CN111484704A - Method for reprocessing thermosetting high polymer material - Google Patents
Method for reprocessing thermosetting high polymer material Download PDFInfo
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- CN111484704A CN111484704A CN201910074470.5A CN201910074470A CN111484704A CN 111484704 A CN111484704 A CN 111484704A CN 201910074470 A CN201910074470 A CN 201910074470A CN 111484704 A CN111484704 A CN 111484704A
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- thermosetting
- epoxy resin
- polymeric material
- reworking
- diglycidyl ether
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
- C08L75/04—Polyurethanes
- C08L75/08—Polyurethanes from polyethers
Abstract
The invention provides a novel method for reprocessing thermosetting high polymer materials, in particular to a simple method for reprocessing thermosetting epoxy resin materials. The thermosetting epoxy resin used in the method does not contain a catalyst and comprises common epoxy resin and liquid crystal epoxy resin containing liquid crystal elements. The reprocessing method has the advantages of no need of a catalyst, simple steps, high material stability, strong universality and the like, and realizes direct recycling of a large amount of the conventional epoxy resin.
Description
Technical Field
The invention relates to the field of processing of high polymer materials, in particular to a reprocessing method of a thermosetting epoxy resin material.
Background
Epoxy resin is an important thermosetting resin, and is one of the most widely applied materials in common polymer composite materials. The cured epoxy resin has excellent electrical insulating property, high adhesion, dimensional stability, corrosion resistance and other properties, is used as a coating, an adhesive, an electronic and electrical material and the like, and is widely applied to the fields of mechanical aviation, chemical engineering, construction automobiles and the like. As an important thermosetting material, epoxy resin is insoluble and infusible, so that the epoxy resin cannot be processed again after being formed, and the epoxy resin material is difficult to recycle after being discarded, aged and damaged, thereby causing resource waste and solid waste pollution.
In recent years, researchers L eibler introduced dynamic covalent bonds into a cross-linked network of an epoxy resin to achieve the performance of re-processing a thermosetting polymer material after processing and molding for the first time L eibler introduced dynamic ester bonds and a catalyst accelerating the transesterification into an epoxy resin to perform a rapid transesterification reaction (ester bond cleavage-rearrangement) at a high temperature using the ester bonds to re-shape the epoxy resin after molding, the catalyst plays an important role in the processing process, but the addition of the catalyst certainly has an important influence on the preparation and use of the material.
Furthermore, the existing large amount of epoxy resins are applied to the crosslinked network of finished products or waste products without catalysts, and they can be stably stored or used at room temperature or low temperature, but cannot be reprocessed and recycled at high temperature. Therefore, if a large amount of epoxy resin application finished products or waste products can be stably stored or used at room temperature or low temperature, and can be reprocessed and recycled at high temperature without a catalyst, the environmental pollution caused by epoxy resin waste is reduced, resources are fully utilized, the processing process of the epoxy resin is simplified, and the service life of the epoxy resin is prolonged. Therefore, there is an urgent need to develop a catalyst-free method for directly reworking a large amount of thermosetting epoxy resin materials available.
In addition, besides epoxy resin, exchange reaction exists inside the cross-linked network of many other thermosetting materials (such as transcarbamylation reaction exists inside polyurethane), and the method for reprocessing and recycling the epoxy resin is very expected to be used for recycling other thermosetting materials.
Disclosure of Invention
The present invention has been made to solve the above-mentioned problems occurring in the prior art, and an object of the present invention is to provide a method for directly reworking a large amount of thermosetting polymer materials, particularly epoxy resin materials, without using a catalyst.
A method of reprocessing a thermoset polymeric material comprising:
providing a thermosetting high polymer material to be treated, wherein the thermosetting high polymer material can perform exchange reaction and is provided with a part to be treated; using external force to deform the part to be processed, then keeping the new shape and heating at high temperature to make the material generate exchange reaction to permanently fix the new shape; thereby realizing the direct deformation processing of the thermosetting polymer material and obtaining the thermosetting polymer material which can be hot-formed and utilized again.
Specifically, the heating temperature is not lower than 100 ℃, and the heating time is 0.5 to 8 hours.
Specifically, the above-mentioned exchange reaction is a transesterification reaction, or a transamination reaction.
Specifically, the thermosetting polymer material includes, but is not limited to, thermosetting epoxy resin, polyurethane, and the like.
More specifically, the thermosetting epoxy resin material includes a general epoxy resin and a liquid crystal epoxy resin containing mesogen.
More specifically, the thermosetting epoxy resin materials include, but are not limited to, diglycidyl ethers and aliphatic diacids, or diglycidyl ethers and anhydrides.
Further, the diglycidyl ether may include one of bisphenol a diglycidyl ether, 1, 4-butanediol diglycidyl ether, neopentyl glycol diglycidyl ether, and 1, 4-dihydroxybiphenyl diglycidyl ether; the aliphatic diacid can comprise one of adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, dodecyl diacid, hexadecyl diacid, octadecyl diacid and hexadecyl diacid; the acid anhydride may include one of glutaric anhydride, adipic anhydride, and succinic anhydride.
More specifically, in the high-temperature rework step in the process of the present invention, the time required for heating is relatively shorter as the temperature to be employed is higher. When the thermosetting polymer material is a thermosetting epoxy resin, it is preferable that the heating time is 8 hours when the temperature is 100 ℃,4 hours when the temperature is 150 ℃, 2 hours when the temperature is 180 ℃, 1 hour when the temperature is 200 ℃ and 0.5 hour when the temperature is 220 ℃. When the thermosetting polymer material is polyurethane, it is preferable that the heating time is 3 hours at a temperature of 100 ℃, 2 hours at a temperature of 120 ℃ and 1 hour at a temperature of 140 ℃.
Specifically, the deformation process includes, but is not limited to, mechanical stretching, reshaping, welding, and pressing.
The invention also protects the thermosetting polymer material with the reprocessing characteristic obtained by the reprocessing method.
The method for reprocessing the thermosetting polymer material can ensure that the thermosetting polymer material has the characteristic of reprocessing after molding without a catalyst. Specifically, in the processing method of the invention, the exchange reaction of the thermosetting polymer material is excited at high temperature, and after the exchange reaction is carried out for a long enough time, the cross-linked network of the material is changed under the condition of unchanged cross-linked density, thereby realizing the direct deformation processing and the direct recycling of the thermosetting polymer material.
The method of the invention is very simple, because the material has no catalyst, the performance of the thermosetting polymer material after being remolded is very stable, thus the service life of the thermosetting polymer material can be prolonged, and the reprocessing cost of the method of the invention is very low.
Drawings
FIG. 1 is a flow chart of the high temperature processing of an epoxy material for reshaping according to an embodiment of the present invention.
FIG. 2 is a flow chart of high temperature recycling of epoxy chips according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the following method for processing thermosetting polymer materials according to the present invention is further described in detail with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The method for reprocessing the thermosetting polymer material provided by the invention is used for carrying out deformation treatment on the thermosetting polymer material to be treated by using external force, then carrying out high-temperature heating to enable the material to have exchange reaction, wherein the high temperature is not lower than 100 ℃, and then keeping the new shape at the temperature for not less than 0.5 hour, thereby realizing the direct deformation processing on the thermosetting polymer material and obtaining the thermosetting polymer material which can be subjected to hot forming and utilization again.
The thermosetting polymer material in the present invention includes, but is not limited to, thermosetting epoxy resin, polyurethane, and the like.
Example 1:
the epoxy resin used in this example is a material in which an ester exchange reaction can occur, and is cured by bisphenol a diglycidyl ether and adipic acid.
The specific reshaping processing method for the epoxy resin of this example is as follows:
referring to fig. 1, the strip-shaped epoxy resin material is heated to 180 ℃, deformed into a spiral shape by an external force, kept at 180 ℃ for 2 hours, and then cooled to room temperature, and the spiral shape is a permanent stable shape. Repeating the above steps to obtain another permanent stable spiral shape.
Example 2:
the specific recycling processing method for the epoxy resin of example 1 of the present invention is as follows:
referring to fig. 2, the epoxy resin fragments are heated to 180 ℃, and then are heated and pressed for 2 hours by external force and then cooled to room temperature, so that the epoxy resin fragments are hot-pressed again to form a new material for reuse.
Example 3:
the polyurethane used in this embodiment is a material in which transcarbamylation reaction can occur, and is specifically formed by curing diisocyanate, polyethylene glycol and a crosslinking agent.
The specific reshaping procedure for the polyurethane of this example was as follows:
heating the strip-shaped polyurethane material to 120 ℃, deforming and stretching the polyurethane material by 50 percent by using external force, keeping the stretched state, placing the polyurethane material at 120 ℃ for 2 hours, and then cooling the polyurethane material to room temperature, wherein the stretched state is the permanent stable shape.
The above examples are described by taking the relatively common thermosetting polymer material as an example, but it should be understood that the invention is not limited to the above materials, and the thermosetting polymer material capable of undergoing exchange reaction can be directly recycled by the method of the invention.
The above-mentioned embodiments only express one embodiment of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A method of reworking a thermoset polymeric material, comprising:
providing a thermosetting high polymer material to be treated, wherein the thermosetting high polymer material can perform exchange reaction and is provided with a part to be treated;
using external force to deform the part to be processed, then keeping the new shape and heating at high temperature to make the material generate exchange reaction and permanently fix the new shape;
thereby realizing the direct deformation processing of the thermosetting polymer material and obtaining the thermosetting polymer material which can be hot-formed and utilized again.
2. A method of reworking a thermoset polymeric material according to claim 1, wherein said heating temperature is not less than 100 ℃ and said heating time is from 0.5 to 8 hours.
3. The method of reworking a thermoset polymeric material according to claim 1, wherein said interchange reaction is a transesterification reaction or a transcarbamylation reaction.
4. The method of reworking a thermoset polymeric material according to claim 1, wherein the thermoset polymeric material comprises one of a thermoset epoxy resin and a polyurethane.
5. A method of reworking a thermosetting polymeric material according to claim 4, wherein said thermosetting epoxy material comprises a conventional epoxy resin and a liquid crystal epoxy resin containing mesogens.
6. A method of reworking a thermosetting polymeric material according to claim 4 or 5, wherein said thermosetting epoxy resin material comprises a diglycidyl ether and an aliphatic diacid or comprises a diglycidyl ether and an anhydride.
7. The method of reworking a thermoset polymeric material according to claim 6, wherein the diglycidyl ether comprises one of bisphenol A diglycidyl ether, 1, 4-butanediol diglycidyl ether, neopentyl glycol diglycidyl ether, and 1, 4-dihydroxybiphenyl diglycidyl ether.
8. A method of reworking a thermosetting polymeric material according to claim 6, wherein said aliphatic diacid comprises one of adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, dodecanedioic acid, hexadecanedioic acid, octadecanedioic acid.
9. The method of reprocessing a thermoset polymer material of claim 6, wherein said anhydride comprises one of glutaric anhydride, adipic anhydride, and succinic anhydride.
10. A thermoset polymeric material having reworkable properties obtained by the process of claim 1.
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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US20110319524A1 (en) * | 2010-05-31 | 2011-12-29 | Centre National De La Recherche Scientifique | Epoxy Acid Thermoset Resins and Composites that Can Be Hot-Fashioned and Recycled |
CN107828051A (en) * | 2017-10-18 | 2018-03-23 | 清华大学 | The processing method and sweep-out method of thermosetting resin |
CN108219111A (en) * | 2018-01-03 | 2018-06-29 | 中国工程物理研究院化工材料研究所 | Selfreparing, the thermosets that can be reprocessed and can be recycled and its processing method under a kind of temperate condition |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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US20110319524A1 (en) * | 2010-05-31 | 2011-12-29 | Centre National De La Recherche Scientifique | Epoxy Acid Thermoset Resins and Composites that Can Be Hot-Fashioned and Recycled |
CN107828051A (en) * | 2017-10-18 | 2018-03-23 | 清华大学 | The processing method and sweep-out method of thermosetting resin |
CN108219111A (en) * | 2018-01-03 | 2018-06-29 | 中国工程物理研究院化工材料研究所 | Selfreparing, the thermosets that can be reprocessed and can be recycled and its processing method under a kind of temperate condition |
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