CN111485072B - Preparation system and method of high-strength high-conductivity heterogeneous copper conductor - Google Patents

Abstract

The invention belongs to the field of material preparation, and particularly relates to a system and a method for preparing a high-strength high-conductivity heterogeneous copper wire. The system comprises: a crimping device: the material mixing plate is used for curling a material mixing plate into a bar, and the material mixing plate is formed by alternately stacking two copper/copper alloy plates with different components; rotating the drawing deformation device: the bar is used for simultaneously carrying out rotation and drawing deformation on the bar after being curled; wire coiling device: the device is used for coiling the copper wire obtained after the rotary drawing deformation; an annealing device: the method is used for annealing the copper wire after coiling, regulating and controlling the microstructure with heterogeneous grain size, and obtaining the high-strength high-conductivity heterogeneous copper wire material. By the preparation process of mixing and laminating, curling and rotary drawing and the subsequent multi-stage recrystallization treatment, the high-strength high-conductivity heterogeneous copper wire can be prepared, and the microstructure has great flexibility and directivity.

Description

Preparation system and method of high-strength high-conductivity heterogeneous copper conductor

Technical Field

The invention belongs to the field of material preparation, and particularly relates to a system and a method for preparing a high-strength high-conductivity heterogeneous copper wire.

Background

Compared with other metal materials, copper and copper alloy have excellent electrical conductivity, thermal conductivity, ductility and corrosion resistance, and are widely applied to products such as electricians, communication, new energy and the like. The copper wire prepared by the conventional process has low mechanical strength, poor deformation resistance and poor service performance stability, and the service life of the product is influenced to a certain extent.

The Chinese invention patent CN108251684A provides a high-conductivity high-strength copper-iron alloy and a preparation method thereof, wherein an atomization method is adopted to prepare copper-iron alloy powder, the alloy powder is sintered, then a sintered blank obtained by sintering is subjected to wire drawing to obtain a wire material, and finally the wire material is subjected to aging treatment to obtain the copper-iron alloy. The technology is characterized in that: (1) the prepared copper-iron alloy has high conductivity and high strength; (2) the process does not need to research and develop a special device, and saves cost. However, the following disadvantages exist in this patent: (1) the time for preparing the alloy powder is long, and the production efficiency is low; (2) the alloy powder is easy to oxidize, and the density is poor after sintering; (3) the sintering temperature of the powder is high, and the energy consumption is high.

Further retrieval found that x.l.ma et al, in "stress hardening and toughness studies of macrocrystalline/nanocrystalline layer sheet material", published in the text materials report of script materials, 2015,103:57-60, describes a method for preparing a sheet-structured copper alloy material using high pressure torsional deformation and obtaining a macrocrystalline/nanocrystalline hetero-sheet-structured copper alloy by heat treatment, wherein the grain size of the nanocrystalline layer is about 100nm and the grain size of the macrocrystalline layer is about 4 μm. The technology has the following characteristics: (1) the prepared material has good interface bonding quality; (2) the prepared copper alloy has super-strong strain hardening capacity, and keeps the excellent uniform elongation of the coarse-grained copper to a certain extent while keeping the high strength of the nano-crystalline copper. However, this technique also has the following problems: (1) difficulty in controlling oxidation of the interface; (2) the sample obtained by high-pressure torsion has small size and higher requirements on equipment and a die, and is not beneficial to industrial production and application.

Disclosure of Invention

The invention aims to provide a system and a method for preparing a high-strength high-conductivity heterogeneous copper wire. .

The technical solution for realizing the purpose of the invention is as follows: a preparation system of high-conductivity heterogeneous copper wires comprises:

a crimping device: the material mixing plate is used for curling a material mixing plate into a bar, and the material mixing plate is formed by alternately stacking two copper/copper alloy plates with different components;

rotating the drawing deformation device: the bar material is used for simultaneously rotating and drawing deformation of the curled bar material to obtain a heterogeneous copper wire;

wire coiling device: the device is used for coiling the heterogeneous copper wire obtained by the rotary drawing deformation device;

an annealing device: for annealing the copper isomerate wire after coiling.

Furthermore, the crimping and deforming device comprises an upper roller, two lower rollers, a detachable support and a non-detachable support which are arranged at two ends of the rollers, a heating mechanism and a driving mechanism;

the heating mechanism is used for heating the upper roller; the driving mechanism is used for driving the upper roller to rotate; two vertical guide rails are arranged inside the detachable support and the non-detachable support, so that the two lower rollers can move up and down along the guide rails, and the vertical height interval between the upper rollers and the lower rollers in the machining process can be adjusted; the diameters of the two lower rollers are the same and larger than the diameter of the upper roller.

Furthermore, the heating mechanism comprises a resistance wire arranged in the detachable support;

the driving mechanism comprises a motor arranged on the non-detachable support, and the motor is connected with the upper roller and used for driving the upper roller to rotate;

the lower roller is in interference fit with the two vertical guide rails inside the detachable support and the non-detachable support; or the vertical height distance between the upper roller and the lower roller can be adjusted through a cam mechanism.

Further, the rotary drawing deformation device comprises two three-jaw chucks, a guide rail, a driving mechanism and a heating mechanism which are oppositely arranged;

one of the three-jaw chucks is fixedly arranged on the guide rail, and the other three-jaw chuck is arranged on the guide rail in a sliding way; the driving mechanism is used for driving the three-jaw chuck fixedly arranged on the guide rail to rotate and driving the three-jaw chuck slidably arranged on the guide rail to move along the guide rail;

the heating mechanism is used for heating the bar to be rotationally drawn.

Further, the driving mechanism comprises a translation motor and a rotating motor, the translation motor drives the three-jaw chuck to move on the guide rail, so that the drawing deformation of the bar is realized, and the rotating motor drives the three-jaw chuck to rotate, so that the rotating deformation of the bar is realized;

the heating mechanism comprises a heating sleeve, and the heating sleeve is arranged on the periphery of the bar and used for heating the bar.

Further, the wire coiling device comprises a wire coil and a coiling motor, wherein the coiling motor drives the wire coil to rotate so as to wind the wire on the wire coil; the annealing device comprises an annealing furnace.

A method for preparing a heterogeneous copper wire by using the system comprises the following steps:

step (1): mixing and superposing: selecting a plurality of copper/copper alloy plates with two or more than two different components, and alternately stacking the copper/copper alloy plates in sequence;

step (2): and (3) crimping deformation: curling the mixed material laminated mixed material plate into a bar;

and (3): rotating and drawing: performing torsion and drawing composite deformation by using a rotary drawing device under a heating condition to obtain a compact heterogeneous copper alloy wire with good interface combination;

and (4): winding the wire;

and (5): multi-stage recrystallization: the multipolarization of the recrystallization temperature of the isomeric copper alloy is utilized, and the microstructure is regulated and controlled by the heat treatment temperature, so that the high-strength high-conductivity isomeric copper wire material is obtained.

Further, the material mixing and laminating in the step (1) specifically comprises the following steps: selecting a plurality of copper/copper alloy plates with two or more than two components, polishing the surfaces of the plates before superposition to remove oil stains and oxide scales on the surfaces, superposing the plates in an alternating sequence after polishing, and binding and fixing the end parts and the tail parts of the plates by using copper/copper alloy filaments with the same components as the plates with any component;

the crimping deformation in the step (2) is specifically as follows: conveying the bundled and fixed mixed material plate into a crimping device, adjusting the position of a lower roller to enable the vertical height between the upper roller and the lower roller to be equal to the thickness of the mixed material plate, heating by a resistance wire to enable the temperature of an upper roller to rise to 50-200 ℃, enabling the temperature rise speed to be 1-10 ℃/min, conveying one end of the mixed material plate into a plate rolling machine, enabling the upper roller of the plate rolling machine to rotate at a constant speed of 5-10 rpm under the action of a motor, crimping the plate for 2-5 weeks, detaching a left support after crimping deformation is completed, taking down a workpiece and the upper roller, and cutting off the part of the upper roller, which exceeds a bar.

Furthermore, the material of the upper roller in the curling device is the same as the composition of one of the mixed material plates, and is different from the composition of the plate contacted with the upper roller.

Further, the rotary drawing in the step (3) is specifically as follows: feeding the rod after the curling deformation into a rotary drawing device, respectively fixing two ends of the rod on two three-jaw chucks, and raising the temperature of the rod to 50-200 ℃ by using a heating sleeve at a rate of 1-10 ℃/min; rotating the three-jaw chuck at one end and translating the three-jaw chuck at the other end to apply rotary drawing deformation to the bar, wherein the rotating speed is 1.5-3 rpm, the drawing speed is 3-10 m/min, and the deformation of the bar is 10-70%;

the multi-stage recrystallization in the step (5) is annealing treatment, the annealing temperature is between the recrystallization temperatures of the two copper alloy plates, and the annealing time is 0.1-100 minutes.

Further, the copper and copper alloy sheet material is pure copper and Cu-10Zn or pure copper and Cu-20 Zn.

Compared with the prior art, the invention has the remarkable advantages that:

(1) the preparation process of the invention, namely mixing and laminating, curling and rotary drawing, is matched with subsequent multi-stage recrystallization treatment, so that the high-strength high-conductivity heterogeneous copper wire can be prepared, the microstructure has great flexibility and directivity, the selection of alloy proportion can be adjusted according to actual requirements, and the selectable materials comprise pure copper and alloy components of Cu-10Zn, pure copper, Cu-20Zn and the like.

(2) The method can prepare the heterogeneous copper conductor with the radially spirally and alternately distributed multi-scale grains, obtains soft and hard phases in the radial direction, and realizes the synergistic improvement of the strength and the toughness of the material.

(3) The invention directly processes the plate with larger size, does not need to be prepared into powder, and has shorter time consumption and higher production efficiency.

(4) The multi-stage recrystallization treatment in the invention requires lower temperature and lower energy consumption.

(5) After the plates are mixed and laminated, the proportion of the surfaces exposed in the air to the whole is low, the oxidation phenomenon is not obvious, and protective gas does not need to be added in the whole processing process.

Drawings

Figure 1 is a schematic view of the crimping and spin-drawing of the present invention.

FIG. 2 is a schematic view showing the lamination of a pure copper plate and a Cu-Zn alloy plate.

FIG. 3 is a schematic view of the crimping apparatus and crimping of the present invention; wherein, figure (a) is a crimping device and figure (b) is a composite board for crimping.

FIG. 4 is a schematic view of the spin-draw of the present invention; wherein, the drawing (a) is a schematic view of the whole rotary drawing apparatus, and the drawing (b) is a schematic view of a cross section A-A of the drawing (a).

Fig. 5 is a schematic diagram of a wire wrap of the present invention.

FIG. 6 is a schematic view of a multi-polar recrystallization process; wherein, the figure (a) is a schematic view of annealing treatment, and the figure (b) is a schematic view of an axial section of the annealed material.

Description of reference numerals:

1-Cu-10Zn alloy plate, 2-pure copper plate, 3-detachable support, 4-roller, 5-composite plate, 6-non-detachable support, 7-upper roller motor, 8-curled deformed bar, 9-curled feeding direction, 10-upper roller detaching direction, 11-translation motor, 12-heating sleeve, 13-three-jaw chuck, 14-rotating motor, 15-horizontal guide rail, 16-rotating drawing feeding direction, 17-wire coil, 18-wire coil motor, 19-annealing furnace, 20-Cu-10Zn, 21-pure copper.

Detailed Description

The present invention is described in further detail below with reference to the attached drawing figures.

The preparation method of the invention specifically comprises the following steps: firstly, two copper/copper alloy plates are alternately mixed and overlapped, and are curled and deformed into a rod in a curling and deforming device, so that the primary mechanical combination of an interface is realized. And then, carrying out plastic forming on the interface between the materials by rotary drawing to form a compact interface structure, and preparing the heterogeneous copper wire with the components alternately distributed along the radial direction. After the wire is wound, the obtained wire is subjected to multi-pole recrystallization treatment by utilizing the difference of the recrystallization temperatures of dissimilar alloys, the microscopic grain size is regulated and controlled, and the multi-grain size characteristic that the grain sizes are radially and alternately distributed is realized. The soft and hard phase interfaces with alternately distributed coarse and fine crystals generate mutual constraint, so that the material obtains back stress hardening in the deformation process, the strength and toughness are cooperatively improved, and finally the high-strength high-conductivity heterogeneous copper wire is obtained.

The invention is realized by the following technical scheme, which comprises the following steps:

firstly, mixing and superposing, namely taking two copper/copper alloy plates with the same length and width, polishing and cleaning, removing oil stains and oxide scales on the surfaces, sequentially mixing and superposing the two copper/copper alloy plates in a vertical direction alternately and piling mode to a required thickness, and binding and fixing the end parts and the tail parts of the plates by using any one of copper/copper alloy thin wires with the same component after mixing and superposing as shown in figure 2.

And secondly, carrying out crimping deformation, namely feeding the fixed plate into a crimping deformation device, and adjusting the position of a lower roller to ensure that the vertical height interval between the upper roller and the lower roller is just the thickness of the laminated plate. The temperature of an upper roller made of pure copper is raised to 50-200 ℃ by using a resistance wire in the detachable support 3, the temperature raising speed is 1-10 ℃/min, one end of a mixed material plate is fed into the crimping deformation device, the upper roller of the crimping deformation device rotates at a constant speed of 5-10 rpm under the action of an upper roller motor 7, and the material is crimped for 2-5 weeks. And (4) removing the detachable support 3 after the curling deformation is finished, taking down the workpiece and the upper roller together, and cutting off the part of the upper roller, which exceeds the bar material.

And thirdly, carrying out rotary drawing, namely feeding the rod subjected to curling deformation into a rotary drawing device, respectively fixing two ends of the rod on two three-jaw chucks 13, and raising the temperature of the rod to 50-200 ℃ by using a heating sleeve 12 at a rate of 1-10 ℃/min. The bar is subjected to rotary drawing deformation through the movement of the three-jaw chucks 13 at the two ends, the rotating speed is 1.5-3 rpm, the drawing speed is 3-10 m/min, and the deformation of the bar is 10-70%.

And fourthly, winding the wire, taking out the wire obtained after rotary drawing, removing oil stains and oxidation films on the surface, and cutting off the head and tail redundant parts and the parts with poor combination. Under the action of a winding motor 18, a wire coil 17 with the diameter of 50 cm-100 cm performs rotary motion at the rotating speed of 3-4.5 rpm, the prepared copper wire is wound on the wire coil 17, and the wire is taken down from the wire coil after the winding is finished.

And fifthly, performing multi-pole recrystallization, and annealing the lead at the temperature of 200-300 ℃ for 2-3 h.

Example 1

The present embodiment is directed to pure copper and Cu-Zn alloy.

Firstly, mixing materials and superposing, selecting 3 pure copper plates (99.9 wt.%) with the length of 3m, the width of 1.5m and the thickness of 3cm and 3 Cu-Zn alloy plates (Cu-10 wt.%) with the same size, respectively carrying out surface treatment, removing oil stains and oxidation films on the surfaces of the pure copper plates and the 3 Cu-Zn alloy plates, and polishing the surfaces until the surfaces are bright. The two processed metal plates are sequentially mixed and laminated in a vertical direction and alternately stacked, as shown in fig. 2. The end part and the tail part of the blank are respectively tied and fixed by copper wires with the diameter of 6mm, so that loosening and disorder are prevented.

And secondly, carrying out crimping deformation, namely conveying the bundled and fixed metal plates into a crimping deformation device, and adjusting the height of a lower roller to enable the vertical height interval between the upper roller and the lower roller to be 1.8 m. The resistance wire in the detachable support 3 is utilized to raise the temperature of the upper roller to 120 ℃, and the temperature raising rate is 7 ℃/min. One end of the plate is fed into the crimping device according to the feeding direction 9, and the other end of the plate is driven to gradually feed the plate into the crimping device. The upper roller was rotated uniformly by the upper roller motor 7 at a rate of 6rpm to curl the material for 2 revolutions. During the machining process, the position of the lower roller moves downwards along the vertical guide rail in the non-detachable support 6 under the extrusion of the workpiece. And (4) after the deformation is finished, the detachable support 3 is detached, the workpiece and the upper roller are taken down together, and the part of the upper roller, which exceeds the bar, is cut off. As shown in fig. 3.

And thirdly, carrying out rotary drawing, namely feeding the rod subjected to the curling deformation into a rotary drawing device, respectively fixing two ends of the rod on a three-jaw chuck 13, and heating the rod to 100 ℃ by using a heating sleeve 12 at a heating rate of 5 ℃/min. And a starting motor 14 drives the three-jaw chuck 13 to rotate, so that the bar is rotationally deformed, and the rotation speed is 3 rpm. The motor 11 drives the three-jaw chuck 13 to move on the guide rail 15, so that the drawing deformation of the bar is realized, the drawing speed is 7m/min, and the deformation of the bar is 50%. As shown in fig. 4.

And fourthly, winding the wire, taking out the wire obtained after the rotary drawing is finished, removing oil stains and oxidation films on the surface, and cutting off the head and tail redundant parts and the parts with poor combination. The wire is wound on the wire coil 17 which is driven by the starting motor 18 and has a diameter of 75cm at a rotation speed of 3 rpm. As shown in fig. 5. And after winding is finished, the wire is taken down from the wire coil.

And a fifth step of performing a multi-stage recrystallization treatment by annealing the wire using an annealing furnace 19 at 240 ℃ for 2.5 hours, as shown in fig. 6 (a).

The microstructures of the obtained heterogeneous copper wires of a multi-grain scale are shown in fig. 6(b) and 6 (c). Due to the multipolarization of the recrystallization temperatures of the two materials, the grains of the pure copper are hardly changed in the annealing process and are kept at the micron level, the Cu-Zn alloy is recrystallized and refined, the grains are refined to the nanometer level, and the obtained alloy matrix presents the characteristic of multi-scale grains which are radially and alternately distributed. The soft and hard phase interfaces with alternately distributed coarse and fine crystals generate mutual restraint, so that the material is subjected to back stress hardening in the deformation process, the strength and the toughness are synergistically improved, and finally the high-strength high-conductivity heterogeneous copper wire is obtained.

Claims (9)

1. A preparation system of high strength high conductivity isomeric copper wire, characterized by includes:

a crimping device: the material mixing plate is used for curling a material mixing plate into a bar, and the material mixing plate is formed by alternately stacking two copper/copper alloy plates with different components;

rotating the drawing deformation device: the wire drawing device is used for simultaneously rotating and drawing the curled bar to obtain a copper wire;

wire coiling device: the device is used for coiling the copper wire obtained after the rotary drawing deformation;

an annealing device: annealing the copper wire after the coiling;

the crimping and deforming device comprises an upper roller, two lower rollers, a detachable support and a non-detachable support which are arranged at two ends of the rollers, a heating mechanism and a driving mechanism;

the heating mechanism is used for heating the upper roller; the driving mechanism is used for driving the upper roller to rotate; two vertical guide rails are arranged inside the detachable support and the non-detachable support, so that the two lower rollers can move up and down along the guide rails, and the vertical height interval between the upper rollers and the lower rollers in the machining process can be adjusted; the diameters of the two lower rollers are the same and larger than the diameter of the upper roller.

2. The system of claim 1, wherein the heating mechanism comprises a resistance wire disposed within a removable holder;

the driving mechanism comprises a motor arranged on the non-detachable support, and the motor is connected with the upper roller and used for driving the upper roller to rotate;

the lower roller is in interference fit with the two vertical guide rails inside the detachable support and the non-detachable support; or the vertical height distance between the upper roller and the lower roller can be adjusted through a cam mechanism.

3. The system of claim 2, wherein the rotary draw texturing apparatus comprises two oppositely disposed three-jaw chucks, a guide rail, a drive mechanism and a heating mechanism;

one of the three-jaw chucks is fixedly arranged on the guide rail, and the other three-jaw chuck is arranged on the guide rail in a sliding way; the driving mechanism is used for driving the three-jaw chuck fixedly arranged on the guide rail to rotate and driving the three-jaw chuck slidably arranged on the guide rail to move along the guide rail;

the heating mechanism is used for heating the bar to be rotationally drawn.

4. The system according to claim 3, wherein the driving mechanism comprises a translation motor and a rotating motor, the translation motor drives the three-jaw chuck to move on the guide rail to realize the drawing deformation of the bar material, and the rotating motor drives the three-jaw chuck to rotate to realize the rotating deformation of the bar material;

the heating mechanism comprises a heating sleeve, and the heating sleeve is sleeved on the periphery of the bar and used for heating the bar.

5. The system of claim 1, wherein the wire spooling device comprises a spool and a spooling motor, the spooling motor drives the spool to perform a rotational motion to wind the wire onto the spool; the annealing device comprises an annealing furnace.

6. A method of making a copper isomerate wire using the system of any of claims 1-5, comprising:

step (1): mixing and superposing: selecting a plurality of copper/copper alloy plates with two or more than two different components, and alternately stacking the copper/copper alloy plates;

step (2): and (3) crimping deformation: curling the mixed material plate overlapped by the mixed materials into a rod;

and (3): rotating and drawing: performing torsion and drawing composite deformation by using a rotary drawing device under a heating condition to obtain a compact heterogeneous copper alloy wire with good interface combination;

and (4): winding the wire;

and (5): multi-stage recrystallization: the multipolarization of the recrystallization temperature of the isomeric copper alloy is utilized, and the microstructure is regulated and controlled by the heat treatment temperature, so that the high-strength high-conductivity isomeric copper wire material is obtained.

7. The method according to claim 6, wherein the compounding stack in step (1) is specifically: selecting a plurality of two or more copper/copper alloy plates, polishing the surfaces of the plates before superposition to remove oil stains and oxide scales on the surfaces, superposing the plates in an alternating sequence after polishing, and binding and fixing the end parts and the tail parts of the plates by using copper/copper alloy filaments with the same components as the plates with any components;

the crimping deformation in the step (2) is specifically as follows: conveying the bundled and fixed mixed material plate into a crimping device, adjusting the position of a lower roller to enable the vertical height between the upper roller and the lower roller to be equal to the thickness of the mixed material plate, heating by a resistance wire to enable the temperature of an upper roller to rise to 50-200 ℃, enabling the temperature rise speed to be 1-10 ℃/min, conveying one end of the mixed material plate into a plate rolling machine, enabling the upper roller of the plate rolling machine to rotate at a constant speed of 5-10 rpm under the action of a motor, crimping the plate for 2-5 weeks, detaching a left support after crimping deformation is completed, taking down a workpiece and the upper roller, and cutting off the part of the upper roller, which exceeds a bar.

8. The method of claim 7, wherein the upper roller of the texturizing device has a material of the same composition as one of the plurality of mixing sheets and a different composition than the composition of the sheet in contact with the upper roller.

9. The method according to claim 8, wherein the rotary drawing in the step (3) is specifically: feeding the rod after the curling deformation into a rotary drawing device, respectively fixing two ends of the rod on two three-jaw chucks, and raising the temperature of the rod to 50-200 ℃ by using a heating sleeve at a rate of 1-10 ℃/min; rotating the three-jaw chuck at one end and translating the three-jaw chuck at the other end to apply rotary drawing deformation to the bar, wherein the rotating speed is 1.5-3 rpm, the drawing speed is 3-10 m/min, and the deformation of the bar is 10-70%;

the multi-stage recrystallization in the step (5) is annealing treatment, the annealing temperature is between the recrystallization temperatures of the two copper alloy plates, and the annealing time is 0.1-100 minutes.

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