CN111485276B

CN111485276B - Electroplating equipment

Info

Publication number: CN111485276B
Application number: CN202010507504.8A
Authority: CN
Inventors: 莫雷清; 孙彬; 简永幸
Original assignee: Xiamen Tongfu Microelectronics Co ltd
Current assignee: Xiamen Tongfu Microelectronics Co ltd
Priority date: 2020-06-05
Filing date: 2020-06-05
Publication date: 2021-10-12
Anticipated expiration: 2040-06-05
Also published as: CN111485276A

Abstract

The invention discloses electroplating equipment, which is provided with an electroplating bath, wherein an electric connection unit is arranged on the electroplating bath, and the electric connection unit comprises: the top of the solution tank is provided with an opening, a conductive piece is arranged in the solution tank, and the conductive piece is provided with an electric contact part which is lower than the opening; the protection liquid inlet is used for inputting protection liquid into the solution tank, and the protection liquid outlet is used for discharging the protection liquid in the solution tank; through will electrically conductive piece setting in the solution tank to through protection liquid input port input protection liquid, protect electrically conductive through endless protection liquid electrically conductive, make electrically conductive electric contact portion be in clear state all the time, guaranteed electrically conductive effect of electrically conductive, can not exert an influence to electroplating equipment, thereby guaranteed electroplating equipment's electroplating effect, guaranteed electroplating equipment's work efficiency, improve electroplating quality.

Description

Electroplating equipment

Technical Field

The invention relates to the field of semiconductor manufacturing, in particular to electroplating equipment.

Background

In the manufacturing process of semiconductor products, gold bumps formed on the surface of a wafer are applied to electroplating technology, at present, in the electroplating process, the wafer is placed in a clamp and then placed in an electroplating bath together with the clamp, electrode points on the clamp are contacted with a conductive piece above the electroplating bath, the conductive piece is connected with a negative pole of a power supply, so that a reduction reaction is generated on the surface of the wafer, Au is deposited on the surface of the wafer, after the electroplating of the wafer is completed, the electrode points leave the conductive piece above the electroplating bath, the clamp is moved from the electroplating bath to a water washing bath for water washing, residual plating solution on the clamp and the wafer can drop onto the conductive piece in the moving process, the water of the plating solution dropping onto the electroplating bath volatilizes after a period of time, solid salt is formed on the conductive piece, the solid salt is not conductive, and when the wafer is electroplated next time, the electrode points on the clamp cannot completely contact with the conductive piece, the resistance is large, the current and the voltage of the electroplated wafer are abnormal, the height of an electroplated layer formed on the surface of the wafer is abnormal, the yield of products is affected, and rework is seriously needed.

Disclosure of Invention

In view of the above-mentioned drawbacks or deficiencies in the prior art, it is desirable to provide an electroplating apparatus.

The invention discloses electroplating equipment, which is provided with an electroplating bath, wherein an electric connection unit is arranged on the electroplating bath,

the electrical connection unit includes: the top of the solution tank is provided with an opening, a conductive piece is arranged in the solution tank, and the conductive piece is provided with an electric contact part which is lower than the opening;

the protection liquid inlet is used for inputting protection liquid into the solution tank, and the protection liquid outlet is used for discharging the protection liquid in the solution tank;

the protective liquid inlet is connected with an input pipe, the input pipe is connected with a flow sensor, the protective liquid outlet is connected with a liquid discharge pipe, and the liquid discharge pipe is connected with a flow control valve;

the support frame comprises a first part which is arranged in the solution tank and used for fixing the conductive piece; and a second part penetrating through the solution tank and arranged outside the solution tank, wherein the second part is used for fixedly supporting the solution tank, and the conductive piece is arranged at a certain height from the bottom of the solution tank through the support frame;

wherein, the protective liquid input port is a shower type nozzle.

Specifically, according to the electric connection unit provided by the application, the conductive piece is arranged in the solution tank, the protection solution is input through the protection solution input port, the plating solution dripped to the conductive piece is dissolved through the protection solution, the conductive piece is protected, the protection solution with the dissolved plating solution is timely discharged through the protection solution outlet port, and the purity of the protection solution is ensured, so that the protection effect on the conductive piece is ensured, the electric contact part of the conductive piece is always in a clean state, and the conductive effect of the conductive piece is ensured; specifically, the liquid level of the protective liquid can be higher than the electric contact part of the conductive piece, so that the electric contact part of the conductive piece is positioned below the liquid level of the protective liquid, and therefore, the plating solution dripped from the clamp and the wafer cannot directly drip on the electric contact part, the cleanliness of the electric contact part is ensured, and the conductive effect of the conductive piece is further ensured.

Further, the protective liquid input port is disposed toward the electrical contact, through which the protective liquid input by the protective liquid input port may flow at least partially.

Specifically, the protective liquid input port is arranged towards the electric contact part, so that at least part of the protective liquid input from the protective liquid input port flows through the electric contact part to flush the electric contact part of the conductive piece, and the plating solution of the electric contact part is flushed away in a flushing mode of the electric contact part, so that the cleanliness of the electric contact part is ensured, and the conductive effect of the conductive piece is further ensured.

Further, the electric contact part is a conductive surface or a conductive contact arranged on the top of the conductive piece.

The support frame comprises a first part which is arranged in the solution tank and used for fixing the conductive piece; and a second portion provided through the solution tank outside the solution tank, the second portion being for fixedly supporting the solution tank.

Specifically, the solution tank and the conductive member are fixedly supported by the support frame.

Further, the support frame is made of a conductive material.

Further, the solution tank is an insulation tank.

Advantageous effects

The invention discloses an electroplating device, comprising: electroplating device electrical connection unit, electroplating device electrical connection unit includes: the top of the solution tank is provided with an opening, a conductive piece is arranged in the solution tank, and the conductive piece is provided with an electric contact part which is lower than the opening; the protection liquid inlet is used for inputting protection liquid into the solution tank, and the protection liquid outlet is used for discharging the protection liquid in the solution tank; through setting up electrically conductive piece in the solution tank, and input the protection liquid through the protection liquid input port, will drip to the plating bath of electrically conductive piece through the protection liquid and dissolve, protect electrically conductive, and in time will dissolve the protection liquid of plating bath through the protection liquid flow export and in time discharge, guarantee the purity of protection liquid, thereby guaranteed the protection effect to electrically conductive, make the electric contact part of electrically conductive piece be in clear state all the time, electrically conductive effect of electrically conductive piece has been guaranteed, can not exert an influence to electroplating equipment, thereby electroplating equipment's electroplating effect has been guaranteed, electroplating equipment's work efficiency has been guaranteed, the electroplating quality is improved.

Drawings

Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:

FIG. 1 is a schematic structural diagram of an embodiment of the present invention;

fig. 2 is a schematic structural diagram of another embodiment of the present invention.

Detailed Description

The present application will be described in further detail with reference to the following drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and not restrictive of the invention. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.

In a first aspect, referring to fig. 1 and fig. 2, the invention discloses an electrical connection unit for electroplating equipment, comprising: a solution tank 10 with an opening at the top, wherein a conductive member 70 is arranged in the solution tank 10, the conductive member 70 is provided with an electric contact part 71, and the electric contact part 71 is lower than the opening;

the protection solution tank is characterized by further comprising a protection solution input port 30 and a protection solution outlet port 11, wherein the protection solution input port 30 is used for inputting a protection solution 20 into the solution tank 10, and the protection solution outlet port 11 is used for discharging the protection solution 20 in the solution tank.

Specifically, the conductive member 70 is arranged in the solution tank 10, the protective solution 20 is input through the protective solution input port 30, the conductive member 70 is protected by the protective solution 20, the plating solution dripped onto the electric contact part 71 is dissolved by the protective solution 20, the protective solution in which the plating solution is dissolved is timely discharged through the protective solution outlet 11, the conductive member 70 is in a protective environment of the circulating protective solution 20, the electric contact part 71 of the conductive member 70 is always in a clean state, the conductive effect of the conductive member 70 is ensured, the quality of a wafer electroplated by electroplating equipment is further ensured, and the yield of products is improved; generally, the protective solution inlet 30 and the protective solution outlet 11 can be disposed on two opposite sides of the solution tank 10, so as to facilitate discharging of the plating solution with higher concentration, since the plating solution has higher concentration than the protective solution 20, the outlet 11 can be disposed at the bottom of the solution tank 10, and the inlet 30 can be disposed at the upper part of the solution tank 10, so that the new protective solution 20 flowing in can be disposed at the upper layer of the solution tank 10, and the protective solution with higher concentration dissolved with the plating solution is disposed at the lower layer of the solution tank 10, so as to facilitate flowing out of the protective solution with higher concentration, thereby ensuring the purity of the protective solution 20;

further, the protection liquid 20 may be distilled water or deionized water, and since the distilled water and the deionized water have high purity and no impurities, the conductive member 70 is not corroded, and the protection effect on the conductive member 70 is ensured; when the protection solution 20 discharged from the solution tank 10 is discharged into the plating tank for recycling, the protection solution 20 is preferably deionized water, because in the semiconductor manufacturing industry, metal ions in the solution have a large influence on semiconductor products, and deionized water does not contain ionic impurities after ion removal, so that the requirements of the semiconductor industry are met, and the quality of the semiconductor products is not influenced.

Referring to fig. 1 and 2, the liquid level 22 of the protective solution 20 in the solution tank 10 is higher than the electrical contact 71.

Specifically, the liquid level 22 of the protection solution 20 is made higher than the electrical contact portion 71 of the conductive member 70, so that the electrical contact portion 71 of the conductive member 70 is positioned below the liquid level 22 of the protection solution, and therefore, the plating solution dripped from the jig and the wafer does not directly drip on the electrical contact portion 71, thereby ensuring the cleanliness of the electrical contact portion 71 and further ensuring the conductive effect of the conductive member 70, referring to fig. 1 and 2, when the electrical contact portion 71 is disposed on the top surface of the conductive member 70, the liquid level 22 of the protection solution is made higher than the conductive member 70, so that the dripped plating solution directly drips into the protection solution 20 and directly dissolves into the protection solution 20, the protection solution with the plating solution dissolved therein is timely output through the protection solution outlet 11, a new protection solution is input through the protection solution inlet 30, thereby the protection solution 20 in the solution tank 10 is always in a state of high purity, and the electrical contact portion 71 of the conductive member 70 is always in a clean state, the conductive effect of the conductive member 70 is ensured, so that the quality of the electroplated wafer of the electroplating equipment is ensured, and the yield of the product is improved.

Referring to fig. 1, the protective liquid input port 30 is disposed toward the electrical contact 71, and the protective liquid 21 input from the protective liquid input port 30 can flow at least partially through the electrical contact 71.

Specifically, at least part of the protection liquid 21 input from the input port 30 flows through the electrical contact portion 71, the electrical contact portion 71 of the conductive member 70 is washed by the protection liquid 21, the plating liquid dripping onto the electrical contact portion 71 is washed away, the cleanliness of the electrical contact portion 71 is ensured, and the conductive effect of the conductive member 70 is further ensured.

Referring to fig. 1, further, the protection liquid input port 30 is a shower type nozzle.

The protection liquid 21 flowing out from the output port 30 is dispersed by setting the protection liquid input port 30 as a shower type nozzle, so that the whole electric contact part 71 of the conductive piece 71 can be washed, the washing effect of the electric contact part 71 is ensured, the cleanliness of the electric contact part 71 is further ensured, and the conductive effect of the conductive piece 70 is ensured.

Referring to fig. 1 and 2, further, an input pipe 40 is connected to the input port 30, a flow sensor 41 is connected to the input pipe 40, a drain pipe 50 is connected to the outflow port 11, and a flow control valve 51 is connected to the drain pipe 50.

Specifically, by arranging the flow sensor 41 on the input pipe 40, the speed of inputting the protection liquid 20 can be monitored through the flow sensor 41, and the outflow speed of the protection liquid is adjusted by arranging the flow control valve 51 in the liquid discharge pipe 50, so that the outflow speed and the inflow speed of the protection liquid 20 are ensured to be consistent, the liquid level of the protection liquid 20 is ensured to be always above the conductive member 70, and the protection effect on the conductive member 70 is ensured; it can be understood that, can also set up level sensor in protection liquid 20, through the liquid level of level sensor real-time supervision protection liquid 20, can in time send alarm signal when level sensor detects the liquid level unusual, remind operating personnel in time to get rid of the trouble, ensure the protection effect to electrically conductive piece 70, in addition, when discharging the interior discharged protection liquid 20 that has the plating bath of being dissolved of solution tank 10 when discharging the plating bath, can also control the speed of input protection liquid through setting up flow sensor 41 and flow control valve 51 and not exceed the consumption of plating bath in the plating bath, in order to prevent that the plating bath in the plating bath from overflowing.

Referring to fig. 1 and 2, further, the electrical contact part 71 is a conductive surface or a conductive contact point disposed on the top of the conductive member 70, and the electrical contact part 71 is disposed on the top surface of the conductive member 70, so that the clamp is convenient to contact the electrical contact part for conducting electricity, and the protection liquid is also convenient to flush the electrical contact part.

Referring to fig. 1 and 2, further, a support bracket 60 is further included, and the support bracket includes a first portion disposed in the solution tank 10 for fixing a conductive member 70; and a second portion provided through the solution tank 10 outside the solution tank 10 for fixedly supporting the solution tank 10.

Specifically, as an embodiment, referring to fig. 1 and fig. 2, the electrical connection device of the electroplating apparatus is further provided with a support frame 60, the support frame 60 is fixedly disposed with the solution tank 10 through the side wall or the bottom of the solution tank 10, one end of the support frame 60 is disposed inside the solution tank 10, the conductive member 70 is fixedly disposed on the support frame 60, the other end extends out of the solution tank 10, and the portion of the solution tank 10 extending out of the solution tank 10 through the support frame 60 is fixedly disposed on the electroplating bath; referring to fig. 1, fig. 2; it can be understood that, because the concentration of the plating solution is higher, the concentration of the protection solution 20 at the bottom of the tank in the solution tank 10 is higher than that of the protection solution 20 at the upper layer, and the conductive member 70 is set to a certain height from the bottom of the solution tank 10 by the support bracket 60, so that the conductive member 70 is away from the protection solution 20 with higher concentration, thereby ensuring the protection effect on the conductive member 70, and it can be understood that the solution tank 10 can also be fixed to the plating tank by other means, for example, the solution tank 10 can be integrally set with the plating tank, or fixed to the plating tank by bonding, welding, and the plated member 70 can be directly fixed to the bottom or the side wall of the solution tank 10.

Further, the supporting frame 60 is made of a conductive material, the second part of the supporting frame 60, which is located outside the solution tank 10, is connected with the negative electrode of the power supply, so that the conductive piece 70 is communicated with the negative electrode of the power supply, the supporting frame 60 can be made of copper, copper alloy, aluminum alloy and the like, in addition, a protective layer can be arranged on the two parts of the supporting frame 60, which are located outside the solution tank 10, so that the plating solution is prevented from dripping onto the second part to corrode the supporting frame 60, the protective layer can be made of polypropylene, polytetrafluoroethylene, PVC and the like, the solution tank 10 is an insulating tank, and the solution tank 10 can be made of polyethylene, polytetrafluoroethylene, PVC and the like.

In a second aspect, the application further discloses an electroplating device, which is provided with an electroplating bath, wherein the electroplating bath is provided with the electric connection unit.

Specifically, the electric connection unit that this application provided protects electrically conductive piece through setting up protection liquid, can guarantee electrically conductive effect of electrically conductive piece effectively, can not guarantee electroplating equipment's work efficiency because electrically conductive problem influence equipment of electrically conductive piece 70, improves electroplating quality.

Further, a liquid discharge port of the liquid discharge pipe is provided in the plating tank, so that the protective liquid discharged from the liquid discharge pipe can flow into the plating tank.

Specifically, the protective solution dissolved with the plating solution and discharged from the solution tank is discharged into the plating tank, so that the waste of the plating solution can be reduced, and the use cost of equipment can be saved.

The above description is only a preferred embodiment of the application and is illustrative of the principles of the technology employed. It will be appreciated by a person skilled in the art that the scope of the invention as referred to in the present application is not limited to the embodiments with a specific combination of the above-mentioned features, but also covers other embodiments with any combination of the above-mentioned features or their equivalents without departing from the inventive concept. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.

Claims

1. An electroplating device is provided with an electroplating bath and is characterized in that an electric connection unit is arranged on the electroplating bath,

the electroplating equipment electric connection unit is characterized by comprising: the device comprises a solution tank with an opening at the top, wherein a conductive piece is arranged in the solution tank, and is provided with an electric contact part which is lower than the opening at the top;

the protection liquid inlet is used for inputting protection liquid into the solution tank, and the protection liquid outlet is used for discharging the protection liquid in the solution tank; the protective liquid inlet is connected with an input pipe, the input pipe is connected with a flow sensor, the protective liquid outlet is connected with a liquid discharge pipe, and the liquid discharge pipe is connected with a flow control valve; a liquid outlet of the liquid discharge pipe is communicated with the electroplating bath so that the protective liquid discharged by the liquid discharge pipe can flow into the electroplating bath;

the support frame comprises a first part which is arranged in the solution tank and used for fixing the conductive piece; the second part penetrates through the solution tank and is arranged outside the solution tank, the second part is used for fixedly supporting the solution tank, and the conducting piece is arranged at a certain height from the bottom of the solution tank through the supporting frame;

wherein, the protective liquid input port is a shower type nozzle.

2. The plating apparatus as recited in claim 1, wherein said protective liquid input port is provided toward said electrical contact portion, and said protective liquid input from said protective liquid input port can flow at least partially through said electrical contact portion.

3. Electroplating apparatus according to claim 1 or 2, wherein the electrical contact is a conductive surface or a conductive contact provided on top of the conductive member.

4. The plating apparatus as recited in claim 1, wherein said support frame is made of a conductive material.

5. The plating apparatus as recited in claim 1, wherein said solution tank is an insulating tank.