrometer < depth D1 ≦ 10 micrometers), and in some embodiments, the depth D1 of the recess 110D can be greater than or equal to 1 micrometer and less than or equal to 6 micrometers (1 micrometer ≦ depth D1 ≦ 6 micrometers), but not limited thereto. The depth D1 of the recess 110D herein refers to the maximum depth of the recess 110D measured along the normal direction of the substrate upper surface 110 a.

In the present embodiment, the conductive layer 120 is disposed on the substrate upper surface 110a of the first substrate 110, and at least a portion of the conductive layer 120 is disposed in the recess 110 d. In detail, the conductive layer 120 of the present embodiment may include a first conductive portion 122 and a second conductive portion 124, wherein the first conductive portion 122 corresponds to the recess 110d, for example, is located in the recess 110d, the second conductive portion 124 is located outside the recess 110d, and the first conductive portion 122 and the second conductive portion 124 are connected to each other; in other words, each of the first conductive portions 122 of the conductive layer 120 may correspond to one of the recesses 110d, and the second conductive portion 124 located outside the recess 110d may represent that the second conductive portion 124 of the conductive layer 120 is disposed on the upper surface 110a of the substrate without the recess 110d, but not limited thereto. The conductive layer 120 may include any suitable transparent conductive material, semitransparent material or opaque material, and In the present embodiment, the conductive layer 120 may be a transparent conductive layer, such as one of Indium Tin Oxide (ITO), indium oxide (In2O3), tin oxide (SnO2), zinc oxide (ZnO), cadmium oxide (CdO), cadmium indium oxide (CdIn2O4), cadmium tin oxide (Cd2SnO4), zinc tin oxide (Zn2SnO4) and polyethylenedioxythiophene (Poly-3,4-Ethylenedioxythiophene, PEDOT), but not limited thereto. In addition, in the present invention, the conductive layer 120 of the display device can be used as an electrode for touch sensing, fingerprint recognition, controlling a display screen, or other suitable functions.

In the present embodiment, the adhesion layer 130 is used to adhere the polarizing layer 140 to the first substrate 110 and at the same time serves as a filling layer to fill the recess 110 d. as shown in fig. 1, in the method of forming the first substrate structure 100 of the present embodiment, the adhesion layer 130 and the polarizing layer 140 as filling layers are first provided on the conductive layer 120, and the polarizing layer 140 covers the adhesion layer 130 as filling layers. it should be noted that, in the present embodiment, the adhesion layer 130 and the polarizing layer 140 may be provided on the conductive layer 120 at the same time (e.g. the adhesion layer 130 is formed on the polarizing layer 140, and then the polarizing layer 140 is adhered to the conductive layer 120 by the adhesion layer 130), so that, in this arrangement, the adhesion layer 130 may not be filled into the recess 110d from the beginning. subsequently, the adhesion layer 130 may be filled into the recess 110d by means of, such as heating and/or pressurizing (AC L V) the adhesion layer 130 into the recess 110d, so as to reduce or eliminate voids between the adhesion layer 120 and the adhesion layer 130 in the adhesion layer 130 and the adhesion layer 130 in the recess 110d, which may be filled with a suitable adhesive 130, such as a suitable for example, a substrate 130, such as a substrate 130, or a substrate 130 may not be filled with a suitable for filling adhesive layer 130 having a suitable for filling effect according to the requirements, such as a first filling of a hard-fill-to the first substrate 130, such as a conventional adhesive-filling adhesive-to-adhesive-type adhesive-adhesive layer 130-adhesive layer 130-adhesive layer 130-adhesive-.

As can be seen from the above, at least a portion of the adhesion layer 130 as the filling layer is located in the recess 110d and at least partially overlaps the conductive layer 120 (i.e., the first conductive portion 122) in the recess 110d (e.g., the portion of the adhesion layer 130 located in the recess 110d covers the first conductive portion 122), and the adhesion layer 130 of the embodiment at least partially fills the recess 110d, so that there is almost no gap between the conductive layer 120 and the adhesion layer 130, thereby reducing the influence of the recess 110d on the display quality. In addition, in the present embodiment, the adhesive layer 130 as a filling layer may include a filling portion 132 and a planar portion 134, the filling portion 132 is located in the recess 110d and covers the first conductive portion 122 of the conductive layer 120, and the planar portion 134 is located on the filling portion 132 and at least partially overlaps with the filling portion 132 and the conductive layer 120. For example, in the present embodiment, the planar portion 134 may at least partially cover the filling portion 132 and the first conductive portion 122 and the second conductive portion 124 of the conductive layer 120. Moreover, since the upper surface of the planar portion 134 can also be a flat surface, the polarizing layer 140 can be attached to the first substrate 110 flatly.

In addition, in order to further reduce the influence of the recess 110d on the light traveling path, the refractive index of the adhesion layer 130 as the filling layer and the refractive index of the conductive layer 120 need to be matched with each other to reduce the influence of the recess 110d on the display quality. In the embodiment, when the refractive index of the adhesive layer 130 and the refractive index of the conductive layer 120 are matched, the difference between the two refractive indexes can be 0.01 to 0.8 (0.01. ltoreq. refractive index difference. ltoreq.0.8), 0.01 to 0.5 (0.01. ltoreq. refractive index difference. ltoreq.0.5), 0.01 to 0.2 (0.01. ltoreq. refractive index difference. ltoreq.0.2), or 0.01 to 0.1 (0.01. ltoreq. refractive index difference. ltoreq.0.1). In some embodiments of the present invention, the refractive index of the adhesive layer 130 is greater than or equal to that of the conductive layer 120, and in some embodiments, the refractive index of the adhesive layer 130 is less than or equal to that of the conductive layer 120. For example, if the refractive index of the conductive layer 120 is about 1.5 to about 2.1 (e.g., the refractive index of indium tin oxide is about 1.8, and the refractive index of polydioxyethyl thiophene is about 1.5), the refractive index of the adhesive layer 130 can be selected to be about 1.3 to about 2.3, but not limited thereto.

In the present invention, the influence of the recess 110d of the first substrate structure 100 on the display quality (e.g., whether the recess 110d is observed when the light is incident) can be confirmed by the way of light incident on the first substrate 110 side of the first substrate structure 100 (i.e., in fig. 2, the light is irradiated from bottom to top), so as to determine the influence of the difference between the refractive index of the adhesive layer 130 and the refractive index of the conductive layer 120 on the display quality. In this determination, assuming that the pressure sensitive adhesive with a refractive index of about 1.48 is selected for the adhesive layer 130, it is found that the influence of the recess 110d in the case of the conductive layer 120 being poly ethylenedioxythiophene (refractive index of about 1.5) is lower than the influence of the recess 110d in the case of the conductive layer 120 being indium tin oxide (refractive index of about 1.8). Therefore, the difference between the refractive indexes of the adhesive layer 130 and the conductive layer 120 is reduced at the recess 110d, and the display quality can be improved. In the structure of the first substrate structure 100 of the present embodiment, for example, the adhesive layer 130 of pressure sensitive adhesive (refractive index is about 1.48) and the conductive layer 120 of polydioxyethyl thiophene (refractive index is about 1.5) may be used, but not limited thereto. In another embodiment, other materials for the adhesive layer 130 and the conductive layer 120 may be selected such that the difference between the two refractive indices ranges from 0.01 to 0.2 or from 0.01 to 0.1, for example, indium tin oxide or other conductive materials with higher refractive index may be used for the conductive layer 120 by increasing the refractive index of the adhesive layer 130 (e.g., adding a material capable of increasing the refractive index).

On the other hand, in order to further reduce the influence of the recess 110d on the display quality, the thickness of the adhesive layer 130 as the filling layer may be in the range of 5 micrometers to 55 micrometers (5 micrometers ≦ adhesive layer thickness ≦ 55 micrometers) or in the range of 20 micrometers to 55 micrometers (20 micrometers ≦ adhesive layer thickness ≦ 55 micrometers), but not limited thereto. In the embodiment, since the adhesion layer 130 has the filling portion 132 and the planar portion 134, the thickness of the adhesion layer 130 may be greater than 5 micrometers and less than or equal to 55 micrometers (5 micrometers < adhesion layer thickness ≦ 55 micrometers) or 20 micrometers to 55 micrometers (20 micrometers ≦ adhesion layer thickness ≦ 55 micrometers), or the thickness of the planar portion 134 of the adhesion layer 130 may be 5 micrometers to 50 micrometers (5 micrometers ≦ planar portion thickness ≦ 50 micrometers), but not limited thereto. In the present invention, the relationship between the degree of the influence of the recess 110d of the first substrate structure 100 on the display quality and the thickness of the adhesive layer 130 can be confirmed by the above-mentioned manner of the incident light on the first substrate 110 side of the first substrate structure 100. In this determination, it is found that the influence of the recess 110d when the planar portion 134 of the adhesive layer 130 is 50 micrometers is lower than the influence of the recess 110d when the planar portion 134 of the adhesive layer 130 is 25 micrometers. It can be seen that, as the thickness of the adhesive layer 130, which is used as a filling layer, is increased, the display quality can be improved. In addition, the ratio of the maximum thickness of the adhesive layer 130 as the filling layer corresponding to the recess 110D to the depth D1 of the recess 110D may range from 1 to 11(1 is less than or equal to 11), or the ratio may be greater than 1 and less than or equal to 11(1 is less than or equal to 11). In other words, in fig. 2, the maximum thickness of the filling portion 132 is the first thickness T1, the thickness of the planar portion 134 is the second thickness T2, and the ratio of the sum of the first thickness T1 and the second thickness T2 (i.e., the sum of the thicknesses of the filling portion 132 and the planar portion 134 of the adhesive layer 130) to the depth D1 of the recess 110D may range from 1 to 11, or may be greater than 1 and less than or equal to 11, but is not limited thereto. In the present embodiment, when calculating the first thickness T1, the two highest points P1 and P2 of the upper surface of the second conductive portion 124 can be found in the cross-sectional view similar to fig. 2, and a virtual connection line between the two highest points P1 and P2 is drawn, and a maximum depth measured from the virtual connection line along the normal direction of the upper surface 110a of the substrate to the upper surface of the first conductive portion 122 is the first thickness T1.

For example, in the embodiment, the filling portion 132 fills the recess 110D, and since the surface of the recess 110D includes the first conductive portion 122, when the conductive layer thickness of the first conductive portion 122 is the same as the conductive layer thickness of the second conductive portion 124, the depth D1 of the recess 110D is substantially the same as the first thickness T1 of the filling portion 132. At this time, if the depth D1 of the recess 110D is 5 micrometers and the second thickness T2 of the planar portion 134 of the adhesive layer 130 is 50 micrometers, the ratio of the sum of the first thickness T1 of the filling portion 132 and the second thickness T2 of the planar portion 134 to the depth D1 of the recess 110D is 11.

Referring to fig. 3, fig. 3 is a schematic cross-sectional view illustrating a first substrate structure of a display device according to a second embodiment of the invention. As shown in fig. 3, the difference between the present embodiment and the first embodiment is that the adhesion layer 130 serving as a filling layer in the first substrate structure 200 of the present embodiment does not completely fill the recess 110d, so that there is a gap between the conductive layer 120 and the adhesion layer 130 in the recess 110d, but the first conductive part 122 of the conductive layer 120 can still partially contact the adhesion layer 130. It should be noted that, since there is a gap between the conductive layer 120 and the filling portion 132 of the adhesive layer 130 in the recess 110D, the first thickness T1 is different from the depth D1 of the recess 110D, for example, in the embodiment, the first thickness T1 of the filling portion 132 is smaller than the depth D1 of the recess 110D. Under the structure of the present embodiment, the influence of the recess 110d on the display quality can still be reduced, and the difference between the refractive index of the adhesion layer 130 and the refractive index of the conductive layer 120 and/or the thickness of the adhesion layer 130 can be selectively configured as in the case of the first embodiment, which will not be repeated herein.

Referring to fig. 4 to 5, fig. 4 is a schematic cross-sectional view illustrating a first substrate structure 300 of a display device according to a third embodiment of the invention in a manufacturing process, and fig. 5 is a schematic cross-sectional view illustrating the first substrate structure 300 of the display device according to the third embodiment of the invention. As shown in fig. 4 to 5, the difference between the present embodiment and the first embodiment is that the first substrate structure 300 of the present embodiment further includes a filler 310, in fig. 4, the filler 310 is disposed on the conductive layer 120, and the filler 310 of the present embodiment is used as a filling layer to fill the recess 110d, while the adhesive layer 130 is not filled in the recess 110 d; in other words, the filling material 310 of the present embodiment is at least partially filled into the recess 110d and covers the conductive layer 120 (i.e., the first conductive part 122) in the recess 110d, and the adhesion layer 130 is disposed between the polarizing layer 140 and the filling material 310 as a filling layer to attach the polarizing layer 140 to the first substrate 110. In addition, in the present embodiment, the first conductive portion 122 and the second conductive portion 124 of the conductive layer 120 are both at least partially in contact with the filler 310. In some embodiments, the first substrate structure 300 does not necessarily have the adhesion layer 130 and the polarizing layer 140.

In the forming method of the first substrate structure 300 of the present embodiment, as shown in fig. 4, after the conductive layer 120 is formed, the filler 310 is disposed on the conductive layer 120. In the present embodiment, the filler 310 may be a liquid or gel material, and therefore, the filler 310 may be disposed on the conductive layer 120 by a coating method such as spin coating or other suitable disposing methods, and then a curing process is performed to cure the filler 310, and optionally a planarization process (e.g., polishing) is performed on the filler 310 after curing the filler 310 to complete the disposing of the filler 310, but the type and disposing method of the filler 310 are not limited thereto. Then, as shown in fig. 5, the adhesive layer 130 and the polarizing layer 140 are disposed on the filler 310, and the adhesive layer 130 is adhered to the filler 310 by, for example, heating and/or pressure defoaming. The material of the filler 310 used as the filling layer can be selected according to the requirement, for example, the filler 310 used as the filling layer can include acrylic (PMMA), epoxy resin (epoxy), silicone resin (silicone), or other suitable materials, and other suitable materials can be added according to the requirement, such as silica particles, zirconia particles, titania particles, alumina particles, boron nitride particles, or a combination thereof, but not limited thereto.

In addition, as shown in fig. 5, in the present embodiment, at least a portion of the filler 310 serving as the filling layer is located in the recess 110d and covers the conductive layer 120 located in the recess 110d (i.e. covers the first conductive portion 122), and the filler 310 of the present embodiment fills the recess 110d, so that there is no gap between the conductive layer 120 and the filler 310, thereby reducing the influence of the recess 110d on the display quality. Moreover, the filling material 310 serving as the filling layer may include a filling portion 312 and a planar portion 314, the filling portion 312 of the filling material 310 is located in the recess 110d and at least partially overlaps (at least partially covers) the first conductive portion 122 of the conductive layer 120, and the planar portion 314 of the filling material 310 is located at least on the filling portion 312 and at least partially overlaps (covers) the filling portion 312, the first conductive portion 122 of the conductive layer 120, and the second conductive portion 124 (i.e., the planar portion 314 may at least partially cover the filling portion 312, the conductive layer 120, and the first substrate 110). Similarly, the upper surface of the planar portion 314 may also be a flat surface.

Similar to the first embodiment, in order to further reduce the influence of the recess 110d on the light traveling path, the refractive index of the filler 310 as the filling layer and the refractive index of the conductive layer 120 need to be matched to each other, so as to further reduce the influence of the recess 110d on the display quality. In the embodiment, when the refractive index of the filler 310 and the refractive index of the conductive layer 120 are matched, the difference between the two refractive indexes can be in the range of 0.01 to 0.8 (0.01. ltoreq. refractive index difference. ltoreq.0.8), 0.01 to 0.5 (0.01. ltoreq. refractive index difference. ltoreq.0.5), 0.01 to 0.2 (0.01. ltoreq. refractive index difference. ltoreq.0.2), or 0.01 to 0.1 (0.01. ltoreq. refractive index difference. ltoreq.0.1); for example, if the refractive index of the conductive layer 120 is about 1.5 to about 2.1 (e.g., the refractive index of indium tin oxide is about 1.8, and the refractive index of polydioxyethyl thiophene is about 1.5), the refractive index of the selected filler 310 can be about 1.3 to about 2.3, but not limited thereto.

In the present invention, the influence of the recess 110d of the first substrate structure 300 on the display quality (e.g., whether the recess 110d is observed when the light is incident) is confirmed by the way of the light incident on the first substrate 110 side of the first substrate structure 300 (i.e., the light is irradiated from bottom to top in fig. 5), and the influence of the difference between the refractive index of the filler 310 and the refractive index of the conductive layer 120 on the display quality is determined. In this determination, assuming that the silicone resin with the refractive index of about 1.41 is selected as the filler 310, it is found that the influence of the recess 110d in the case where the conductive layer 120 is poly (ethylenedioxythiophene) (refractive index of about 1.5) is lower than the influence of the recess 110d in the case where the conductive layer 120 is indium tin oxide (refractive index of about 1.8); assuming that the refractive index of the selected filler 310 is about 1.7 acryl, it is found that the recess 110d has a lower effect when the conductive layer 120 is ito (refractive index of about 1.8) than the recess 110d has when the conductive layer 120 is pdothiophene (refractive index of about 1.5). Therefore, the difference between the refractive indexes of the filler 310 and the conductive layer 120 is reduced, and the display quality is improved. In the structure of the first substrate structure 300 of the present embodiment, for example, the filler 310 of silicon oxide resin with a refractive index of about 1.41 and the conductive layer 120 of poly ethylenedioxythiophene with a refractive index of about 1.5 may be selected, or the filler 310 of acryl with a refractive index of about 1.7 and the conductive layer 120 of ito with a refractive index of about 1.8 may be selected, but not limited thereto. In another embodiment, other materials for the filler 310 and the conductive layer 120 may be selected such that the difference between the two refractive indices is between 0.01 and 0.2 or between 0.01 and 0.1, and the refractive index of the filler 310 may be increased (e.g., by adding a material with an increased refractive index) to correspond to the other conductive material with a higher refractive index.

On the other hand, in order to make the influence of the depressions 110d on the display quality more reduced, the thickness of the filler 310 as the filling layer may range from 5 micrometers to 55 micrometers (5 micrometers ≦ filler thickness ≦ 55 micrometers) or from 5 micrometers to 10 micrometers (5 micrometers ≦ filler thickness ≦ 10 micrometers), but is not limited thereto. In the embodiment, since the filler 310 has the filling portion 312 and the planar portion 314, the thickness of the filler 310 may be greater than 5 microns and less than or equal to 55 microns (5 microns < filler thickness ≦ 55 microns) or greater than 5 microns and less than or equal to 10 microns (5 microns < filler thickness ≦ 10 microns), or the thickness of the planar portion 314 of the filler 310 may be 5 microns to 50 microns (5 microns ≦ planar portion thickness ≦ 50 microns), but not limited thereto. In addition, the ratio of the maximum thickness of the filler 310 as the filling layer corresponding to the recess 110d to the depth of the recess 110d may range from 1 to 11 (1. ltoreq. thickness to depth ratio. ltoreq.11), or the ratio may be greater than 1 and less than or equal to 11(1< thickness to depth ratio. ltoreq.11). In the present embodiment, the ratio of the sum of the thicknesses of the filling portion 312 and the planar portion 314 of the filler 310 to the depth of the recess 110d may be greater than 1 and less than or equal to 11(1< the ratio of the thickness to the depth ≦ 11).

Referring to fig. 6, fig. 6 is a schematic cross-sectional view illustrating a first substrate structure of a display device according to a fourth embodiment of the invention. As shown in fig. 6, the difference between the present embodiment and the third embodiment is that the filler 310 as the filling layer of the first substrate structure 400 of the present embodiment only includes the filling portion 312 and does not include the planar portion 314; that is, the filler 310 covers only the first conductive portion 122 of the conductive layer 120 in the recess 110d and does not cover the second conductive portion 124. In addition, in the present embodiment, in order to planarize the surface, the upper surface of the second conductive portion 124 of the conductive layer 120 and the upper surface of the filler 310 serving as the filling layer are substantially located at the same horizontal plane, that is, the ratio of the maximum thickness of the filler 310 serving as the filling layer corresponding to the recess 110d (i.e., the thickness of the filling portion 312 of the filler 310) to the depth of the recess 110d may be 1 or approximately 1, for example, the difference in height between the upper surface of the filling portion 312 and the upper surface of the second conductive portion 124 in the normal direction of the second conductive portion 124 is within about 10% of the thickness of the second conductive portion 124, but not limited thereto. In the method for disposing the filler 310 of the present embodiment, for example, after curing the filler 310, a planarization process (e.g., polishing) may be performed to remove the excess filler 310, but the method for disposing the filler 310 is not limited thereto.

In a variation of the fourth embodiment, the filler 310 covers only the first conductive part 122 of the conductive layer 120 located in the recess 110d and does not cover the second conductive part 124, but the upper surface of the filler 310 is not located at the same level as the upper surface of the second conductive part 124 of the conductive layer 120, and at least a portion of the upper surface of the second conductive part 124 of the conductive layer 120 is higher or lower than the upper surface of the second conductive part 124 of the conductive layer 120. In this variation, although the upper surface of the filling 310 is not at the same level as the upper surface of the second conductive portion 124 of the conductive layer 120, the influence of the recess 110d on the display quality can be reduced. In other words, in the fourth embodiment, the upper surface of the filler 310 and the upper surface of the second conductive portion 124 may be located on the same level or different levels.

Referring to fig. 7 and 8, fig. 7 is a schematic cross-sectional view illustrating a first substrate structure 500 of a display device according to a fifth embodiment of the invention in a manufacturing process, and fig. 8 is a schematic cross-sectional view illustrating the first substrate structure 500 of the display device according to the fifth embodiment of the invention. As shown in fig. 7 and 8, in the method for forming the first substrate structure 500 of the present embodiment, the filling material 310 serving as the filling layer is first filled into the recess 110d, the conductive layer 120 is then disposed on the filling material 310 serving as the filling layer, and finally the adhesion layer 130 and the polarization layer 140 are further disposed, wherein the filling material 310 at least partially covers the first substrate 110, and at least a portion of the conductive layer 120 corresponds to the recess 110d in the normal direction of the conductive layer 120 (as shown in fig. 7 and 8). In some embodiments, the filler 310 only covers the recess 110d of the first substrate 110, and the filler 310 may contact the first substrate 110, and the arrangement and structure of the filler 310, the adhesion layer 130 and the polarization layer 140 may refer to the third embodiment or the fourth embodiment, which is not repeated herein. The present embodiment planarizes the substrate upper surface 110a of the first substrate 110 by filling the filling material 310 into the recess 110d, and simultaneously reduces the influence of the recess 110d on the display quality.

In the present embodiment, in order to further reduce the influence of the recess 110d on the display quality, the refractive index of the filler 310 as the filling layer and the refractive index of the first substrate 110 need to be matched. In the embodiment, when the refractive index of the filler 310 and the refractive index of the first substrate 110 are matched, the difference between the two refractive indexes may range from 0.01 to 0.8 (0.01. ltoreq. refractive index difference. ltoreq.0.8), from 0.01 to 0.5 (0.01. ltoreq. refractive index difference. ltoreq.0.5), from 0.01 to 0.2 (0.01. ltoreq. refractive index difference. ltoreq.0.2), or from 0.01 to 0.1 (0.01. ltoreq. refractive index difference. ltoreq.0.1), and the improvement effect achieved by the combination of the filler 310 and the first substrate 110 will increase as the difference between the two refractive indexes decreases, but the difference between the two refractive indexes is not limited thereto. In addition, in order to make the influence of the recess 110d on the display quality more reduced, the thickness of the filler 310 as the filling layer may be in a range of 5 to 55 micrometers (5 micrometers ≦ 55 micrometers) or 5 to 10 micrometers (5 micrometers ≦ 10 micrometers), or the thickness of the planar portion 314 of the filler 310 may be in a range of 5 to 50 micrometers (5 micrometers ≦ 50 micrometers), but not limited thereto. In addition, the ratio of the maximum thickness of the filler 310 as the filling layer corresponding to the recess 110d to the depth of the recess 110d may range from 1 to 11 (1. ltoreq. thickness to depth ratio. ltoreq.11), or the ratio may be greater than 1 and less than or equal to 11(1< thickness to depth ratio. ltoreq.11).

Referring to fig. 9, fig. 9 is a cross-sectional schematic view of a display device according to an embodiment of the invention, wherein a first substrate structure SB1 of the display device DV shown in fig. 9 may be the first substrate structure of any one of the above-described embodiments or variations thereof, it should be noted that the display device DV may be any suitable display, such as a micro light emitting diode (L ED) display, an organic light emitting diode (O L ED) display, a liquid crystal (liquid crystal) display, a Quantum Dot (QD), a quantum dot light emitting diode (QD), a Q L or a QD-L) display, or a combination thereof, for example, but the invention is not limited thereto, and the display device DV may include a first substrate structure SB1 and a second substrate structure SB 892, and the second substrate structure may include a second substrate structure SB 9635, and the optional display device DV structures may be arranged on the second substrate structure SB, such as a display medium layer, a display device DV, or a display device DV, may include a display device according to the invention, wherein the optional display device DV structures may include a display medium layer structure SB1, a display device DV, a second substrate structure, a display medium layer, a display device DV, a display device, a.

In summary, in the present invention, the filling layer is filled into the recess of the first substrate to planarize the recess of the first substrate surface, thereby reducing the influence of the recess on the display quality. In addition, the thickness of the filling layer can be adjusted, or the difference of the refractive index between the filled filling layer and the film layer in contact with the filling layer can be adjusted, so that the display quality can be improved.

The above description is only an example of the present invention, and is not intended to limit the present invention, and it is obvious to those skilled in the art that various modifications and variations can be made in the present invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A display device, comprising:

a first substrate having a substrate upper surface with at least one recess;

a conductive layer disposed on the substrate upper surface of the first substrate, at least a portion of the conductive layer corresponding to the recess; and

and at least part of the filling layer is positioned in the recess.

2. The display device according to claim 1, wherein the filling layer is provided on the conductive layer.

3. The display device according to claim 2, wherein the conductive layer has a first conductive portion and a second conductive portion, the first conductive portion is located inside the recess, the second conductive portion is located outside the recess, and the first conductive portion and the second conductive portion are connected to each other.

4. The display device of claim 3, wherein the fill layer comprises a fill portion located within the recess and at least partially overlapping the first conductive portion of the conductive layer.

5. The display device of claim 4, wherein the fill layer further comprises a planar portion at least over the fill portion and at least partially overlapping the fill portion and the conductive layer.

6. The display device according to claim 5, wherein a ratio of a sum of thicknesses of the filling portion and the planar portion to a depth of the recess ranges from 1 to 11.

7. The display device of claim 1, wherein the filling layer has a first refractive index, the conductive layer has a second refractive index, and a difference between the first refractive index and the second refractive index ranges from 0.01 to 0.8.

8. The display device of claim 1, further comprising a polarizing layer disposed on the fill layer.

9. The display device of claim 8, further comprising an adhesive layer disposed between the polarizing layer and the filler layer.

10. The display device of claim 5, wherein the planar portion of the fill layer has a thickness in a range from 5 microns to 50 microns.